M439904 五、新型說明： 【新型所屬之技術領域】 本創作係與發光二極體封裝結構有關，特別是指一種散 熱與防潮性能優越，可使發光晶片具有更穩定的發光效果， 使用壽命更長之發光二極體封裝結構改良。 【先前技術】 隨著LED照明技術的迅速發展，人們對各種led照明設 備的要求越來越高，比如穩定性、使用壽命等等。目前，大 部分LED模組都包括基板、形成於基板之上的反射杯，以及 設置在反射杯令的晶片，傳統的基板包括一基板本體和疊層 設置在基板本體之上的絕緣層和線路層，晶片則直接與暴漏 於反射杯底部的線路層接觸，實現晶片與驅動電路的電連 接。這種LED結構中，反射杯與基板之間不可避免的存在氣 密性不良的問題，水汽容易滲入反射杯中，導致晶片發光效 率降低’並且’這種光源由於線路層與基板本體之間設有絕 籲緣層，導致晶片產生的熱量無法快速導出；這種傳統結構的 LED模組由於其防潮性差且散熱不良，使得整個模組的發光 效果不穩定，影響使用壽命。 【新型内容】 有鑑於此，本創作即在提供一種散熱與防潮性能優越， 可使發光晶片昇有更穩定的發光效果，使用壽命更長之發光 二極體封裝結構改良，為其主要目的者。 3 M439904 為達上述創作之發光二極體封裝結構，包括有 散熱基板以及發光4，該散熱基板表面—體成型有至少一 反射杯，於所=基板上且於所述反射杯以外的區 設有絕緣層和線路層’所述絕緣層沿所述反射杯的外側 上延伸使所述反射杯與線路層相隔離，該 反射杯底部，所述發光晶片通過導線與桃線:電連又： 其中，該發光晶片直接與散熱基板 ; 直接通過散熱基板導出’加快散熱；且傳 = 單獨設置反射杯，反射杯和基板之間結合的緊密 上 勢=其==理想’本創作的反射杯與散ί基板為 :體結構’可避免關題；該散熱及_性能優越，可使發 光晶片具有更穩定的發光效果，使用壽命更長。 依據上述技述特徵，所述反射杯的深度為所述發光晶片 的高度的2〜10倍。 依據上述技述特徵，所述反射杯為圓臺形，所述反射杯 的内侧面與底面之間形成9〇〜150。夾角。 依據上述技述特徵，所述反射杯的内侧面和底面設有金φ 屬錢層。 _ 依據上述技述特徵，所述反射杯内灌注有混有螢光粉的 封裝膠。 依據上述技述特徵，所述反射杯的杯口處覆蓋有透鏡。 依據上述技述特徵，所述線路層由金屬導電材料按照預 设線路結構刻蝕或衝壓而成。 依據上述技述特徵，所述絕緣層由非導電材料按照預設 線路結構刻蝕或衝壓而成。 … M439904 【實施方式】 本創作之待點，可參閱本案圖式及杳 獲得清楚地瞭解。 實轭例之詳細說明而 如第一圖本創作發光二極體封震站主 創作之發光二極體封裝結構包括有散熱:基 片105 ;其中：該散熱基板101和反射杯1〇2 一體成型 散熱基板HU上疊層設置有絕緣層1〇3和線路層ι〇4，絕緣 =03將散熱基板m與線路層1Q4隔開1闕⑽ 二射杯!02的外側面·向上延伸，使反射杯1〇2和線路層 104相隔離，以免線路層104與反射杯1〇2接觸導致短路。 f反射杯1〇2的底部設置有發光晶片1〇5，發光曰曰以1〇5與 線路層104之間通過兩條導線106進行電連接， 工 -端與發光晶片105相連接，另一端與線路層1〇4相連接， 為發光晶片1G5供^本實施例中的散缝板1()1作為整個 模組的支撐主體和散熱主體，發光晶片105產生的熱量直接 通過散熱，板1G1導出，加快了散熱速度，有利於&高模組 出光的穩定性；並且散熱基板101與線路層104熱電分離， 線路層104不會受到熱量的影響，這也在一定程^上提高了 發一極體封裝結構的穩定性；並且，傳統的模組中反射杯 是單，形成在散熱基板表面的，反射杯與散熱基板之間結合 的緊密程度有限，因此防水防潮性能有限，本實施例中的反 射杯102與散熱基板1〇1為一體結構，因此不存在氣密性不 良的問題，具有更好的防水、防潮性；另外，散熱基板101 與反射杯102—體成型，節省了在散熱基板上另設反射杯的 序’有利於提高生產率、降低生產成本。 5 料外9〇4 結合第二圖至第六圖，該發光二極體封裝結構可以通過 下述方法製成： 第一步，取散熱基板板材，並在板材的正面按照預設的 大】、、形狀做出反射杯102，獲得帶有反射杯1〇2的散熱基 =，反射杯102具體可以通過沖切、鑽銑或模鑄和蝕刻 等工藝成型，如第二圖。 第二步，在散熱基板101表面除反射杯1〇2的區域設置 絕緣層103’並且使絕緣層103沿著反射杯1〇2的外侧面1〇21 向上延伸至反射杯102的杯口處，如第三圖。 第三步，在絕緣層103表面形成線路層1〇4。具體的， 可以先將導電材料壓合/粘貼在絕緣層1〇3表面，然後按照預 設的線路結構對材料進行沖切/蝕刻，此處可以只對線路層、加 工，也可以對絕緣層與線路層同時加工，達到預設非短 構，如第四圖。 第四步，在反射杯102的底部設置發光晶片1〇5，並^ 發光晶片105和線路層104之間焊接導線1〇6，如第五圖。 第五步，在反射杯1G2中灌注混有螢光粉的封裝膠並名 盍透鏡107,保護發光晶片105和導線106，如第六圖。 在本實施例中’反射杯102㈣度可以設置為發光晶> =的向度的卜2G倍’反射杯1Q2的深度過小不利於調^ 2的方向’深度過大又會增加光的損失，因此本實施例_ 士射杯102的深度最好為發光晶片1()5的高度的_倍，』 進一步優選為5倍左右。 的形狀優選為圓臺 1 〇23之間形成一純 進一步的，如第二圖中反射杯1〇2 形’其内侧面1022 (即反射面）與底面 M439904 角，該角度可以為90〜150。^通過對反射杯102的高度和内 側面1022的傾斜角度進行合理的配置，可以有效改善出射光 的方向性和出光強度。 為了改善發光二極體封裝結構的散熱性能，散熱基板1〇1 優選由金屬材料構成H與散熱基板1Q1 —體的反射杯 102為同一金屬材質’與傳統的塑膠反射杯相比，金屬反射 杯對光的反射率要高得多，有利於提高模組的光效。 進一步的’反射杯1〇2的内侧面1〇22和底面1023還可 叹置金屬鍍層，優選鍍銀，以進一步提高反射杯1〇2的反射 率’提高發光二極體封裝結構的光效。 本實施例中，反射杯102中可封裝有混有螢光粉的透明 膠，以保護發光晶片105並獲得不同顏色的出射光。進一步 的，可以在反射杯102的杯口處覆蓋透鏡1〇7，用以同時保 濩發光晶片105和導線106。具體的，可以在每個反射杯1〇2 的杯口處設置一個獨立的透鏡1〇7,也可以在整個模組的表 面设置連片結構的透鏡組，當然，透鏡組中的透鏡與反 鲁射杯102是一一對位設置的。透鏡107可以是平板結構，也 可以是凸透鏡結構，具體根據實際應用確定。 進一步的，透鏡107可以通過模具模壓形成在反射杯1〇2 的杯口處，也可以通過向杯中灌注矽膠等透鏡材料並進行乾 燥處理形成。 進一步的，混有螢光粉的透明膠的折射率高於透鏡1〇7 的折射率，有利於提高出光效率。 本實施例中，線路層104的表面可以進行表面處理，如 設置金屬鍍層、助焊層或易焊層等，使導線1〇6與線路層1〇4 結合的更好。 本新型提供的發光二極體封裝結構適合作為發光部件安 猶切明裳置中’如第七圖所示的日光燈，具體可以採用單 珣一個發光二極體封裝結構201作為發光部件，也可以採用多 # ^光一極體封裝結構201按照預設的方式排布後作為發光 件安裝於照明裝置的燈筒202中。 如上所述，本創作提供一較佳可行之發光二極體封裝結 t良，爰依法提呈㈣專利之申請；本創作之技術内容及 “寺點已揭不如上’然而熟悉本項技術之人士仍可能基於 本創作之揭㈣作各種不㈣本_箱神之替換及修飾。 因此’本創作之保護feu應不限於實施例所揭示者，而應包 括各種不ί離本創作之替換及修飾，並為以下之巾請專利範 圍所涵蓋。 【圖式簡單說明】 第-圖係為本創作中發光二極體封裝結構之剖面結構示 意圖。 第二圖〜第六圖係為本創作中發光二極體封裝結構之制 程示意圖。 第七圖係為本創作中照明裝置的結構示意圖。 【主要元件符號說明】 散熱基板101 反射杯102 外側面1021 M439904 内侧面1022 底面1023 絕緣層103 線路層104 發光晶片105 導線106 透鏡107 發光二極體封裝結構201 燈筒202M439904 V. New description: [New technical field] This creation is related to the LED package structure, especially the heat dissipation and moisture resistance, which can make the illuminating wafer have more stable illuminating effect and longer service life. The LED package structure is improved. [Prior Art] With the rapid development of LED lighting technology, people are increasingly demanding various LED lighting devices, such as stability, service life and the like. At present, most LED modules include a substrate, a reflective cup formed on the substrate, and a wafer disposed on the reflective cup. The conventional substrate includes a substrate body and an insulating layer and a line laminated on the substrate body. The layer, the wafer is directly in contact with the wiring layer that leaks into the bottom of the reflector cup, and the electrical connection between the wafer and the driving circuit is realized. In such an LED structure, there is an inevitable problem of poor airtightness between the reflective cup and the substrate, and water vapor easily penetrates into the reflective cup, resulting in a decrease in luminous efficiency of the wafer 'and' such a light source is disposed between the wiring layer and the substrate body. There is an absolute margin, which causes the heat generated by the wafer to be unable to be quickly exported. This conventional LED module has poor moisture resistance and poor heat dissipation, which makes the illumination effect of the entire module unstable and affects the service life. [New content] In view of this, this creation is to provide a superior heat dissipation and moisture-proof performance, which can make the luminescent wafer have a more stable illuminating effect, and the LED package structure with longer service life is improved, and its main purpose is . 3 M439904 is a light-emitting diode package structure of the above, comprising a heat-dissipating substrate and a light-emitting surface 4, wherein the surface of the heat-dissipating substrate is integrally formed with at least one reflective cup, and is disposed on the substrate and outside the reflective cup. There is an insulating layer and a circuit layer. The insulating layer extends along the outer side of the reflective cup to isolate the reflective cup from the circuit layer. The bottom of the reflective cup passes through the wire and the peach line: electrical connection: Wherein, the illuminating wafer is directly connected to the heat dissipating substrate; directly passing through the heat dissipating substrate to accelerate the heat dissipation; and transmitting = separately setting the reflecting cup, and the close upper potential of the combination between the reflecting cup and the substrate = its == ideal 'reflex cup of the present invention The scatter substrate is: the body structure' can avoid the problem; the heat dissipation and _ superior performance can make the illuminating wafer have more stable illuminating effect and longer service life. According to the above feature, the depth of the reflecting cup is 2 to 10 times the height of the light emitting wafer. According to the above feature, the reflecting cup is in the shape of a truncated cone, and between the inner side surface and the bottom surface of the reflecting cup is formed 9 to 150. Angle. According to the above technical feature, the inner side surface and the bottom surface of the reflecting cup are provided with a gold φ money layer. According to the above technical feature, the reflective cup is filled with an encapsulant mixed with phosphor powder. According to the above feature, the cup of the reflector cup is covered with a lens. According to the above features, the wiring layer is etched or stamped from a metal conductive material in accordance with a predetermined wiring structure. According to the above feature, the insulating layer is etched or stamped from a non-conductive material in accordance with a predetermined wiring structure. M439904 [Embodiment] For the purpose of this creation, please refer to the diagram and 杳 of this case for a clear understanding. The detailed description of the yoke example is as shown in the first figure. The light-emitting diode package structure created by the light-emitting diode sealing station includes heat dissipation: the substrate 105; wherein: the heat-dissipating substrate 101 and the reflective cup 1〇2 are integrated The insulating heat dissipation substrate HU is laminated with an insulating layer 1〇3 and a wiring layer ι4, and the insulation=03 separates the heat dissipation substrate m from the wiring layer 1Q4 by 1阙(10) the outer side surface of the two-shot cup!02 and extends upward. The reflector cup 1〇2 is isolated from the circuit layer 104 to prevent the circuit layer 104 from contacting the reflector cup 1〇2 resulting in a short circuit. The bottom of the f-reflecting cup 1〇2 is provided with a light-emitting chip 1〇5, and the light-emitting layer is electrically connected between the circuit layer 104 and the circuit layer 104 through two wires 106, and the working end is connected to the light-emitting chip 105, and the other end is connected. Connected to the circuit layer 1〇4, the scattering plate 1()1 in the embodiment is provided as the supporting body and the heat-dissipating body of the whole module for the light-emitting chip 1G5, and the heat generated by the light-emitting chip 105 directly passes through the heat dissipation, the board 1G1 The heat dissipation speed is accelerated, and the stability of the high module light output is facilitated; and the heat dissipation substrate 101 is thermally and electrically separated from the circuit layer 104, and the circuit layer 104 is not affected by heat, which is also improved in a certain range. The stability of the one-pole package structure; and the reflector of the conventional module is single, formed on the surface of the heat-dissipating substrate, and the tightness of the combination between the reflector cup and the heat-dissipating substrate is limited, so the waterproof and moisture-proof performance is limited, and this embodiment The reflecting cup 102 and the heat dissipating substrate 1〇1 are integrated, so there is no problem of poor airtightness, and better waterproof and moisture resistance; in addition, the heat dissipating substrate 101 and the reflecting cup 102 are integrally formed, saving The addition of a reflective cup on the heat-dissipating substrate is advantageous for improving productivity and reducing production costs. 5 Outside the material 9〇4 In combination with the second to sixth figures, the LED package structure can be made by the following method: First, take the heat sink substrate and press the preset large on the front side of the board. The shape of the reflector cup 102 is obtained, and the heat dissipation base with the reflection cup 1〇2 is obtained. The reflector cup 102 can be specifically formed by a process such as punching, drilling, milling or molding and etching, as shown in the second figure. In the second step, the insulating layer 103' is disposed on the surface of the heat dissipation substrate 101 except for the reflective cup 1〇2, and the insulating layer 103 is extended upward along the outer side surface 1〇21 of the reflective cup 1〇2 to the cup opening of the reflective cup 102. , as shown in the third picture. In the third step, the wiring layer 1〇4 is formed on the surface of the insulating layer 103. Specifically, the conductive material may be pressed/pasted on the surface of the insulating layer 1〇3, and then the material is punched/etched according to a preset circuit structure, where the circuit layer, the processing layer, or the insulating layer may be used. Simultaneous processing with the circuit layer to achieve a preset non-short structure, as shown in the fourth figure. In the fourth step, a light-emitting wafer 1〇5 is disposed at the bottom of the reflective cup 102, and a bonding wire 1〇6 is formed between the light-emitting wafer 105 and the wiring layer 104, as shown in the fifth figure. In the fifth step, the encapsulating compound mixed with the phosphor powder is infused into the reflecting cup 1G2 and the lens 107 is protected to protect the light-emitting chip 105 and the wire 106 as shown in the sixth drawing. In the present embodiment, the 'reflection cup 102 (four) degree can be set to the illuminating crystal > = the dimension of the 2G times 'the depth of the reflective cup 1Q2 is too small, which is disadvantageous to the direction of the adjustment 2', and the depth is too large, which increases the loss of light, so In the present embodiment, the depth of the shot glass 102 is preferably _ times the height of the light-emitting wafer 1 () 5, and more preferably about 5 times. The shape is preferably such that the round table 1 〇 23 forms a pure further, as in the second figure, the reflective cup 1 〇 2 shape 'the inner side surface 1022 (ie, the reflecting surface) and the bottom surface M439904 angle, the angle may be 90~150 . By rationally arranging the height of the reflecting cup 102 and the inclination angle of the inner side surface 1022, the directivity of the emitted light and the light output intensity can be effectively improved. In order to improve the heat dissipation performance of the LED package structure, the heat dissipation substrate 1〇1 is preferably made of a metal material H and the reflection cup 102 of the heat dissipation substrate 1Q1 is made of the same metal material. Compared with the conventional plastic reflector cup, the metal reflection cup The reflectivity of light is much higher, which is beneficial to improve the light efficiency of the module. Further, the inner side surface 1〇22 and the bottom surface 1023 of the reflective cup 1〇2 may also be splated with a metal plating layer, preferably silver plated, to further improve the reflectivity of the reflective cup 1〇2 to improve the light effect of the light emitting diode package structure. . In this embodiment, the reflective cup 102 may be encapsulated with a transparent gel mixed with phosphor powder to protect the light-emitting wafer 105 and obtain light of different colors. Further, the lens 1〇7 may be covered at the cup opening of the reflector cup 102 to simultaneously protect the light-emitting wafer 105 and the wires 106. Specifically, a separate lens 1〇7 may be disposed at the cup mouth of each reflective cup 1〇2, or a lens group of a contiguous structure may be disposed on the surface of the entire module. Of course, the lens and the counter in the lens group The ruthen cups 102 are arranged in a pair. The lens 107 may be a flat plate structure or a convex lens structure, and is specifically determined according to practical applications. Further, the lens 107 may be formed by molding at the cup of the reflecting cup 1〇2 by a mold, or may be formed by pouring a lens material such as silicone into the cup and performing a drying process. Further, the refractive index of the transparent rubber mixed with the fluorescent powder is higher than the refractive index of the lens 1〇7, which is advantageous for improving the light extraction efficiency. In this embodiment, the surface of the wiring layer 104 may be subjected to surface treatment, such as providing a metal plating layer, a soldering layer or a solderable layer, etc., so that the wiring 1〇6 is better combined with the wiring layer 1〇4. The light-emitting diode package structure provided by the present invention is suitable as a light-emitting component, and the fluorescent lamp shown in FIG. 7 can be used as a light-emitting component, and a single light-emitting diode package structure 201 can be used as a light-emitting component. The plurality of light-emitting body package structures 201 are arranged in a predetermined manner and then mounted as light-emitting members in the lamp cylinder 202 of the lighting device. As described above, the present invention provides a better and feasible LED package, and the application of the patent is submitted according to the law; the technical content of the creation and the "the temple has been revealed as above" but familiar with the technology. The person may still make a variety of (4) _ box god replacements and modifications based on the disclosure of this creation (4). Therefore, the protection feu of this creation should not be limited to those disclosed in the examples, but should include all kinds of replacements and The modification is covered by the patent scope of the following. [Simplified illustration of the diagram] The first diagram is a schematic diagram of the cross-sectional structure of the LED package structure in the creation. The second to sixth diagrams are in this creation. Schematic diagram of the process of the light-emitting diode package structure. The seventh figure is a schematic diagram of the structure of the lighting device in the present creation. [Main component symbol description] Heat-dissipating substrate 101 Reflecting cup 102 Outer side 1021 M439904 Inner side 1022 Bottom surface 1023 Insulation layer 103 Circuit layer 104 illuminating wafer 105 wire 106 lens 107 light emitting diode package structure 201 lamp 202