JP6038623B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL substrate, an FED (Field Emission Display) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate. The present invention relates to a substrate processing apparatus for processing a substrate and a solar cell substrate (hereinafter simply referred to as a substrate), and more particularly to a technique for removing various coatings such as a photoresist coating.

  Conventionally, as this type of apparatus, a processing tank for storing a processing liquid and immersing a substrate to perform cleaning and removing processing of a film, an overflow tank for collecting processing liquid overflowing from the processing tank, a processing tank and an overflow tank, A circulation pipe for supplying and circulating the treatment liquid to the treatment tank, a filter member provided so as to cover the upper part of the drain port of the overflow tank communicated with the circulation pipe, and the circulation pipe. Some include a circulation filter that removes particles in the processing liquid and a lifter that holds a plurality of substrates on which a photoresist film is deposited (see, for example, Patent Document 1).

  In the apparatus having such a configuration, for example, in a state where the stripping solution is stored and circulated in the processing tank and the overflow tank, a plurality of substrates coated with a photoresist film are placed on the lifter while the processing liquid is stored in the processing tank and the overflow tank. Immerse in the stripper. Then, by maintaining the state for a predetermined time, the photoresist film deposited on the substrate is peeled off. The stripped photoresist film is discharged along with the flow of the stripping solution from the processing tank to the overflow tank, and is captured by the filter member. Therefore, clogging of the circulation filter due to the fragments of the photoresist film can be prevented. Note that the peeled photoresist film floats in the processing tank as small fragments of several millimeters square or large fragments of several centimeters square.

JP 2002-96012 A

However, the conventional example having such a configuration has the following problems.
That is, the conventional apparatus has a problem that although the fragments of the photoresist film are captured by the filter member, the frequency of replacement of the filter member becomes high, and the filter member needs to be manually cleaned and maintenance becomes complicated. .

  In addition, there are cases in which fragments of the photoresist film are not discharged from the processing tank to the overflow tank, and there is a problem that the fragments of the photoresist film cannot be efficiently collected by the filter member provided in the overflow tank. . Small debris of the photoresist film is likely to be discharged in the liquid flow from the processing tank to the overflow tank, but in particular, large pieces of the photoresist film tend to be difficult to be discharged. Therefore, when large pieces of photoresist film remain in the processing solution of the processing tank, large pieces of photoresist film adhere to the substrate being processed, or when the substrate of the next lot is immersed in the processing tank. Adhering to the substrate may cause adverse effects.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the substrate processing apparatus which can collect | recover the fragments of a film easily and can perform maintenance easily.

  Another object of the present invention has been made in view of such circumstances, and is to provide a substrate processing apparatus capable of reliably discharging a piece of a film peeled from a substrate from a processing tank. is there.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate processing apparatus for performing a peeling process on a film attached to a substrate with a peeling liquid, storing a peeling liquid, and immersing the substrate for processing, An overflow tank that collects the stripping solution overflowing from the processing tank, a lifter that holds a plurality of substrates, can be raised and lowered over a processing position in the processing tank, and a standby position above the processing tank, and the overflow tank A net-like member disposed so as to cover the upper opening of the plate so as to be openable and closable. On the other hand, after the peeling process is performed, the mesh member is moved to a disposal position.

  [Operation / Effect] According to the first aspect of the present invention, the lifter is positioned at the processing position and the substrate is peeled off while the upper opening of the overflow tank is closed by the mesh member. Then, the coating film peeled off from the substrate floats in the processing tank and is discharged to the overflow tank side by the flow of the peeling liquid. At this time, since the debris of the discharged film is captured by the mesh member, if the upper opening of the overflow tank is opened by the mesh member, the debris of the film captured by the mesh member is discarded. Therefore, the fragments of the coating can be easily recovered and maintenance can be easily performed.

  In the present invention, there is further provided drive means for changing the posture of the mesh member over a collection position in which one surface of the mesh member is directed upward and a disposal position in which one surface of the mesh member is directed downward. It is preferable to provide (Claim 2).

  Since the posture of the mesh member is changed by the driving means between the collection position and the disposal position, the coating pieces can be easily discarded.

  In the present invention, the mesh member includes a rotation shaft in the longitudinal direction of the upper edge of the processing tank, and the driving means rotationally drives the rotation shaft according to the collection position and the disposal position. (Claim 3).

  The mesh member can be displaced between the collection position and the disposal position simply by rotating the rotation shaft of the mesh member with the driving means. Therefore, a complicated mechanism is not required and an increase in device cost can be suppressed.

  Further, in the present invention, a recovery container is further provided at a side of the overflow tank and below the recovery tank for recovering fragments of the coating falling from the mesh member when the mesh member is moved to the disposal position. (Claim 4).

  Since the fragments of the coating from the mesh member are collected by the collection container, it is possible to prevent particles resulting from the coating fragments from scattering.

  According to the substrate processing apparatus of the present invention, the lifter is positioned at the processing position and the substrate is peeled off in a state where the upper opening of the overflow tank is closed by the mesh member. Then, the coating film peeled off from the substrate floats in the processing tank and is discharged to the overflow tank side by the flow of the peeling liquid. At this time, since the debris of the discharged film is captured by the mesh member, if the upper opening of the overflow tank is opened by the mesh member, the debris of the film captured by the mesh member is discarded. Therefore, the fragments of the coating can be easily recovered and maintenance can be easily performed.

1 is an overall view showing a schematic configuration of a substrate processing apparatus according to Embodiment 1. FIG. It is a schematic diagram which shows the state which has a lifter in a standby position. It is a schematic diagram which shows the state which the lifter lowered to the processing position. It is a schematic diagram which shows during a peeling process. It is a schematic diagram which shows the state which the photoresist film has peeled from the board | substrate by peeling process. It is a schematic diagram which shows the state which raised the lifter to the standby position after the peeling process. It is a schematic diagram which shows the operation | movement which discards the fragment of the photoresist film adhering to the mesh member. It is a schematic diagram which shows the operation | movement which wash | cleans the mesh member of a lifter with a washing tank. 6 is an overall view showing a schematic configuration of a substrate processing apparatus according to Embodiment 2. FIG. It is a schematic diagram which shows the state which opened the auto cover. It is a schematic diagram which shows the state which moved the lifter to the processing position. It is a schematic diagram which shows during a peeling process. It is a schematic diagram which shows the state which finished the peeling process. It is a schematic diagram which shows the operation | movement which opens an auto cover. It is a schematic diagram which shows operation | movement of a squeezer. It is a schematic diagram which shows operation | movement of a squeezer. 10 is an overall view showing a schematic configuration of a substrate processing apparatus according to Embodiment 3. FIG. It is a schematic diagram which shows during a peeling process. It is a schematic diagram which shows during a peeling process. FIG. 10 is an overall view showing a schematic configuration of a substrate processing apparatus according to a fourth embodiment. It is a schematic diagram which shows during a peeling process. It is a schematic diagram which shows the state which started raising the lifter from the processing position.

  Various embodiments of a substrate processing apparatus according to the present invention will be described.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is an overall view illustrating a schematic configuration of the substrate processing apparatus according to the first embodiment. 2 is a schematic diagram showing a state where the lifter is in the standby position, FIG. 3 is a schematic diagram showing a state where the lifter is lowered to the processing position, and FIG. 4 is a schematic diagram showing that the peeling process is being performed. FIG. 5 is a schematic view showing a state where the photoresist film is peeled from the substrate by the peeling process, and FIG. 6 is a schematic view showing a state where the lifter is raised to the standby position after the peeling process. FIG. 7 is a schematic diagram showing an operation of discarding fragments of the photoresist film adhering to the mesh member, and FIG. 8 is a schematic diagram showing an operation of cleaning the mesh member of the lifter in the cleaning tank.

  The substrate processing apparatus according to the present embodiment performs a peeling process on the film deposited on the substrate W with a peeling liquid. In the following description, a photoresist film will be described as an example of the film, but the film in the present invention may be a film such as a passivation film, for example.

  The substrate processing apparatus includes a processing unit 1 for collectively performing a peeling process on a plurality of substrates W. The processing unit 1 stores a processing liquid such as pure water or a stripping liquid, and has a processing tank 3 having a size capable of accommodating a plurality of substrates W and a processing liquid overflowing from the upper edge of the processing tank 3 to the surroundings. An overflow tank 5 to be recovered and an outer container 7 surrounding the processing tank 3 and the lower side and the side of the overflow tank 5 are provided. The processing tank 3 has a rectangular shape in plan view, and an overflow tank 5 is provided on the outer side along each of the four sides.

  A lifter 9 is provided near the processing unit 1. The lifter 9 can be moved up and down over the “standby position” (the two-dot chain line in FIG. 1) that is above the processing tank 3 in the height direction and the “processing position” (the solid line in FIG. 1) that is inside the processing tank 3. It is configured. Further, the lifter 9 is configured to be movable in the horizontal direction at the standby position. Furthermore, the lifter 9 includes a back plate 11 extending along the side wall of the processing tank 3 and three support portions 13 extending in the horizontal direction (the front side of the paper) at the lower portion of the back plate 11. And. In the lifter 9, a scooping net portion 15 is attached to the lower surface of the three support portions 13.

  The scooping net portion 15 has a width at which both ends thereof extend beyond both side edges of the substrate W held by the lifter 9 and are inside the inner wall of the processing tank 3. Although it has the same shape, it has a size and shape that does not contact the inner wall of the treatment tank 3. The scooping net portion 15 is formed of a “net-like member” that allows the processing liquid to pass but does not allow the photoresist film peeled off from the substrate W to pass.

  The treatment tank 3 has jet pipes 17 attached to both sides of the bottom. Each ejection pipe 17 ejects the supplied processing liquid toward the center of the bottom surface of the processing tank 3. Four bubble supply pipes 19 are provided between the ejection pipes 17 and on the bottom surface of the processing tank 3. Each bubble pipe 19 supplies bubbles from the bottom of the processing tank 3.

  The overflow tank 5 is provided with a capturing part 21 at its upper edge. The capturing unit 21 captures fragments of the photoresist film included in the processing liquid overflowing from the processing tank 3. Specifically, the capture unit 21 includes a drive unit 23 disposed on the upper edge of the overflow tank 5 and a capture member 25 that is driven to swing by the drive unit 23 for each of the four sides of the processing tank 3. Yes. The capturing member 25 is formed of a “net member” similar to the scooping net portion 15 described above. The capturing member 25 is installed in the upper opening of the overflow tank 5 so as to be openable and closable. The capturing member 25 substantially covers the upper opening and has one surface directed upward (solid line in FIG. 1). The posture is controlled by the drive unit 23 over the “discard position” (the two-dot chain line in FIG. 1) where one side of the head is directed downward. The drive unit 23 includes, for example, an electric motor.

  The drive unit 23 described above corresponds to the “drive unit” in the present invention. The above-described overflow tank 5 does not necessarily have to be provided on the entire circumference of the processing tank 3, but it is preferable that substantially all of the processing liquid can be received at a place where the processing liquid overflows from the processing tank 3. In addition, it is desirable that the capturing member 25 of the capturing unit 21 is provided in substantially all paths from which the processing liquid overflows from the processing tank 3 to the overflow tank 5.

  The outer container 7 includes a collection container 27. The recovery container 27 is located outside and below the overflow tank 5 in the outer container 7, and receives the debris of the photoresist film that falls from the capture member 25 when the capture member 25 is moved to the disposal position. And collect. The collection container 27 has a container handle 29 erected at the top. The upper portion of the container handle 29 is locked to the outer container 7. The collection container 27 is disposed below the outer container 7 by the container handle 29 and is carried out of the outer container 7 by pulling the container handle 29 upward.

  The overflow tank 5 has a drain port 31 formed at the bottom. One end of the circulation pipe 33 is connected to the drain port 31 and the other end is connected to the ejection pipe 17. The circulation pipe 33 includes a circulation pump 35, a control valve 37, an in-line heater 39, and a circulation filter 41 in order from the upstream side that is the overflow tank 5 side. Further, between the circulation pump 35 and the control valve 37, one end side of the drainage pipe 43 is connected in communication. On the other end side of the drainage pipe 43, a drainage processing unit (not shown) is arranged. A control valve 45 is attached to the drainage pipe 43.

  One end side of the supply pipe 47 is connected to each bubble supply pipe 19 described above. The other application side of the supply pipe 447 is connected in communication with a nitrogen gas supply source 49. A control valve 51 is attached to the supply pipe 47.

  The bubble supply pipe 19 described above corresponds to the “bubble supply means” in the present invention.

  Each of the above-described units is centrally controlled by the control unit 53. Specifically, the control unit 53 controls the lifting and lowering operation of the lifter 9, the rotation operation of the capturing member 25 by the drive unit 23, the operation of the circulation pump 35, the temperature adjustment operation of the inline heater 39, and the opening and closing of the control valves 37, 45, 51. Be controlled. Although not shown, the control unit 53 also controls a processing liquid supply system that supplies a processing liquid such as pure water or a stripping liquid to the processing unit 1.

  In this embodiment, it is assumed that the cleaning tank 55 shown in FIG. 8 is arranged near the processing unit 1 described above. The cleaning tank 55 performs cleaning with a cleaning liquid such as pure water. The cleaning tank 55 includes a processing tank 3 and an overflow tank 5 as in the processing unit 1 described above.

  Next, the operation of the above-described substrate processing apparatus will be described with reference to FIGS. The treatment tank 3 has already stored a stripping solution whose temperature is adjusted to a predetermined temperature, and a plurality of substrates W to which a photoresist film is applied have already been immersed at least once to perform the stripping process. It is assumed that the stripped pieces ff of the stripped photoresist film are floating in the stripping solution stored in the tank 3. Further, it is assumed that the control valves 37, 45, 51 are closed and the capturing member 25 is in the collection position.

  The lifter 9 is in a standby position while holding a plurality of substrates W to which a photoresist film is applied (FIG. 2). The control unit 53 lowers the lifter 9 to the processing position. At this time, as the lifter 9 is lowered, the stripping solution in the processing tank 3 passes from the bottom to the top of the scooping net 15, but the photoresist film fragments ff floating in the stripping solution are removed from the lifter 9. Those larger than the mesh of the scooping net 15 cannot pass through the scooping net 15 and are driven to the bottom of the processing tank 3 (FIG. 3). Therefore, it is possible to prevent the fragments ff of the photoresist film remaining in the processing tank 3 from adhering to the substrate W.

  Next, the control unit 53 opens the control valve 37 and operates the circulation pump 35 and the in-line heater 39 to circulate the stripping solution stored in the processing tank 3 through the circulation pipe 33 while adjusting the temperature to a predetermined temperature. Furthermore, the control part 53 opens the control valve 51, and supplies the bubble of nitrogen gas from the bottom part of the processing tank 3 from the bubble supply pipe | tube 15 (FIG. 4). Due to the circulation of the stripping solution, a liquid flow from the bottom of the processing tank 3 toward the liquid surface is generated inside the processing tank 3. Furthermore, since the bubbles from the bubble supply pipe 19 rise while entering between the substrates W, the peeling of the photoresist film attached to the substrate W can be promoted. Moreover, the photoresist film peeled from the substrate W can be finely divided by bubbles. If this stripping process is maintained for a predetermined time, the photoresist film deposited on the substrate W is stripped, and fragments of the photoresist film ff are discharged to the overflow tank 5 side in a liquid flow. The discharged photoresist film fragments ff are captured by the capture member 25 located at the collection position (FIG. 5). Therefore, a fragment ff having a size larger than a predetermined size of the photoresist film does not flow into the overflow tank 5. Further, the fragment ff of the photoresist film that has not been put on the liquid flow stays in the stripping solution of the processing tank 3.

  After the peeling process for a predetermined time, the control unit 53 raises the lifter 9 from the processing position to the standby position (FIG. 6). At this time, the debris ff of the photoresist film floating in the portion above the scooping net 15 in the stripping solution of the processing tank 3 is scooped up by the scooping net 15 and collected. At this time, the control unit 53 may close the control valves 37 and 51 and stop the circulation pump 35 and the inline heater 39 (FIG. 6).

  After the lifter 9 has been lifted to the standby position, the control unit 53 operates the drive unit 23 to rotate the capture member 25 from the collection position to the disposal position (FIG. 7). Then, since one surface of the capture member 25 faces downward, the capture member 25 has its photoresist coating fragments ff dropped and collected in the collection container 27. Therefore, the fragments ff of the photoresist film captured by the capturing member 25 can be easily recovered, and maintenance can be easily performed. When the photoresist coating fragments ff have accumulated, the collection container 27 is taken out from the outer container 7 by holding the container handle 29 by the operator, and the photoresist coating fragments ff accumulated therein are discarded.

  Next, after transferring the plurality of substrates W held by the lifter 9 to another apparatus or the like, the control unit 53 moves the empty lifter 9 to the cleaning tank 55 at a position different from the processing unit 1. Let Then, after the lifter 9 is moved to the processing position of the cleaning tank 55, the cleaning liquid overflows from the processing tank 3 of the cleaning tank 55 to the overflow tank 5. Thereby, the fragments ff of the photoresist film captured by the scooping net portion 15 are pushed up by the cleaning liquid and discharged from the processing tank 3 to the overflow tank 5. Therefore, the photoresist film debris ff captured by the scooping net 15 can be washed away with the cleaning liquid, so that the photoresist film debris ff is removed from the processing tank 3 of the processing section 1 during the next processing of the substrate W. Can be prevented.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the first embodiment described above, the lifter 9 is provided with the scooping net 15, the overflow tank 5 is provided with the capturing part 21, and the treatment tank 3 is provided with the bubble supply pipe 19. However, the present invention does not necessarily include these three configurations at the same time, and may be configured to include only one of these.

  (2) In the first embodiment described above, the collection container 27 is detachable from the outer container 7 by the container handle 29, but the collection container 27 may be fixedly provided to the outer container 7.

  (3) In the first embodiment described above, the capture member 25 is driven to rotate (swing) by the drive unit 23. For example, the posture of the capture member 25 is changed between the collection position and the discard position by an air cylinder and a link mechanism. You may comprise as follows.

  (4) In the first embodiment described above, the scooping net portion 15 is attached to the lower surface of the support portion 13, but the attachment position of the scooping net portion 15 is not limited as long as it is below the lower edge of the substrate W.

Next, Embodiment 2 of the present invention will be described with reference to the drawings.
FIG. 9 is an overall view illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment. FIG. 10 is a schematic view showing a state where the auto cover is opened, FIG. 11 is a schematic view showing a state where the lifter is moved to the processing position, and FIG. 12 is a schematic view showing that the peeling process is being performed. FIG. 13 is a schematic diagram showing a state after the peeling process is finished, FIG. 14 is a schematic diagram showing an operation of opening the auto cover, and FIG. 15 is a schematic diagram showing an operation of the squeezer. FIG. 16 is a schematic diagram showing the operation of the squeezer.

  In addition, a different part from Example 1 mentioned above is demonstrated, and it abbreviate | omits about detailed description by attaching | subjecting the same code | symbol about the structure similar to Example 1. FIG.

  The processing section 1A in the present embodiment does not include the outer container 7, the lifter 9A does not include the scooping net section 15, and the overflow tank 5 does not include the capturing section 21. It differs from the configuration. On the other hand, the processing unit 1 </ b> A includes an auto cover 57. The auto cover 57 includes a pair of cover members 59. The pair of cover members 59 are configured to be movable between a “closed position” that covers the top of the processing tank 3 and an “open position” that opens the top of the processing tank 3. As shown by a two-dot chain line in FIG. 9, the movement is gradually displaced to the side in an inclined posture so that the fluctuation in height on the center side is small and the fluctuation in height on the end side is large. Done in

  The auto cover 57 is located slightly above the upper edge of the processing tank 3 with its lower surface spaced apart and is disposed over the overflow tank 5. The auto cover 57 has a squeezer 61 attached to the abutting portion of each cover member 59. The squeezer 61 includes an attachment member 63 attached to the cover member 59, and a squeeze portion 65 provided in a posture that is suspended from the cover member 59 by the attachment member 63. The squeeze part 65 is provided at a position where the squeeze part 65 is immersed in the surface layer of the stripping solution stored in the processing tank 3 in a state where the auto cover 57 is closed. On the other hand, when the auto cover 57 is opened, the squeeze unit 65 is moved so as to push the surface layer of the stripping solution stored in the processing tank 3 toward the overflow tank 5.

  The above-described auto cover 57 is driven and operated by the control unit 53.

  Next, the operation of the above-described substrate processing apparatus will be described with reference to FIGS.

  First, the controller 53 moves the auto cover 57 to the open position with the lifter 9A supporting the substrate W positioned at the standby position (FIG. 10). Then, after the lifter 9A is lowered to the processing position, the auto cover 57 is moved to the closing position (FIG. 11). Next, the controller 53 circulates the stripping solution between the processing tank 3 and the overflow tank 5 while adjusting the temperature of the stripping liquid, and further supplies bubbles to the processing tank 3. As a result, the photoresist film applied to the substrate W is stripped. The peeled photoresist film is carried to the surface layer of the processing tank 3 by riding on bubbles and a liquid flow (FIG. 12). However, not all of the fragments ff of the photoresist film are discharged to the overflow tank 5 and partly stays in the surface layer of the stripping solution stored in the processing tank 3 (FIG. 13).

  The controller 53 moves the auto cover 57 to the open position after the processing is finished and the circulation of the stripping solution and the supply of bubbles are stopped. At this time, as shown in FIGS. 14 to 16, when the auto cover 57 moves to the open position, the squeeze portion 65 of the squeezer 61 moves while being immersed in the surface layer of the stripping solution stored in the treatment tank 3. Then, the surface layer of the stripping solution is pushed to the overflow tank 5 side, and the debris ff of the photoresist film floating along with it is pushed out to the overflow tank 5 together with the surface layer of the stripping solution and discharged.

  Through the above-described operation, the fragments ff of the photoresist film peeled off from the substrate W can be reliably discharged from the processing tank 3.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the second embodiment described above, since the squeezer 61 is attached to the auto cover 57, it can be interlocked with the operation of the auto cover 57. Therefore, since the driving means for the squeezer 61 is not required, the apparatus cost can be suppressed. However, the squeezer 61 may be moved by another driving means. Thereby, the squeezer 61 can be operated regardless of the operation of the auto cover 57.

  (2) In the second embodiment described above, bubbles are generated from the bubble supply pipe 19, but the bubble supply pipe 19 may be omitted.

  (3) In contrast to the second embodiment described above, the overflow tank 5 may further include the capturing unit 21 according to the first embodiment. Thereby, the fragments ff of the coating extruded by the squeezer 61 can be easily recovered.

Next, Embodiment 3 of the present invention will be described with reference to the drawings.
FIG. 17 is an overall view illustrating a schematic configuration of the substrate processing apparatus according to the third embodiment. FIG. 18 is a schematic diagram showing the peeling process, and FIG. 19 is a schematic diagram showing the peeling process.

  In addition, about the structure similar to Example 1, 2 mentioned above, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  The processing unit 1 </ b> B in this embodiment does not include the squeezer 61 attached to the auto cover 57, but includes a solvent tank 69 so as to surround the bottom surface of the processing tank 3, and imparts ultrasonic vibration to the lower surface of the solvent tank 69. The second embodiment is different from the second embodiment described above in that the portion 67 is provided. The ultrasonic vibration applying unit 67 generates ultrasonic vibration. The solvent tank 69 transmits the ultrasonic vibration generated by the ultrasonic vibration applying unit 67 from the bottom surface of the processing tank 3 to the stripping solution stored in the processing tank 3. The ultrasonic vibration applying unit 67 is operated by the control unit 53.

  The ultrasonic vibration applying unit 67 described above corresponds to “ultrasonic vibration applying means” in the present invention.

  Next, the operation of the above-described substrate processing apparatus will be described with reference to FIGS.

  The lifter 9A supporting the substrate W is moved to the processing position, the substrate W is immersed in the stripping solution in the processing tank 3, and the stripping solution is circulated. Further, the control unit 53 generates ultrasonic vibration from the ultrasonic vibration applying unit 67 (FIG. 18). The photoresist film is peeled off from the substrate W by the stripping solution and becomes a fragment ff of the photoresist film and floats in the stripping solution. However, the fragment ff of the photoresist film is finely decomposed by the ultrasonic vibration to form a fine fragment sff. (FIG. 19). Therefore, it is possible to discharge the fragments ff of the photoresist film by being put on the liquid flow of the stripping solution from the processing tank 3 to the overflow tank 5. As a result, the fragments ff of the photoresist film peeled from the substrate can be reliably discharged from the processing tank.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described third embodiment, the overflow tank 5 may be provided with the same bubble supply pipe 19 as in the first and second embodiments. Thereby, the fine debris sff of the photoresist film discharged to the overflow tank 5 can be further subdivided by bubbles. Therefore, clogging of the circulation filter 41 and the circulation pipe 33 on the downstream side can be suppressed.

  (2) In Example 3 mentioned above, you may use together the capture | acquisition part 21 similar to Example 1. FIG. As a result, the film fragments ff that have not been made fine can be captured by the capturing unit 21.

  (3) In the above-described third embodiment, the same squeezer 61 as in the second embodiment may be used in combination. As a result, fine fragments sff of the photoresist film that could not survive the liquid flow can be discharged to the overflow tank 5.

Next, Embodiment 4 of the present invention will be described with reference to the drawings.
FIG. 20 is an overall view illustrating a schematic configuration of the substrate processing apparatus according to the fourth embodiment. FIG. 21 is a schematic diagram showing the peeling process, and FIG. 22 is a schematic diagram showing a state where the lifter starts to be lifted from the processing position.

  In addition, about the structure similar to Example 1 mentioned above, detailed description is abbreviate | omitted by attaching | subjecting a same sign.

  The processing unit 1 </ b> C includes a processing tank 3 and an overflow tank 5. The lifter 9 </ b> B includes a scooping member 71 on the lower surface of the support portion 13. The scooping member 71 is a plate-like member. The scooping member 71 has a width that exceeds the side edge of the substrate W and does not exceed the inner wall of the processing bath 3.

  The control unit 53 moves the lifter 9B holding the substrate W coated with the photoresist film to the processing position, and circulates the stripping solution to perform the stripping process. At this time, even if fragments of the photoresist film are floating in the processing tank 3, the peeling process can be performed in a state where the scooping member 71 has driven the lower part of the processing tank 3. As a result of the peeling process, the photoresist film applied to the substrate W is peeled off and floats in the peeling solution as fragments ff of the photoresist film (FIG. 21). Some of them are discharged into the overflow tank 5 along with the flow of the stripping solution, but some stay in the processing tank 3.

  When the peeling process is finished, the control unit 53 starts to raise the lifter 9B to the standby position. At this time, the peeling liquid in the processing tank 3 is lifted by the scooping member 71 (FIG. 22). As a result, an ascending liquid flow is generated in the stripping solution, so that the fragments ff of the photoresist film floating in the processing tank 3 can be discharged to the overflow tank 5. Therefore, the fragments ff of the photoresist film peeled from the substrate W can be reliably discharged from the processing tank 3.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In Example 4 mentioned above, you may use together the capture | acquisition part 21 similar to Example 1. FIG. Thereby, the debris ff of the photoresist film pushed to the overflow tank 5 side can be captured by the capturing unit 21.

  (2) In the above-described fourth embodiment, the overflow tank 5 may be provided with the same ultrasonic vibration applying unit 67 as that of the third embodiment. Thereby, the fragments ff of the photoresist film discharged to the overflow tank 5 can be subdivided by ultrasonic vibration. Therefore, clogging of the circulation filter 41 and the circulation pipe 33 on the downstream side can be suppressed.

W ... Substrate 1 ... Processing section 3 ... Processing tank 5 ... Overflow tank 9 ... Lifter 15 ... Scooping net section 19 ... Bubble supply pipe 21 ... Trapping section 23 ... Trapping member 27 ... Recovery container 33 ... Circulation piping 35 ... Circulation pump 53 ... Control unit ff… Photoresist coating fragments

Claims (4)

In a substrate processing apparatus for performing a peeling process with a peeling liquid on a film attached to a substrate,
A treatment tank for storing the stripping solution and immersing the substrate for processing,
An overflow tank for recovering the stripping solution overflowing from the treatment tank;
A lifter that holds a plurality of substrates and can be raised and lowered over a processing position in the processing tank and a standby position above the processing tank;
A net-like member arranged so as to freely open and close the upper opening of the overflow tank;
With
In a state where the mesh member is positioned at the collection position, the lifter is positioned at the processing position and the substrate held by the lifter is peeled off, and then the mesh member is moved to the disposal position. A substrate processing apparatus. The substrate processing apparatus according to claim 1,
It further comprises drive means for changing the posture of the mesh member over a collection position where one surface of the mesh member is directed upward and a disposal position where one surface of the mesh member is directed downward. A substrate processing apparatus. The substrate processing apparatus according to claim 2,
The mesh member includes a rotation axis in the longitudinal direction of the upper edge of the processing tank,
The substrate processing apparatus, wherein the driving unit rotationally drives the rotating shaft in accordance with the collection position and the disposal position. In the substrate processing apparatus according to claim 1,
A recovery container is further provided at a side of the overflow tank and below the recovery tank for recovering fragments of the coating falling from the mesh member when the mesh member is moved to a disposal position. Substrate processing equipment.

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