JP2007064925A - Electronic component tester - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component tester, capable of securing high testing accuracy and of increasing the efficiency of testing operations. <P>SOLUTION: In the electronic component tester testing electronic components under a prescribed temperature environment, a carrier 18 for mounting a lead frame 11, in which the plurality of electronic components 12 with built-in light emitting elements 14 are prepared is held by a socket 9. A heat-conducting part 30, having a structure in which a thin plate 33 provided with a protruded part 33a corresponding to the position of the electronic component 12, is jointed to a heat-conducting block 31 via an elastic sheet 36 is jointed to one end-side of a Peltier element to constitute a contact-type temperature adjustment part. The contact-type temperature adjustment part is mounted on a cover, capable of being opened/closed with respect to the socket 9, and the protruded part 33a of the heat-conducting part 30 is brought into contact with the electronic component 12, by closing the cover so that the heat from the Peltier element is transferred to the electronic component 12 via the heat-conducting block 31, the elastic sheet 36 and via the projecting part 33a, thereby adjusting the temperature during test. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component testing apparatus for testing an electronic component under a predetermined temperature environment.

As one of various tests performed in the manufacturing process of electronic components such as semiconductor devices, there is a burn-in test for the purpose of assuring reliability by evaluating deterioration with time of quality characteristics. In this burn-in test, quality characteristic items are measured while operating electronic components in a temperature environment higher than normal temperature, and a dedicated burn-in device is used for such a test (for example, Patent Documents 1 and 2). reference). In the example shown in Patent Document 1, a burn-in board in which a plurality of electronic components to be tested are mounted is housed in a thermostatic chamber whose interior is maintained at a predetermined test temperature, and the electronic components are maintained at a predetermined temperature. The operation state of the electronic component is measured. In the example shown in Patent Document 2, the temperature of the electronic component to be tested is raised to a predetermined temperature by heating it by contact heat transfer. By conducting the test in an environment higher than room temperature in this way, there is an advantage that the deterioration of quality with time can be accelerated and the time required for the test can be shortened.
JP 2005-156172 A JP 2003-31884 A

  However, the burn-in apparatus shown in the above-mentioned patent document example has the following problems due to the characteristics of the heating means for heating the burn-in board on which the electronic component is mounted. First, in the example shown in Patent Document 1, air in a thermostat is heated by circulating a heating medium heated by a heater in the thermostat, and an electronic component to be tested is heated via the heated air. The method to do was adopted. For this reason, it takes time to raise the temperature of the electronic component to a predetermined inspection temperature and adjust the temperature, and to uniformly adjust the temperature of all the electronic components in a state where a large number of electronic components are housed in a thermostat. However, there is a problem that it is difficult to ensure test accuracy for electronic parts that require high-accuracy test temperature management. In the example shown in Patent Document 2, it is difficult to adjust the temperature uniformly and with high accuracy for a plurality of electronic components to be tested at the same time, and a test apparatus excellent in work efficiency and test accuracy can be configured with a simple configuration. It has not been realized.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component testing apparatus that can improve the efficiency of test work and ensure test accuracy.

An electronic component test apparatus according to the present invention is an electronic component test apparatus that performs an electronic component test under a predetermined temperature environment, and holds an electronic component holding unit that holds a plurality of electronic components and the electronic component holding unit. A socket having a contact terminal that can be in electrical contact with the electrode of the electronic component, a heat transfer portion that directly or indirectly contacts the electronic component held in the socket, and the heat transfer portion are thermally coupled to one end side. A contact-type temperature control unit having a thermo module, a temperature control unit for driving the thermo module, an electronic component held in the socket, and an electric circuit formed through the contact terminal to drive the electronic component And an electronic component operation test section for detecting the operating state, the heat transfer section being a plate-shaped heat transfer block coupled to the thermo module, and an elastic sheet having heat transfer A thin plate provided with a plurality of convex portions that directly or indirectly contact the electronic component, and the thin plate is coupled to the heat transfer block with the elastic sheet sandwiched between the heat transfer block and the thin plate. Configured.

  According to the present invention, a contact-type temperature having a heat transfer section that directly or indirectly contacts a plurality of electronic components to be tested held in a socket, and a Peltier element in which the heat transfer section is thermally coupled to one end side. By adopting a configuration in which the adjustment unit is attached to the cover, the cover is closed, and the heat transfer unit of the contact temperature adjustment unit is brought into contact with a plurality of electronic components held in the socket to heat the electronic component to be tested, The temperature adjustment time can be shortened to improve the efficiency of the test work, and the test accuracy can be ensured.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views of an electronic component testing apparatus according to an embodiment of the present invention. FIG. 3 is a plan view of a lead frame to be tested by the electronic component testing apparatus according to an embodiment of the present invention. FIG. 5 is a configuration explanatory view of a carrier holding a lead frame in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 5 is a perspective view of a carrier holding socket in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 6 is a cross-sectional view of a carrier holding socket in the electronic component test apparatus according to the embodiment of the present invention. FIG. 7 is a perspective view of the contact-type temperature adjusting unit in the electronic component test apparatus according to the embodiment of the present invention. 8 is an exploded perspective view of a contact-type temperature adjusting unit in the electronic component testing apparatus according to the embodiment of the present invention, FIG. 9 is a partial sectional view of the electronic component testing apparatus according to the embodiment of the present invention, and FIG. Electronics of an embodiment of the invention FIG. 11 is a block diagram showing the configuration of the control system in the electronic component testing apparatus according to the embodiment of the present invention, and FIG. 12 is the present invention. FIG. 13 is an explanatory view of the structure of a carrier for holding a lead frame in the electronic component testing apparatus according to the embodiment. FIG. 13 shows the contact state between the contact-type temperature adjusting unit and the electronic component in the electronic component testing apparatus according to the embodiment of the present invention. It is explanatory drawing of.

  First, with reference to FIG. 1 and FIG. 2, an overall configuration of an electronic component test apparatus 1 that performs an electronic component test in a predetermined temperature environment will be described. The electronic component testing apparatus 1 is a burn-in device that measures quality characteristic items while operating the electronic components in a temperature environment higher than normal temperature. As shown in FIG. 1, the electronic component testing apparatus 1 opens and closes an upper cover 3 (cover) having a built-in contact temperature adjustment unit that adjusts the temperature by contacting an electronic component to be tested, and opens and closes the upper surface of the main body 2. It is configured to be mounted so as to cover freely. By operating the clamp lever 4, the main cover 2 of the upper cover 3 is locked and unlocked.

  The main body unit 2 includes a temperature control system for driving the contact-type temperature adjusting unit, and a control unit including an operation test circuit that conducts predetermined measurement while driving the electronic component while being connected to the electronic component to be tested. Is built-in. The operation of the control unit can be performed by an operation button 5 provided on the upper surface of the upper cover 3, and the operation state of the electronic component testing apparatus 1 is displayed by blinking of the display lamp 7. Further, a ventilation hole of the ventilation fan 6 is opened on the upper surface of the upper cover 3, and heat exchange at the time of temperature adjustment is performed by the ventilation fan 6.

  FIG. 2 shows a state in which the lock by the clamp lever 4 is released and the upper cover 3 is opened. A plurality of sockets 9 for setting carriers on which electronic components are mounted are arranged in parallel on a socket table 8 provided on the upper surface of the main body 2. In the upper cover 3, a plurality of contact-type temperature adjusting units 10 are mounted at positions corresponding to the sockets 9. When the upper cover 3 is closed with the electronic component to be tested held in the socket 9, the contact-type temperature adjusting unit 10 comes into contact with the electronic component held in the socket 9, thereby the electronic component during the burn-in test. The temperature is adjusted.

Next, with reference to FIG. 3, an electronic component to be tested will be described. In the present embodiment, an example is shown in which a plurality of electronic components (in this case, light emitting devices) connected to a single lead frame in a strip shape are collectively subjected to testing. In FIG. 3, a plurality of positioning holes 11 a are provided at both edges of the lead frame 11, and the electronic component 12 is placed inside a notch 11 b provided corresponding to the position of each positioning hole 11 a. Is formed.

  The electronic component 12 has a light emitting element 14 mounted on an island portion connected through a lead 15 in the notch portion 11b, and a mold portion 13 having a cavity 13a opened on the light emitting surface side (the front side in FIG. 3). Is formed around the light emitting element 14. The light emitting element 14 is a semiconductor element having a function of generating light, such as a semiconductor laser or a light emitting diode. The light emitting element 14 is electrically connected to a plurality of leads 15 formed by punching the lead frame 11, and the electronic component 12 is notched by the leads 15 partially connected to the main body of the lead frame 11. 11b. In the burn-in test for the light emitting element 14, high-accuracy temperature management (for example, ± 0.5 to 1 ° C.) is required. A method of adjusting the temperature of the electronic component 12 by the unit 10 is adopted.

  Next, a carrier to which the lead frame 11 is mounted will be described with reference to FIG. Since the lead frame 11 is thin and easily bent, the lead frame 11 is handled in a state of being sandwiched from both the upper and lower surfaces by the first plate 16 and the second plate 17 as shown in FIG. The first plate 16 that contacts the upper surface of the lead frame 11 is provided with a through hole 16a for exposing the electronic component 12 to the upper side. The second plate 17 is provided with a frame recess 17c for fitting the lead frame 11 and a through hole 17d for exposing the electronic component 12 to the lower side. Further, the second plate 17 is provided with flanges 17a for holding the socket 9 so as to extend laterally from both ends, and positioning pin holes 17b are formed in the flanges 17a. .

  FIG. 4B shows a state where the carrier 18 is formed by sandwiching the lead frame 11 between the first plate 16 and the second plate 17. In this state, the mold part 13 of the electronic component 12 is exposed to the upper surface side through the through hole 16a, and the light emitting element 14 and the lead 15 are exposed to the lower surface side through the through hole 17d. The lead frame 11 is attached to the socket 9 in such a state that it is set on the carrier 18 in this manner.

  Next, the structure of the socket 9 to which the carrier 18 is attached will be described with reference to FIGS. FIG. 5 shows a pair of sockets 9 arranged in parallel on a socket table 8 provided on the upper surface of the main body 2. As shown in FIG. 5, the socket 9 has a structure in which a rectangular flat plate-like eject plate 21 for supporting the carrier 18 from the lower surface side is mounted on a socket body 20 that is a groove-shaped member. The socket body 20 is provided with positioning pins 22 for positioning the carrier 18 by fitting into the pin holes 17b of the second plate 17.

  The eject plate 21 is provided with a device hole 21 a for transmitting light emitted from the light emitting element 14 downward when testing the electronic component 12 at a position corresponding to the arrangement of the electronic components 12 in the lead frame 11. . Contact terminals 23 are inserted from below into terminal insertion grooves 21b provided on both sides of the device hole 21a. The contact terminal 23 can be brought into electrical contact with the lead 15 of the electronic component 12 by mounting the carrier 18 on which the lead frame 11 is set on the socket 9 and pushing it down.

FIG. 6 shows a cross section in the Y direction of one socket 9 at the position of the device hole 21 a and the positioning pin 22. As shown in FIG. 6, the socket body 20 is provided with an elevating space 20 b having a sliding contact surface 20 a for moving up and down by sliding both sides of the eject plate 21. The eject plate 21 is urged from below by a spring 24 in the elevating space 20b. In a state where the eject plate 21 is lifted by the urging force of the spring 24, the upper surface of the eject plate 21 is positioned at a height that substantially matches the holding surface 21c provided to support the flange portion 17a from the lower surface side.

  The light receiving unit 25 is disposed at a position that coincides with the center of the device hole 21a on the bottom surface of the elevating space 20b. The light receiving unit 25 and the contact terminal 23 are electrically connected to the control unit 40 (see FIG. 11), respectively. The contact terminal 23 contacts the lead 15 and is electrically connected to the control unit 40, thereby emitting light. The element 14 is driven to emit light. This light is detected by the light receiving unit 25 located immediately below, and the detection result is transmitted to the control unit 40. That is, the light receiving unit 25 functions as a light detection unit that detects light emission of the light emitting element 14 (light emitting element) built in the electronic component 12 held in the socket 9.

  In the above configuration, the holding surface 20c and the positioning pin 22 provided on the socket body 20 hold the carrier 18 on which the lead frame 11 provided with the plurality of electronic components 12 is set, thereby allowing a plurality of electronic devices to be tested. It is an electronic component holding unit for holding the component 12. And the socket 9 becomes a form which has the contact terminal 23 which can be electrically contacted to the lead 15 as an electrode of the electronic component 12 hold | maintained at this electronic component holding part and the electronic component holding part which hold | maintains an electronic component. Yes.

  Next, with reference to FIGS. 7 and 8, the structure of the heat transfer unit 30 that comes into contact with the electronic components held in the socket 9 in the contact-type temperature adjusting unit 10 will be described. FIG. 7 shows the heat transfer section 30 of the contact-type temperature adjusting section 10 mounted on the upper cover 3 in an inverted state in a normal rotation posture, and corresponds to the pair of sockets 9 shown in FIG. . Moreover, FIG. 8 has shown the state which decomposed | disassembled each element which comprises the heat-transfer part 30 to the up-down direction.

  As shown in FIG. 7, the heat transfer section 30 has a rectangular plate shape, and a thin plate 33 is fixed to the upper surface of the heat transfer block 31 by a fixed frame 32. The thin plate 33 is provided with a plurality of convex portions 33 a corresponding to the arrangement of the electronic components 12 in the lead frame 11, and the contact-type temperature adjusting unit 10 is attached to the electronic components 12 held by the socket 9 by closing the upper cover 3. When contacting, the convex portion 33 a contacts the upper surface of each electronic component 12, that is, the back surface of the mold portion 13.

  The convex portion 33a is provided by removing a range other than the portion corresponding to the convex portion 33a by etching in a thin metal plate having excellent thermal conductivity such as copper. The heat transfer block 31 is coupled to one end side of a Peltier element 37 as a thermo module that generates heat in a state where the heat transfer block 31 is incorporated in the contact temperature adjusting unit 10, and transfers heat from the Peltier element 37 to the convex portion 33 a. It has a function.

  As shown in FIG. 8, a heat transfer sheet 35 and an elastic sheet 36 are interposed between the thin plate 33 and the heat transfer block 31. The heat transfer block 31 is provided with a rectangular sheet mounting recess 31a, and a rectangular plate-shaped elastic sheet 36 is mounted in the sheet mounting recess 31a. As the elastic sheet 36, silicon which is rich in elasticity and has heat resistance to a heating temperature in the burn-in test (about 100 ° C. in the present embodiment), and further heat-conducting silicon rubber formed into a sheet shape. A sheet is used. Of course, materials other than silicon rubber may be used as long as the above conditions are satisfied. The heat transfer sheet 35 is formed by molding a material having excellent thermal conductivity such as graphite into a sheet shape. By interposing the heat transfer sheet 35, it is possible to improve the thermal conductivity between the thin plate 33 and the heat transfer block 31, which are thin and difficult to adhere by bolt fastening.

When the heat transfer section 30 is assembled, the elastic sheet 36 is mounted on the sheet mounting recess 31a, the heat transfer sheet 35 is placed on the elastic sheet 36, and the thin plate 33 is mounted thereon. Then, the thin plate 33 is pressed by the fixed frame 32, the bolts 34 are inserted into the mounting holes 32a and 33b provided in the fixed frame 32 and the thin plate 33, respectively, and the bolts 34 are screwed into the screw holes 31b provided in the heat transfer block 31. To do. Thereby, the heat-transfer part 30 with which each said member was integrated is formed. In this state, the convex portion 33a is supported by the thin plate 33 having a small rigidity in the plate pressure direction, and the thin plate 33 is surface-supported on the opposite surface side of the convex portion 33a by the elastic sheet 36 rich in stretchability. Therefore, it is displaced so as to easily sink into the elastic sheet 36 by the force in the surface direction.

  The heat transfer unit 30 assembled in this manner is incorporated into the upper cover 3 as a part of the contact-type temperature adjusting unit 10. Then, by closing the upper cover 3, the heat transfer unit 30 is pressed against the plurality of electronic components 12 held by the socket 9. At this time, as described above, since the convex portion 33a easily sinks into the elastic sheet 36 by the force in the surface direction, when there are variations in height and flatness in the plurality of electronic components 12 held by the socket 9. Even if it exists, the convex part 33a can be made to follow the height of each electronic component 12, and can be made to contact favorably here.

  That is, in the above configuration, the heat transfer section 30 directly or indirectly contacts the plate-shaped heat transfer block 31 coupled to the Peltier element 37 as a thermo module, the heat-conductive elastic sheet 36, and the electronic component. And a thin plate 33 provided with a plurality of convex portions 33a, and the thin plate 33 is coupled to the heat transfer block 31 with an elastic sheet 36 sandwiched between the heat transfer block 31 and the thin plate 33. Here, an example using the Peltier element 37 is shown as the thermo module, but other electric heaters or the like may be adopted as the thermo module.

  FIG. 9 shows a cross section in a state in which the upper cover 3 in which the contact-type temperature adjusting unit 10 is incorporated is closed. In a state where the upper cover 3 is closed, the heat transfer section 30 is lowered with respect to the socket 9. The heat transfer part 30 is fixed to a base part 3 a provided on the upper cover 3, and one end side of the Peltier element 37 abuts on the upper surface side of the heat transfer part 30 so that the heat transfer part 30 and the Peltier element 37 are heated. Combined. A temperature sensor 39 is inserted in the heat conduction block 31 of the heat transfer section 30, and the temperature of the heat conduction block 31 is detected by the temperature sensor 39.

  The lower surface of the heat exchanging member 38 having a plurality of fins 38a abuts on the other end side of the Peltier element 37, and the Peltier element 37 and the heat exchanging member 38 are thermally coupled. Further, the ventilation fan 6 is positioned above the heat exchange member 38. By driving the ventilation fan 6, outside air can be taken from outside the upper cover 3 and blown to the fins 38a. When the Peltier element 37 is heating the heat transfer unit 30, the heat exchange member 38 functions to transmit the heat of the outside air to the Peltier element 37, and when the Peltier element 37 is cooling the heat transfer unit 30 The heat exchange member 38 functions to dissipate the heat of the Peltier element 37 to the outside air.

  That is, the contact-type temperature adjusting unit 10 includes a heat transfer unit 30 that contacts an electronic component held in the socket 9 and a Peltier element 37 in which the heat transfer unit 30 is thermally coupled to one end side. Further, a heat exchange member 38 for heat exchange is thermally coupled to the other end side of the Peltier element 37, and a ventilation fan 6 is further provided as a ventilation means for blowing air to the fins 38 a provided on the heat exchange member 38. It becomes the composition. In addition, as a form which makes the heat-transfer part 30 contact the electronic component hold | maintained at the socket 9, the heat-transfer part 30 may be made to contact the electronic component 12 directly, or it manufactured with the material with good heat conductivity, such as a metal. You may make the transmission part 30 contact the electronic component 12 indirectly through a heat transfer member.

FIG. 10 shows details of a state where the upper cover 3 is closed and the heat transfer section 30 is lowered with respect to the socket 9. FIG. 10A shows a state before the heat transfer section 30 comes into contact with the carrier 18 held by the socket 9. At this time, the carrier 18 is positioned with respect to the socket 9 by inserting the upper end portion of the positioning pin 22 into the pin hole 17b provided in the flange portion 17a. In this state, the eject plate 21 on which the carrier 18 is placed is in a normal position supported by the urging force of the spring 24.

  When the heat transfer section 30 descends from this state, as shown in FIG. 10B, the convex portion 33a comes into contact with the back surface of the mold section 13, and further the upper cover 3 is closed to lower the heat transfer section 30. As a result, the entire carrier 18 is pushed downward. As a result, the eject plate 21 is also pushed down against the urging force of the spring 24 together with the carrier 18, and the descent stops at a height at which the flange portion 17a contacts the holding surface 21c. In this state, the heat generated by the Peltier element 37 is transmitted to the electronic component 12 through the heat transfer block 31, the elastic sheet 36, the thin plate 33, and the convex portion 33a. The contact terminal 23 is in contact with the lead 15, and the light emitting element 14 of the electronic component 12 is at a position facing the light receiving portion 25 provided in the socket 9.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 11, a plurality of (here, four from # 1 to # 4) sockets 9 and a plurality (two in this case) of contact-type temperature adjusting units 10 are connected to the control unit 40. The control unit 40 includes an electronic component detection unit 41, a temperature control unit A42, a temperature control unit B43, and an electronic component operation test unit 44. The electronic component detection unit 41 detects whether or not a test target electronic component is set in the socket 9, that is, whether or not the carrier 18 in which the lead frame 11 is set is mounted in the socket 9. As a detection method, it is possible to use electrical characteristics such as current, voltage, and resistance during energization for the test, presence / absence of light reception by the light receiving unit 25, and the carrier 18 using an optical sensor or a mechanical sensor. Alternatively, a method of directly detecting

  The temperature control unit A42 and the temperature control unit B43 have a function of driving the Peltier element 37. At this time, while detecting the temperature signal from the temperature sensor 39 set in the heat transfer block 31, the Peltier element 37 is driven to control the temperature of the Peltier element 37 to the target temperature. Here, the operations of the temperature control unit A42 and the temperature control unit B43 are executed based on the electronic component detection result by the electronic component detection unit 41. If the carrier 18 is not set in the sockets # 1 and # 2, the temperature control unit A42 is in a resting state, and power supply to the contact-type temperature adjusting unit 10 corresponding to the sockets 9 and # 2 is stopped. The Similarly, if the carrier 18 is not set in the sockets # 3 and # 4, the temperature control unit B43 is in a dormant state, and power is supplied to the contact-type temperature adjusting unit 10 corresponding to the sockets 9 and # 4. Stopped.

  That is, the electronic component test apparatus according to the present embodiment further includes an electronic component detection unit 41 that detects the presence or absence of an electronic component in the socket 9, and the temperature control unit A42 and the temperature control unit B43 are detected by the electronic component detection unit 41. Based on the result, the power supply to the contact-type temperature adjusting unit 10 where there is no electronic component to be contacted is stopped. As a result, in the electronic component testing apparatus having a plurality of sockets 9, even if the number of lead frames to be tested increases or decreases depending on the work lot, the contact-type temperature adjustment unit necessary for performing the test Only 10 can be driven. Therefore, it is possible to eliminate energy consumption by driving the contact-type temperature adjusting unit 10 corresponding to the socket 9 on which the test object is not mounted, and promote energy saving.

  The electronic component operation test unit 44 has a function of forming an electric circuit via the contact terminal 23 and the electronic component 12 held in the socket 9 to drive the electronic component 12 and detecting its operating state. The electronic component drive unit 45, the measurement unit 46, the determination unit 47, and the determination result storage unit 48 are included. The electronic component drive unit 45 drives the electronic component 12 according to the operation sequence, and causes the light emitting element 14 built in the electronic component 12 to emit light.

  The measurement unit 46 measures the driving state of the electronic component 12 (the light emission state of the semiconductor 14 in the present embodiment). That is, the electrical signal (voltage) output when the light receiving unit 25 receives the light of the light emitting element 14 is measured. The determination unit 47 performs pass / fail determination of the electronic component 12 based on the measurement result by the measurement unit 46. Here, the light emission state detected by the light receiving unit 25 is determined, and it is determined whether or not the deterioration with time of the light emission characteristics of the light emitting element 14 is below an allowable level. That is, in the present embodiment, the electronic component operation test unit 44 causes the light emitting element 14 to emit light and determines the light emitting state detected by the light receiving unit 25.

  The determination result storage unit 48 stores the determination result obtained by the determination unit 47. The determination result stored in the determination result storage unit 48 is output to a personal computer or a determination result display via the communication interface 50, and the determination result is displayed by these. The personal computer displays the inspection result in the form of a pass / fail list. The inspection result is linked to the serial number of each electronic component 12 and output to the determination result display, and the lead frame 11 after the inspection is set to the determination result display on the determination result display. Each determination result is displayed. The control unit 40 is connected to the operation unit 51 (operation button 5) and the display unit 52 (display lamp 7). By operating the operation button 5, an operation instruction is input to the control unit 40. The display of the control state by the control unit 40 is performed by causing the display unit 52 to blink the display lamp 7.

  When performing a burn-in test on the electronic component 12 in the lead frame state with this electronic component testing apparatus, the following procedure is used. First, the lead frame 11 to be tested is sandwiched between the first plate 16 and the second plate 17 to prepare the carrier 18 shown in FIG. Next, the upper cover 3 is opened, and the upper surface of the main body 2 is exposed as shown in FIG. When the carrier 18 is set in the socket 9, the upper cover 3 is closed to cover the upper surface of the main body 2.

  Thereby, the heat transfer part 30 of the contact-type temperature adjusting unit 10 covers the upper side of the carrier 18, and the protrusions 33 a provided on the heat transfer part 30 are in direct contact with the plurality of electronic components 12 held by the carrier 18. At this time, as described above, the thin plate 33 provided with the protrusions 33a is supported by the elastic sheet 36 having a high elasticity, so that the height and flatness of the plurality of electronic components 12 held by the single carrier 18 are increased. Even when the degrees vary, the respective protrusions 33 a are displaced following the respective electronic components 12. Therefore, the convex part 33a and the electronic component 12 are thermally coupled in a good contact state, and good thermal conductivity is ensured.

  Thereby, heat exchange between the Peltier element 37 and the electronic component 12 is performed efficiently and with good responsiveness, and the temperature adjustment time in the burn-in test can be shortened. For example, in a conventional apparatus that raises the temperature in a thermostatic chamber via a heated gas to raise the temperature from room temperature to the test temperature (about 100 ° C.), a temperature adjustment time of about 1 hour is required at the time of temperature increase. It was necessary. On the other hand, in the electronic component testing apparatus of the present embodiment, it is possible to raise the temperature of the plurality of electronic components 12 from room temperature to the test temperature in a short time of 5 to 10 minutes. Significant shortening has been realized.

  In the above embodiment, the convex portion 33a is brought into direct contact with the electronic component 12 in the heat transfer section 30, but the carrier 18A as shown in FIG. 12 is used and the heat transfer section 30 functions as a heat transfer member. The electronic component 12 may be indirectly contacted through a spacer. In this case, the first plate 16A as shown in FIG. 12A is used in place of the first plate 16 together with the second plate 17 shown in FIG.

The first plate 16A is thicker than the first plate 16, and the electronic component 12
A through hole 16b is provided at a position corresponding to. The through hole 16b has a shape in which a spacer 53 made of a material having excellent thermal conductivity is fitted with the upper surface of the first plate 16A in a flush state. In a state where the lead frame 11 is sandwiched between the first plate 16A and the second plate 17 to form the carrier 18A, the spacer 53 is in contact with the electronic component 12 (the back surface of the mold part 13) as shown in FIG. It becomes.

  FIG. 13 shows a state in which the carrier 18A having such a configuration is set in the socket 9 and heated by the contact-type temperature adjusting unit 10. In this case, instead of the heat transfer unit 30 shown in FIG. 10, as shown in FIG. 13A, a heat transfer unit 30A in which a protrusion 33c having a protrusion margin smaller than the protrusion 33a is formed. Then, by lowering the heat transfer portion 30 </ b> A with respect to the socket 9, the convex portion 33 c comes into contact with the upper surface of the spacer 53, and the electronic component 12 is heated by the Peltier element 37 via the spacer 53. That is, in this case, the convex portions 33 c of the heat transfer section 30 </ b> A are indirectly brought into contact with the plurality of electronic components 12 held by the plurality of sockets 9.

  As described above, in the electronic component test apparatus shown in the present embodiment, the heat transfer section 30 that directly or indirectly contacts the plurality of electronic components 12 to be tested held in the socket 9, and the heat transfer section. Is attached to the upper cover 3 with the Peltier element 37 thermally coupled to one end side, the upper cover 3 is closed, and the heat transfer section 30 of the contact temperature adjusting section 10 is connected to the socket 9. A configuration is adopted in which the temperature of the electronic component 12 to be tested is adjusted by bringing it into contact with the plurality of electronic components 12 held on the surface.

  As a result, the time required for temperature adjustment can be shortened and the efficiency of the test work can be improved, and an electronic component such as the light-emitting element 14 that requires high-precision temperature management in the burn-in test is used as a test target. Even in some cases, high test accuracy can be ensured. Further, by adopting the heat transfer section 30 having the above-described configuration as a heat transfer mechanism for performing contact-type temperature adjustment for a plurality of electronic components 12 held in the socket 9, the height and flatness of the electronic components 12 can be improved. Even when there are variations in the temperature, a uniform contact state is always ensured and good temperature adjustment is realized.

  The electronic component testing apparatus 1 shown in the present embodiment has a simple configuration in which the contact-type temperature adjusting unit 10 having the above-described configuration is attached to the openable upper cover 3, so that a plurality of units are arranged in parallel. It is possible to realize a flexible electronic component testing apparatus with excellent product compatibility at low cost.

  The electronic component testing apparatus of the present invention has an effect of shortening the temperature raising time and improving the efficiency of the test work and ensuring high test accuracy. It is useful as a test apparatus for the target burn-in test.

The perspective view of the electronic component testing apparatus of one embodiment of this invention The perspective view of the electronic component testing apparatus of one embodiment of this invention The top view of the lead frame used as the test object of the electronic component testing apparatus of one embodiment of this invention Structure explanatory drawing of the carrier holding a lead frame in the electronic component testing apparatus of one embodiment of the present invention The perspective view of the socket for carrier holding | maintenance in the electronic component testing apparatus of one embodiment of this invention Sectional drawing of the socket for carrier holding in the electronic component testing apparatus of one embodiment of this invention The perspective view of the contact-type temperature control part in the electronic component testing apparatus of one embodiment of this invention The disassembled perspective view of the contact-type temperature control part in the electronic component testing apparatus of one embodiment of this invention 1 is a partial cross-sectional view of an electronic component test apparatus according to an embodiment of the present invention. Explanatory drawing of the contact state of the contact-type temperature control part and electronic component in the electronic component testing apparatus of one embodiment of this invention The block diagram which shows the structure of the control system in the electronic component testing apparatus of one embodiment of this invention Structure explanatory drawing of the carrier holding a lead frame in the electronic component testing apparatus of one embodiment of the present invention Explanatory drawing of the contact state of the contact-type temperature control part and electronic component in the electronic component testing apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component test apparatus 2 Main body part 3 Upper cover 6 Ventilation part 9 Socket 10 Contact-type temperature control part 11 Lead frame 12 Electronic component 14 Semiconductor element 18, 18A Carrier 23 Contact terminal 25 Light-receiving part 30, 30A Heat-transfer part 33 Thin plate 33a Convex part 37 Peltier element (thermo module)
38 Heat exchange member

Claims (5)

An electronic component test apparatus that performs an electronic component test under a predetermined temperature environment,
A socket having an electronic component holding portion for holding a plurality of electronic components, a contact terminal that can be electrically contacted with an electrode of the electronic component held in the electronic component holding portion, and an electronic component held in the socket directly or A contact-type temperature adjustment unit having a heat transfer unit that indirectly contacts and a thermo module in which the heat transfer unit is thermally coupled to one end side, a temperature control unit that drives the thermo module, and held by the socket An electronic component operation test unit that forms an electric circuit via the contact terminal and drives the electronic component through the contact terminal and detects the operating state of the electronic component,
The heat transfer part includes a plate-like heat transfer block coupled to the thermo module, an elastic sheet having heat transfer properties, and a thin plate provided with a plurality of convex portions that directly or indirectly contact the electronic component. An electronic component testing apparatus comprising: the elastic sheet sandwiched between the heat transfer block and the thin plate; and the thin plate coupled to the heat transfer block.   The electronic component testing apparatus according to claim 1, wherein the thermo module is a Peltier element.   2. The electronic component testing apparatus according to claim 1, further comprising a fan that thermally couples a heat exchange member having a fin to the other end of the Peltier element and blows air onto the fin.   The electronic component testing apparatus according to claim 1, wherein the convex portion is provided by etching a thin plate. The electronic component testing apparatus according to claim 1, wherein the elastic sheet is a silicon sheet.

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