CN107703361A - A kind of measurable FOF of whole Bonding regions impedance - Google Patents
A kind of measurable FOF of whole Bonding regions impedance Download PDFInfo
- Publication number
- CN107703361A CN107703361A CN201710862147.5A CN201710862147A CN107703361A CN 107703361 A CN107703361 A CN 107703361A CN 201710862147 A CN201710862147 A CN 201710862147A CN 107703361 A CN107703361 A CN 107703361A
- Authority
- CN
- China
- Prior art keywords
- pin
- golden finger
- layer
- fpc
- fof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention provides a kind of measurable FOF of whole Bonding regions impedance, including the first FPC and the second FPC；First FPC is provided with the first golden finger layer with multiple pin pin and the articulamentum with multiple pin pin；Second FPC is provided with the second golden finger layer with multiple pin pin；Wherein, each pin pin of second golden finger layer corresponds to pin pin corresponding to the first golden finger layer and carries out Bonding processing procedures respectively, formed with the pressing region coexisted between the first FPC and the second FPC and to electrically connect between any two pin pin in pressing region, and each pin pin of the second golden finger layer extends certain length outside pressing region.Implement the present invention, can quickly be detected the Bonding impedances of Zone Full, exclude situations such as particle is weak, and particle is few, and can prevent security risk subsequently occur.
Description
Technical field
The present invention relates to FPC（Flexible Printed Circuit Board, FPC）Field of measuring technique,
A kind of more particularly to measurable FOF of whole Bonding regions impedance（FPC ON FPC）.
Background technology
With the development of industrial technology technology, the utilization of flexible processing procedure and flexible material is more and more wider in Bonding fields
It is general so that the FPC that can be destroyed or force to yield also is becoming increasingly popular.However, in Bonding processing procedures, Bonding quality is to determine product
The key normally lighted, then how to be determined to Bonding effects is also a considerable problem.
At present, the method for inspection Bonding effects has following two：（1）Visual examination：Utilize microscope or AOI
（Automatic optic inspection, automatic optics inspection）Appearance determination is carried out to pressing particle and number of particles；（2）
Impedance, which measures, to be judged：Utilize impedance measuring Instrument（Such as universal meter）And assembling spring probe is hindered pressing Pin pin into tool
Anti- measurement, determines whether OK.However, for FOF processing procedures, due to the PI of two pressing materials（Plastic cement counterdie）Typically
Non-transparency material, stitching state can not be detected by optical power, i.e., microscope and AOI can not in the first inspection method
Use, now can only use in second method impedance measurement come judge its whether OK.
But existing FOF impedances are measured simply using the Dummy on Bonding regions（Dummy line TAB）It is connected into back
Road（As depicted in figs. 1 and 2）, then from FPC1/And FPC2/The upper connection of lead respectively TP（Test Point）Point measures, and leads
Such a method is caused to be limited to FPC1/And FPC2/Overall routing mode, and can only apply to detect Bonding ends both sides, but can not
Detect intermediate region.
Therefore, a kind of FOF that can measure Zone Full impedance of design is needed badly, the energy control Zone Full in processing procedure
Bonding effects, be advantageous to Product Status detection and failure analysis.
The content of the invention
Technical problem to be solved of the embodiment of the present invention is, there is provided a kind of whole Bonding regions impedance is measurable
FOF, the Bonding impedances of Zone Full can be quickly detected, exclude situations such as particle is weak, and particle is few, and can prevent
Subsequently there is security risk.
In order to solve the above-mentioned technical problem, the embodiments of the invention provide a kind of whole Bonding regions impedance is measurable
FOF, it is engaged with the tool formed by two spring probes and impedance measuring Instrument, including the first FPC and second
FPC；Wherein,
First FPC is provided with the first golden finger layer with multiple pin pin and the connection with multiple pin pin
Layer；
Second FPC is provided with the second golden finger layer with multiple pin pin；
Wherein, corresponding pin pin corresponding to the first golden finger layer enter each pin pin of the second golden finger layer respectively
Row Bonding processing procedures, formed with the pressing region coexisted between first FPC and second FPC
And to electrically connect between any two pin pin in the pressing region, and each pin pin of the second golden finger layer is equal
Extend certain length outside the pressing region.
Wherein, described two spring probes are connected respectively with any two pin pin in the second golden finger layer；It is or described
Two spring probes and any one pin pin point in any one pin pin in the second golden finger layer and the articulamentum
Do not connect；Or described two spring probes are connected respectively with any two pin pin in the articulamentum.
Wherein, each pin pin of the second golden finger layer extend it is described pressing region outside length [1mm,
2mm] between.
Wherein, each pin pin of the first golden finger layer also extends certain length outside the pressing region.
Wherein, any middle two pin pin of arbitrary neighborhood of the first golden finger layer, articulamentum and the second golden finger layer it
Between spacing be respectively less than the diameters of described two spring probes.
Wherein, any two formed in described two spring probes and the second golden finger layer by two neighboring pin pin
Group connects respectively；Or one group that two pin pin of described two spring probes and arbitrary neighborhood in the second golden finger layer are formed
And two pin pin of arbitrary neighborhood are formed in the first golden finger layer one group connects respectively；Or described two spring probes
Any two groups with being formed in the first golden finger layer by two neighboring pin pin are connected respectively.
Wherein, each pin pin of the first golden finger layer extend it is described pressing region outside length [1mm,
2mm] between.
Wherein, any middle two pin pin of arbitrary neighborhood of the first golden finger layer, articulamentum and the second golden finger layer it
Between spacing be respectively positioned between [0.11mm, 0.15mm], and a diameter of 0.19mm of described two spring probes.
Wherein, each pin pin of the second golden finger layer corresponds to the corresponding pin to the first golden finger layer respectively
Pin realizes electrical connection by different square conducting resinl encapsulation.
Implement the embodiment of the present invention, have the advantages that：
1）, the present invention is different from Conventional impedance test point and only has both sides to have（And Total only has 4 test points）And it can not measure
The pattern of whole lead pressing resistance, by each pin for extending the upper second golden finger layers of the second FPC FPC2
Pin realizes the Bonding impedance measurements of Zone Full, and it is weak/few effectively to distinguish Bonding particles（Impedance is high）But the feelings of conducting
Condition, and prevent security risk subsequently occur, while after measurement notes abnormalities, bad position can be quickly found out, so as to
Analyzing efficiency is improved, facilitates and solves the problems, such as；
2）, the present invention be different from the test point that uses of tradition using FPC cablings derivative to non-pressing region, also by extending simultaneously
Each pin of the upper second golden finger layers of second FPC FPC2 and the upper first golden finger layers of the first FPC FPC1
Pin realizes the Bonding impedance measurements of Zone Full as test point so that the present invention can be combined real with Bonding boards
Existing automated production, has high economic value.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, according to
These accompanying drawings obtain other accompanying drawings and still fall within scope of the invention.
Fig. 1 is the fundamental diagram that FOF impedances in the prior art measure；
Fig. 2 is Fig. 1 equivalent circuit diagram；
Fig. 3 is the planar structure schematic diagram for the measurable FOF of whole Bonding regions impedance that the embodiment of the present invention one provides；
Fig. 4 is the application scenario diagram that FOF impedances measure in Fig. 3；
Fig. 5 is the planar structure schematic diagram for the measurable FOF of whole Bonding regions impedance that the embodiment of the present invention two provides；
Fig. 6 is the application scenario diagram that FOF impedances measure in Fig. 5；
Fig. 7 is the close-up schematic view of A points in Fig. 6；
Fig. 8 is Fig. 6 front partial enlarged drawing；
Fig. 9 is Fig. 8 equivalent circuit diagram.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with accompanying drawing
It is described in detail on step ground.
As shown in figure 3, in the embodiment of the present invention one, there is provided a kind of measurable FOF of whole Bonding regions impedance,
Itself and the tool formed by two spring probes and impedance measuring Instrument（As shown in Figure 4）It is engaged to realize detection Bonding
Effect, the measurable FOF of whole Bonding regions impedance include the first FPC FPC1 and the second FPC
FPC2；Wherein,
First FPC FPC1 is provided with the first golden finger layer M1 with multiple pin pin and the company with multiple pin pin
Meet a layer Connecter；
Second FPC FPC2 is provided with the second golden finger layer M2 with multiple pin pin；
Wherein, the second golden finger layer M2 each pin pin corresponds to carried out to the first golden finger layer M1 corresponding pin pin respectively
Bonding processing procedures, formed with the pressing region coexisted between the first FPC FPC1 and the second FPC FPC2
Overlap simultaneously to electrically connect between any two pin pin in pressing region Overlap, and the second golden finger layer M2's is each
Individual pin pin also extend pressing region Overlap outside certain length, such as extension length can design [1mm, 2mm] it
Between, it can thus be realized by extending the upper second golden finger layer M2 of the second FPC FPC2 each pin pin complete
The Bonding impedance measurements in portion region.
It should be noted that the first FPC FPC1 and the second FPC FPC2 pass through different square conducting resinl
ACF is encapsulated and is realized electrical connection, i.e., the second golden finger layer M2 each pin pin corresponds to the phase with the first golden finger layer M1 respectively
Pin pin are answered to realize electrical connection by different square conducting resinl ACF encapsulation.Impedance measuring Instrument is universal meter etc..
In the embodiment of the present invention one, it can directly contact pin pin by two spring probes and achieve that to single pin
The impedance measurement of pin, be in parallel two adjacent pin pin, the modes such as multiple pin pin that are in series, specific impedance measurement application scenarios tool
Body includes but is not limited to following several situations：
The first situation：Spring probe only connects single pin pin
（1）Two spring probes are connected respectively with any two pin pin in the second golden finger layer M2, carry out Bonding effect inspections
Survey；
（2）Two spring probes with it is any one in any one pin pin in the second golden finger layer M2 and articulamentum Connecter
Individual pin pin connect respectively, carry out Bonding effect detections；
（3）Two spring probes are connected respectively with any two pin pin in articulamentum Connecter, carry out Bonding effect inspections
Survey.
Second of situation：Spring probe is connected across on two neighboring pin pin
（I）Two spring probes are connected respectively with formed in the second golden finger layer M2 by two neighboring pin pin any two groups, are entered
Row Bonding effect detections；
（II）One group and the articulamentum that two pin pin of arbitrary neighborhood are formed in two spring probes and the second golden finger layer M2
Two pin pin of arbitrary neighborhood are formed in Connecter one group connects respectively, carries out Bonding effect detections；
（III）Two spring probes connect respectively with formed in articulamentum Connecter by two neighboring pin pin any two groups
Connect, carry out Bonding effect detections.
The third situation, the spring probe for connecting articulamentum Connect may be designed to connector, and with the second gold medal
The spring probe of finger layer M2 connections only connects single pin pin, and concrete application is as shown in figure 4, now use spring after Bonding
The second golden finger layer M2 pin pin are pushed down under probe, Bonding impedances are measured, using program from one side to other one
Side scanning signal successively, obtains the impedance of respective PIN.
As shown in figure 5, in the embodiment of the present invention two, there is provided another whole Bonding regions impedance it is measurable
FOF, itself and the tool formed by two spring probes and impedance measuring Instrument（As shown in Figure 6）It is engaged to realize detection
Bonding effects, the measurable FOF of whole Bonding regions impedance include the first FPC FPC1 and the second flexible wires
Road plate FPC2；Wherein,
First FPC FPC1 is provided with the first golden finger layer M1 with multiple pin pin and the company with multiple pin pin
Meet a layer Connecter；
Second FPC FPC2 is provided with the second golden finger layer M2 with multiple pin pin；
Wherein, the second golden finger layer M2 each pin pin corresponds to carried out to the first golden finger layer M1 corresponding pin pin respectively
Bonding processing procedures, formed with the pressing region coexisted between the first FPC FPC1 and the second FPC FPC2
Overlap simultaneously to electrically connect between any two pin pin in pressing region Overlap；
Wherein, the first golden finger layer M1 each pin pin and the second golden finger layer M2 each pin pin can extend pressure
Certain length outside the Overlap of region is closed, the length of such as extension is designed between [1mm, 2mm], can be thus different from
The test point that tradition uses is using FPC cablings derivative to non-pressing region, by extending the first golden finger layer M1 and second simultaneously
Golden finger layer M2 each pin pin realizes the Bonding impedance measurements of Zone Full as test point so that the present invention can
To be implemented in combination with automated production with Bonding boards, there is high economic value.
It should be noted that the first FPC FPC1 and the second FPC FPC2 pass through different square conducting resinl
ACF is encapsulated and is realized electrical connection, i.e., the second golden finger layer M2 each pin pin corresponds to the phase with the first golden finger layer M1 respectively
Pin pin are answered to realize electrical connection by different square conducting resinl ACF encapsulation.Impedance measuring Instrument is universal meter etc..
In the embodiment of the present invention two, it again may be by two spring probes and directly contact pin pin achieving that to list
The impedance measurement of one pin pin, be in parallel two adjacent pin pin, the modes such as multiple pin pin that are in series, specific impedance measurement application
Scene may refer to the related content in the embodiment of the present invention one.
Certainly, in order to further illustrate the impedance of two adjacent pin pin for being in parallel or connecting in pressing region Overlap
Measurement application, as shown in Figure 7 to 9, to the diameter and the first golden finger layer M1, articulamentum of two spring probes
Connecter and the second golden finger layer M2 adjacent pin pin spacing pich has carried out special provision, specially the first golden finger layer
Spacing between M1, articulamentum Connecter and the second golden finger layer M2 any middle two pin pin of arbitrary neighborhood should be less than
The diameter of two spring probes, as the first golden finger layer M1, articulamentum Connecter and the second golden finger layer M2 it is any in appoint
The spacing anticipated between two neighboring pin pin is respectively positioned between [0.11mm, 0.15mm], and two spring probes is a diameter of
0.19mm。
Therefore, specific impedance measurement application scenarios can specifically include：In two spring probes and the second golden finger layer M2
Any two groups formed by two neighboring pin pin connect respectively, carry out Bonding effect detections；Or two spring probes and
Two pin of arbitrary neighborhood in two pin pin of arbitrary neighborhood are formed in two golden finger layer M2 one group and the first golden finger layer M1
One group of pin formation connects respectively, carries out Bonding effect detections（As shown in Figure 8 and Figure 9）；Or two spring probes and first
Any two groups formed in golden finger layer M1 by two neighboring pin pin connect respectively, carry out Bonding effect detections.
Implement the embodiment of the present invention, have the advantages that：
1）, the present invention is different from Conventional impedance test point and only has both sides to have（And Total only has 4 test points）And it can not measure
The pattern of whole lead pressing resistance, by each pin for extending the upper second golden finger layers of the second FPC FPC2
Pin realizes the Bonding impedance measurements of Zone Full, and it is weak/few effectively to distinguish Bonding particles（Impedance is high）But the feelings of conducting
Condition, and prevent security risk subsequently occur, while after measurement notes abnormalities, bad position can be quickly found out, so as to
Analyzing efficiency is improved, facilitates and solves the problems, such as；
2）, the present invention be different from the test point that uses of tradition using FPC cablings derivative to non-pressing region, also by extending simultaneously
Each pin of the upper second golden finger layers of second FPC FPC2 and the upper first golden finger layers of the first FPC FPC1
Pin realizes the Bonding impedance measurements of Zone Full as test point so that the present invention can be combined real with Bonding boards
Existing automated production, has high economic value.
The above disclosed power for being only a kind of preferred embodiment of the present invention, the present invention can not being limited with this certainly
Sharp scope, therefore the equivalent variations made according to the claims in the present invention, still belong to the scope that the present invention is covered.
Claims (9)
1. a kind of measurable FOF of whole Bonding regions impedance, it by two spring probes and impedance measuring Instrument with being formed
Tool is engaged, it is characterised in that including the first FPC and the second FPC；Wherein,
First FPC is provided with the first golden finger layer with multiple pin pin and the connection with multiple pin pin
Layer；
Second FPC is provided with the second golden finger layer with multiple pin pin；
Wherein, corresponding pin pin corresponding to the first golden finger layer enter each pin pin of the second golden finger layer respectively
Row Bonding processing procedures, formed with the pressing region coexisted between first FPC and second FPC
And to electrically connect between any two pin pin in the pressing region, and each pin pin of the second golden finger layer is equal
Extend certain length outside the pressing region.
2. the measurable FOF of whole Bonding regions impedance as claimed in claim 1, it is characterised in that described two springs are visited
Pin is connected respectively with any two pin pin in the second golden finger layer；Or described two spring probes and the second gold medal hand
Refer in layer that any one pin pin connects respectively in any one pin pin and the articulamentum；Or described two spring probes with
Any two pin pin connect respectively in the articulamentum.
3. the measurable FOF of whole Bonding regions impedance as claimed in claim 2, it is characterised in that second golden finger
Each pin pin of layer extends the length pressed outside region between [1mm, 2mm].
4. the measurable FOF of whole Bonding regions impedance as claimed in claim 1, it is characterised in that first golden finger
Each pin pin of layer also extends certain length outside the pressing region.
5. the measurable FOF of whole Bonding regions impedance as claimed in claim 4, it is characterised in that first golden finger
Spacing between any middle two pin pin of arbitrary neighborhood of layer, articulamentum and the second golden finger layer is respectively less than described two springs
The diameter of probe.
6. the measurable FOF of whole Bonding regions impedance as claimed in claim 5, it is characterised in that described two springs are visited
Pin is connected respectively with formed in the second golden finger layer by two neighboring pin pin any two groups；Or described two springs are visited
Any phase in formed one group of two pin pin of pin and arbitrary neighborhood in the second golden finger layer and the first golden finger layer
One group of adjacent two pin pin formation connects respectively；Or by adjacent two in described two spring probes and the first golden finger layer
Any two groups of individual pin pin formation connect respectively.
7. the measurable FOF of whole Bonding regions impedance as claimed in claim 6, it is characterised in that first golden finger
Each pin pin of layer extends the length pressed outside region between [1mm, 2mm].
8. the measurable FOF of whole Bonding regions impedance as claimed in claim 7, it is characterised in that first golden finger
Spacing and the second gold medal in spacing, articulamentum on layer between any two neighboring pin pin between any two neighboring pin pin
Spacing on finger layer between any two neighboring pin pin is respectively between [0.11mm, 0.15mm], and described two springs
A diameter of 0.19mm of probe.
9. the measurable FOF of whole Bonding regions impedance as any one of claim 1-8, it is characterised in that described
Each pin pin of second golden finger layer is corresponding respectively, and corresponding pin pin pass through different square conduction to the first golden finger layer
Electrical connection is realized in glue encapsulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710862147.5A CN107703361A (en) | 2017-09-21 | 2017-09-21 | A kind of measurable FOF of whole Bonding regions impedance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710862147.5A CN107703361A (en) | 2017-09-21 | 2017-09-21 | A kind of measurable FOF of whole Bonding regions impedance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107703361A true CN107703361A (en) | 2018-02-16 |
Family
ID=61171867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710862147.5A Pending CN107703361A (en) | 2017-09-21 | 2017-09-21 | A kind of measurable FOF of whole Bonding regions impedance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107703361A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108319043A (en) * | 2018-02-26 | 2018-07-24 | 深圳市比亚迪电子部品件有限公司 | A kind of method for sticking and covering based on COG techniques touch panel and liquid crystal display panel |
| CN110161090A (en) * | 2019-05-23 | 2019-08-23 | 京东方科技集团股份有限公司 | The detection method of chip and its bonding state, display device on a kind of multilayer film |
| CN110596616A (en) * | 2019-10-12 | 2019-12-20 | 上海泽丰半导体科技有限公司 | Power supply impedance test method and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080050982A1 (en) * | 2006-08-25 | 2008-02-28 | Canon Kabushiki Kaisha | Electronic module and method of manufacturing electronic module |
| CN101178419A (en) * | 2006-11-10 | 2008-05-14 | 群康科技(深圳)有限公司 | Integrate circuit system pressing impedance detection method |
| CN101441339A (en) * | 2008-12-18 | 2009-05-27 | 友达光电股份有限公司 | LCD module and method for measuring contact electric impedance between circuit boards therein |
| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
| CN107144602A (en) * | 2017-05-16 | 2017-09-08 | 武汉华星光电技术有限公司 | Binding region conducting particles presses detection method |
-
2017
- 2017-09-21 CN CN201710862147.5A patent/CN107703361A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080050982A1 (en) * | 2006-08-25 | 2008-02-28 | Canon Kabushiki Kaisha | Electronic module and method of manufacturing electronic module |
| CN101178419A (en) * | 2006-11-10 | 2008-05-14 | 群康科技(深圳)有限公司 | Integrate circuit system pressing impedance detection method |
| CN101441339A (en) * | 2008-12-18 | 2009-05-27 | 友达光电股份有限公司 | LCD module and method for measuring contact electric impedance between circuit boards therein |
| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
| CN107144602A (en) * | 2017-05-16 | 2017-09-08 | 武汉华星光电技术有限公司 | Binding region conducting particles presses detection method |
Non-Patent Citations (1)
| Title |
|---|
| TAE-WAN KIM等: "Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly", 《IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108319043A (en) * | 2018-02-26 | 2018-07-24 | 深圳市比亚迪电子部品件有限公司 | A kind of method for sticking and covering based on COG techniques touch panel and liquid crystal display panel |
| CN110161090A (en) * | 2019-05-23 | 2019-08-23 | 京东方科技集团股份有限公司 | The detection method of chip and its bonding state, display device on a kind of multilayer film |
| CN110596616A (en) * | 2019-10-12 | 2019-12-20 | 上海泽丰半导体科技有限公司 | Power supply impedance test method and circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105632382B (en) | The method of display device and its detection binding region binding situation | |
| CN107703361A (en) | A kind of measurable FOF of whole Bonding regions impedance | |
| TW200806994A (en) | Noncontact type single side probe device and apparatus and method for testing open or short circuits of pattern electrodes using the same | |
| CN104515874B (en) | For pinboard and method of testing, the test device of circuit board testing | |
| CN1690723A (en) | Method and apparatus for non-contact testing and diagnosing electrical paths | |
| CN103293503B (en) | Probe card detecting method | |
| CN104237823B (en) | Method for effectively verifying probe card abnormality | |
| CN1690722A (en) | Test structure embedded in a shipping and handling cover for integrated circuit sockets and testing method | |
| JP2008026321A (en) | Noncontact single side probe, and apparatus and method for testing breakage of wire and short circuit of conductive line for using the same | |
| CN101699376B (en) | Touch panel and method for detecting touch panel | |
| CN107703364A (en) | Anisotropic conductive film connects measurement apparatus, method and the integrated circuit of resistance | |
| CN103675581B (en) | Electrical connection component and detection method thereof | |
| TWI398808B (en) | Touch panel and detecting method of touch panel | |
| CN108646127A (en) | Touch screen location of short circuit detection structure and detection method | |
| TW494232B (en) | Method and apparatus for inspecting simple-matrix type liquid crystal panel, and method and apparatus for inspecting plasma display panel | |
| JP5317554B2 (en) | Circuit board inspection apparatus and circuit board inspection method | |
| JP5415134B2 (en) | Inspection apparatus and inspection method | |
| KR20220114414A (en) | System for inspecting departure of connector pin | |
| JP2006200973A (en) | Circuit board inspection method and its device | |
| TW201843461A (en) | Probe card system, probe loader device and manufacturing method of the probe loader device | |
| TWI411841B (en) | Lcd module and method for measuring contact resistances between circuit boards therein | |
| CN109073695A (en) | The inspection method and inspection system of the wiring path of substrate | |
| CN104237720A (en) | Capacitive Test Method, Apparatus and System for Semiconductor Packages | |
| JP2000232141A (en) | Method for testing conduction of substrate for semiconductor package | |
| TWM534854U (en) | Grounding connection structure between touch panel and flexible printed circuit board, and flexible printed circuit board thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180216 |
|
| RJ01 | Rejection of invention patent application after publication |