五、新型說明： 【新型所屬之技術領域】 本創作係關於—種散缝置，尤其是-種具有可擺動傾斜導熱端之散 熱裝置及該散熱裝置總成。 . 【先前技術】 積體電路①件將大量電路元件缝化、微型化，還不斷提升運算速度 '、產叩效’投影設備與照明裝置巾的統與錢構不斷讎化、卻需因 鲁應市場需求而不斷提升發光效率；種種產品最終都將面臨散熱問題。一旦 伴隨電子運r或發光等功效所產生的熱無法被順利排除則運轉所產生的 局溫不僅減損產品壽命、降低產品效能，也會對其它周邊相關零件造成不 良办響’甚至導致燃燒等危險，因此散熱問題絲毫不可以被輕忽。 為此’目前常見利用散熱續片、風扇、甚至致冷晶片、或上述各裝置 之、.且口而攜走發熱元件附近熱能、降低發熱元件附近之溫度。常見例如個 人電腦設置風扇強制空氣對流；亦有業者更進一步以金屬散熱片之接觸面 貼合於發熱元件’使熱傳導至散熱片整體，再以風扇吹送氣流散熱。 細’無論是在發熱元件與散熱片接觸面間、由接觸面至金屬轉片、 或空氣與金屬鰭)ί間的熱傳導’都會受限於接觸面積或傳導截面大小。亦 .即，如果在-個狹窄空間中，無法設置較大尺寸的散熱片或散熱韓片，散 熱效率將隨之大打折扣^相對地，電子裝置需不斷順應潮流趨勢而逐漸 輕薄短小，如何在㈣大幅縮敵態下確保散熱效率，也使得規劃電子裝 置内部空間與電路佈局的工程師相當困擾。 、 而且，有時發熱元件在擺放或絲過程情有偏差，導致上表面 於散熱裝置係呈-微小傾斜角度，此時，若無法改變散熱裝置接觸面 度，則會在散熱裝置與發熱元件的接觸面之間，形成一個微小的間隙 隙中的空氣將使熱阻大幅提昇，聽裝置因而不能發生預定的效果「能藉 =====_-_雜元件 判，就意味產出良率A端降低、成本p 2測發熱元件傾斜擺放而導致誤 【新型内容】 本隨之提高，故為業者所不能接受》 使發熱 本創狀目的在提供__種可朗於狹蝴㈣料熱效率， 置 兀所發熱能被快速導離的具有可擺動傾斜導熱端之散孰裝 *劃彈性的具有可擺動傾斜導 本創作之另一目的在提供—種增加空間規 熱端之散熱裝置。 本創作之X-目的在提供—種散触較好之餘裝置總成。 2作之再-目的在提供__種應用於測試機台時，可減少因待測發執 兀件被傾斜置放而誤判之散熱裝置總成。 依照本新型财之具村鷄傾斜導熱端之健裝置及該散熱裝置總 主要包含組餘流體驅動H 個具有—細彡财職該發熱元 件位置之穿孔的底壁、-個形成有—個緩衝㈣部的頂壁、並形成有兩處 分別導接至該散熱流體驅動器且分別供該散熱流體進人及流出之開口的中 空殼體；及-個導熱模組，包括：其中至少形成有__根其中容納有一揮發 性液體之中空封_鮮道、並具有―鮮熱連接至該發熱元件之導熱端 及個相反於。玄導熱4之緩衝固定端的導熱件；一組位於該中空殼體内、 導熱連接地設置機導熱件遠離該導熱端處之散舰片；及—個_端抵靠 至該忒體、另一端抵壓該導熱件或該組散熱鰭片、並套設於該導熱件，使 該導熱端被迫緊抵靠至該發熱元件、且該緩衝固定端係受該緩衝固定部之 侷限而可在一預定範圍内擺動之彈性件。 藉由具有中空封閉管道的導熱件，可以將發熱元件所發熱量，經由揮 發性液體的揮發及移動而傳輸至導熱件’再由風扇等散熱流體驅動器，將 空氣或其他散熱流體驅動而流經導熱件進行熱交換，使揮發性液體再度回 復液態而回到接近發熱元件位置，反覆傳熱。且導熱模組可於中空殼體内 M392531 擺動’當發熱元件絲面誤擺放或安裝树呈傾斜角麟導献件將 可因應該傾邮姆財空娜同步傾斜，_料熱端緊秘發熱元件 的表面’如此，不僅可由狹小之發熱區域中將熱順利導出增加空間規劃 之彈性’更可確保散熱效率；甚且在制於戦機台時，大幅降低誤判: 機率、提升產品良率、降低製造成本，達到上述所有目的。 【實施方式】 . 2關本新型之前述及其他内容、特點與功效，在配合以下參考圖式之 較佳實施例的詳細說明，將可以清楚的呈現。 • 本案之第一較佳實施例，請參閱圖卜2所示，該散熱裝置i主要包含： 中空殼體1卜及導熱模組13，為了使散熱效率更好，於散熱裝置i之中空 殼體11兩側外更裝設有一組散熱流體驅動器12，其中該導熱模組13更包 -括散熱縛片13卜彈性件132、及導熱件133，導熱件133與散熱韓片131 都不是IU設於巾空殼體11内’並且於巾空殼體U留有些許供導熱件133 與散熱鰭片131擺動空間。本例之導熱件133如圖3所示，係為一根内部 形成有-根中空封閉導熱管道1331的管件，並以圖式下方的端部供導熱抵 接至該發熱元件2，為便於說明，以下稱此端部為導熱端1333 ;中空封閉 φ -導熱官道1331中容納有一揮發性液體1332，當導熱端1333被迫緊至發熱 兀件2的上表面時，由發熱元件2傳來的熱將促使揮發性液體1332在中空 封閉導熱管道1331中揮發向上。 當然，如熟悉本技術領域者所能輕易理解，上述導熱件形成中空封閉 導熱管道之表面亦可為毛細表面，使得揮發性液體可以更易於在管道中往 返。因此，當發熱元件附近的設置空間較狹窄時，亦可藉由上述結構設計， 符合各種空間需求。 本例中散熱鰭片131係為複數且彼此平行地設置於中空殼體η中，從 而在各散熱鰭片131間形成對應的複數孔道1312，該散熱鰭片131之每一 鰭片分別形成有一個穿孔1311 ’供導熱件133以大致垂直於散熱鰭片131 M392531 的方向插入，並與各散賊片131緊密結合。使中空封閉導熱管道i33i内 的已汽化揮發性液體在此再度釋放熱能而被液化，重新向下落回導熱端 1333處，反覆循環。 … 中空殼體11在圖2左右兩側分別形成有一處開口⑴，而散熱流體驅 動器12則是由中空殼體11 —側邊導入、另一侧邊導出的方式連接至中空 -殼體11的鼓風機’使得作為散熱流體的乾燥空氣在賴的通氣管道中受到 -強制對流，將中空殼體11中的溫度降低。請一併參考圖4所示，中空殼體 11於頂壁開設-通孔而形成-個做為緩衝用的緩衝固定部_，且在導熱 • 件133相反於導熱端1333設置有緩衝固定端1330，且緩衝固定端1330的、 半徑係小於該緩衝固定部謂，使緩衝固定端133〇可輕易的在緩衝固定部 1100的限制範圍移動。 m本例之散熱裝置進行散熱作業時，請-併參考如圖4及圖5所示， 在本例中發熱元件2之表面並非與散熱裝置】平行，為使導熱件133的導 熱端1333能迫緊貼合於發熱元件2，使其間沒有間隙，藉以避免形成較大 熱阻’本例中之導熱件133更形成有一個擋止部1334，且在導熱件133外， 套設有例釋為彈簧的彈性件132，彈性件132藉由—端推抵中空殼體u内 φ·祕措部1120 ’另端抵壓至導熱件⑶的擋止部1334，因此在進行散熱作 業時，散熱裝置1向發熱元件2方向垂直下壓，其導熱端1333會受到外力 座迫而如圖5所示與發熱元件2之表面貼合，而導熱件133與散熱韓片⑶ 也會於中空殼體11内同步傾斜，其傾斜範圍則係受緩衝固定端133〇在緩 衝固定部1100的移動細，從而迫使導熱端1333被迫緊抵靠至發熱元件 2 ’使散熱裝置1可因應發熱元件2的傾斜角度進行散熱。 此外，導熱件亦可如圖6本案第二較佳實施例所示，本例中緩衝固定 部1100’係設置成-個非開通的凹陷，且緩衝固定端133〇’的尺寸的外廊則 必需小於該凹陷，使導熱件133’可於中空殼體u，内並受缓衝固定部ιι〇〇， 的牵制擺動。且彈性件132’亦可設置於中空殼體u，内，並推抵中空殼體u，⑶ 6 M392531 1330 1330, 、 1330” 緩衝固定端 2 發熱元件V. New description: [New technical field] This creation is about a kind of spatter, especially a heat sink with a swingable and inclined heat conduction end and the heat sink assembly. [Prior Art] One piece of integrated circuit sewn and miniaturized a large number of circuit components, and it continues to increase the speed of operation, and the production and efficiency of projection equipment and lighting equipment are constantly deteriorating. The luminous efficiency will be continuously improved in response to market demand; all kinds of products will eventually face heat dissipation problems. Once the heat generated by the effects of electron transport or illuminating cannot be smoothly eliminated, the local temperature generated by the operation not only degrades the life of the product, reduces the performance of the product, but also causes bad effects on other peripheral related parts, and even causes dangers such as burning. Therefore, the heat dissipation problem should not be ignored. To this end, it is common to use heat sinks, fans, even cryogenic wafers, or the above-mentioned devices, and to carry away heat energy near the heat generating components and to lower the temperature in the vicinity of the heat generating components. Commonly, for example, a personal computer is provided with a fan to force air convection; further, the contact surface of the metal heat sink is attached to the heat generating component to conduct heat to the entire heat sink, and then the air is blown by the fan to dissipate heat. The thermal conduction between the thin section "between the contact surface of the heat generating component and the heat sink, from the contact surface to the metal rotor, or between the air and the metal fin" is limited by the contact area or the conductive cross section. In other words, if a large size heat sink or heat sink cannot be set in a narrow space, the heat dissipation efficiency will be greatly reduced. Relatively, the electronic device needs to constantly conform to the trend and gradually become light and thin, how to (4) Ensuring the heat dissipation efficiency under the situation of drastically shrinking the enemy, it also makes the engineers who plan the internal space and circuit layout of the electronic device quite troublesome. Moreover, sometimes the heating element is misaligned during the placement or the wire process, resulting in a slight tilt angle of the upper surface of the heat dissipating device. At this time, if the contact surface of the heat dissipating device cannot be changed, the heat dissipating device and the heating element are Between the contact faces, the formation of a tiny gap in the air will greatly increase the thermal resistance, and the listening device will not be able to produce the predetermined effect. "It can be judged by the =====_-_ miscellaneous component judgment, which means good output. The rate A is lowered, the cost p 2 is measured, and the heating element is tilted and placed incorrectly. [New content] This is improved, so it is unacceptable for the industry. The purpose of making the fever is to provide __ species can be narrow (4) The thermal efficiency of the material, the heat-dissipating heat-dissipating heat-dissipating device having the swingable and slanting heat-conducting end The X-purpose of this creation is to provide a device assembly with better spatter. 2 re-purposes are provided when the __ type is applied to the test machine, which can reduce the inclination of the test piece to be tested. Heat sink placed and misjudged According to the present invention, the device for tilting the heat conduction end of the village chicken and the heat dissipating device mainly comprise a group of residual fluids for driving the bottom walls of the perforations having the position of the heating element. a top wall of the buffer (four) portion, and a hollow housing that is respectively connected to the heat dissipating fluid driver and respectively for opening and flowing the heat dissipating fluid; and a heat conducting module comprising: Forming at least a hollow seal containing a volatile liquid therein, and having a heat-conductive end that is freshly connected to the heat-generating component and a heat-conductive member opposite to the buffer-fixed end of the heat-conducting heat-conducting 4; The heat-conducting member of the hollow housing is disposed away from the heat-dissipating piece at the heat-conducting end; and the one end abuts against the body, and the other end presses the heat-conducting member or the group of heat-dissipating fins, And the elastic member is sleeved on the heat conducting member such that the heat conducting end is pressed against the heat generating component, and the buffer fixing end is limited by the buffer fixing portion to swing in a predetermined range. Heat conduction of hollow closed pipes The heat generated by the heating element can be transmitted to the heat-conducting member via the volatilization and movement of the volatile liquid. Then, the heat-dissipating fluid driver such as a fan drives the air or other heat-dissipating fluid to flow through the heat-conducting member for heat exchange, thereby making the volatile The liquid returns to the liquid state and returns to the position close to the heating element, and the heat transfer is repeated. The heat conduction module can be oscillated in the hollow housing M392531 'When the heating element wire surface is misplaced or the installation tree is inclined, the lining guide will be available. Because it should be dumped, the financial side is synchronously tilted, and the surface of the hot element is tight. Therefore, not only can the heat be smoothly derived from the narrow heating area, the flexibility of the space planning can be increased to ensure the heat dissipation efficiency; When it is built on the machine, it can greatly reduce the false positives: probability, improve product yield, reduce manufacturing cost, and achieve all of the above objectives. [Embodiment] 2 The above-mentioned and other contents, features and effects of the new type are matched with the following reference drawings. The detailed description of the preferred embodiments will be apparent. In the first preferred embodiment of the present invention, as shown in FIG. 2, the heat dissipating device i mainly comprises: a hollow casing 1 and a heat conducting module 13 for better heat dissipation efficiency in the heat dissipating device i A plurality of heat dissipating fluid drivers 12 are further disposed on both sides of the empty casing 11. The heat conducting module 13 further includes a heat dissipating member 13 and an elastic member 132, and a heat conducting member 133. The heat conducting member 133 and the heat dissipating film 131 are both It is not that the IU is disposed in the empty casing 11 and that a space for the heat conducting member 133 and the heat dissipating fin 131 is left in the empty casing U. As shown in FIG. 3, the heat conducting member 133 of the present embodiment is a tubular member in which a hollow insulating heat pipe 1331 is formed, and is thermally coupled to the heat generating component 2 at the lower end of the drawing for convenience of explanation. The end portion is referred to as a heat conducting end 1333; the hollow closed φ-heat conducting official passage 1331 contains a volatile liquid 1332 which is transmitted by the heating element 2 when the heat conducting end 1333 is forced to the upper surface of the heat generating element 2 The heat will cause the volatile liquid 1332 to volatilize upward in the hollow closed heat pipe 1331. Of course, as will be readily understood by those skilled in the art, the surface of the heat-conducting member forming the hollow closed heat-conducting pipe may also be a capillary surface, so that the volatile liquid can be more easily returned in the pipe. Therefore, when the installation space in the vicinity of the heat generating component is relatively narrow, the above structural design can also be adopted to meet various space requirements. In this example, the heat dissipation fins 131 are plural and are disposed in parallel with each other in the hollow casing η, so that a corresponding plurality of holes 1312 are formed between the heat dissipation fins 131, and each fin of the heat dissipation fins 131 is formed separately. There is a through hole 1311' for the heat conducting member 133 to be inserted in a direction substantially perpendicular to the heat radiating fin 131 M392531, and is tightly coupled to each of the thief pieces 131. The vaporized volatile liquid in the hollow closed heat conducting pipe i33i is again liquefied by releasing heat energy, and is again returned to the heat conducting end 1333, and is circulated repeatedly. The hollow casing 11 is respectively formed with an opening (1) on the left and right sides of FIG. 2, and the heat dissipating fluid driver 12 is connected to the hollow-shell by the side of the hollow casing 11 and the other side is led out. The blower of '11' causes the dry air, which is a heat-dissipating fluid, to be subjected to forced convection in the venting duct, which lowers the temperature in the hollow casing 11. Referring to FIG. 4 together, the hollow casing 11 is formed with a through hole in the top wall to form a buffer fixing portion _ as a buffer, and the heat conducting member 133 is provided with a buffer fixing opposite to the heat conducting end 1333. The end 1330, and the radius of the buffer fixed end 1330 is smaller than the buffer fixing portion, so that the buffer fixing end 133 can easily move within the limited range of the buffer fixing portion 1100. When the heat sink of this example is used for heat dissipation, please refer to FIG. 4 and FIG. 5. In this example, the surface of the heat generating component 2 is not parallel to the heat sink, so that the heat conducting end 1333 of the heat conducting member 133 can The heat-generating component 2 is pressed tightly to have no gap therebetween, so as to avoid formation of a large thermal resistance. The heat-conducting member 133 in this example is further formed with a stopper portion 1334, and the heat-dissipating member 133 is disposed outside the heat-conducting member 133. In the elastic member 132 of the spring, the elastic member 132 is pressed against the φ·secure portion 1120 ′ of the hollow housing u to end the pressing portion 1334 of the heat conducting member ( 3 ), so that during the heat dissipation operation, The heat dissipating device 1 is vertically pressed downward in the direction of the heating element 2, and the heat conducting end 1333 is forced by the external force to adhere to the surface of the heating element 2 as shown in FIG. 5, and the heat conducting member 133 and the heat dissipating piece (3) are also hollow. The inside of the casing 11 is synchronously inclined, and the inclination range thereof is thinned by the movement of the buffer fixing end 133 at the buffer fixing portion 1100, thereby forcing the heat conducting end 1333 to be pressed against the heat generating component 2' so that the heat dissipating device 1 can respond to the heating element The tilt angle of 2 is used for heat dissipation. In addition, the heat conducting member can also be as shown in the second preferred embodiment of the present invention. In this example, the buffer fixing portion 1100' is disposed as a non-opening recess, and the outer cover of the size of the buffering fixed end 133〇' is It is necessary to be smaller than the recess, so that the heat conducting member 133' can be oscillated in the hollow casing u, and is restrained by the buffer fixing portion. And the elastic member 132' may also be disposed in the hollow casing u, and pushed against the hollow casing u, (3) 6 M392531 1330 1330, , 1330" buffer fixed end 2 heating element