M404583 五、新型說明： 【新型所屬之技術領域】 本新型是是有關於一種散熱裝置，且特別是有關於一 種具有外力壓迫保護機制之散熱模組。 【先前技術】 電腦是現代人生活中不可或缺的工具。由於現代電腦 需要進行大量資料的運算與處理，各種處理器與晶片都需 要在相當高的頻率下運作，所產生的熱能也隨之增加。因 此，處理器或晶片的散熱模組的良劣對於其是否能正常運 作，影響亦相當大。通常，散熱模組將覆蓋於晶片上方， 並與晶片接觸以提供散熱的效果。但是，這樣的配置方式， 往往在散熱模組受到不當外力的時候，會施加壓力在位於 其下的晶片，而使得晶片受到壓迫容易受損。 因此，如何設計一個具有外力壓迫保護機制之散熱模 組，以使散熱模組在受到外力時，能夠讓晶片不致於受到 損壞，乃為此一業界亟待解決的問題。 【新型内容】 因此，本揭示内容之一態樣是在提供一種散熱模組， 具有外力壓迫保護機制，並用以對位於主機板上之晶片進 行散熱，晶片具有承載面，承載面具有第一面積。散熱模 組包含：散熱板以及散熱介面。散熱板具有接觸面，接觸 面是用以接觸承載面，並具有第二面積，且第二面積大於 第一面積，而使散熱板固定於主機板上以夾持住晶片。接 4 M404583 觸面包含：凹陷區域以及周圍區域。晶片是容納於凹陷區 域中，而凹陷區域之深度小於晶片之高度。周圍區域位於 凹陷區域之周圍。散熱介面形成於接觸面以及承載面之 間，以將晶片之熱能由承載面傳導至接觸面。 依據本揭示内容一實施例，其中散熱介面為導熱膏。 u 依據本揭示内容另一實施例，散熱板之至少二角隅更 • 分別包含鎖固結構，以固定於主機板上。 依據本揭示内容又一實施例，散熱模組更包含複數散 • 熱件，形成於散熱板之接觸面之另一側，以使晶片之熱能 由承載面傳導至接觸面後，經由散熱件進行散熱。散熱件 為金屬材質。其中散熱件為複數散熱鰭片。 依據本揭示内容再一實施例，晶片形成於基板上，基 板與主機板相連接。當散熱模組受到外力，散熱板之接觸 面之周圍區域適可抵住基板以避免晶片受損。 依據本揭示内容更具有一實施例，凹陷區域橫跨接觸 . 面相對之二側邊或具有對應晶片之形狀。當凹陷區域橫跨 • 接觸面相對之二側邊時，凹陷區域上更形成有至少一溝 槽，以對應於晶片之至少一側邊。 本揭示内容之另一態樣是在提供一種散熱模組，具有 外力壓迫保護機制，並用以對位於主機板上之晶片進行散 熱，晶片具有承載面，而承載面具有第一面積，晶片為裸 晶，並形成於基板上，而基板與主機板相連接。散熱模組 包含：散熱板、散熱介面以及散熱縛片。散熱板具有接觸 面，接觸面是用以接觸承載面，並具有第二面積，且第二 面積大於第一面積，散熱板之至少二角隅更分別包含鎖固 M404583 結構，以固定於主機板上夾持住晶片。接觸面包含：凹陷 區域以及周圍區域。晶片是容納於凹陷區域中，而凹陷區 域之深度具有小於晶片之高度。凹陷區域橫跨接觸面相對 之二侧邊或具有對應晶片之形狀。周圍區域位於凹陷區域 之周圍。散熱介面為散熱膏，形成於接觸面以及承載面之 * 間，以將晶片之熱能由承載面傳導至接觸面。散熱鰭片為 - 金屬材質，形成於散熱板之接觸面之另一側，以使晶片之 熱能由承載面傳導至接觸面後，經由散熱鰭片進行散熱。 φ 應用本揭示内容之優點在於藉由凹陷區域之設計，可 以在外力施加於散熱模組上時，使散熱板接觸面的周圍區 域抵住基板，避免散熱模組進一步的下沉使晶片受到壓 迫，而輕易地達到上述之目的。 【實施方式】 請參照第1圖。第1圖為本揭示内容之一實施例中之 . 具有外力壓迫保護機制之散熱模組1之仰視立體圖。請同 • 時參照第2A圖及第2B圖。第2A圖為第1圖之散熱模組 1與晶片20及主機板22相結合後沿第1圖之A方向之侧 視圖。而第2B圖為第2A圖中之虛線框部份放大後之示意 圖。 散熱模組1用以對位於主機板22上之晶片20進行散 熱。晶片20包含具有第一面積之承載面21。晶片20可為 裸晶。晶片20位於基板24上，以藉由基板24與主機板 22連接。散熱模組1用#覆蓋於晶片20上，並包含散熱 板10、散熱介面12、散熱鰭片14以及鎖固結構16。 6 M404583 散熱板10具有接觸面11，用以接觸承載面21，具有 第二面積，且第二面積大於第一面積。其中，散熱板10之 二角隅具有鎖固結構16,以將散熱模組1固定在主機板22 上，並夾持住晶片20。一較佳之實施例中，鎖固結構16 是位於對角處。 、 接觸面11包含：凹陷區域18a以及周圍區域18b。晶 ， 片20容納於凹陷區域18a中，而凹陷區域18a之深度小於 晶片20之高度。周圍區域18b則位於凹陷區域18a之周 • 圍。本實施例之凹陷區域18a是橫跨接觸面11相對之二侧 邊，可以鋁擠製程形成。 散熱介面12於一實施例中為導熱膏，形成於接觸面 11的凹陷區域18a以及承載面21之間，以將晶片20產生 的熱能由承載面21傳導至接觸面11。而散熱鰭片14則進 一步將由接觸面11傳來的熱散發出去。於一實施例中，散 熱鰭片14可為導熱係數高的金屬，以利提供晶片較佳的散 熱效果。於其他實施例中，散熱模組1亦可採用其他不同 • 於散熱鰭片14的散熱件來進行排熱。 因此，藉由凹陷區域18a之設置，散熱模組1可在不 影響與晶片20之距離之下，縮短散熱板10與基板24及主 機板22間的距離。因此，當本實施例中的散熱模組1受到 外力F時，將如第2C圖所示，散熱板10的接觸面11之周 圍區域18b將由擺動幅度較大而將先碰觸到晶片20的基板 24上，而可提供一阻力避免散熱模組1過度下沉壓迫晶片 20。位於凹陷區域18a中的晶片20因此而降低受到壓迫的 力量。 7 M404583 因此，藉由凹陷匳威之°又汁，可以在外力施加於 散执模组1上時，使散熱板10之接觸面11的周圍區域18b ^住基板24’避免位於四陷區域他散熱模組進一步的下 沉使晶片受到壓迫° 請參照第3A圖及第3B圖。第3A圖為本揭示内容之 •另-實施例中，散熱模組1之仰視立體圖。第3B圖為第 -3A圖之散熱模組1與晶片^及主機板22相結合後沿第 3 A圖之A方向之侧祝®。本實施例中的散熱模組1於散熱 Φ板ίο的接觸面n上之四陷區域18a上更形成有溝槽30。 溝槽30形成於接觸面11上’對應晶片20之側邊。於 本實施例中，溝槽30之數目為=個〃別對應晶片20的 二側邊。於第3B圖町以得知，晶片20的側邊約略位於溝 槽30的中間。請參照第扣圖。當散熱模組1受到-壓迫 性的外力F，將會往傾斜而壓迫晶片2G。如果前述之散熱 板ίο之接觸面u的商園區域18b由於擺動幅度過大而使 在抵住基板24之情形下，晶片2G仍有受迫的危險，此時 翁溝槽3〇仍可容置易受迫的晶片20的側邊23 5避免散熱模 '組1對晶片20的直接廢迫° 請參照第4圖。第4圖為本揭示内容之又一實施例中 之散熱模組1之仰視立體圖。本實施例中的散熱板10之接 觸面11上的凹陷區域18a具有對應晶片20之形狀，亦可 提供如前述之功效。然而，對應晶片20之形狀的凹陷區域 ISa，需要多施以如電腦化數值控制（C〇mputerNumerical Control，CNC)的加工程序，來對散熱板1〇的接觸面u 形成凹陷區域18a’與先前之實施例中以鋁擠製程形成之 8 M404583 凹陷區域18a相較下製程較費工。 雖然本揭示内容已以實施方式揭露如上，然其並非用 以限定本揭示内容，任何熟習此技藝者，在不脫離本揭示 内容之精神和範圍内，當可作各種之更動與潤飾，因此本 揭示内容之保護範圍當視後附之申請專利範圍所界定者為 準〇 【圖式簡單說明】 為讓本揭示内容之上述和其他目的、特徵、優點與實 施例能更明顯易懂，所附圖式之說明如下： 第1圖為本揭示内容之一實施例中之具有外力壓迫保 護機制之散熱模組之仰視立體圖 第2A圖為第1圖之散熱模組與晶片及主機板相結合 後之侧視圖； 第2B圖為第2A圖中之虛線框部份放大後之示意圖； 第2C圖為第2B圖之散熱板受力傾斜後之示意圖； 第3A圖為本揭示内容之另一實施例中，散熱模組之 仰視立體圖； 第3B圖為第3A圖之散熱模組與晶片及主機板相結合 後之侧視圖； 第3C圖為第2B圖之散熱板受力傾斜後之示意圖；以 及 第4圖為本揭示内容之又一實施例中之散熱模組之仰 視立體圖。 9 M404583 p【主要元件符號說明】 I :散熱模組 II :接觸面 .14 :散熱鰭片 18a :凹陷區域 20 :晶片 22 :主機板 籲 24 :基板 A :方向 10 :散熱板 12 :散熱介面 16 :鎖固結構 18b :周圍區域 21 :承載面 23 :側邊 30 :溝槽 F :外力M404583 V. New description: [New technical field] The present invention relates to a heat dissipating device, and in particular to a heat dissipating module having an external force pressing protection mechanism. [Prior Art] Computers are an indispensable tool in modern life. Since modern computers require a large amount of data to be processed and processed, various processors and chips need to operate at a relatively high frequency, and the generated heat energy also increases. Therefore, the quality of the heat dissipation module of the processor or the chip is quite large for its normal operation. Typically, the thermal module will overlie the wafer and contact the wafer to provide heat dissipation. However, in such a configuration, when the heat dissipation module is subjected to an improper external force, a pressure is applied to the wafer underneath, and the wafer is easily damaged by being pressed. Therefore, how to design a heat dissipation module with an external force compression protection mechanism to prevent the wafer from being damaged when the heat dissipation module is subjected to an external force is an urgent problem to be solved in the industry. [New content] Therefore, one aspect of the present disclosure is to provide a heat dissipation module having an external force compression protection mechanism for dissipating heat to a wafer located on a motherboard, the wafer having a bearing surface, and the bearing surface having a first area . The thermal module consists of a heat sink and a heat sink. The heat sink has a contact surface for contacting the load bearing surface and having a second area, and the second area is larger than the first area, and the heat sink is fixed to the motherboard to clamp the wafer. The 4 M404583 contact surface contains: the recessed area and the surrounding area. The wafer is housed in the recessed region, and the depth of the recessed region is less than the height of the wafer. The surrounding area is located around the recessed area. A heat dissipating interface is formed between the contact surface and the bearing surface to conduct thermal energy of the wafer from the bearing surface to the contact surface. According to an embodiment of the present disclosure, the heat dissipation interface is a thermal paste. According to another embodiment of the present disclosure, at least two corners of the heat sink include a locking structure for fixing to the motherboard. According to still another embodiment of the present disclosure, the heat dissipation module further includes a plurality of heat dissipation members formed on the other side of the contact surface of the heat dissipation plate, so that the thermal energy of the wafer is transmitted from the bearing surface to the contact surface, and then the heat dissipation member is used. Cooling. The heat sink is made of metal. The heat sink is a plurality of heat sink fins. According to still another embodiment of the present disclosure, the wafer is formed on the substrate, and the substrate is connected to the motherboard. When the heat dissipation module is subjected to an external force, the area around the contact surface of the heat dissipation plate is suitable to resist the substrate to avoid damage to the wafer. In accordance with an embodiment of the present disclosure, the recessed regions span the contact. The opposite sides of the face or have the shape of the corresponding wafer. When the recessed area spans the opposite sides of the contact surface, the recessed area is further formed with at least one groove to correspond to at least one side of the wafer. Another aspect of the present disclosure is to provide a heat dissipation module having an external force compression protection mechanism for dissipating heat from a wafer located on a motherboard, the wafer having a bearing surface, and the bearing surface having a first area, the wafer being bare The crystal is formed on the substrate, and the substrate is connected to the motherboard. The thermal module includes: a heat sink, a heat sink, and a heat sink. The heat dissipation plate has a contact surface, the contact surface is for contacting the bearing surface, and has a second area, and the second area is larger than the first area, and at least two corners of the heat dissipation plate respectively comprise a locking M404583 structure for fixing to the motherboard Hold the wafer on top. The contact surface consists of a recessed area and a surrounding area. The wafer is housed in the recessed region, and the depth of the recessed region has a height smaller than that of the wafer. The recessed regions span the opposite sides of the contact surface or have the shape of a corresponding wafer. The surrounding area is located around the recessed area. The heat dissipating interface is a thermal grease formed between the contact surface and the bearing surface to conduct thermal energy of the wafer from the bearing surface to the contact surface. The heat dissipating fins are made of metal and formed on the other side of the contact surface of the heat dissipating plate so that the thermal energy of the wafer is conducted from the carrying surface to the contact surface, and then dissipated through the heat dissipating fins. φ Application The present disclosure has the advantage that the design of the recessed area allows the surrounding area of the contact surface of the heat sink to abut against the substrate when an external force is applied to the heat dissipation module, thereby preventing the heat sink from further sinking and compressing the wafer. And easily achieve the above purpose. [Embodiment] Please refer to Figure 1. 1 is a bottom perspective view of a heat dissipation module 1 having an external force compression protection mechanism in an embodiment of the present disclosure. Please refer to Figures 2A and 2B for the same time. Fig. 2A is a side view of the heat dissipation module 1 of Fig. 1 combined with the wafer 20 and the motherboard 22 in the direction A of Fig. 1. Fig. 2B is a schematic enlarged view of a portion of the broken line frame in Fig. 2A. The heat dissipation module 1 is used to dissipate the wafer 20 on the motherboard 22. Wafer 20 includes a load bearing surface 21 having a first area. Wafer 20 can be bare. The wafer 20 is placed on the substrate 24 to be connected to the motherboard 22 via the substrate 24. The heat dissipation module 1 covers the wafer 20 with #, and includes a heat dissipation plate 10, a heat dissipation interface 12, heat dissipation fins 14, and a locking structure 16. 6 M404583 The heat sink 10 has a contact surface 11 for contacting the bearing surface 21, having a second area, and the second area being larger than the first area. The two corners of the heat dissipation plate 10 have a locking structure 16 for fixing the heat dissipation module 1 to the motherboard 22 and holding the wafer 20. In a preferred embodiment, the locking structure 16 is located at a diagonal. The contact surface 11 includes a recessed area 18a and a surrounding area 18b. The crystal piece 20 is housed in the recessed portion 18a, and the depth of the recessed portion 18a is smaller than the height of the wafer 20. The surrounding area 18b is located around the circumference of the recessed area 18a. The recessed portion 18a of this embodiment is formed on the opposite sides of the contact surface 11 and can be formed by an aluminum extrusion process. The heat dissipating interface 12, in one embodiment, is a thermally conductive paste formed between the recessed regions 18a of the contact surface 11 and the carrier surface 21 to conduct thermal energy generated by the wafer 20 from the carrier surface 21 to the contact surface 11. The heat sink fins 14 further dissipate the heat transmitted from the contact surface 11. In one embodiment, the fins 14 can be a metal having a high thermal conductivity to provide a better heat dissipation effect of the wafer. In other embodiments, the heat dissipation module 1 can also use other heat dissipation fins for the heat dissipation fins 14 to perform heat removal. Therefore, by the arrangement of the recessed regions 18a, the heat dissipation module 1 can shorten the distance between the heat dissipation plate 10 and the substrate 24 and the main board 22 without affecting the distance from the wafer 20. Therefore, when the heat dissipation module 1 of the present embodiment receives the external force F, as shown in FIG. 2C, the peripheral region 18b of the contact surface 11 of the heat dissipation plate 10 will be touched by the wafer 20 first by the amplitude of the oscillation. On the substrate 24, a resistance can be provided to prevent the heat sink module 1 from excessively sinking and pressing the wafer 20. The wafer 20 located in the recessed area 18a thus reduces the force of compression. 7 M404583 Therefore, by applying the external force to the non-distribution module 1 by the depression, the surrounding area 18b of the contact surface 11 of the heat dissipation plate 10 can be prevented from being located in the depression area. Further cooling of the heat sink module causes the wafer to be pressed. Please refer to Figures 3A and 3B. Fig. 3A is a bottom perspective view of the heat dissipation module 1 in the other embodiment of the disclosure. Fig. 3B is a side view of the heat dissipation module 1 of Fig. 3A combined with the wafer and the motherboard 22 along the A direction of the third drawing A. The heat dissipation module 1 in this embodiment is further formed with a trench 30 on the four recessed regions 18a on the contact surface n of the heat dissipation Φ board. The trenches 30 are formed on the contact faces 11' corresponding to the sides of the wafer 20. In this embodiment, the number of trenches 30 is = two corresponding sides of the corresponding wafer 20. It is known in Fig. 3B that the side of the wafer 20 is located approximately in the middle of the groove 30. Please refer to the figure button. When the heat dissipating module 1 receives a compressive external force F, it will tilt and press the wafer 2G. If the commercial area 18b of the contact surface u of the aforementioned heat sink ίο is too large to cause the wafer 2G to be pressed against the substrate 24, the wafer 2G is still in danger. The side 23 of the wafer 12 that is susceptible to being forced avoids the direct depletion of the heat sink 'set 1 to the wafer 20'. Please refer to FIG. Figure 4 is a bottom perspective view of the heat dissipation module 1 in still another embodiment of the present disclosure. The recessed area 18a on the contact surface 11 of the heat dissipation plate 10 in this embodiment has a shape corresponding to the wafer 20, and can also provide the effects as described above. However, the recessed area ISa corresponding to the shape of the wafer 20 needs to be subjected to a machining program such as computer numerical control (C〇mputer Numerical Control (CNC)) to form the recessed area 18a' with the contact surface u of the heat sink 1〇. In the embodiment, the 8 M404583 recessed region 18a formed by the aluminum extrusion process is more labor-intensive than the lower process. The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the disclosure. The scope of the disclosure is to be understood as the scope of the appended claims. The above and other objects, features, advantages and embodiments of the present disclosure will become more apparent. The drawings are as follows: FIG. 1 is a bottom perspective view of a heat dissipation module having an external force compression protection mechanism according to an embodiment of the present disclosure. FIG. 2A is a combination of the heat dissipation module of FIG. 1 and a chip and a motherboard. 2B is a schematic enlarged view of a portion of a broken line frame in FIG. 2A; FIG. 2C is a schematic view showing a heat sink of FIG. 2B after being tilted; FIG. 3A is another embodiment of the disclosure In the example, the bottom view of the heat dissipation module; FIG. 3B is a side view of the heat dissipation module of FIG. 3A combined with the chip and the motherboard; FIG. 3C is a view of the heat dissipation plate of FIG. 2B after being tilted by force 4 and FIG. 4 is a bottom perspective view of a heat dissipation module in still another embodiment of the present disclosure. 9 M404583 p [Main component symbol description] I : Thermal module II : Contact surface . 14 : Heat sink fin 18a : Recessed area 20 : Wafer 22 : Mother board 24 : Substrate A : Direction 10 : Heat sink 12 : Thermal interface 16: Locking structure 18b: surrounding area 21: bearing surface 23: side 30: groove F: external force