CN203489220U - Cooling panel structure - Google Patents
Cooling panel structure Download PDFInfo
- Publication number
- CN203489220U CN203489220U CN201320529224.2U CN201320529224U CN203489220U CN 203489220 U CN203489220 U CN 203489220U CN 201320529224 U CN201320529224 U CN 201320529224U CN 203489220 U CN203489220 U CN 203489220U
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- China
- Prior art keywords
- cooling
- heat dissipation
- panel structure
- dissipation film
- dielectric layer
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- Expired - Fee Related
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Abstract
The utility model relates to a cooling panel structure which enables a cooling panel to be small in size, light in weight and good in cooling efficiency. The cooling panel structure is characterized in that a medium layer is arranged on a substrate; a cooling film is arranged on the medium layer which is formed by silicon dioxide; the cooling film is formed by manganese, iron and copper compound; the cooling film is combined to the medium layer through high temperature coating, so that the cooling film can generate a plurality of polygon crystal surfaces. The cooling panel structure has the advantages of achieving perfect cooling effect due to the facts that the manganese, iron and copper compound is perfect in heat suction and heat dissipation effect and the polygon crystal surface increases the cooling area and being thin in thickness, small in size and light in weight.
Description
Technical field
The utility model relates to a kind of cooling plate structure.
Background technology
Radiator structure with LED lamp (light emitting diode), existing structure as shown in Figure 1, light emitting diode 4 is arranged at ceramic substrate 1 one side, substrate 1 another side coordinates the bonding radiator 2 of viscose glue, this radiator 2 is to be made by aluminium material, be provided with the spaced fin 3 of multi-disc, by radiator 2 heat absorptions, heat radiation; , in fact there is following shortcoming in above-mentioned radiator structure:
(1) the radiator 2 and formed volume of fin 3 is large, weight is heavy, while being therefore used in LED lamp light fixture, causes light fixture volume large, heavy.
(2) radiator 2 and fin 3 thereof are made by aluminium material, and aluminium material cost is high, make LED lamp price high.
(3) radiator 2 and fin 3 thereof are made by aluminium material, and the heat conduction of aluminium, radiating effect are not good, so the non-the best of its radiating efficiency.Therefore need use radiator 2 a plurality of, larger volume during a plurality of light emitting diode 4, cause that price is higher, volume is larger.
Utility model content
The purpose of this utility model is to improve above-mentioned existing problem, and a kind of cooling plate structure is provided, and it has thin thickness, volume is little, lightweight, radiating efficiency is good effect.
In order to achieve the above object, the utility model provides a kind of cooling plate structure: at ceramic substrate, dielectric layer is simultaneously set, heat dissipation film is set on dielectric layer again, this dielectric layer is to consist of silica, this heat dissipation film is to consist of manganese, iron, copper compound, and heat dissipation film system forms with pyrolytic coating, form the crystal plane that heat dissipation film surface is the small crystalline solid formation being covered with.
The beneficial effects of the utility model are: by silica, can add strong adhesive force, heat dissipation film can not come off with the close combination of substrate, and silica have splendid heat-conducting effect; This heat dissipation film is pyrolytic coating and is incorporated on dielectric layer, formation is covered with a plurality of polygon crystalline solid that are crystal plane, by crystalline wafer increasing heat radiation area and manganese, iron, copper compound, there is splendid heat radiator function, and can form heat radiation fast, the good effect of radiating efficiency.
Accompanying drawing explanation
The structure cutaway view of the existing cooling plate structure of Fig. 1.
The structure of Fig. 2 cooling plate structure of the present utility model is analysed and observe.
Symbol description:
1 substrate
2 radiators
3 fin
4 light emitting diodes
10 substrates
11 dielectric layers
12 heat dissipation films
13 crystal planes
14 light emitting diodes.
The specific embodiment
Refer to Fig. 2, wherein (a) is partial enlarged drawing, and the heat sink of light emitting diode (LED lamp) of take is example, in substrate 10 one sides of a pottery, light emitting diode 14 is set, another side arranges dielectric layer 11, then on dielectric layer 11, heat dissipation film 12 is set.
This dielectric layer 11 is to consist of silica, the combination of itself and substrate 10 is to adopt " pyrolytic coating " mode, thereby ceramic wafer is heated to high temperature, make its surface active, then silica is sprayed on substrate, silica can form the small crystalline solid that is incorporated into substrate.
This heat dissipation film is to consist of manganese, iron, copper compound, the combination of itself and dielectric layer 11 is to adopt " pyrolytic coating " mode, thereby in connection with substrate 10, the dielectric layer 11 of one, heat again high temperature and make its surface active, again by heat dissipation film material spraying on dielectric layer 11, form heat dissipation film 12, and this heat dissipation film 12 also can produce the small polygon crystalline solid that is covered with whole, form crystal plane 13.
By above-mentioned structure, can obtain following effect, advantage:
(1) as shown in Figure 2, the heat sink that substrate 10, dielectric layer 11, heat dissipation film 12 form, thin thickness, little, the lightweight effect of volume, while being applied to LED lamp, can make overall lamp specifically long-pending little, lightweight.
(2) silica of dielectric layer 11 can add strong adhesive force, can difficult drop-off, and silica has splendid endothermic character, and can by hot temperature fast conduction to heat dissipation film 12 heat radiations.
(3) material manganese, iron, the copper compound of heat dissipation film 12, have splendid heat radiator characteristic, and obtain fast, hot temperature fallen apart and removed.
(4) dielectric layer 11 silica and heat dissipation film 12 materials, cheap, can make heat sink price low.
(5) especially, the surface of heat dissipation film 12 is polygonal crystal plane 13, forms the effect of area increased, is increasing heat radiation area, therefore can obtain the effect of quick heat radiating.
In sum, structure of the present utility model, has splendid practicality and improved effect really, really meets utility model patent main idea, earnestly asks gift quasi patent.
Claims (1)
1. a cooling plate structure, is characterized in that, in the one side of a substrate, dielectric layer is set, heat dissipation film is set on dielectric layer, this dielectric layer is to consist of silica, and heat dissipation film forms with pyrolytic coating, forms heat dissipation film surface and is the crystal plane that the small crystalline solid that is covered with forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320529224.2U CN203489220U (en) | 2013-08-28 | 2013-08-28 | Cooling panel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320529224.2U CN203489220U (en) | 2013-08-28 | 2013-08-28 | Cooling panel structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203489220U true CN203489220U (en) | 2014-03-19 |
Family
ID=50260051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320529224.2U Expired - Fee Related CN203489220U (en) | 2013-08-28 | 2013-08-28 | Cooling panel structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203489220U (en) |
-
2013
- 2013-08-28 CN CN201320529224.2U patent/CN203489220U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TENGRUI PHOTOELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHANG TINGFANG Effective date: 20140926 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140926 Address after: Chinese Taiwan Taichung Nantun District Public Road 2 No. 485 8 floor 1 Patentee after: TENGRUI PHOTOELECTRIC TECHNOLOGY CO., LTD. Address before: Taichung City, Taiwan, China Patentee before: Zhang Tingfang |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140319 Termination date: 20150828 |
|
| EXPY | Termination of patent right or utility model |