TWI576561B - Dynamic heat conduction system - Google Patents

Description

Dynamic thermal conductivity system

This case relates to a dynamic thermal conductivity system, and more particularly to a dynamic thermal conductivity system for use in a computer device.

In a computer device, in order to maintain the computer device operating at an appropriate temperature, a heat conducting device having a heat conducting module is generally used, and the heat conducting module is closely attached to the electronic component that generates a large amount of thermal energy to rapidly transfer the thermal energy from the electronic component to the electronic device. Thermal conduction device.

In order to make the heat conducting module on the heat conducting device closely fit to the processor, a conventional method is to place a thermal pad in the gap between the heat conducting module and the processor, wherein the heat conducting sheet is attached to the processor when the heat conducting module is attached to the processor. A deformation amount is generated to closely bond the heat conductive sheet to the heat conducting module and the processor. However, such a thermal conductive sheet usually has a high thermal resistance value, and the heat conducting device cannot adapt to the height of different electronic components in the case where the thickness of the thermal conductive sheet is minimized, so the conventional method must design different heat conducting devices for electronic components of various heights. ,higher cost. In addition, such a thermally conductive sheet does not have a buffering ability, and is liable to cause damage to electronic components when subjected to external force or vibration.

Another conventional heat conduction module refers to the heat conduction structure of the first figure (the new M451797 of the Republic of China), in which a heat conducting block 3 is exposed, and when the electronic component of the circuit board (not shown) is bonded to the heat conducting block, the heat conduction is performed. The downward displacement of the block applies a force to an engaging portion 21 of the heat pipe 2 and the elastic positioning piece 4, and the heat conducting block and the heat conducting tube are fixed by the spring screws, so that the heat conducting block 3 is The heat conducting structure with low thermal resistance can be completed by closely fitting the electronic component on one side and the heat conducting tube 2 on one side at the same time. However, the conventional heat conduction module has the following disadvantages: the deformation of the heat pipe may cause the heat pipe to fail; the heat pipe and the spring screw have high cost; the electronic components of different heights are not easily assembled; the heat conduction module and the electronic component are not easily maintained. The heat-conducting structure is not cushioned, and the electronic component is easily damaged in a vibrating environment.

In addition, for a plurality of electronic components that require heat conduction at the same time, conventional techniques The heat conducting device is usually designed and arranged with a corresponding heat conducting device for each electronic component. Therefore, the heat conduction module of the conventional heat conduction device obviously has inconvenience and absence in practical application, and can be improved.

In view of the above problems of the conventional heat conduction module, the problem to be solved by the present invention is to prevent the external force from being damaged when the heat conduction device and the electronic component are assembled, and at the same time, to keep the heat conduction device and the electronic component in close contact, and to simplify the plurality of electronic components. A process for providing a plurality of heat conducting devices.

In view of the purpose of the present invention, a dynamic thermal conductivity system is provided that includes a base, a thermally conductive module, a resilient device, and at least one fastener. The base has a bottom surface and an inner side wall, and the inner side wall includes at least two base fixing holes. The base fixing hole has a base fixing hole length in a direction perpendicular to the bottom surface. The heat conducting module comprises a heat conducting sidewall and a heat conducting surface, and the heat conducting sidewall is opposite to the inner sidewall of the base, wherein the heat conducting sidewall and the inner sidewall of the base comprise a gap therebetween. The heat conducting sidewall includes at least two heat conducting module fixing holes at positions corresponding to the base fixing holes, and the heat conducting module fixing holes have a heat conducting module fixing hole length in a direction perpendicular to the bottom surface of the base. The foregoing One end of the elastic device is disposed on the bottom surface of the base, and the other end of the elastic device is coupled to the heat conducting module with respect to the other end of the bottom surface of the base, so that the heat conducting module is disposed in the base and maintains the heat conducting surface of the heat conducting module Outside the aforementioned base. At least one portion of the at least one fixing member is respectively fixed in the fixing hole of the heat conducting module, and at least another portion thereof is respectively disposed in the fixing holes of the base, wherein the fixing member has a direction perpendicular to the bottom surface of the base A fixing piece width. The length of the fixing hole of the base is greater than the width of the fixing member, and the width of the fixing member is greater than or equal to the length of the fixing hole of the heat conducting module, so that the heat conducting module can move in a direction perpendicular to the heat conducting surface, and at least a part of the heat conducting module is restricted. In the aforementioned base.

Optionally, the dynamic thermal conductivity system comprises a heat transfer fluid disposed on the guide The gap between the hot side wall and the aforementioned inner side wall. Further optionally, the heat conducting module has at least one groove on the thermally conductive sidewall for receiving the heat transfer fluid.

Still optionally, the dynamic thermal conductivity system includes a pass through the thermal conduction module The holes form the at least two heat conducting module fixing holes on the heat conducting sidewall.

Further, in view of the object of the present invention, another dynamic thermal conductivity system is further provided, The utility model comprises a heat conducting plate, a plurality of bases, a plurality of heat conducting modules, a plurality of elastic devices and a plurality of fixing members. The aforementioned heat conducting plate is used to cover the electronic components at the same time. The plurality of bases are respectively disposed on the heat conducting plate corresponding to the positions of the electronic components, and the bases respectively include a bottom surface and an inner side wall including at least two base fixing holes, wherein the base fixing holes are perpendicular to the There is a base fixing hole length in the bottom direction. The plurality of heat conducting modules are respectively disposed in the plurality of bases, and the heat conducting modules respectively comprise a heat conducting sidewall and a heat conducting surface, wherein the heat conducting sidewalls are respectively opposite to the inner sidewalls of the bases, and the heat conducting sidewalls are The bottom A gap is included in the middle of the inner side wall of the seat. The heat conducting sidewalls respectively include at least two heat conducting module fixing holes at positions corresponding to the fixing holes of the bases, and the heat conducting module fixing holes respectively have a heat conducting module fixing hole length in a direction perpendicular to the bottom surface of the bases. The plurality of elastic devices are respectively disposed in the plurality of bases, and the elastic devices respectively have one end disposed on the bottom surface of the bases, and respectively having opposite ends of the bottom surface of the bases coupled to the heat conduction And a module, wherein the heat conducting modules are respectively disposed in the bases and the heat conducting surfaces are kept outside the bases. The plurality of fixing members are respectively disposed in the bases, and the fixing members respectively have at least one portion fixed in the fixing holes of the heat conducting modules, and each having at least another portion disposed in the fixing holes of the bases, And the fixing members respectively have a fixing member width in a direction perpendicular to the bottom surface of the bases. The lengths of the fixing holes of the bases are respectively greater than the widths of the fixing members, and the widths of the fixing members are respectively greater than or equal to the lengths of the fixing holes of the heat conducting modules, so that the heat conducting modules are respectively perpendicular to the bottom surface of the bases. Moving up and limiting at least a portion of the thermally conductive modules in the bases.

Optionally, the gaps between the heat conducting sidewall and the inner sidewall are respectively Contains a heat transfer fluid. Further optionally, the plurality of thermally conductive modules respectively have at least one groove on the thermally conductive sidewalls for receiving the heat transfer fluid.

Optionally, the plurality of heat conducting modules respectively have a heat conducting die extending through the heat conducting modes The through hole of the block forms the at least two heat conducting module fixing holes on the heat conducting sidewall.

Still optionally, corresponding to the height of the plurality of electronic components, the plurality of The bases respectively have different base heights, or the plurality of heat conducting modules respectively have different heat conducting module heights, or the plurality of elastic devices respectively have different elastic device heights or different elastic coefficients.

Optionally, corresponding to a contact surface area of the plurality of electronic components, the front The plurality of heat conducting modules respectively have different heat conducting surface areas, or the plurality of elastic devices respectively have different elastic device areas.

Still optionally, the plurality of bases may be secured to the thermally conductive plate using post-treatment nickel welding. Alternatively, the plurality of bases may be fixed to the heat conducting plate with screws.

By the dynamic thermal conduction system of the present invention, when the electronic component is assembled and assembled, a buffering function can be provided to prevent the components of the electronic component or the dynamic thermal conduction system from being damaged by external force, and at the same time, the electronic component and the dynamic thermal conduction system are ensured. Closely fit for better thermal conductivity. In addition, with the dynamic thermal conduction system of the present invention, a heat conducting module can be separately provided between the plurality of electronic components to achieve a better thermal conduction effect, and the assembly process of the heat conducting device and the plurality of electronic components can be significantly simplified.

The following description is based on specific embodiments of the invention and with reference to the drawings.

First, an embodiment of the present invention will be described. Referring to the second drawing, an exploded view of the dynamic thermal conductivity system 100 in the present embodiment depicts the structure of the base 110, the elastic device 120, the thermal conduction module 130, and the fixture 140. The base 110 includes a bottom surface 111, an inner side wall 112, and a base fixing hole 113 on the inner side wall 112. One end of the elastic device 120 is coupled to the bottom surface 111 of the base 110, and the other end of the elastic device 120 is coupled to the heat conducting module 130. The heat conduction module 130 includes a heat conductive sidewall 131, a heat conduction surface 132, a heat conduction module fixing hole 133, and a groove 134.

Referring to the third drawing, a top view of the dynamic thermal conductivity system 100 in the present embodiment is depicted, wherein the inner sidewall 112 of the base 110 is opposite to the thermally conductive sidewall 131 of the thermal module 130, and the inner sidewall 112 and the thermally conductive sidewall 131 are included. Clearance 114. It is worth mentioning that although this is true The dynamic thermal conduction system 100 of the present invention is circular in the upper view. The thermal conduction module and the base of the dynamic thermal conduction system of the present invention may also have other shapes such as an ellipse, a rectangle, or the like in the upper view, or have different sizes. The area of the heat transfer surface or the area of the open area of the base to match the electronic components of different shapes or areas. Preferably, the elastic device of the dynamic thermal conduction system of the present invention can also have a different elastic device area in the direction of the vertical heat conducting surface to match the electronic components of different shapes or areas.

Please refer to the fourth figure, which is the second embodiment of the dynamic thermal conduction system 100 along the second embodiment. A cross-sectional view taken along the line A-A depicts the relationship between the various components in the assembled dynamic thermal conductivity system 100. One portion of the fixing member 140 is fixed in the fixing hole 133 of the heat conducting module, and another portion of the fixing member 140 is disposed in the fixing hole 113 of the base, and the fixing member 140 has a fixing member width in the direction of the vertical bottom surface 111. L1; the base fixing hole 113 has a base fixing hole length L2 in the direction of the vertical bottom surface 111; the heat conducting module fixing hole 133 has a heat conducting module fixing hole length L3 in the direction of the vertical bottom surface 111. When the condition of L2>L1≧L3 is satisfied, when the fixing member 140 and the heat conducting module 130 are moved along the vertical bottom surface 111, at least a part of the heat conducting module 130 is restricted to the base by the fixing member 140 and the base fixing hole 113. 110.

In this application, the heat conducting surface 132 of the heat conducting module 130 can be applied. The thermal energy generated by the electronic component is conducted to the base 110 via the heat conducting surface 132, the heat conducting sidewall 131, and the inner sidewall 112 of the base 110 via the heat conducting surface 132. Preferably, the present invention can selectively provide an appropriate amount of heat transfer fluid disposed in the gap 114 of the dynamic thermal conductivity system 100 to increase the thermal conduction between the thermally conductive sidewall 131 and the inner sidewall 112 of the base 110, wherein the heat transfer fluid can It is a thermal paste known in the art.

It is worth mentioning that when this embodiment selectively provides a heat transfer fluid in motion In the gap 114 of the thermal conductivity system 100, the trench 134 on the thermally conductive sidewall 131 can serve as a buffer space for the heat transfer fluid in the gap 114, which can accommodate excess heat transfer fluid when there is too much heat transfer fluid in the gap 114, and When the heat transfer fluid in the gap 114 is insufficient, the heat transfer fluid contained in the groove 134 is supplied into the gap 114. Thereby, the dynamic thermal conductivity system 100 of the present invention maintains an appropriate amount of heat transfer fluid in the gap 114 to maintain a better thermal conductivity between the thermally conductive sidewall 131 and the inner sidewall 112 of the base 110. Preferably, the dynamic thermal conduction system of the present invention can selectively provide more than two grooves or a groove of a threaded body on the thermally conductive side wall to increase the buffering effect on the heat transfer fluid. More preferably, the dynamic thermal conductivity system of the present invention can selectively provide no grooves on the thermally conductive sidewalls to increase the contact area of the thermally conductive sidewalls with the inner sidewalls of the submount.

In another embodiment of the present invention, please refer to the fifth figure, which is the implementation. The top view of the dynamic thermal conductivity system 200 in the aspect. The heat conducting module 230 and the base 210 are rectangular in a top view. It is to be noted that the thermal conduction module and the base of the dynamic thermal conduction system of the present invention may also have other shapes such as an elliptical shape, a circular shape, or the like, or have different heat conduction surface areas or base opening surface areas. Used in conjunction with electronic components with different shapes or mating surface areas. Preferably, the elastic device of the dynamic thermal conduction system of the present invention can also have a different elastic device area in the direction of the vertical heat conducting surface to match the electronic components of different shapes or areas.

Please refer to the sixth figure, which is the fourth embodiment of the dynamic thermal conduction system 200 along the fourth embodiment. A cross-sectional view taken along line B-B of the figure. The heat conducting module 230 has a through hole 233 extending through the heat conducting module, and two heat conducting module fixing holes are formed on the heat conducting side wall (not disclosed), and the dynamic thermal conduction system is The system 200 is fixed in the through hole 233 through the heat conducting module 230 , and the two ends of the fixing member 240 are respectively disposed in the base fixing hole 213 . In addition, the fixing member 240 has a fixing member width L1' in the direction of the vertical bottom surface 211; the base fixing hole 213 has a base fixing hole length L2' in the direction of the vertical bottom surface 211, wherein the condition of L2'>L1' is satisfied. When the fixing member 240 and the heat conducting module 230 are moved along the vertical bottom surface 211, at least a portion of the heat conducting module 230 is restrained in the base 210 by the fixing member 240 and the base fixing hole 213. It is worth mentioning that the dynamic thermal conduction system of the present invention can selectively use two fixing members respectively disposed on the fixing holes of the two heat conducting modules on the heat conducting side wall, so as to achieve at least one part of the heat conducting module is restricted in the base. .

In this application, the heat conducting surface 232 of the heat conducting module 230 can be applied. The thermal energy generated by the electronic component is conducted to the base 210 via the heat conducting surface 232, the heat conducting sidewall 231, and the inner sidewall 212 of the base 210 via the heat conducting surface 232. Preferably, the present invention can selectively provide an appropriate amount of heat transfer fluid disposed in the gap 214 of the dynamic thermal conductivity system 200 to increase the thermal conduction between the thermally conductive sidewall 231 and the inner sidewall 112 of the base 210, wherein the heat transfer fluid can It is a thermal paste known in the art.

It is worth mentioning that when this embodiment selectively provides a heat transfer fluid in motion In the gap 214 of the thermal conductivity system 200, the trench 234 on the thermally conductive sidewall 231 can serve as a buffer space for the heat transfer fluid in the gap 214, which can accommodate excess heat transfer fluid when there is too much heat transfer fluid in the gap 214, and When the heat transfer fluid in the gap 214 is insufficient, the heat transfer fluid contained in the groove 234 is supplied into the gap 214. Thereby, the dynamic thermal conductivity system 200 of the present invention maintains an appropriate amount of heat transfer fluid in the gap 214 to maintain a better thermal conductivity between the thermally conductive sidewall 231 and the inner sidewall 212 of the base 210. Preferably, the dynamic thermal conductivity system of the present invention is A groove for selectively providing two or more grooves or a threaded body on the thermally conductive side wall to increase the buffering effect on the heat transfer fluid. More preferably, the dynamic thermal conductivity system of the present invention can selectively provide no grooves on the thermally conductive sidewalls to increase the contact area of the thermally conductive sidewalls with the inner sidewalls of the submount.

Next, another embodiment of the present invention will be described. Please refer to the seventh figure, which is dynamic. A perspective view of thermal conductivity system 300. Wherein, a thermal thermal conduction system 100 according to the second, third and fourth embodiments of the present invention and a dynamic thermal conduction system 200 according to the fifth and sixth embodiments of the present invention are disposed on the heat conducting plate 310. The dynamic thermal conductivity systems 100 and 200 are fixed to the heat conducting plate 310 by post-treatment nickel welding. Preferably, the present invention can also be used to secure the dynamic thermal conductivity system to the thermally conductive plate using other means such as screwing. In this embodiment, the thermal conduction modules 300 and 230 in the dynamic thermal conduction system 100, 200 can be moved in the direction of the bottom surface of the vertical base, and the dynamic thermal conduction system 300 can be simultaneously completed with two electronic components having different heights. It is more suitable for close fitting, and at the same time, it avoids the stress of the electronic components during assembly or the damage of the electronic components caused by external force vibration after assembly. In addition, the heat conducting surfaces 132 and 232 of the heat conducting modules 130 and 230 respectively have a circular and rectangular shape and different heat conducting surface areas, the bases 110 and 210 have different opening surface areas, and the elastic devices respectively have different elastic device areas. The dynamic thermal conductivity system 300 can be closely attached to electronic components having different contact surface areas or shapes, and the bases have different base heights, the thermal conduction modules have different thermal module heights, and the elastic devices have different elastic heights and The coefficient of elasticity allows the dynamic thermal conductivity system 300 to be closely attached to electronic components having different heights at the same time. It is worth mentioning that the present invention can pre-set a plurality of grooves on the heat conducting plate to accommodate a plurality of dynamic thermal conduction systems in the heat conducting plate, thereby increasing the contact area between the base of the dynamic thermal conduction system and the heat conducting plate, thereby achieving better Thermal conductivity.

Furthermore, it must be emphasized that the invention is not limited to providing two dynamic thermal conduction systems The present invention is generally known in the art, and it is naturally known that the present invention can provide a single or a plurality of different dynamic thermal conduction systems on a heat conducting plate. Preferably, the present invention can provide elastic devices having different elastic coefficients or provide dynamic thermal conduction systems having different shapes, heights or areas corresponding to a plurality of electronic components having different heights, shapes or areas. Achieving better thermal conductivity for a plurality of different electronic components, achieving simplified fabrication complexity and avoiding damage to electronic components caused by external forces during assembly or assembly.

Various changes and modifications can be made without departing from the scope of the invention, and the invention is not limited by the description. Embodiments of the illustrated embodiments.

2‧‧‧heat pipe

21‧‧‧Connecting Department

3‧‧‧thermal block

4‧‧‧Flexible positioning piece

100,200,300‧‧‧Dynamic thermal conductivity system

110,210‧‧‧Base

111,211‧‧‧ bottom

112,212‧‧‧ inner side wall

113,213‧‧‧Base fixing hole

114,214‧‧‧ gap

120,220‧‧‧Flexible device

130, 230‧‧‧ Thermal Module

131,231‧‧‧ Thermal side wall

132,232‧‧‧heat conduction surface

133,233‧‧‧thermal module fixing hole

134,234‧‧‧ trench

140,240‧‧‧Fixed parts

310‧‧‧heat conducting plate

The first figure is a thermally conductive structure of the prior art.

The second figure is an exploded view of a specific embodiment of the present invention.

The third figure is a top view of the embodiment as shown in the second figure.

The fourth figure is a cross-sectional view along the AA direction of the third drawing as in the second embodiment.

The fifth figure is a top view of another embodiment of the present invention.

The sixth drawing is a cross-sectional view taken along the BB direction of the fifth drawing as in the fifth embodiment.

Figure 7 is a perspective view of another embodiment of the present invention.

100‧‧‧Dynamic Thermal Conduction System

110‧‧‧Base

111‧‧‧ bottom

112‧‧‧ inner side wall

113‧‧‧Base fixing hole

120‧‧‧Flexible device

130‧‧‧thermal module

131‧‧‧ Thermal side wall

132‧‧‧heat conduction surface

133‧‧‧thermal module fixing hole

134‧‧‧ trench

140‧‧‧Fixed parts

Claims (12)

A dynamic thermal conduction system comprising: a base comprising a bottom surface and an inner side wall, wherein the inner side wall comprises at least two base fixing holes, and the base fixing holes have a base fixing hole length in a direction perpendicular to the bottom surface; a heat conducting module includes a heat conducting side wall and a heat conducting side surface, wherein the heat conducting side wall is opposite to the inner side wall of the base, the heat conducting side wall and the inner side wall of the base comprise a gap therebetween, the gap accommodating a heat conducting fluid, the heat conducting The side wall has at least two heat-conducting module fixing holes corresponding to the base hole-punching positions, and the heat-conducting module fixing holes have a heat-conducting module fixing hole length in a direction perpendicular to the bottom surface of the base; an elastic device is disposed at one end thereof On the bottom surface of the base, the elastic device is engaged with the heat conducting module with respect to the other end of the bottom surface of the base, such that the heat conducting module is disposed in the base and the heat conducting surface is outside the base; and at least one fixed At least one portion of the member is fixed in the fixing holes of the heat conducting modules, and at least another portion thereof is respectively disposed on the fixing holes In the fixing hole, the fixing member has a fixing member width in a direction perpendicular to the bottom surface of the base, wherein the fixing hole length is greater than the fixing member width, and the fixing member width is greater than or equal to the heat conducting module fixing hole. The length allows the thermally conductive module to move in a direction perpendicular to the thermally conductive surface and to limit at least a portion of the thermally conductive module in the base. The dynamic thermal conductivity system of claim 2, wherein the thermally conductive module has at least one groove on the thermally conductive sidewall for receiving the thermally conductive fluid. The dynamic thermal conductivity system of claim 1, wherein the heat conducting module comprises a through hole, the through hole forming the at least two heat conducting module fixing holes on the heat conducting sidewall through the heat conducting module. A dynamic thermal conduction system comprising: a heat conducting plate, wherein the heat conducting plate is used to cover a plurality of electronic components at the same time; a plurality of bases respectively disposed on the heat conducting plate corresponding to positions of the electronic components, wherein the bases respectively The inner side wall includes at least two base fixing holes, and the base fixing holes have a base fixing hole length in a direction perpendicular to the bottom surface; a plurality of heat conducting modules are respectively disposed in the bases Each of the heat-conducting modules includes a heat-conducting side wall and a heat-conducting surface, respectively, and the heat-conducting side walls are respectively opposite to the inner side wall of the base, and the heat-conducting side wall and the inner side wall of the base respectively comprise a gap. Each of the heat-conducting walls includes at least two heat-conducting module fixing holes respectively at positions corresponding to the fixing holes of the bases, and the heat-conducting module fixing holes respectively have a direction perpendicular to the bottom surface of the bases a heat conducting module fixing hole length; a plurality of elastic devices respectively disposed in the bases, the elastic devices respectively One end is disposed on the bottom surface of the bases, and the other end of the bottom surface of the bases is respectively coupled to the heat conducting modules, so that the heat conducting modules are respectively disposed in the bases and maintain the heat conduction And a plurality of fixing members respectively disposed in the bases, wherein the fixing members respectively have at least one portion fixed in the fixing holes of the heat conducting modules, and each having at least another portion In the base fixing holes, and the fixing members are respectively perpendicular to the bottom surface of the bases Having a fixing member width, wherein the lengths of the fixing holes of the bases are respectively greater than the widths of the fixing members, and the widths of the fixing members are respectively greater than or equal to the lengths of the fixing holes of the heat conducting modules, so that the heat conducting modules are respectively vertically The base is moved in the direction of the bottom surface and at least a portion of the thermally conductive modules are constrained in the base. The dynamic thermal conductivity system of claim 6, wherein the thermally conductive sidewalls of the thermally conductive modules each include at least one trench to accommodate the thermally conductive fluid. The dynamic thermal conductivity system of claim 5, wherein the heat conducting modules respectively comprise a through hole, and the through holes respectively form the at least two heat conducting module fixing holes on the heat conducting sidewalls through the heat conducting modules. The dynamic thermal conductivity system of claim 5, wherein the bases have different base heights corresponding to the heights of the electronic components. The dynamic thermal conductivity system of claim 5, wherein the thermal conduction modules respectively have different heights of a thermal conduction module corresponding to heights of the electronic components. The dynamic thermal conductivity system of claim 5, wherein the elastic devices respectively have different elastic device heights or different elastic coefficients corresponding to the heights of the electronic components. The dynamic thermal conductivity system of claim 5, wherein the bases respectively have different opening surface areas corresponding to one of the electronic components, and the heat conducting modules respectively have corresponding to the contact surface areas. The different heat transfer surface areas, and the elastic means respectively have different elastic device areas corresponding to the open face areas. The dynamic thermal conductivity system of claim 5, wherein the base is welded to the heat conducting plate using post-treated nickel. The dynamic thermal conductivity system of claim 5, wherein the base is screwed to the heat conducting plate.