TWM469482U - Detection system for detecting inspection area based on displacement variation of laser beam - Google Patents

Detection system for detecting inspection area based on displacement variation of laser beam Download PDF

Info

Publication number
TWM469482U
TWM469482U TW102217587U TW102217587U TWM469482U TW M469482 U TWM469482 U TW M469482U TW 102217587 U TW102217587 U TW 102217587U TW 102217587 U TW102217587 U TW 102217587U TW M469482 U TWM469482 U TW M469482U
Authority
TW
Taiwan
Prior art keywords
detection platform
laser light
tested
top surface
detection
Prior art date
Application number
TW102217587U
Other languages
Chinese (zh)
Inventor
Zheng-Tai Chen
Zhi-Hong Li
Zhi-Wei Chen
Original Assignee
Hauman Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hauman Technologies Corp filed Critical Hauman Technologies Corp
Priority to TW102217587U priority Critical patent/TWM469482U/en
Publication of TWM469482U publication Critical patent/TWM469482U/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Description

根據雷射光之位移變化檢測待測區域之檢測系統Detection system for detecting a region to be tested according to a change in displacement of laser light

本創作係關於檢測系統,尤指一種利用雷射光線投設至檢測平台及其上的待測元件,以根據雷射光的位移量變化進行檢測的檢測系統。The present invention relates to a detection system, and more particularly to a detection system that uses laser light to be applied to a detection platform and a component to be tested to detect the displacement of the laser light according to the change in displacement of the laser light.

按,隨著電子產業的蓬勃發展,及受到電子產品之輕薄化的設計理念影響,積體電路(integrated circuit,簡稱IC)被廣泛地應用於各種電子產品上,而成為不可或缺的電子元件,一般言,為能確保積體電路的生產良率,業者通常會對積體電路進行電路檢測作業,以能淘汰出不良品。According to the booming development of the electronics industry and the design concept of thin and light electronic products, integrated circuits (ICs) are widely used in various electronic products and become indispensable electronic components. In general, in order to ensure the production yield of the integrated circuit, the operator usually performs circuit detection operations on the integrated circuit to eliminate defective products.

一般言,積體電路被執行電路檢測作業時,業者通常會利用一吸附裝置將積體電路在複數個檢測平台之間移動,以能執行各種檢測作業,惟,前述的作業方式中,積體電路會被往復的組裝或拔除於該檢測平台上,因此,該檢測平台的內部有時會殘留受損之積體電路的餘屑,又,在長時間的使用下,該檢測平台的內部尚會蓄積灰塵或其它異物,當工作人員未能即時察覺或清理的情況下,易使後續置入之積體電路因壓抵到異物而陸續受損,且該異物亦會影響積體電路與檢測平台之探針接觸,造成積體電路損壞率增加及測試品質不佳之缺失。In general, when an integrated circuit is operated by an execution circuit, the operator usually moves the integrated circuit between a plurality of detection platforms by using an adsorption device to perform various detection operations. However, in the aforementioned operation mode, the integrated body is integrated. The circuit is reciprocally assembled or removed from the detection platform. Therefore, the inside of the detection platform sometimes has residual debris of the damaged integrated circuit, and the interior of the detection platform is still used under long-term use. Dust or other foreign matter will accumulate. When the staff fails to detect or clean it, it is easy to cause the subsequent integrated circuit to be damaged due to the pressure on the foreign object, and the foreign object will also affect the integrated circuit and detection. The probe contact of the platform causes an increase in the damage rate of the integrated circuit and a lack of test quality.

另,為使測試機台的測試信號,能夠確實地傳送至積體電路,以測試出該積體電路是否能正常工作,該吸附裝置會將積體電路按壓 到檢測平台上的插座,以使積體電路的端子和插座的探針相接觸,然而,在插拔積體電路的過程中,當吸附裝置不慎吸取積體電路失敗時,將會造成該積體電路遺留在檢測平台的插座上,導致後續的積體電路被按壓至該插座時,會重疊於原先的積體電路上而無法正常執行電路檢測作業,甚至會發生將原先的積體電路的測試結果,誤認為是後續的原先的的測試結果,而誤區分積體電路的良劣品質,此外,將積體電路重覆疊置按壓時,亦可能造成插座或積體電路損傷,提高了業者的生產與維修成本。In addition, in order to enable the test signal of the test machine to be reliably transmitted to the integrated circuit to test whether the integrated circuit can work normally, the adsorption device will press the integrated circuit. Go to the socket on the detection platform to make the terminal of the integrated circuit and the probe of the socket contact. However, during the process of plugging and unplugging the integrated circuit, when the adsorption device accidentally absorbs the integrated circuit, the The integrated circuit is left on the socket of the detection platform, so that when the subsequent integrated circuit is pressed to the socket, it will overlap the original integrated circuit and the circuit detection operation cannot be performed normally, and even the original integrated circuit may occur. The test result is mistaken for the subsequent original test result, and the quality of the integrated circuit is incorrectly distinguished. In addition, when the integrated circuit is repeatedly stacked and pressed, the socket or integrated circuit may be damaged and improved. The production and maintenance costs of the industry.

為能解決前述問題,業者通常會配置工作人員以目視檢查,但前述檢查方式極容易因疏忽,而未完全發現未被移除的積體電路,或不易察看到檢測平台上的異物,因此,有業者特別在檢測平台的上方增設一攝影機,該攝影機會不斷地拍攝該檢測平台上的畫面,並將拍攝圖片傳送至一電腦裝置,嗣,該電腦裝置會將拍攝圖片與一標準圖片進行比對,其中該標準圖片係為檢測平台上未插設有積體電路的畫面,如此,電腦裝置即可判斷出當前的檢測平台上,是否存有未移除的積體電路,以能通知工作人員將該積體電路移除。惟,前述的方式雖然能夠大幅地避免積體電路被重覆疊置的問題,但由於該電腦裝置必須比對大量的拍攝圖片,且不斷地比對每個拍攝圖片及標準圖片間的每個細節,以能判斷出拍攝圖片上是否存有積體電路,因此,會造成該電腦裝置的運作負荷過大,且不同時間之工作環境上的差異(如:燈光、工作人員的影子)亦容易造成拍攝圖片與標準圖片有較大的區別,影響了電腦裝置於辨識上的困難度及精準度。In order to solve the above problems, the operator usually configures the staff to perform visual inspection, but the foregoing inspection method is extremely easy to be negligent, and the integrated circuit that has not been removed is not completely found, or the foreign matter on the detection platform is not easily observed, therefore, In particular, a camera adds a camera above the inspection platform. The camera continuously captures the image on the detection platform and transmits the captured image to a computer device. The computer device compares the captured image with a standard image. Yes, wherein the standard picture is a picture on the detection platform without an integrated circuit, so that the computer device can determine whether there is an unremoved integrated circuit on the current detection platform to notify the work. The person removes the integrated circuit. However, although the foregoing method can largely avoid the problem that the integrated circuits are overlapped, since the computer device must compare a large number of captured pictures, and constantly compare each of the captured pictures and the standard pictures. The details can be used to determine whether there is an integrated circuit on the captured image. Therefore, the operation load of the computer device is too large, and the difference in working environment at different times (such as lighting, shadow of the staff) is also likely to be caused. The difference between the captured picture and the standard picture is different, which affects the difficulty and accuracy of the computer device in identification.

綜上所述可知,現有的檢測系統是將兩張圖片上的所有細節進行比對,以能判斷出檢測平台上是否存有積體電路,但前述方式不僅會 造成電腦裝置的運作負擔大增,且無法迅速地判斷出結果,故,如何針對前述缺失,設計出一種更佳的網路檢測系統,即成為相關業者之重要課題。In summary, the existing detection system compares all the details on the two pictures to determine whether there is an integrated circuit on the detection platform, but the foregoing method will not only As a result, the operational burden of the computer device is greatly increased, and the result cannot be quickly determined. Therefore, how to design a better network detection system for the aforementioned deficiency is an important issue for the relevant industry.

有鑑於現有的檢測系統,會造成電腦裝置的運作負荷過大,且比對速度緩慢,故,創作人經過長久努力研究與實驗,終於開發設計出本創作之一種根據雷射光之位移變化檢測待測區域之檢測系統,以期藉由本創作而能提供業者一種更為迅速且正確的檢測結果。In view of the existing detection system, the operation load of the computer device is too large, and the comparison speed is slow. Therefore, after long efforts and research, the creator finally developed and designed a kind of detection based on the displacement change of the laser light to be tested. The regional detection system, in order to provide a more rapid and accurate test result by the author.

本創作之一目的,係提供一種根據雷射光之位移變化檢測待測區域之檢測系統,以藉由雷射光所投射形成之光線痕跡的位移變化,來判斷出檢測平台表面上,是否存有異物,該檢測系統包括一檢測平台、一雷射單元、一攝像單元及一電腦裝置,其中該檢測平台沿其頂面之縱向位置,設有一待測區域,另,該雷射單元及該攝像單元係分別設置於該檢測平台上方的位置,且分別與該檢測平台相隔一間距,其中該雷射單元能對該檢測平台的頂面投射一雷射光,該雷射光的投射方向及投射位置係沿著該檢測平台之縱向位移,又,該攝像單元的攝像角度則與該待測區域形成一預定之攝像角度,且能擷取投射在該待測區域上的該雷射光之位移變化,並據以產生一影像檔案,再者,該電腦裝置係與該攝像單元相連接,且能接收該影像檔案,並能根據該影像檔案中之雷射光的位移變化,同時判斷出該檢測平台之頂面是否存在其它異物?如此,本創作之檢測系統僅需判斷雷射光的位移變化,便能迅速且正確地判斷出該檢測平台及該等待測元件上是否存在任何可能危及後續檢測結果正確性之問題。One of the purposes of the present invention is to provide a detection system for detecting an area to be tested according to a change in displacement of laser light, to determine whether there is a foreign object on the surface of the detection platform by the displacement change of the light trace formed by the projection of the laser light. The detection system includes a detection platform, a laser unit, a camera unit and a computer device, wherein the detection platform is provided with a region to be tested along a longitudinal position of the top surface thereof, and the laser unit and the camera unit Positioned above the detection platform, respectively, and spaced apart from the detection platform, wherein the laser unit can project a laser light on the top surface of the detection platform, and the projection direction and the projection position of the laser light are along the edge The longitudinal displacement of the detecting platform, and the imaging angle of the imaging unit forms a predetermined imaging angle with the area to be tested, and can capture the displacement change of the laser light projected on the area to be tested, and according to To generate an image file, and the computer device is connected to the camera unit, and can receive the image file, and can be based on the image file. Displacement of the laser beam, while the top surface is judged whether the detection of the presence of other foreign internet? In this way, the detection system of the present invention only needs to judge the displacement change of the laser light, and can quickly and correctly determine whether there is any problem on the detection platform and the waiting component that may jeopardize the correctness of the subsequent detection result.

本創作之另一目的,係該待測區域能供放置複數個待測元 件,等待測元件會沿該檢測平台之縱向,依序排列在該檢測平台之頂面上,且該攝像單元的攝像角度,會與該等待測元件的頂面形成該預定角度,以供電腦裝置能根據該等待測元件之頂面的雷射光之位移變化,同時判斷出待測元件的頂面是否存有異物?判斷各該待測元件之頂面是否正常?或判斷相鄰之該等待測元件間之距離是否正確?如此,業者即無需如同傳統的檢測系統般,必需在電腦裝置中儲存一標準圖片,且透過攝像單元不斷地對各該待測元件拍攝大量的照片,再針對各個照片與標準圖片進行逐一比對,有效降低電腦裝置的運作負荷。Another purpose of the creation is that the area to be tested can be used to place a plurality of elements to be tested. Awaiting the measuring component along the longitudinal direction of the detecting platform, sequentially arranged on the top surface of the detecting platform, and the imaging angle of the camera unit forms the predetermined angle with the top surface of the waiting component for the computer The device can change the displacement of the laser light on the top surface of the waiting component, and determine whether there is foreign matter on the top surface of the component to be tested. Is it judged whether the top surface of each of the components to be tested is normal? Or determine whether the distance between adjacent waiting components is correct? In this way, the manufacturer does not need to store a standard picture in the computer device as in the conventional detection system, and continuously takes a large number of photos for each of the components to be tested through the camera unit, and then compares each photo with the standard picture one by one. , effectively reduce the operational load on the computer device.

為便 貴審查委員能對本創作目的、技術特徵及其功效,做更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下:For the sake of your review, you can make a further understanding and understanding of the purpose, technical features and efficacy of this creation. The examples are shown in the following diagram:

〔習知〕[study]

no

〔本創作〕[this creation]

1‧‧‧檢測系統1‧‧‧Detection system

11‧‧‧檢測平台11‧‧‧Testing platform

110‧‧‧待測區域110‧‧‧ Area to be tested

111‧‧‧插座111‧‧‧ socket

112‧‧‧待測元件112‧‧‧Device under test

13‧‧‧雷射單元13‧‧‧Laser unit

15‧‧‧攝像單元15‧‧‧ camera unit

17‧‧‧電腦裝置17‧‧‧Computer equipment

θ 1‧‧‧攝像角度θ 1‧‧‧ camera angle

X‧‧‧雷射光X‧‧‧Laser light

L‧‧‧光線痕跡L‧‧‧Light traces

a1、a2、b1、b2‧‧‧線條A1, a2, b1, b2‧‧‧ lines

第1圖係本創作之檢測系統的前視示意圖;第2圖係本創作之檢測系統的測視示意圖;第3圖係檢側平台的示意圖;第4圖係待測元件及其上之雷射光的示意圖;及第5圖係影像檔案的示意圖。The first picture is a front view of the detection system of the present creation; the second picture is a schematic view of the detection system of the present creation; the third picture is a schematic diagram of the detection side platform; the fourth picture is the device to be tested and the thunder thereon Schematic diagram of the light; and Figure 5 is a schematic diagram of the image file.

本創作係一種根據雷射光之位移變化檢測待測區域之檢測系統,請參閱第1~3圖所示,該檢測系統1包括一檢測平台11、一雷射單元13、一攝像單元15及一電腦裝置17,且該電腦裝置17與該攝像單元15相電氣連接,以能彼此傳遞訊息,其中該檢測平台11的頂面設有一待測區 域110,在該實施例中,該待測區域110上設有複數個插座111,該等插座111沿該檢測平台11之縱向,依序排列在該檢測平台11之頂面上,以使複數個待測元件112(如:積體電路)分別被插設於各該插座111上,惟,在本創作之其它實施例中,當待測元件112並非為電子元件時,該待測區域110亦可不設有插座111,合先陳明。The present invention is a detection system for detecting a region to be tested according to a change in displacement of a laser light. Referring to FIGS. 1 to 3, the detection system 1 includes a detection platform 11, a laser unit 13, an imaging unit 15, and a The computer device 17 is electrically connected to the camera unit 15 to transmit information to each other, wherein the top surface of the detecting platform 11 is provided with a waiting area In the embodiment, the area to be tested 110 is provided with a plurality of sockets 111. The sockets 111 are arranged on the top surface of the detection platform 11 in the longitudinal direction of the detection platform 11 so as to be plural. The devices to be tested 112 (eg, integrated circuits) are respectively inserted into the sockets 111. However, in other embodiments of the present invention, when the device under test 112 is not an electronic component, the area to be tested 110 It is also possible to have no socket 111.

復請參閱第1~3圖所示,後續實施例係以該待測區域110上已置放待測元件112為例,進行說明,該等待測元件112係分別插設於各該插座111上,以能沿該檢測平台11之縱向,依序排列在該檢測平台11之頂面上,另,該雷射單元13係設置於該檢測平台11上方,且與該檢測平台11相隔一間距,使得該雷射單元13不會碰觸到該檢測平台11,並能對該檢測平台11的頂面投射一雷射光X,又,該雷射單元13自身能夠在該檢測平台11的上方沿其縱向位移,或者是,該雷射單元13的一端被固定住,且其另一端能旋轉,如此,當該雷射單元13自身在位移或旋轉時,其所射出之雷射光X的投射方向及投射位置,會沿著該檢測平台11之縱向位移,且該雷射光X會對應於該等待測元件112,使得該檢測平台11之頂面及該等待測元件112的表面上能形成一光線痕跡L(如第4圖所示)。Referring to FIG. 1 to FIG. 3, the following embodiments are described by taking the device to be tested 112 on the area to be tested 110 as an example. The waiting components 112 are respectively inserted into the sockets 111. The laser unit 13 is disposed on the top surface of the detecting platform 11 in the longitudinal direction of the detecting platform 11 , and the laser unit 13 is disposed above the detecting platform 11 and spaced apart from the detecting platform 11 . So that the laser unit 13 does not touch the detection platform 11, and can project a laser light X to the top surface of the detection platform 11, and the laser unit 13 itself can be along the detection platform 11 Longitudinal displacement, or one end of the laser unit 13 is fixed, and the other end of the laser unit 13 is rotatable, so that when the laser unit 13 itself is displaced or rotated, the projection direction of the laser light X emitted therefrom is The projection position is displaced along the longitudinal direction of the detection platform 11, and the laser light X corresponds to the waiting component 112, so that a light trace can be formed on the top surface of the detection platform 11 and the surface of the waiting component 112. L (as shown in Figure 4).

復請參閱第1至3圖所示,該攝像單元15係設置於該檢測平台11上方的橫向位置,且與該檢測平台11相隔一間距,使得該攝像單元15不會碰觸到該檢測平台11,又,該攝像單元15的攝像角度係與該待測區域110上之該等待測元件112之頂面形成一預定之攝像角度θ 1,在該實施例中,前述之攝像角度係介於零度與90度間,且對應於該雷射光X投射位置之位移路徑,因此,該攝像單元15能夠擷取該雷射光X所形成的光 線痕跡L(如第4圖所示),由於該檢測平台11及該等待測元件112之頂面間存有高度差,因此,該攝像單元15所擷取的畫面,包括了投射在該檢測平台11及該等待測元件112之頂面上的該雷射光X之位移變化,嗣,該攝像單元15會據以產生一影像檔案(如第5圖所示),並將該影像檔案傳送至該電腦裝置17上。Referring to FIG. 1 to FIG. 3 , the camera unit 15 is disposed at a lateral position above the detection platform 11 and spaced apart from the detection platform 11 such that the camera unit 15 does not touch the detection platform. 11. In this embodiment, the imaging angle of the imaging unit 15 forms a predetermined imaging angle θ1 with the top surface of the waiting component 112 on the to-be-tested area 110. In this embodiment, the foregoing imaging angle is Between zero degree and 90 degrees, and corresponding to the displacement path of the projection position of the laser light X, therefore, the image capturing unit 15 can capture the light formed by the laser light X The line trace L (as shown in FIG. 4), because the height difference between the detection platform 11 and the top surface of the waiting component 112, the image captured by the image capturing unit 15 includes the projection in the detection. The displacement of the laser light X on the top surface of the platform 11 and the waiting component 112, the camera unit 15 generates an image file (as shown in FIG. 5), and transmits the image file to The computer device 17 is on.

另,復請參閱第1及5圖所示,該電腦裝置17在接收到該影像檔案後,會檢視該雷射光X之位移變化,並根據該雷射光X之位移變化,判斷該檢測平台11及待測元件112的當前狀況,舉例而言,在第5圖的左側位置中,由於線條a1及線條a2間存有一高度差,故可得知該檢測平台11上置放有待測元件112,又,由於該線條a1及線條a2呈平整狀,故可得知,該檢測平台11及待測元件112的頂面是不存有其它異物或是破損情況;在第5圖的右側位置中,由於線條b2呈凹凸狀,故可得知,該待測元件112的頂面是存有異物或是破損,則工作人員便能迅速地更換該待測元件112,或是立即地清除異物,以確保後續檢測程序的正常運作。此外,透過線條a1及線條b1的長度,亦可判斷出相鄰的兩個待測元件112間的距離是否正確,以避免該待測元件112被錯誤置放,影響了後續的檢測程序。In addition, as shown in FIGS. 1 and 5, after receiving the image file, the computer device 17 checks the displacement change of the laser light X, and determines the detection platform 11 according to the displacement change of the laser light X. And the current condition of the device under test 112. For example, in the left position of FIG. 5, since there is a height difference between the line a1 and the line a2, it can be known that the detecting element 112 is placed on the detecting platform 11. Moreover, since the line a1 and the line a2 are flat, it can be known that the top surface of the detecting platform 11 and the element to be tested 112 is free from other foreign matter or damage; in the right position of FIG. Since the line b2 has a concave-convex shape, it can be known that if the top surface of the element to be tested 112 is foreign matter or damaged, the worker can quickly replace the element to be tested 112 or immediately remove the foreign object. To ensure the normal operation of the subsequent testing procedures. In addition, through the lengths of the line a1 and the line b1, it can be determined whether the distance between the two adjacent elements to be tested 112 is correct, so as to prevent the device under test 112 from being misplaced, which affects the subsequent detection process.

在此特別一提者,復請參閱第1~3圖所示,當該檢測平台11上未置放有待測元件112時,前述之攝像單元15的攝像角度θ 1能與該待測區域110形成該預定之攝像角度θ 1,以使該電腦裝置17能判斷出該檢測平台11上是否存有異物,或是檢測該待測區域110中的插座111內,是否存有異物;如此,業者即無需如同傳統的檢測系統般,必需在電腦裝 置17中儲存一標準圖片,且透過攝像單元15不斷地對各該待測元件112拍攝大量的照片,再針對各個照片與標準圖片進行逐一比對,故,由於本創作之檢測系統1僅需分析雷射光X的位移變化,因此能迅速地判斷出檢測平台11與待測元件112的當前狀態,以能大幅減輕電腦裝置17的運作負荷,且能正確地判斷出該檢測平台11及該等待測元件112上是否存在任何可能危及後續檢測結果正確性之問題。In particular, as shown in FIGS. 1 to 3, when the detecting element 112 is not placed on the detecting platform 11, the imaging angle θ 1 of the aforementioned imaging unit 15 can be compared with the area to be tested. The predetermined imaging angle θ1 is formed to enable the computer device 17 to determine whether there is a foreign object on the detection platform 11, or to detect whether there is a foreign object in the socket 111 in the area to be tested 110; The industry does not need to be installed in a computer like a traditional inspection system. A standard picture is stored in the 17th, and a large number of photos are continuously taken by the camera unit 15 through the camera unit 15, and then the photos are compared with the standard pictures one by one. Therefore, since the detection system 1 of the present invention only needs The displacement change of the laser light X is analyzed, so that the current state of the detection platform 11 and the device under test 112 can be quickly determined, so that the operational load of the computer device 17 can be greatly reduced, and the detection platform 11 and the waiting can be correctly determined. There are any problems on the test component 112 that may jeopardize the correctness of subsequent test results.

按,以上所述,僅係本創作之較佳實施例,惟,本創作所主張之權利範圍,並不侷限於此,按凡熟悉該項技藝人士,依據本創作所揭露之技術內容,可輕易思及之等效變化,均應屬不脫離本創作之保護範疇。According to the above description, it is only a preferred embodiment of the present invention, but the scope of the claims claimed by the present invention is not limited thereto, and according to those skilled in the art, according to the technical content disclosed in the present invention, Equivalent changes that are easily thought of should be in the protection of this creation.

1‧‧‧檢測系統1‧‧‧Detection system

11‧‧‧檢測平台11‧‧‧Testing platform

112‧‧‧待測元件112‧‧‧Device under test

13‧‧‧雷射單元13‧‧‧Laser unit

15‧‧‧攝像單元15‧‧‧ camera unit

17‧‧‧電腦裝置17‧‧‧Computer equipment

X‧‧‧雷射光X‧‧‧Laser light

Claims (7)

一種根據雷射光之位移變化檢測待測區域之檢測系統,包括:一檢測平台,沿其頂面之縱向位置,設有一待測區域;一雷射單元,係設置於該檢測平台上方,且與該檢測平台相隔一間距,並能對該檢測平台的頂面投射一雷射光,該雷射光的投射方向及投射位置係沿著該檢測平台之縱向位移;一攝像單元,係設置於該檢測平台上方,與該檢測平台相隔一間距,且對應於該雷射光投射位置之位移路徑,以擷取投射在該待測區域上的該雷射光之位移變化,且據以產生一影像檔案;及一電腦裝置,係與該攝像單元相連接,且能接收該影像檔案,當該電腦裝置接收到該影像檔案後,會檢視該雷射光之位移變化,以根據該雷射光之位移變化,判斷出該檢測平台之頂面是否存在其它異物。A detection system for detecting an area to be tested according to a change in displacement of a laser light, comprising: a detection platform having a test area along a longitudinal position of a top surface thereof; a laser unit disposed above the detection platform, and The detection platform is spaced apart by a distance, and a laser beam can be projected on the top surface of the detection platform. The projection direction and the projection position of the laser light are longitudinally displaced along the detection platform; a camera unit is disposed on the detection platform. Upper, spaced apart from the detection platform, and corresponding to the displacement path of the projection position of the laser light, to capture the displacement change of the laser light projected on the area to be tested, and accordingly generate an image file; The computer device is connected to the camera unit and can receive the image file. When the computer device receives the image file, it monitors the displacement change of the laser light to determine the displacement according to the displacement of the laser light. Check if there are other foreign objects on the top surface of the platform. 如請求項1所述之檢測系統,其中該攝像單元係設置於該檢測平台上方的橫向位置,且與該待測區域形成一預定之攝像角度,該攝像角度係小於90度且大於零度。The detection system of claim 1, wherein the camera unit is disposed at a lateral position above the detection platform, and forms a predetermined imaging angle with the area to be tested, the imaging angle being less than 90 degrees and greater than zero degrees. 如請求項2所述之檢測系統,其中該待測區域能供放置複數個待測元件,該等待測元件係沿該檢測平台之縱向,依序排列在該檢測平台之頂面上。The detection system of claim 2, wherein the area to be tested is capable of placing a plurality of components to be tested, and the waiting components are sequentially arranged on a top surface of the detection platform along a longitudinal direction of the detection platform. 如請求項3所述之檢測系統,其中該雷射光的投射方向及投射位置係對應於該等待測元件之頂面。The detection system of claim 3, wherein the projection direction and the projection position of the laser light correspond to a top surface of the waiting component. 如請求項4所述之檢測系統,其中該攝像單元的攝像角度係對應於該等待測元件之頂面。The detection system of claim 4, wherein the imaging angle of the camera unit corresponds to a top surface of the waiting component. 如請求項5所述之檢測系統,其中該電腦裝置尚會根據該雷射光之位移變化,判斷各該待測元件之頂面是否正常,或判斷相鄰之該等待測元件間之距離是否正確。The detection system of claim 5, wherein the computer device determines whether the top surface of each of the components to be tested is normal according to the displacement of the laser light, or determines whether the distance between the adjacent waiting components is correct. . 如請求項6所述之檢測系統,其中該待測區域上設有複數個插座,該等插座係沿該檢測平台之縱向,依序排列在該檢測平台之頂面上,且能供該等待測元件插設其上。The detection system of claim 6, wherein the area to be tested is provided with a plurality of sockets, the sockets are arranged on the top surface of the detection platform in the longitudinal direction of the detection platform, and can be used for waiting The measuring component is inserted thereon.
TW102217587U 2013-09-18 2013-09-18 Detection system for detecting inspection area based on displacement variation of laser beam TWM469482U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102217587U TWM469482U (en) 2013-09-18 2013-09-18 Detection system for detecting inspection area based on displacement variation of laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102217587U TWM469482U (en) 2013-09-18 2013-09-18 Detection system for detecting inspection area based on displacement variation of laser beam

Publications (1)

Publication Number Publication Date
TWM469482U true TWM469482U (en) 2014-01-01

Family

ID=50346976

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102217587U TWM469482U (en) 2013-09-18 2013-09-18 Detection system for detecting inspection area based on displacement variation of laser beam

Country Status (1)

Country Link
TW (1) TWM469482U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684015B (en) * 2017-06-29 2020-02-01 日商精工愛普生股份有限公司 Electronic component transport apparatus and electronic component inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684015B (en) * 2017-06-29 2020-02-01 日商精工愛普生股份有限公司 Electronic component transport apparatus and electronic component inspection apparatus

Similar Documents

Publication Publication Date Title
TWI665443B (en) Automatic optical inspection system and operating method thereof
KR101590831B1 (en) Method of inspecting foreign substance on a board
KR101657952B1 (en) Method of inspecting board
CN103673934A (en) Method for detecting planeness of PCB based on network projection
JP2013243273A (en) Component suction operation monitoring device and component presence detection device
KR20180039662A (en) IN-POCKET integrated circuit (IC) device detection with each mounted laser and camera
KR20150084623A (en) Test apparatus, test system and method of defects in blind vias of printed circuit board
TW201741653A (en) Component inspecting device and method
TWI467166B (en) Method and apparatus for inspecting pcb defects
TWM469482U (en) Detection system for detecting inspection area based on displacement variation of laser beam
JP6387620B2 (en) Quality control system
KR102091014B1 (en) Machine vision inspection device and product inspection method using machine vision
KR101228426B1 (en) Apparatus and method for inspection of marking
US8577123B2 (en) Method and system for evaluating contact elements
KR20150104766A (en) Tracking method for badness history in inspection process
KR101126759B1 (en) Method of teaching for electronic parts information in chip mounter
JP2008261692A (en) Substrate inspection system and substrate inspection method
TWM583616U (en) Printed circuit board inspection system
JP6999327B2 (en) Board inspection equipment
TW201638602A (en) Wire detection apparatus and method and wire applied by the same
GB2519991A (en) Apparatus and method
JP6559446B2 (en) Circuit pattern disconnection and short circuit inspection method and printed circuit board having inspection wiring pattern
TW201516394A (en) System and method for checking fillet welds of inductors
RU2811335C1 (en) Method and device for monitoring contacts of connector sockets installed on printed circuit board
TWM570424U (en) Optical inspection apparatus

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees