M356906 Λ 正M356906 Λ 正
八、新型說明： ,印 【新型所屬之技術領域】 鏡 本^乍是-_於探針職裝置之技術領域，_是指一種具有 頭組、霧喊鏡且崎測試影像細；之料裝置。 ’、 【先前技術】 -般測試半導體晶狀探針卡，主要是作為測試機台 ==件’由測試機台提供電壓使⑽ 〇 CCD ^ cm〇s)^^^ ? 則須將測試光__f彡賴U之絲感魅 ΓΓΓ性變化，並產生電性訊號至所連接的探針卡及測== 處。由於與習用-般探針卡的要求不同，於是就有 像感測晶片之探針卡。 丨j寻㈣元 此_於影佩測糾之探針卡，主要特殊之處是在電路板上具 有一開口，使得外部的光绩 片所需之級。目卩，麟供制之影像感測晶 S，線的照射方式，是直接提供-光源於探針 1上方位置，此光源内部具有特殊的結構，當光源發亮時光線是呈 奸仃細射，大部份树除了會_先設定路徑 面進達電路板下方的_，但乃有部份光線會照射至電路板ί 面後反射回去，干擾到原太τ火Α _ 孜表 測試結果。 ’、巾路㈣姐’軸干涉縣’影響到 5 M356906Eight, new description:, India [new technology field] mirror is ^ - is in the technical field of the probe device, _ refers to a head group, fog mirror and fine test image; . ', [previous technology] - general test semiconductor crystal probe card, mainly as a test machine == piece 'provided by the test machine voltage (10) 〇 CCD ^ cm 〇 s) ^ ^ ^ ? __f 彡 U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U Since it is different from the conventional probe card, there is a probe card like a sensing chip.丨j寻(四)元 This is the main reason for the probe card, which has an opening on the circuit board, so that the external light is required. It is seen that the image sensing crystal S of the lining system is directly provided with the light source above the probe 1. The light source has a special structure inside, and when the light source is bright, the light is incidental. Most trees except _ first set the path surface to the _ below the board, but some of the light will illuminate the board and then reflect back, disturbing the original too τ Α _ 测试 test results. ‘, towel road (four) sister’s axis interferes with the county’ influence 5 M356906
本創作之主要目的是提供—次能進行高品纽夠影像_晶片. 測試之探針職裝置，該裝置内具有數組綱_—大面積的霧面遽 鏡’使光線能均勻照射並由鏡頭組作有效的處理與聚焦，讓最後投射 於測試影像感測晶片的光線最符合測試條件，且一次能進行複數個晶 片的測試’具有測試效率提昇及職品f穩定等雙重功效。 本創作之次要目的是提供一種組裝生產容易的探針測試裝置，主 φ 要將主要餅模組化，例如形成__縣模組、複數_顧定模組、 探針固賴料，城時將各齡依序減在—起，如此—來生產^ 便，效率也能提昇，另外維修校正時也更為容易。 本創作之再一目的是提供一種用於測試影像感測晶片之探針測試 裝置，該探針測試裝置内部所之用之探針可為彈菁式探針(印咖 probe)或垂直式可撓曲探針(如㈣此祕呢pr〇be)等，藉此形成鲁 一種創新的垂直式探針卡。 為達成雨述之目的’本創作主要包含有一燈光模組、一霧面渡鏡 (D·中複數組鏡頭固定模組、一固定座、一電路板以及一探針固定 模、”且别述各構作是由上而下依序組配在―起。該電路板上分佈著陣 列式的複數個視窗，該探針固定模組固定於電路板底面，將複數探針 被固定保持於接近視訂方的測區域，每—視賴鄰近複數探針構 M356906 之探針測試裝置。 獨立的測試_。_定座結合於電路板之上，固定著複數個鏡 賴組，每—個_概之__縣—姆的視窗。該 =拉、、雜於最上綠置’ __期錄奴触與複數鏡頭固 疋核、且之Μ #此提供—種能―:欠進行複數_試影賴測晶片測試 /另外補作之探針切採㈣的騎麟單_型式，可依不同的 須求選用合適的探針，而所使用的探針則可為彈簧式探針、垂直式可 撓曲探針、懸臂式探針(cantilever pr〇be)等，藉此增加本創作的適 【實施方式】 茲配合下列之圖示說明本創作之詳細結構及其連結關係，俾使熟習 該項技術領域者在研讀本說明書後能據以實施。 、 請參閱第-、二圖所示，係為本創作之結構剖面示意圖及平面分 解示意圖。本解之探針職裝置A由上而下依序包含有—燈光模組 1、-霧面遽鏡2、複數組鏡顧定模組3、一固定座4、一電路板5 以及-探針固定模組6。該燈光模組丨提供測試時所須之光線，在本 實施例中紐細組丨之光駐要是_發光二極體。雜面遽鏡2 主要用以使光線能均自照射。該鏡顧定触3主要包括_鏡頭承座 31及-鏡頭組32 ’該鏡頭組32内部具有數片透鏡，使光線具有聚焦 投射的效果。該鏡頭承座31為中空狀，中心、具有内螺紋，而該鏡賴 7 M356906 32 J半部則具有外螺紋321，兩者採可調式的螺接方式組合在一起， 二二鏡頭組32能進行焦距的校正工作。該固定座4為一大面積的基 區域職數個結合孔錢，如_所示，複數結合孔座 形成-似方型的陣列。每一個結合孔座41是供 當鏡概觸掏承錢撕衛綱處的過 程中，該鏡頭承座31仍能作水平方向的微量校正，用以校正中心線位 ==板5具有-第一表面51、一第二表面52及複數個視窗53， 輪53則貫穿於電路板。該電路板5是以第—表面51結合於前述 固疋座4底面。該第二表面52處則結合著該探針固定模組6 _模組6是將複數探針61固定簡於接近視窗53的下方周圍區 域，母-視窗53是與鄰近複數探針61構成一獨立的測試區域。該探 針頂部是與電路板5之第二表面52上的線路相電性連接，底制 延伸錄針固定模組6下方。在本實施财諫針狀模組6且有複 數個開口 62 ’每一開口 62對應著—視窗53的位置，該複數探針61 ^被固定保持於鄰近開口 62附近的區域。藉此在進行測試時，該燈光 杈組1產生之光線’經霧面滤鏡2處理即可獲得均均光，再由鏡頭組 32聚焦投射於影像感測晶片處，使得影感測晶片獲得最佳 線，提昇晶片的測試品質。 本創作之探針固定模組6主要是將探針61固定保持於電路板5 下方位置’作為與影像躺“接觸駐具。該探針Μ的翻貞則依設 計者的需求而定。在本實施财，該探針61為—彈簧式探針加^ 8 M356906 probe)，並採垂直式方式設置。但並不以此為限，例如該探針也可為 垂直式可&曲探針（\rerticai Bending pr〇be)或懸臂式探針 (cantilever probe)等 ° 如第四圖所示，本實施例之探針測試裝置用於測試影像感測晶片 之較佳實施例圖。該測試單元8〇處具有複數個影像感測晶片81，所 形成的影像感測晶片陣列對應著前述電路板5之複數個視窗53之位 齡置。當進行測試時’該探針固定模組6之複數探針61會與相對應之影 像感測晶片81的線路相接觸。該燈光單元丨產生適當的可見光，光線 先經務面遽鏡2處理形成均勻光，之後由固定於固定座4之複數鏡頭 固定模組3之鏡頭組31聚焦後，能使光線會經電路板5之視窗53投 射到相對應之影像感測晶片81的光學感應區内，影像感測晶片81因 雙光線之照射而產生電性變化，提供電性訊號予探針61、電路板5、 最後至測試機台，由測試機台進行相關的測試及資料處理。 綜合以上所述’本創作之用於測試影像感測晶片之探針測試裝 置’以陣列式分佈的複數視窗配合相對應的數目的鏡頭組，故能同時 進行複數個影像感測晶片的測試工作，讓測試效率提昇。另外内部具 有鏡頭組與霧面濾鏡的設計，能提供最佳的測試光線，使測試品質相 對提昇。符合專利之申請要件。 惟以上所述者，僅為本創作之較佳實施例而已，當不能以之限定 9 M356906 本創作實施之細’即大膽本創料請翻範叫 … 修飾，皆赫屬於糊作專顺蓋之細内。 切等變化與 【圖式簡單說明】 第一圖為本創作之結構剖面示意圖； 第二圖為本創作之結構平面分解示賴，部份構件以剖關表示； 第二圖為本創作之固定座之平面圖； 第四圖為本創作之祕測試影像_ “之較佳實施例圖。 【主要元件符號說明】 A探針測試裝置 1燈光模組 2霧面濾、鏡 3鏡頭固定模組 31鏡頭承座 32鏡頭組 321外螺紋 4固定座 41結合孔座 5電路板 51第一表面 52第二表面 53視窗 • M356906 l 1 -6探針固定模組 61探針 62開口 .80測試單元 81影像感測晶片 M356906 « I 十、圖式 徐）月Ρ 修正丨 i：'The main purpose of this creation is to provide a probe device for high-quality imagery. The device has an array of _-a large-area matte mirror to make the light evenly illuminated by the lens. The group is effectively processed and focused, so that the light finally projected on the test image sensing wafer is most in accordance with the test conditions, and the test of multiple wafers at one time can have the dual effects of improving test efficiency and stabilizing the job. The second objective of this creation is to provide a probe testing device that is easy to assemble and manufacture. The main φ is to modularize the main cake, for example, to form a __ county module, a complex _Guding module, a probe, and a city time The ages are reduced in sequence, so that the production can be improved, and the efficiency can be improved. It is also easier to repair and correct. A further object of the present invention is to provide a probe testing device for testing an image sensing chip, and the probe used in the probe testing device can be a bullet-probe probe or a vertical type Deflection probes (such as (4) this secret pr〇be), etc., thereby forming an innovative vertical probe card. In order to achieve the purpose of the rain, 'this creation mainly includes a light module, a matte mirror (D·Chinese complex array lens fixed module, a fixed seat, a circuit board and a probe fixed mold,) and other descriptions Each of the structures is sequentially arranged from top to bottom. The circuit board is provided with an array of a plurality of windows, and the probe fixing module is fixed on the bottom surface of the circuit board, and the plurality of probes are fixed and kept close to each other. Depending on the test area of the prescription, each probe is connected to the probe test device of the M366906. The independent test _. _ is fixed on the circuit board, fixed with a plurality of mirror groups, each _ __县—Mr's window. The = pull, miscellaneous on the top of the green set ' __ period of the slave touch and the complex lens solid nucleus, and then # this offer - kind of energy -: owed to the plural _ test Depending on the need for the probe, the probe can be a spring-loaded probe or a vertical type. Flexing probes, cantilever probes, etc., thereby increasing the appropriate implementation of the creation The following is a description of the detailed structure of the creation and its connection relationship, so that those skilled in the art can implement it after studying this manual. Please refer to the figures - and Figure 2 for The schematic structure diagram and the plane decomposition diagram of the present invention. The probe device A of the present solution includes the light module 1, the matte mirror 2, the complex array mirror module 3, and a fixed seat from top to bottom. 4. A circuit board 5 and a probe fixing module 6. The light module 丨 provides the light required for the test. In this embodiment, the light of the new group is _light emitting diode. The mirror 2 is mainly used to make the light self-irradiation. The mirror contact 3 mainly includes a lens holder 31 and a lens group 32. The lens group 32 has a plurality of lenses inside, so that the light has a focusing projection effect. The lens holder 31 is hollow, has a center and has an internal thread, and the mirror has a male thread 321 in the half portion of the M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M Correction of the focal length. The mount 4 is a large area The base area is combined with a plurality of holes, as shown in _, the plurality of combined holes form a square-like array. Each of the combined hole seats 41 is used in the process of omitting the money to tear the guard. The lens holder 31 can still be used for minor correction in the horizontal direction for correcting the center line position == the board 5 has a first surface 51, a second surface 52 and a plurality of windows 53, and the wheel 53 runs through the circuit board. The circuit board 5 is coupled to the bottom surface of the solid housing 4 by a first surface 51. The second surface 52 is coupled to the probe fixing module 6 _ the module 6 is to fix the plurality of probes 61 to the window 53. In the lower surrounding area, the female-window 53 is formed as a separate test area from the adjacent plurality of probes 61. The top of the probe is electrically connected to the line on the second surface 52 of the circuit board 5, and the bottom extension needle is inserted. Below the fixed module 6. In the present embodiment, the needle-shaped module 6 has a plurality of openings 62' each of which corresponds to the position of the window 53, and the plurality of probes 61 are fixedly held in the vicinity of the opening 62. Therefore, when the test is performed, the light generated by the light 杈 group 1 is processed by the matte filter 2 to obtain uniform light, and then the lens group 32 is focused and projected on the image sensing wafer, so that the shadow sensing wafer is obtained. The best line to improve the test quality of the wafer. The probe fixing module 6 of the present invention mainly fixes and holds the probe 61 at a position below the circuit board 5 as a contact keeper with the image lying. The flipping of the probe 依 is determined by the designer's needs. In practice, the probe 61 is a spring-loaded probe plus a ^ 8 M356906 probe), and is disposed in a vertical manner, but is not limited thereto. For example, the probe can also be a vertical type & (\rerticai Bending pr〇be) or cantilever probe, etc. As shown in the fourth figure, the probe testing device of the present embodiment is used to test a preferred embodiment of the image sensing chip. The unit 8 has a plurality of image sensing wafers 81, and the formed image sensing wafer array is corresponding to the position of the plurality of windows 53 of the circuit board 5. When the test is performed, the probe fixing module 6 The plurality of probes 61 are in contact with the lines of the corresponding image sensing wafer 81. The light unit 丨 generates appropriate visible light, which is first processed by the Mirror 2 to form uniform light, and then is fixed by the plurality of fixed blocks 4 After the lens group 31 of the lens fixing module 3 is focused, The light is projected through the window 53 of the circuit board 5 into the optical sensing area of the corresponding image sensing chip 81. The image sensing chip 81 is electrically changed by the illumination of the double light to provide an electrical signal to the probe 61. , the circuit board 5, and finally to the test machine, the relevant test and data processing by the test machine. The above-mentioned 'probe test device for testing the image sensing chip' is distributed in an array. The window cooperates with the corresponding number of lens groups, so that multiple image sensing wafers can be tested simultaneously for improved test efficiency. In addition, the internal lens group and matte filter design can provide the best test light. The quality of the test is relatively improved. It meets the requirements of the patent application. However, the above is only the preferred embodiment of the creation. When it is not possible to limit it, 9 M356906 is the essence of this creation. Calling... Modifications, all of them belong to the details of the paste. The first picture is a schematic cross-section of the structure of the creation; the second picture is Creation planar structure shown Lai exploded, partial cross-sectional expressed off member; a second photo shows a plan view of the fixing base of the present Creation; secret test image according to the present fourth graph Creation _ "in the preferred embodiment of FIG. [Main component symbol description] A probe test device 1 light module 2 matte filter, mirror 3 lens fixed module 31 lens holder 32 lens group 321 external thread 4 fixing seat 41 combined with hole 5 circuit board 51 first surface 52 second surface 53 window • M356906 l 1 -6 probe fixing module 61 probe 62 opening. 80 test unit 81 image sensing wafer M356906 « I ten, schema Xu) month Ρ corrected 丨i: '
M356906M356906
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