TWM448720U - Heat dissipation patch structure - Google Patents

Description

Heat sink structure

This creation is related to the structure of a heat-dissipating sticker, especially a structure that uses a phase change to dissipate heat.

In order to avoid overheating of a heating element, such as a semiconductor wafer, it is often necessary to provide a heat sink on the heating element to help the heat generating body to dissipate heat, and in order to improve the heat dissipation effect, a manufacturer has developed a In the first section, the heat sink is mainly composed of a metal material heat conducting member 1 and the top surface of the heat conducting member 1 is bonded by the penetrant 2. The heat sink 3 of the ceramic material enables the heat sink to achieve the purpose of improving the heat dissipation effect by the high thermal conductivity of the ceramic; and in order to make the heat sink convenient for the user, the manufacturer has developed a kind of For the structure of the flexible tape type heat sink, please refer to the second figure. The heat sink mainly has a flexible base 4, and one side of the base 4 is coated. The cloth has a thermally conductive adhesive layer 5, and the other side has a convex portion 6 for heat dissipation arranged in a warp and weft matrix, and a thinned layer 7 is formed between the convex portion 6 and the convex portion 6, thereby not only transmitting the heat conduction. Gluing layer 5 will be directly The heat sink is fixed on the heat generating body, and can be flexed and cut by the thinned layer 7, so that the heat sink can be cut according to the heat dissipation requirement of the heat generating body, and the effect of winding and receiving can be achieved.

However, the heat dissipation principle of the heat sink is to conduct heat energy generated by the heat generating body to the heat sink 3 or the convex portion 6 by heat conduction, and further to the air through the heat sink 3 or the convex portion 6 and the convex portion 6 Heat exchange between them to achieve the purpose of heat dissipation, that is, the dispersion of the heat sink The thermal performance depends on the contact area between the heat dissipating member 3 or the convex portion 6 and the air, so that the heat dissipating member 3 or the convex portion 6 must maintain a certain thickness to ensure heat dissipation performance, and cannot be applied in a narrow environment. For example, the heat dissipation of the wafer in the mobile phone, in addition to the structure of the flexible tape-type heat sink described above, can only be flexed and cut by the thinned layer 7, so that the shape of the cut and the shape of the bend are limited. There are still many inconveniences in use. Therefore, after observing the above shortcomings, the creator of the case believes that the above-mentioned heat sink is necessary for further improvement, and this creation comes with it.

The purpose of this creation is to provide a heat-dissipating structure which not only has the advantages of thin thickness and excellent heat dissipation performance, but also has the effects of being sticky and flexible to be convenient for the user.

In order to achieve the above object, the structure of the heat-dissipating sticker provided by the present invention comprises a primer layer; and a thin base layer composed of a flexible material and disposed on the top surface of the primer layer; A phase change layer is disposed on the top surface of the thin base layer, and the phase change layer is provided with a plurality of phase change material particles.

The structure of the heat-dissipating sticker provided by the present invention can provide excellent heat dissipation performance not only by the high latent heat characteristics of the phase-change material particles, but also the structure of the heat-dissipating sticker can be achieved by a thin product thickness. The heat dissipation effect is the same as that of the conventional heat sink which uses heat conduction, and since the thin base layer is made of a flexible material, and the phase change layer is composed of the phase change material particles, the heat dissipation paste is The structure is softer and can be arbitrarily cut and bent by the user. At the same time, the adhesive layer allows the user to affix the structure of the heat-dissipating sticker to the user, thereby achieving the effect of user convenience.

Referring to the third and fourth figures, a perspective view and a cross-sectional view of a first preferred embodiment of the present invention are disclosed. The structure 100 of the heat-dissipating sticker is disclosed. The primer layer 10 is made of a material having thermal conductivity and non-conductivity, such as a glue for general adhesion, or a thermal adhesive as shown in the embodiment.

a thin base layer 20, which is made of a flexible material and is disposed on the top surface of the primer layer 10, wherein the flexible material is selected from one of metal, plastic and paper, in this embodiment. The flexible material is made of metal.

a phase change layer 30 is disposed on the top surface of the thin base layer 20, and a plurality of phase change material particles 31 (Phase Change Materials, PCM) are disposed in the phase change layer 30, and in this embodiment, The phase change material particles 31 are first mixed with a binder 32 and then coated on the thin base layer 20 to form the phase change layer 30.

In order to further understand the characteristics of this creation, the use of technical means and the expected results, we will use the way of this creation to describe, and believe that we can have a deeper and more specific understanding of this creation, as follows: Please Referring to the fifth embodiment, it is a schematic diagram of the first preferred embodiment of the present invention. The user can directly attach and fix the heat-dissipating structure 100 to a heating element 200 through the primer layer 10, and Since the thin base layer 20 is made of a flexible material, and the phase change layer 30 is formed by mixing the phase change material particles 31 and the adhesive 32, the heat-dissipating structure 100 is relatively soft. The user can perform any cutting and bending to flatten the structure 100 of the heat-dissipating sticker on the surface of the heating element 200. For example, in the embodiment, the structure 100 of the heat-dissipating sticker is bent into a curved shape, so that the structure 100 of the heat-dissipating sticker can achieve the effect of being convenient for the user.

When the structure 100 of the heat-dissipating sticker is disposed on the heat generating body 200, at this time, since the phase change material particles 31 have the characteristics of high latent heat, the phase change material particles 31 are generated when the heat generating body 200 starts to generate heat. The heat source emitted by the heat generating body 200 can be effectively absorbed during the phase change of the heat gradually changing from the solid state to the liquid state, thereby enabling the heat dissipation paste structure 100 of the present invention to provide extremely excellent heat dissipation performance. The thinner product thickness achieves the same heat dissipation effect as the conventional heat sink that uses heat conduction for heat dissipation, so that the user can use it in a narrow environment.

It is worth mentioning that, because the primer layer 10 is made of a material having thermal conductivity and non-conductivity, in addition to the structure 100 which can be used for fixing and fixing the heat-dissipating sticker, the heating element 200 can be emitted. Thermal energy is effectively conducted to the phase change layer 30 to enhance heat dissipation.

Referring to the sixth embodiment, which is a cross-sectional view of a second preferred embodiment of the present invention, the heat sink structure 100 is different from the foregoing preferred embodiment in that it further includes a heat dissipation layer 40. It is disposed on the top surface of the phase change layer 30, and the heat dissipation layer 40 is composed of a plurality of first porous materials 41 selected from the group consisting of graphite, montmorillonite and alumina. One or a combination thereof can thereby increase the contact area with the air by the heat dissipation layer 40 to dissipate the phase change layer 30, thereby further improving the heat dissipation effect of the heat dissipation structure 100.

Please refer to the seventh embodiment, which is a cross-sectional view of a third preferred embodiment of the present invention. The structure of the heat-dissipating sticker 100 is different from the foregoing second preferred embodiment in that the phase change layer 30 is further Further, a plurality of second porous materials 33 are provided, and the second porous material 33 is And one or a combination of graphite, montmorillonite and alumina, wherein the thermal energy can be transferred to the heat dissipation layer 40 by the second porous material 33 for heat dissipation, and the structure of the heat dissipation paste can be further improved. 100 heat dissipation effect.

Hereby, the characteristics of this creation and its achievable expected effects are stated as follows:

1. The structure of the heat-dissipating sticker of the present invention can be directly adhered to a heat generating body by the adhesive layer, and because the thin base layer is composed of a flexible material, the phase change layer is composed of the phases The material of the modified material is mixed with the adhesive, so that the structure of the heat-dissipating sticker is soft, and can be arbitrarily cut and bent by the user, so that the structure of the heat-dissipating sticker is flatly attached to the surface of the heat-generating body, Therefore, the effect of being convenient for the user can be achieved.

2. The structure of the heat-dissipating sticker of the present invention, when the heating element starts to generate heat, at this time, by the high latent heat characteristics of the phase-changing material particles themselves, the heat source generated by the heating element can be effectively absorbed, so that This creation can provide extremely excellent heat dissipation performance, and the thinner product thickness can achieve the same heat dissipation effect as the conventional heat sink which uses heat conduction for heat dissipation, so that the user can use it in a narrow environment.

In summary, this creation has its excellent progress and practicality in similar products. At the same time, it has investigated the technical information about such structures at home and abroad. The same structure has not been found in the literature. This creation has already possessed new types of patent requirements, and applied for it according to law.

However, the above-mentioned ones are only one of the preferred embodiments of the present invention, and the equivalent structural changes in the application of the present specification and the scope of the patent application are intended to be included in the scope of the present patent.

[study]

1‧‧‧thermal parts

2‧‧‧ penetrant

3‧‧‧ Heat sink

4‧‧‧ base

5‧‧‧ Thermal adhesive layer

6‧‧‧ convex

7‧‧‧ Thin layer

[this creation]

100‧‧‧The structure of the heat sink

10‧‧‧Bottom layer

20‧‧‧ thin base

30‧‧‧ phase change layer

31‧‧‧ phase change material particles

32‧‧‧Viscos

33‧‧‧Second porous material

40‧‧‧heat layer

41‧‧‧First porous material

200‧‧‧heating body

The first figure is a cross-sectional view of a conventional composite heat sink.

The second figure is a cross-sectional view showing the structure of a conventional flexible tape type heat sink.

The third drawing is a perspective view of a first preferred embodiment of the present creation.

The fourth drawing is a cross-sectional view of the first preferred embodiment of the present invention.

The fifth drawing is a schematic view of the use of the first preferred embodiment of the present creation.

Figure 6 is a cross-sectional view of a second preferred embodiment of the present invention.

The seventh drawing is a cross-sectional view of a third preferred embodiment of the present creation.

100‧‧‧The structure of the heat sink

10‧‧‧Bottom layer

20‧‧‧ thin base

30‧‧‧ phase change layer

31‧‧‧ phase change material particles

32‧‧‧Viscos

Claims (9)

The structure of a heat-dissipating sticker comprises: a primer layer; a thin base layer composed of a flexible material and disposed on a top surface of the primer layer; and a phase change layer which is The top surface of the thin base layer, and the phase change layer is provided with a plurality of particles of phase change material. The structure of a heat-dissipating sticker according to claim 1, wherein the primer layer is made of a material having thermal conductivity and non-conductivity. According to the structure of the heat-dissipating sticker of the second aspect of the patent application, the material having thermal conductivity and non-conductivity is a thermal conductive adhesive. The structure of a heat-dissipating sticker according to claim 1, wherein the flexible material is selected from the group consisting of metal, plastic and paper. The structure of a heat-dissipating sticker according to claim 1, wherein the phase change layer is formed by mixing the particles of the phase change material with a glue. The structure of a heat-dissipating sticker according to claim 1, further comprising a heat dissipation layer disposed on a top surface of the phase change layer, wherein the heat dissipation layer is provided with a plurality of first plurality Hole material. The structure of a heat-dissipating sticker according to claim 6, wherein the phase change layer is further provided with a plurality of second porous materials. The structure of a heat-dissipating sticker according to claim 6, wherein the first porous material is selected from one or a combination of graphite, montmorillonite and alumina. A structure of a heat-dissipating sticker according to claim 7 of the patent application, wherein The second porous material is selected from one or a combination of graphite, montmorillonite, and alumina.