五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種以擦拭方式來清潔光罩之光罩清潔裝置 ，特別係指一種可有效去除附著於光罩任一側凸緣及於 凸緣側之外框側邊上微粒子與霧化汙潰之光罩清潔裝置 〇 【先前技術】 [0002] 當進入世紀，人類生活已經進入了數位時代的領域中， 現今許多人類生活周遭的物品、用具均以數位化高科技 產品取而代之，不僅帶給人們許多方便，也同時得以享 受高科技的文明進步成果，而在數位化的時代中，大多 數電器物品、用具都與數位科技有關係甚或直接以高科 技IC晶片進行操控，以達自動化目的，所以有人宣稱1C 晶片為產業之母’而1C晶片是由極精密的積體電路組成 ，其製造過程是利用光罩在無塵室的環境中使用高精密 度的機台對矽晶圓進行高精密度的積層作業來完成，其 機台、廠房等製造成本是非常高昂的，因此在製造晶圓 的過程中，產品良率可以決定一間半導體工廠獲利與否 ，因此致力於提高產品的良率是每一間半導體工廠經營 者最重要的課題。 [0003] 而影響晶圓良率中最重要的因素其中一項即為光罩是否 有遭受到污染，若光罩上出現微塵粒子，會使得受污染 之光罩用於丰導體微影製程時，會於晶圓上產生相對應 的缺陷（Defect)，是以，為了保持光罩之清潔，一般會 於光罩上設置有光罩護膜（Pellicle)，以防止微塵粒子 表單編號A0101 第3頁/共16頁 M424516 沾附在光罩上，而光罩護膜為透過框架支撐而與光罩保 持一距離，使落在光罩上之微塵粒子收集在光罩護膜上 ，微影製程因光罩護膜產生相當程度成像失真，使得該 微塵粒子不至影響原本微影製程。 [0004] 習用光罩清洗方法，其係藉由人工方式針對一光罩之表 面作一潔淨處理。一清潔人員將該光罩穩固的置放於一 架體上，並藉由一清洗液[例如：丙酮、乙醇及去離子水 等]沖洗該光罩表面，同時以一刷具刷除該光罩表面之顆 粒物質；接著，再次以該清洗液沖洗該光罩之表面，如 此重複數次上述清潔步驟後再對該光罩進行乾燥，藉此 ，可去除光罩表面之雜質或殘餘物，進而確保光罩表面 之潔淨度。 [0005] 一般而言，上述習用光罩之清洗方法具有下列缺點，例 如：各清潔人員於清洗該光罩時需長時間暴露於該清洗 液之工作環境下，極易因吸入或直接接觸該化學物質， 而影響該清潔人員之身體健康；另外，該清洗液通常係 為有機溶劑，需集中管理處置，因此必須額外增設廢液 收集裝置，以避免隨意放流造成污染。基於上述原因， 其確實有必要進一步改良上述習用光罩清洗方式。 [0006] 本創作即基於上述目前常見缺失予以總體考量後，希冀 以本創作所提供之光罩清潔結構可同時達到保護清潔人 員人身安全、同樣能維持光罩清潔程度、且可迅速且有 效的縮短清潔時間，俾利半導體工廠使用且進一步可達 提升半導體製程良率之功效。 【新型内容】 表單编號A0101 第4頁/共16頁 [0007] 為了解決上述問題，本創作之一主要目的係在提供一種 以擦拭方式清潔光罩之裝置，其係利用浸潤濕式清潔區 中擦拭布，並同時利用水平位移組及清洗夾頭組將待清 潔光罩於水平位移組所形成軌道上來回移動，俾利光罩 清潔裝置可直接以浸潤擦拭布擦拭光罩任一側凸緣及於 凸緣側之外框側邊，俾能有效地將微粒及霧化汙潰去除 ，而後隨即將待清潔光罩移至乾式清潔區，此時則以乾 式清潔區上乾擦拭布進行擦乾表面水潰動作，使清潔完 成光罩不致留下清洗水痕或汙潰之光罩清潔裝置。 [0008] 本創作之另一主要目的在於提供一具溼式清潔區與乾式 清潔區兩階段清潔區來進行光罩清潔之光罩清潔裝置， 其可有效清潔光罩任一側凸緣及於凸緣側之外框侧邊上 所附著微粒或霧化污潰，且清潔後不會殘留清洗水痕或 霧化汙潰之裝置。 [0009] 本創作之另一主要目的在於提供一光罩清潔裝置，其可 直接將沾附於光罩任一側凸緣表面之微粒與霧化汙潰進 行擦拭動作並將之移除，亦可同步清潔光罩凸緣側之外 框側邊，同時清潔兩者，有助於提升清潔效率。 [0010] 本創作之再一主要目的在於提供一光罩清潔裝置可直接 將光罩表面微粒與霧化汙潰直接擦拭乾淨，且不使用到 大量有機清潔液，不會產生大量待處理廢液，於維持光 罩清潔效果前提下，同時可達維持環境安全性，且可降 低處理成本之功效。 [0011] 根據上述目的，本創作提供一種光罩清潔裝置，其包括 :一框架、一水平位移組，係位於框架之上侧，由一對 表單編號A0101 第5頁/共16頁 M424516 傳輸軌道所形成、一清洗夾頭組，係位於水平位移組上 方，與水平位移組的兩端枢接、一清潔區，係位於水平 位移組所形成傳輸轨道中，其係由清潔區一侧之溼式清 潔區，及相對另一側之乾式清潔區所組成、一點膠機， 係位於清潔區下方，係用於控制清潔區中溼式清潔區之 出水量、一光罩升降組，係位於框架之一侧邊，並係採 機械作動方式升降。 [0012] 藉由本創作所提供之光罩清潔裝置，可有效達成清潔光 罩任一側凸緣及於凸緣側之外框側邊上所附著微粒或霧 化污潰，且清潔後不會殘留清洗水痕或霧化汙潰之功效 【實施方式】 [0013] 為使本創作所運用之技術内容、創作目的及其達成之功 效有更完整且清楚的揭露，茲於下方詳細說明之，並請 一併參閱所揭露之圖示及圖號。 [0014] 請參閱第1圖為本創作之一具體實施例，一光罩清潔裝置 (10)，其主體結構包括：一框架（11)、一水平位移組 (20)，係位於框架（11)之上側，由一對傳輸轨道（21 )所形成、一清洗夾頭組（30)，係位於水平位移組（20) 上方，與水平位移組（20)的兩端樞接、一清潔區（40)， 係位於水平位移組（20)所形成傳輸軌道（21)中，其係 由清潔區（40)—侧之溼式清潔區（50)，及相對另一側之 乾式清潔區（60)所組成、一點膠機（70)，係位於清潔區 (40)下方，係用於控制清潔區（40)中溼式清潔區（50)之 出水量、一光罩升降組（80)，係位於框架（11 )之一側 表單编號A0101 第6頁/共16頁 邊，並係採機械作動方式升降。 [0015] 現輔以所揭露圖式並將光罩（90)清潔流程說明如下：首 先將待清潔光罩（90)置放於光罩升降組（80)上，續將清 洗夾頭組（30)移至光罩升降組（80)正上方並夾取光罩 (90)，而清洗夾頭組（30)初始所夾取光罩（90)位置即決 定待清潔區域大小，而水平位移組（20)是採螺桿帶動方 式作動，螺桿作動同時可帶動清洗夾頭組（30)，並輸送 待清潔光罩（90)至清潔區（40)中，進行清潔動作。 [0016] 針對決定光罩（90)待清潔區域可參照第5圖所示，此圖式 為本創作之光罩清潔裝置之光罩與清潔區相對位置示意 圖，從中可觀察到光罩（90)清潔主要位置在於光罩（90) 任一侧凸緣及於凸緣側之外框（100)側邊，而光罩（90) 凸緣側清潔區域大小則係由清洗夾頭組（30)初始所夾取 位置即予以界定清潔區域。 [0017] 接著請參照第2圖所示，當清潔光罩（90)程序開始後，即 以清洗夾頭組（30)將待清潔光罩（90)首先移至由乾式清 潔區（60)及溼式清潔區（50)所共同組成之清潔區（40)中 進行清潔動作，清潔程序首先係先將待清潔光罩（90)移 至溼式清潔區（50)中，接著請參照第3圖，其中清潔區 (40)中溼式清潔區（50)，係由二溼製程單元（51)所組成 ，溼製程單元（51)則係由一出水頭（52)、一擦拭布（53) 、及一排水裝置（54)所組成，且二溼製程單元（51)係呈 相對方向配置。 [0018] 進行清潔程序時，溼製程單元（51)之出水頭（52)會先出 水約0.5〜lcc，蔣擦拭布（53)潤溼後，續進行光罩（90) 表單編號A0101 第7頁/共16頁 M424516 清潔動作，擦拭布（53)材質則可能係選用自具吸收性、 且不產生微粒或纖維剝落之無塵布、無塵紙等，本處並 不加以限制，此時係將已夹取光罩（90)之清洗夾頭組 (30)於水平位移組（20)所形成之傳輸軌道（21)上，採 來回移動方式清潔，先把待清潔光罩（90)在溼式清潔區 (50)上，以浸潤之擦拭布（53)進行來回擦拭動作，續運 送至乾式清潔區（60)，再進行將多餘水潰去除之擦拭動 作，清潔完畢後檢測結果顯示光罩（90)可達於每立方英 呎下僅餘0. 5/i m粒徑大小微塵數目小於一顆之乾淨程度 ，亦即一般無塵室所謂之class 1等級。 [0019] 於溼式清潔區（50)中，出水頭（52)出水量係由點膠機 (70)所控制，每次光罩（90)清潔所使用之去離子水（DI water)出水量約為0.5〜lcc，出水量若太多可能會滲入 光罩（90)上圖形區，而光罩（90)圖形一旦被破壞，光罩 (90)即等於已報廢無法再使用，故出水頭（52)每次出水 量必須小心控制。 [0020] 而於溼式清潔區（50)中之排水裝置（54)，係採取吸收或 排除水分方式，將過多水分去除，且於去除水分時可同 時進行抽氣作用，避免水滴滲進光罩（90)圖形區，且擦 拭布（53)係採上下框互相卡合方式將其繃緊安置，俾利 於維持光罩（90)清潔過程中擦拭布（53)之張力，使每次 光罩（90)來回擦拭下，擦拭布（53)張力得以維持一致。 [0021] 接著請參考第4圖所示，為本創作之乾式清潔區（60)，本 區係由二乾製程單元（61)所組成，而乾製程單元（61)係 由一擦拭布（53)、及一排水裝置（54)所組成，且二乾製 表單编號A0101 第8頁/共16頁 程單元（61)同樣係呈相對方向配置。 [0022] 乾式清潔區（60)中排水裝置（54)同樣可採吸收或排除水 分方式，將光罩（90)表面上所餘水分去除，且於去除水 分時可同時進行抽氣作用，避免水滴滲進光罩（90)圖形 區，俾利保護光罩（90)之用，且擦拭布（53)係採上下框 互相卡合方式將其繃緊安置，俾利於維持光罩（90)清潔 過程中擦拭布（53)之張力，使每次光罩（90)來回擦拭下 ，擦拭布（53)張力得以維持一致。 [0023] 更值得一提的是此處之清潔區（40)設計，中央挖空部位 乃是為了防止有已被移除之多餘微粒沉降其上，當光罩 清潔裝置（10)操作時，不慎被氣流揚起成為揚塵，而影 響到清潔完成光罩（90)之清潔度。 [0024] 本創作所提及之光罩清潔裝置（10)係光罩（90)整體清洗 流程之一部分，後續可以在加上風刀、水刀及各種清潔 裝置作更完整處理，俾利後續光罩（90)清潔程序更為完 整。 [0025] 雖然本創作以前述之較佳實施例揭露如上，然其並非用 以限定本創作，任何熟習相似技藝者，在不脫離本創作 之精神和範圍内，當可作些許之更動與潤飾，因此本創 作之專利保護範圍須視本說明書所附之申請專利範圍所 界定者為準。 【圖式簡單說明】 [0026] 第1圖為本創作之光罩清潔裝置的整體結構示意圖； [0027] 第2圖為本創作之光罩清潔裝置的清潔區示意圖； 表單編號A0101 第9頁/共16頁 M424516 [0028] 第3圖為本創作之光罩清潔裝置的清潔區之溼式清潔區 部位之局部示意圖； [0029] 第4圖為本創作之光罩清潔裝置之清潔區中的乾式清潔 區部位局部不意圖， [0030] 第5圖為本創作之光罩清潔裝置的光罩與清潔區相對位 置示意圖。 【主要元件符號說明】 [0031] 光罩清潔裝置10 [0032] 框架 11 [0033] 水平位移組20 [0034] 軌道 21 [0035] 清洗夾頭組30 [0036] 清潔區40 [0037] 溼式清潔區50 [0038] 乾式清潔區60 [0039] 點膠機70 [0040] 光罩升降組80 [0041] 溼製程單元51 [0042] 出水頭52 [0043] 擦拭布53 [0044] 排水裝置54 表單编號A0101 第10頁/共16頁 M424516 [0045] 乾製程單元61 [0046] 光罩 90 [0047] 外框 100V. New description: [New technical field] [0001] The present invention relates to a reticle cleaning device for cleaning a reticle by wiping, in particular to an effective removal of a flange attached to either side of the reticle and On the side of the frame on the side of the flange, the granule cleaning device for the microparticles and the atomization of the rim is 〇 [Prior Art] [0002] When entering the century, human life has entered the field of digital age, and many of the things around human life today And the use of digital high-tech products instead, not only bring people a lot of convenience, but also enjoy the high-tech civilization progress, and in the digital age, most electrical appliances, appliances are related to digital technology or even Directly controlled by high-tech IC chips for automation purposes, it is claimed that 1C wafers are the mother of the industry' and 1C wafers are composed of extremely sophisticated integrated circuits, which are manufactured using a photomask in a clean room environment. The high-precision machine is used to perform high-precision lamination work on the silicon wafer, and the manufacturing cost of the machine, factory, etc. is Often high, so the process of manufacturing a wafer, the product yield can decide a semiconductor factory profit or not, and therefore committed to improving the product yield is between each semiconductor plant operators the most important issue. [0003] One of the most important factors affecting wafer yield is whether the mask is contaminated. If dust particles appear on the mask, the contaminated mask will be used in the lithography process. A corresponding defect (Defect) is generated on the wafer. Therefore, in order to keep the reticle clean, a reticle film is generally provided on the reticle to prevent the dust particle form number A0101. Page / Total 16 pages M424516 is attached to the reticle, and the reticle film is supported by the frame to maintain a distance from the reticle, so that the dust particles falling on the reticle are collected on the reticle film, and the lithography process Because the reticle film produces a considerable degree of imaging distortion, the dust particles do not affect the original lithography process. [0004] A conventional reticle cleaning method is performed by manually cleaning a surface of a reticle. A cleaning person securely mounts the reticle on a frame and rinses the surface of the reticle with a cleaning solution [eg, acetone, ethanol, deionized water, etc.] while brushing the light with a brush a particulate material on the surface of the cover; then, the surface of the photomask is again washed with the cleaning liquid, and the cleaning step is repeated several times, and then the mask is dried, thereby removing impurities or residues on the surface of the mask. In turn, the cleanliness of the reticle surface is ensured. [0005] In general, the cleaning method of the conventional reticle has the following disadvantages, for example, each cleaning person needs to be exposed to the working environment of the cleaning liquid for a long time when cleaning the reticle, and is easily exposed by inhalation or direct contact. The chemical substances affect the health of the cleaning personnel. In addition, the cleaning liquid is usually an organic solvent and needs to be managed centrally. Therefore, an additional waste liquid collection device must be added to avoid contamination by random discharge. For the above reasons, it is indeed necessary to further improve the conventional reticle cleaning method described above. [0006] This creation is based on the above-mentioned common shortcomings, and it is hoped that the reticle cleaning structure provided by this creation can simultaneously protect the personal safety of the cleaning personnel, also maintain the opaque degree of the reticle, and can be quickly and effectively Reduced cleaning time, used by the Kennedy Semiconductor factory and further enhanced the efficiency of semiconductor process. [New Content] Form No. A0101 Page 4 of 16 [0007] In order to solve the above problems, one of the main purposes of the present invention is to provide a device for cleaning a reticle by wiping, which utilizes a dip-wet cleaning zone. The wiping cloth is used to simultaneously move the reticle to be cleaned on the track formed by the horizontal displacement group by using the horizontal displacement group and the cleaning collet group, and the blister cleaning device can directly wipe the flange of either side of the reticle with the immersion wiping cloth. And on the side of the outer side of the flange side, the crucible can effectively remove the particles and the atomization, and then the mask to be cleaned is moved to the dry cleaning area, and then the dry cleaning cloth is wiped with a dry cleaning cloth. The surface of the dry surface is broken, so that the cleaning of the reticle does not leave a reticle cleaning device that cleans the water marks or stains. [0008] Another main object of the present invention is to provide a reticle cleaning device for cleaning a reticle with a two-stage cleaning zone of a wet cleaning zone and a dry cleaning zone, which can effectively clean the flange on either side of the reticle and The particles attached to the side of the outer side of the flange side are atomized and stained, and the device for cleaning water marks or atomization and staining does not remain after cleaning. [0009] Another main object of the present invention is to provide a reticle cleaning device that can directly wipe and remove particles and atomization stains adhering to the flange surface on either side of the reticle. Simultaneous cleaning of the side edges of the rim of the reticle side of the hood and cleaning both can help improve cleaning efficiency. [0010] Another main object of the present invention is to provide a reticle cleaning device that can directly wipe the surface of the reticle and the atomized smear directly, without using a large amount of organic cleaning liquid, and does not generate a large amount of waste liquid to be treated. Under the premise of maintaining the glazing cleaning effect, it can maintain environmental safety and reduce the cost of processing. [0011] In accordance with the above object, the present invention provides a reticle cleaning apparatus comprising: a frame, a horizontal displacement group, located on the upper side of the frame, and transmitted by a pair of form numbers A0101, 5/16, M424516 The formed and cleaned chuck group is located above the horizontal displacement group, and is pivotally connected to both ends of the horizontal displacement group, and a cleaning zone is located in the transmission track formed by the horizontal displacement group, which is wetted by the cleaning zone side. The cleaning zone and the dry cleaning zone on the opposite side of the other side are located below the cleaning zone and are used to control the amount of water in the wet cleaning zone in the cleaning zone. One side of the frame is lifted by mechanical action. [0012] With the reticle cleaning device provided by the present invention, it is possible to effectively achieve the attachment of the flange on either side of the reticle and the particles on the side of the frame on the flange side, or the atomization and staining, and the cleaning will not occur. The effect of residual washing water marks or atomization and staining [Embodiment] [0013] In order to make the technical content, the purpose of creation and the effect achieved by the present invention more complete and clear, it is explained in detail below. Please also refer to the illustrations and drawing numbers disclosed. [0014] Please refer to FIG. 1 for a specific embodiment of the present invention. A reticle cleaning device (10) has a main structure comprising: a frame (11) and a horizontal displacement group (20) located at the frame (11). On the upper side, formed by a pair of transport rails (21), a cleaning chuck set (30), located above the horizontal displacement group (20), pivotally connected to both ends of the horizontal displacement group (20), a cleaning zone (40), located in the transport track (21) formed by the horizontal displacement group (20), which is a wet cleaning zone (50) on the side of the cleaning zone (40), and a dry cleaning zone on the opposite side ( 60) The composition, a point glue machine (70), located below the cleaning zone (40), is used to control the amount of water in the wet cleaning zone (50) in the cleaning zone (40), a reticle lifting group (80) ), located on one side of the frame (11), form number A0101, page 6 / total 16 pages, and is lifted by mechanical action. [0015] The present invention is supplemented by the disclosed embodiment and the cleaning process of the reticle (90) is described as follows: First, the reticle (90) to be cleaned is placed on the reticle lifting group (80), and the cleaning chuck group is continued ( 30) Move to the reticle lifting group (80) directly above and grab the reticle (90), and the position of the reticle (90) initially picked up by the cleaning chuck group (30) determines the size of the area to be cleaned, and the horizontal displacement The group (20) is driven by a screw driving method, and the screw actuator can simultaneously drive the cleaning chuck group (30), and transport the reticle (90) to be cleaned into the cleaning area (40) for cleaning operation. [0016] For determining the area to be cleaned by the reticle (90), reference may be made to FIG. 5, which is a schematic view of the relative position of the reticle and the cleaning area of the reticle cleaning device of the present invention, from which the reticle can be observed (90). The main position of the cleaning is on the flange of either side of the reticle (90) and the side of the frame (100) on the flange side, and the size of the cleaning area on the flange side of the reticle (90) is determined by the cleaning chuck set (30). The initial gripping position defines the cleaning area. [0017] Next, referring to FIG. 2, after the cleaning mask (90) program is started, the cleaning mask (90) is first moved to the dry cleaning area (60) by the cleaning chuck group (30). And the cleaning zone (40) composed of the wet cleaning zone (50) performs a cleaning operation, and the cleaning procedure first moves the reticle (90) to be cleaned into the wet cleaning zone (50), and then refers to the 3, wherein the wet cleaning zone (50) in the cleaning zone (40) is composed of a wet processing unit (51), and the wet processing unit (51) is composed of a water outlet (52) and a wiping cloth ( 53), and a drainage device (54), and the two wet process units (51) are arranged in opposite directions. [0018] When the cleaning process is performed, the water outlet head (52) of the wet process unit (51) will first discharge water by about 0.5 to 1 cc, and after the Jiang wipe cloth (53) is wetted, the mask (90) will continue to be continued. Form No. A0101 No. 7 Page / A total of 16 pages M424516 cleaning action, wipe cloth (53) material may use self-absorptive, non-particles or fibers peeling off the dust-free cloth, dust-free paper, etc., this is not limited, this time is The cleaning collet group (30) of the reticle (90) is clamped on the transmission track (21) formed by the horizontal displacement group (20), and is cleaned by moving back and forth, and the reticle (90) to be cleaned is first placed at On the wet cleaning area (50), wipe the back and forth with the infiltrated wiping cloth (53), continue to transport to the dry cleaning area (60), and then wipe the excess water to remove the cleaning action. After the cleaning is completed, the detection result shows light. The cover (90) can reach only 0. 5/im particle size and the number of fine dust is less than one cleanness, that is, the so-called class 1 grade of the general clean room. [0019] In the wet cleaning zone (50), the water output of the water outlet (52) is controlled by a dispenser (70), and each time the mask (90) is cleaned, the DI water is used for cleaning. The amount of water is about 0.5~lcc. If the amount of water is too much, it may penetrate into the pattern area on the mask (90). Once the pattern of the mask (90) is destroyed, the mask (90) is equal to the scrapped and can no longer be used. The amount of water per head (52) must be carefully controlled. [0020] The drainage device (54) in the wet cleaning zone (50) adopts a method of absorbing or removing moisture to remove excess moisture, and simultaneously extracting air when removing moisture to prevent water droplets from seeping into the light. The cover (90) is patterned, and the wiper (53) is placed in a manner that the upper and lower frames are engaged with each other to facilitate the tension of the wiper (53) during the cleaning process of the reticle (90). When the cover (90) is wiped back and forth, the tension of the wiper (53) is maintained. [0021] Next, please refer to FIG. 4, which is a dry cleaning zone (60) of the present invention. The zone is composed of a two-dry process unit (61), and the dry process unit (61) is composed of a wiping cloth ( 53), and a drainage device (54), and the two dry form number A0101 page 8 / total 16 page unit (61) are also arranged in opposite directions. [0022] The drainage device (54) in the dry cleaning zone (60) can also adopt the method of absorbing or removing moisture, removing the residual moisture on the surface of the reticle (90), and simultaneously performing the pumping action when removing moisture, thereby avoiding The water droplets penetrate into the pattern area of the reticle (90) to protect the reticle (90), and the squeegee (53) is tightly placed by the upper and lower frames, so as to maintain the reticle (90). The tension of the wiper (53) during the cleaning process is such that each time the mask (90) is wiped back and forth, the tension of the wiper (53) is maintained. [0023] What is more worth mentioning is the design of the cleaning zone (40) here, the central hollowing site is to prevent the excess particles that have been removed from sinking thereon, when the reticle cleaning device (10) is operated, Inadvertently lifted by the airflow to become dust, which affects the cleanliness of the finished reticle (90). [0024] The reticle cleaning device (10) mentioned in the present invention is part of the overall cleaning process of the reticle (90), and can be further processed by adding air knives, water knives and various cleaning devices. The reticle (90) cleaning procedure is more complete. [0025] Although the present invention has been disclosed in the foregoing preferred embodiments, it is not intended to limit the present invention, and any skilled person can make some changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of this creation is subject to the definition of the scope of the patent application attached to this specification. BRIEF DESCRIPTION OF THE DRAWINGS [0026] Fig. 1 is a schematic view showing the overall structure of a reticle cleaning device of the present invention; [0027] Fig. 2 is a schematic view showing a cleaning area of the reticle cleaning device of the present invention; Form No. A0101, page 9 / Total 16 pages M424516 [0028] Fig. 3 is a partial schematic view of the wet cleaning area of the cleaning area of the reticle cleaning device of the present invention; [0029] Fig. 4 is a cleaning area of the reticle cleaning device of the present invention Part of the dry cleaning zone is not intended, [0030] Fig. 5 is a schematic view showing the relative position of the reticle and the cleaning zone of the reticle cleaning device of the present invention. [Main Component Symbol Description] [0031] Mask Cleaning Device 10 [0032] Frame 11 [0033] Horizontal Displacement Group 20 [0034] Track 21 [0035] Cleaning Collet Set 30 [0036] Cleaning Area 40 [0037] Wet Cleaning Zone 50 [0038] Dry Cleaning Zone 60 [0039] Dispenser 70 [0040] Mask Lifting Group 80 [0041] Wet Process Unit 51 [0042] Water Head 52 [0043] Wipe Cloth 53 [0044] Drainage Device 54 Form No. A0101 Page 10 of 16 M424516 [0045] Dry Process Unit 61 [0046] Photomask 90 [0047] Outer Frame 100
表單編號A0101 第11頁/共16頁Form No. A0101 Page 11 of 16