TWI702404B - Probe card testing device - Google Patents

Abstract

A probe card testing device includes a test circuit board, a signal transfer board and a probe head. The test circuit board includes a first light transmitting portion located in a wafer testing area and a plurality of metal pads located in a signal pressing area. The signal transfer board includes a second light transmitting portion located in the wafer testing area. A top surface of the signal transfer board is provided with a plurality of external pads located in the wafer testing area and disposed along a circumference of the second light transmitting portion. A bottom surface of the signal transfer board is provided with a plurality of connection pads located in the signal pressing area. A positioning seat of the probe head includes a third light transmitting portion located in the wafer testing area. A plurality of conductive probes of the probe head are inserted into the positioning seat and disposed along a circumference of the third light transmitting portion. One ends of the conductive probes respectively pass through the positioning seat and abut against the external pads.

Description

Probe card testing device

The invention relates to a probe card testing device, in particular to a probe card testing device suitable for peripheral wafer testing.

Since CMOS image sensors are all peripheral chips, they generally use Cantilever Probe Cards for testing. However, this type of probe card requires manual To connect the signal by pulling wire and soldering pins, the wire planting operation takes a long time, and in the case of multi-die testing, the difficulty of the wire planting operation and maintenance operation will be greatly increased. Another test method is to use MEMS Probe Card for testing. However, the limitation of this type of probe card is that a ceramic substrate must be used, and the structure of this type of probe card is not easy to repair, for example : When the probe is damaged, in terms of maintenance, in addition to removing the probe, a new probe must be welded on. It must rely on equipment and manual operations are not easy to complete.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The technical problem to be solved by the present invention is to provide a probe card testing device for the shortcomings of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a probe card testing device, which defines a wafer test area and a signal suppression area around the wafer test area, and The probe card test device includes: a test circuit board including a first light-transmitting portion located in the wafer test area and a plurality of metal pads arranged in the signal pressing area; a signal transfer board having A top surface and a bottom surface on opposite sides, the bottom surface of the signal transfer board faces the test circuit board, and the signal transfer board includes a second light-transmitting part located in the wafer test area , The signal transfer board is provided with a plurality of external pads on the top surface, and the signal transfer board is provided with a plurality of connection pads on the bottom surface; wherein, a plurality of the external pads are located on the wafer The test area is disposed along the periphery of the second light-transmitting portion, and the plurality of connection pads are located in the signal suppression area, and are electrically coupled to the plurality of external pads, and are also electrically coupled to A plurality of the metal pads of the test circuit board; and a probe head disposed above the top surface of the signal transfer board, and the probe head includes: a positioning seat body including A third light-transmitting portion located in the wafer test area; and a plurality of conductive probes, which are located on the positioning base and arranged along the periphery of the third light-transmitting portion; wherein, a plurality of the One end of the conductive probe penetrates the positioning base body to abut against the plurality of external pads of the signal transfer board, and the other end of the plurality of conductive probes penetrates the positioning base body. Used to push against an object under test; wherein, the probe card test device can be used to receive a light, and let the light sequentially penetrate the first light-transmitting part, the second light-transmitting part , And the third light-transmitting part, and then irradiate the object under test to generate a photoelectric sensing signal.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a probe card test device, which defines a wafer test area and a signal suppression area located around the wafer test area, and The probe card test device includes: a test circuit board, including a first blank portion located in the wafer test area and a plurality of metal pads set in the signal suppression area; a signal transfer board with A top surface and a bottom surface on the opposite side, the bottom surface of the signal transfer board faces the test circuit board, the signal transfer board includes a second blank part located in the wafer test area, so The signal transfer board is provided with a plurality of external pads on the top surface, and the signal transfer board is provided with a plurality of connection pads on the bottom surface; wherein, a plurality of the external pads are located in the wafer test area And disposed along the periphery of the second blank portion, a plurality of the connection pads are located in the signal suppression area, and are electrically coupled to the plurality of external pads, and are also electrically coupled to the test A plurality of the metal pads of the circuit board; and a probe head disposed above the top surface of the signal transfer board, and the probe head includes: a positioning seat body including A third blank part of the wafer test area; and a plurality of conductive probes, which are located on the positioning base and arranged along the periphery of the third blank part; wherein, one end of the plurality of conductive probes Pass through the positioning base body to respectively abut against the plurality of external pads of the signal transfer board, and the other end of the plurality of conductive probes passes through the positioning base body to abut against An object to be tested; wherein a length direction of each of the conductive probes is substantially perpendicular to the top surface of the signal transfer board, and the third of the positioning base of the probe head The middle part of the blank part is not provided with any conductive probe.

One of the beneficial effects of the present invention is that the probe card testing device disclosed in the embodiment of the present invention can pass through the first light-transmitting part of the test circuit board, the second light-transmitting part of the signal transfer board, and the probe head The design of the third light-transmitting part (or the first blank part, the second blank part, the third blank part), and the edge of the signal transfer board, the second light-transmitting part (or the second blank part) is more often arranged on the periphery The design of multiple conductive probes arranged on the periphery of the third light-transmitting part (or third blank part) along the outer pad and the probe head, instead of the traditional peripheral chip test probe card which requires manual pulling The signal is connected by soldering pins, so that multiple conductive probes can be implanted straight up and down, which greatly reduces the time for implanting the conductive probes and greatly reduces the maintenance difficulty of the probe card test device degree.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

The following are specific examples to illustrate the disclosed embodiments of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used in this document to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Refer to Figures 1 to 6, which are the first embodiment of the present invention. As shown in FIGS. 1 and 2, this embodiment discloses a probe card testing device 100, which is particularly suitable for testing complementary metal oxide semiconductor image sensors (CMOS image sensors). However, the present invention is not limited to this. Furthermore, the probe card testing device 100 includes a test circuit board 1, a signal transfer board 2 disposed above the test circuit board 1, a probe pin disposed above the signal transfer board 2 Head 3, an electrical connection module 4 arranged between the test circuit board 1 and the signal adapter board 2, and an electrical connection module 4 arranged on the signal adapter board 2 and used to press the signal adapter board 2 Suppression structure 5. Wherein, the test circuit board 1, the electrical connection module 4, the signal transfer board 2, the pressing structure 5, and the probe head 3 are sequentially stacked along a thickness direction T in this embodiment, but the present invention is not Limited to this.

As shown in FIG. 3, in this embodiment, the probe card testing device 100 defines a plurality of wafer test regions R1 and a plurality of signal suppression regions R2. The plurality of wafer test regions R1 and a plurality of signal suppression regions The regions R2 are staggered and arranged in a matrix, but the present invention is not limited to this. For example, as shown in FIG. 4, in another modified embodiment of the present invention, a plurality of wafer test regions R1 are arranged in a matrix and are located in a central range RC, and a plurality of signal suppression regions R2 is located in a peripheral range RE surrounding the central range RC.

It should be noted that, since the probe card testing device 100 has substantially the same structure in the multiple wafer test regions R1 and the signal suppression region R2 located on the periphery thereof, the following description is based on the probe The structure of the card testing device 100 in one of the wafer testing regions R1 and the signal suppression region R2 located at the periphery thereof is taken as an example, but the present invention is not limited to this. For example, in an embodiment not shown in the present invention, the probe card testing device 100 may have different structures in different wafer testing areas R1 and signal suppression areas R2.

As shown in FIG. 1 and FIG. 2, the test circuit board 1 is substantially in the shape of a circular plate. The test circuit board 1 includes a first light-transmitting portion 101 located in the wafer test area R1, and the test circuit board 1 on its board surface (eg: the top surface of the test circuit board 1 in FIG. 1) includes There are a plurality of metal pads 11 arranged at intervals. Wherein, the first light transmitting portion 101 of the test circuit board 1 can be used to provide a light penetration. More specifically, in this embodiment, the board surface of the test circuit board 1 is made of an opaque insulating material, and the first light-transmitting portion 101 of the test circuit board 1 is a through hole 12 to provide a Light penetrates, but the present invention is not limited to this. For example, the first light-transmitting portion 101 of the test circuit board 1 may also be an optical lens (such as a concave lens or a convex lens) plugged in the through hole 12.

Furthermore, the above-mentioned test circuit board 1 is used to electrically couple to a test machine (not shown in the figure). In other words, the plurality of metal pads 11 are electrically coupled to the testing machine, so as to analyze the signal received by the test circuit board 1 through the testing machine. Wherein, the electrical coupling method between the test circuit board 1 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 1 may also be directly integrated in the test machine.

As shown in FIG. 1, FIG. 2, FIG. 5, and FIG. 6, the signal transfer board 2 is substantially rectangular. The signal transfer board 2 has a top surface 21 and a bottom surface 22 on opposite sides, and the bottom surface 22 of the signal transfer board 2 faces the test circuit board 1 along the thickness direction T. The signal transfer board 2 includes a second light-transmitting portion 201 located in the wafer test area R1. The signal transfer board 2 is provided with a plurality of external pads 211, a plurality of transfer pads 212, a plurality of outer layers 213, and a solder mask 214 on its top surface 21, and the signal transfer board 2 is provided on the The bottom surface 22 is provided with a plurality of connection pads 221. Wherein, the plurality of connection pads 221 are located in the signal pressing area R2 and are respectively electrically coupled to the plurality of external pads 211 and are also electrically coupled to the plurality of metal pads 11 of the test circuit board 1. More specifically, a plurality of the external pads 211 are located in the wafer test area R1 and arranged along the periphery of the second light-transmitting portion 201. A plurality of the transfer pads 212 are located in the signal suppression area R2, a plurality of the outer layer circuits 213 are arranged across the wafer test area R1 and the signal suppression area R2, and the plurality of the external pads 211 respectively pass through the plurality of outer layer circuits 213 It is electrically connected to a plurality of transfer pads 212 (as shown in FIGS. 1 and 5). Furthermore, the plurality of transfer pads 212 are electrically connected to the plurality of connection pads 221 through a plurality of inner-layer circuits 222, respectively. The solder mask 214 covers the transfer pad 212 to avoid the direct contact between the pressing plate 51 and the transfer pad 212 as described below, which may cause a short circuit.

The arrangement of the multiple connection pads 221 of the signal transfer board 2 is substantially the same as the arrangement of the multiple metal pads 11 of the test circuit board 1. It should be noted that the connecting pad 221 is illustrated in the form of a circle in this embodiment, but in practical applications, the shape of the connecting pad 221 can be adjusted and changed according to design requirements (such as square, rectangular, or irregular) shape).

Furthermore, in this embodiment, the distance between any two adjacent external pads 211 is preferably smaller than the distance between two corresponding connection pads 221. In other words, the signal transfer board 2 in this embodiment includes a signal fan-out (FAN-OUT) structure, but the invention is not limited to this.

It is worth mentioning that in this embodiment, the substrate material of the signal transfer board 2 is preferably a transparent glass substrate, so the second light-transmitting portion 201 of the signal transfer board 2 can be made of transparent glass. The design of the substrate has a light-transmitting property, but the present invention is not limited to this. For example, in an embodiment not shown in the present invention, the signal transfer board 2 may be, for example, a non-transparent substrate, and the second light-transmitting portion 201 of the signal transfer board 2 may be The way of digging holes has the nature of light transmission.

In addition, it should be noted that in this embodiment, although the signal transfer board 2 is described by taking a circuit board with double-layer circuits as an example, the invention is not limited to this. For example, in an embodiment not shown in the present invention, the signal transfer board 2 can also be designed as a multi-layer circuit board with four layers or more than six layers according to design requirements.

As shown in FIGS. 1 and 2, the probe head 3 is disposed above the top surface 21 of the signal transfer board 2, and the probe head 3 can be electrically coupled to the test circuit through the signal transfer board 2. Board 1. The probe head 3 includes a positioning base 31 and a plurality of conductive probes 32. The positioning base 31 includes a third light-transmitting portion 301 located in the wafer test area R1. In this embodiment, the positioning base 31 is made of a transparent glass substrate, so the third light-transmitting portion 301 of the positioning base 31 can have light-transmitting properties through the design of the transparent glass substrate. However, the present invention is not limited to this. For example, in an embodiment not shown in the present invention, the positioning base 31 may be, for example, a non-transparent positioning base, and the third light-transmitting portion 301 of the positioning base 31 may also be The way of digging holes has the nature of light transmission.

More specifically, a plurality of the conductive probes 32 are located on the positioning base 31 and arranged along the periphery of the third light transmitting portion 301. Wherein, one end of the plurality of conductive probes 32 penetrates the positioning base 31 and respectively abuts on the plurality of external pads 211 of the signal transfer board 2, and the other end of the plurality of conductive probes 32 penetrates the positioning base. The base 31 is used to abut an object O (such as a semiconductor wafer) under test.

In this embodiment, a length direction of the one end of each conductive probe 32 (for example, the bottom end portion of the conductive probe 32) is substantially perpendicular to the top surface 21 of the signal transfer board 2. Furthermore, the middle part of the third light-transmitting part 301 of the positioning base 31 of the probe head 3 is not provided with any conductive probe, and the middle part of the second light-transmitting part 201 of the signal transfer board 2 The part is also not provided with any conductive pads or conductive lines.

It should be noted that the conductive probe 32 has a conductive and flexible elongated structure in this embodiment, but the conductive probe 32 of the present invention is not limited to rectangular conductive probes and circular conductive probes. Probes, or other conductive probes.

According to the above configuration, the probe card testing device 100 can be used to receive a light L, and allow the light L to pass through the first light-transmitting portion 101, the second light-transmitting portion 201, and the third light in sequence. A light transmission path formed by the light-transmitting portion 301 is then irradiated to the object O to generate a photoelectric sensing signal.

Furthermore, at least one of the conductive probes 32 of the plurality of conductive probes 32 can be used to receive the photoelectric sensing signal, and pass the photoelectric sensing signal through the corresponding external pad 211 in sequence, corresponding to The outer circuit 213, the corresponding transfer pad 212, the corresponding inner circuit 222, the corresponding connection pad 221, the corresponding vertical conductive structure 42, and the corresponding metal pad 11 are sent to the test The circuit board 1 is finally sent to the testing machine to analyze the signal received by the test circuit board 1 through the testing machine.

Please continue to refer to FIGS. 1 and 2, the electrical connection module 4 is clamped between the test circuit board 1 and the signal transfer board 2. The electrical connection module 4 includes a spacer 41 and a plurality of vertical conductive structures 42. The spacer 41 includes a fourth light-transmitting portion 401 located in the wafer test area R1 and a plurality of through holes 411 located in the signal pressing area R2. Wherein, the fourth light transmission portion 401 is located on the light transmission path formed by the first light transmission portion 101, the second light transmission portion 201, and the third light transmission portion 301 (and is located in the first light transmission portion 101 and the second transparent portion 201). In this embodiment, the spacer 41 can be made of, for example, a transparent glass substrate, so the fourth light-transmitting portion 401 of the spacer 41 can have light-transmitting properties through the design of the transparent glass substrate. However, the present invention is not limited to this. Furthermore, each of the above-mentioned through holes 411 penetrates the spacer plate 41 along the thickness direction T in this embodiment. The spacer 41 is clamped between the test circuit board 1 and the signal transfer board 2, and the metal pads 11 face the connection pads 221 through the through holes 411 respectively. That is, the opposite sides of each through hole 411 (for example, the bottom side and the top side of the through hole 411 in FIG. 1) respectively correspond to one metal pad 11 and one connection pad 221.

Furthermore, a plurality of vertical conductive structures 42 are respectively disposed in the plurality of through holes 411 of the spacer plate 41, and the plurality of connection pads 221 of the signal transfer board 2 can be electrically connected to each other through the plurality of vertical conductive structures 42 The multiple metal pads 11 of the test circuit board 1 form an electrical transmission path. In this embodiment, the plurality of vertical conductive structures 42 may be, for example, vertical conductive metal glue (such as vertical conductive silver glue), but the invention is not limited to this. For example, the plurality of vertical conductive structures 42 may also be elastic mechanisms such as metal elastic arms.

Please continue to refer to FIGS. 1 and 2, the pressing structure 5 is disposed on the signal transfer board 2 and is used to press the signal transfer board 2. The pressing structure 5 includes a pressing plate 51 and a plurality of screws 52. The pressing board 51 is disposed on the top surface 21 of the signal transfer board 2. The pressing plate 51 includes a plurality of screw holes 511 located in the signal pressing area R2. The plurality of screws 52 respectively penetrate the plurality of screw holes 511 of the pressing plate 51 to fix the pressing plate 51 on the signal transfer board 2. Wherein, the plurality of screws 52 further penetrate the signal transfer board 2, the electrical connection module 4, and the test circuit board 1 along the thickness direction T, so that the pressing board 51 can press the signal transfer board 2. Electrically connect the module 4 and the test circuit board 1, and make the two ends of the plurality of vertical conductive structures 42 abut against the plurality of connection pads 221 and the plurality of metal pads 11, respectively, so as to improve the signal transfer The electrical connection characteristics between the board 2 and the test circuit board 1 can allow the electrical transmission path between the test circuit board 1 and the signal transfer board 2 to be achieved without any soldering material. In addition, in this embodiment, when the plurality of screws 52 penetrate the signal transfer board 2, the electrical connection module 4, and the test circuit board 1, the plurality of screws 52 will only touch the insulating substrate material, It will not touch any conductive pads or conductive lines. From another perspective, the pressing board 51 of the pressing structure 5 can clamp the signal transfer board 2 and the electrical connection module 4 together with the test circuit board 1, so that the two ends of the plurality of vertical conductive structures 42 are respectively It abuts against the multiple connection pads 221 and the multiple metal pads 11.

[Second Embodiment]

Please refer to FIG. 7, which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment. The similarities between the two embodiments are not repeated here. However, this embodiment is different from the above-mentioned first embodiment. The difference in this embodiment is to use non-transmissive first blank portion 101', second blank portion 201', and third blank portion 301' to replace the first transparent portion 101, second transparent portion 101, second The light transmitting portion 201 and the third light transmitting portion 301 are specifically described as follows.

This embodiment discloses a probe card testing device 100, which is particularly suitable for testing a liquid crystal display driver IC (LCD driver IC) or memory. The probe card test device 100 defines a wafer test area R1 and a signal suppression area R2 located around the wafer test area R1, and the probe card test device 100 includes a test circuit board 1, a signal transfer Board 2, and a probe head 3. The test circuit board 1 includes a first blank portion 101' located in the wafer test area R1 and a plurality of metal pads 11 located in the signal suppression area R2.

The signal transfer board 2 has a top surface 21 and a bottom surface 22 on opposite sides. The bottom surface 22 of the signal transfer board 2 faces the test circuit board 1. The signal transfer board 2 includes a second blank portion 201' in the wafer test area R1, and the signal transfer board 2 is on top The surface 21 is provided with a plurality of external pads 211, and the signal transfer board 2 is provided with a plurality of connection pads 221 on the bottom surface 22. Wherein, a plurality of the external pads 211 are located in the wafer test area R1 and arranged along the periphery of the second blank portion 201', and a plurality of the connection pads 221 are located in the signal pressing area R2 and are electrically coupled to The plurality of external pads 211 are also electrically coupled to the plurality of metal pads 11 of the test circuit board 1 respectively.

The probe head 3 is disposed above the top surface 21 of the signal transfer board 2, and the probe head 3 includes a positioning base 31 and a plurality of conductive probes 32. The positioning base 31 includes a third blank portion 301' located in the wafer test area R1. A plurality of conductive probes 32 are located on the positioning base 31 and along the periphery of the third blank portion 301'. Wherein, one end of the plurality of conductive probes 32 penetrates the positioning base 31 and respectively abuts on the plurality of external pads 211 of the signal transfer board 2, and the other end of the plurality of conductive probes 32 penetrates the positioning base. The base 31 is used to abut an object under test. Furthermore, a length direction of the one end of each conductive probe 32 (such as the bottom end of the conductive probe 32) is substantially perpendicular to the top surface 21 of the signal transfer board 2, and the probe The middle part of the third blank part 301' of the positioning base body 31 of the head 3 is not provided with any conductive probes, and the middle part of the second blank part 201' of the signal transfer board 2 is also not provided with any conductive probes. Conductive pad body or conductive circuit.

According to the above configuration, at least one of the conductive probes 32 of the plurality of conductive probes 32 can be used to receive a test signal generated by the test object O, and sequentially pass the test signal through the corresponding external pad 211 , The corresponding outer layer circuit 213, the corresponding transfer pad 212, the corresponding inner layer circuit 222, the corresponding connection pad 221, the corresponding vertical conductive structure 42, and the corresponding metal pad 11, which are transmitted to The test circuit board 1 is finally transmitted to the test machine to analyze the signal received by the test circuit board 1 through the test machine.

[Beneficial effects of the embodiment]

In summary, the probe card testing device 100 disclosed in the embodiment of the present invention can pass through the first transparent portion 101 of the test circuit board 1, the second transparent portion 201 of the signal transfer board 2, and the probe head The design of the third light-transmitting part 301 of 3 (or the first blank part 101', the second blank part 201', and the third blank part 301'), the second light-transmitting part 201 matched with the edge of the signal transfer board 2 (Or the second blank portion 201') a plurality of external pads 211 provided on the periphery, and a plurality of conductive probes 32 provided on the periphery of the third transparent portion 301 (or third blank portion 301') of the probe head 3 The design instead of the traditional peripheral chip test probe card needs to manually pull the wire and solder the pin to connect the signal, so that the multiple conductive probes 32 can be implanted in a straight-up and straight-down manner, thereby greatly reducing the conductivity The needle planting operation time of the probe 32 can greatly reduce the maintenance difficulty of the probe card testing device 100.

Furthermore, the probe card test device 100 disclosed in the embodiment of the present invention uses a plurality of vertical conductive structures 42 of the electrical connection module 4 to electrically connect the signal transfer board 2 and the test circuit board 1, and is pressed The structure 5 improves the electrical connection characteristics between the signal transfer board 2 and the test circuit board 1 without soldering, so the probe card testing device 100 can effectively avoid damage caused by thermal shock.

In addition, since the substrate material of the signal transfer board 2 in the embodiment of the present invention is a transparent glass substrate, the second light-transmitting portion 201 of the signal transfer board 2 can be designed to be transparent through the design of the transparent glass substrate. In this way, the signal transfer board 2 of the embodiment of the present invention does not need to be slotted for light guiding, thus contributing to the application of smaller-sized die and larger area test. Furthermore, the positioning base 31 of the probe head 3 of the embodiment of the present invention may also be made of a transparent glass substrate, so the third light-transmitting portion 301 of the positioning base 31 may be designed by the transparent glass substrate. And has the nature of light transmission.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

100: Probe card test device 1: Test the circuit board 101: first light transmission part 101’: The first blank part 11: Metal pad 12: Through hole 2: Signal adapter board 201: second light transmission part 201’: The second blank part 21: Top surface 211: External pad 212: adapter pad 213: Outer Line 214: Solder mask 22: Bottom 221: connection pad 222: inner line 3: Probe head 301: third light transmission part 301’: The third blank part 31: Positioning seat 32: Conductive probe 4: Electrical connection module 401: fourth light transmission part 41: Spacer 411: piercing 42: Vertical conductive structure 5: suppressed structure 51: Press plate 511: screw hole 52: Screw T: thickness direction R1: Wafer test area R2: Signal suppression area RC: center range RE: surrounding area O: DUT L: light

FIG. 1 is a schematic cross-sectional view of a probe card testing device according to a first embodiment of the present invention.

Figure 2 is a plan exploded schematic view of Figure 1.

3 is a schematic diagram of a plurality of wafer test areas and a plurality of signal suppression areas interlaced and arranged in a matrix according to the first embodiment of the present invention.

4 is a schematic diagram of a plurality of wafer test areas located in a central area, and a plurality of signal suppression areas located in a peripheral area of another variation of the embodiment of the present invention.

5 is a partial schematic diagram of the circuit pattern on the top surface of the signal transfer board according to the first embodiment of the present invention.

6 is a partial schematic diagram of the circuit pattern on the bottom surface of the signal transfer board according to the first embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view of the probe card testing device according to the second embodiment of the present invention.

100: Probe card test device

1: Test the circuit board

101: first light transmission part

11: Metal pad

12: Through hole

13: Optical lens

2: Signal adapter board

201: second light transmission part

21: Top surface

211: External pad

212: adapter pad

213: Outer Line

22: Bottom

221: connection pad

222: inner line

3: Probe head

301: third light transmission part

31: Positioning seat

32: Conductive probe

4: Electrical connection module

401: fourth light transmission part

41: Spacer

411: piercing

42: Vertical conductive structure

5: suppressed structure

51: Press plate

511: screw hole

52: Screw

T: thickness direction

R1: Wafer test area

R2: Signal suppression area

O: DUT

L: light

Claims (8)

A probe card testing device, which defines a wafer testing area and a signal suppression area located at the periphery of the wafer testing area, and the probe card testing device includes: a test circuit board, including the wafer A first light-transmitting portion of the circular test area and a plurality of metal pads arranged in the signal suppression area; a signal transfer board having a top surface and a bottom surface on opposite sides, and all of the signal transfer board The bottom surface faces the test circuit board, the signal transfer board includes a second light-transmitting portion located in the wafer test area, and the signal transfer board is provided with a plurality of external pads on the top surface, And the signal transfer board is provided with a plurality of connection pads on the bottom surface; wherein, a plurality of the external pads are located in the wafer test area and are arranged along the periphery of the second light-transmitting portion, and a plurality of The connection pads are located in the signal suppression area and are electrically coupled to a plurality of the external pads and a plurality of the metal pads of the test circuit board respectively; and a probe head, Is disposed above the top surface of the signal transfer board, and the probe head includes: a positioning base including a third light-transmitting portion located in the wafer test area; and a plurality of conductive The probes are located on the positioning base and arranged along the periphery of the third light-transmitting part; wherein one end of the plurality of conductive probes penetrates the positioning base and abuts against the positioning base respectively. A plurality of the external pads of the signal transfer board, and the other end of the plurality of conductive probes penetrates the positioning base body to abut an object to be tested; wherein, the probe card test device It can be used to receive a light, and allow the light to sequentially penetrate the first light-transmitting portion, the second light-transmitting portion, and the third light-transmitting portion, and then irradiate the object under test, To generate a photoelectric sensing signal; Wherein, the probe card testing device further includes an electrical connection module, the electrical connection module is clamped between the test circuit board and the signal transfer board, and the electrical connection module includes : A spacer plate, including a fourth light-transmitting portion located in the wafer test area and a plurality of perforations located in the signal pressing area; and a plurality of vertical conductive structures, respectively provided on the plurality of spacer plates In the perforation; wherein, the fourth light transmitting portion is located on a light transmission path formed by the first light transmitting portion, the second light transmitting portion, and the third light transmitting portion, and The plurality of connection pads of the signal transfer board are electrically connected to the plurality of metal pads of the test circuit board through the plurality of vertical conductive structures, respectively, to form an electrical transmission path. According to the probe card testing device described in the first item of the patent application, at least one of the conductive probes can be used to receive the photoelectric sensing signal and pass the photoelectric sensing signal through the corresponding The external pads, the corresponding connection pads, and the corresponding metal pads are transferred to the test circuit board. According to the probe card testing device described in item 1 of the scope of patent application, a length direction of the one end of each conductive probe is perpendicular to the top surface of the signal transfer board. The probe card testing device according to the first item of the scope of patent application, wherein the middle part of the third light-transmitting part of the positioning base of the probe head is not provided with any conductive probe. According to the probe card test device described in item 1 of the scope of patent application, wherein the signal adapter board is provided with a plurality of adapter pads and a plurality of outer layers on the top surface, and a plurality of the adapter pads are located In the signal suppression area, a plurality of the outer layer circuits are arranged across the wafer test area and the signal suppression area, and a plurality of the external pads are electrically connected to a plurality of the plurality of circuits through a plurality of the outer layer circuits.述Adapter pad. The probe card testing device according to the first item of the patent application, further comprising a pressing structure, the pressing structure includes: a pressing plate arranged on the top surface of the signal transfer board, the The pressing plate includes a screw hole located in the signal pressing area; and a screw passing through the screw hole of the pressing plate to fix the pressing plate on the signal adapter plate. According to the probe card testing device described in item 6 of the patent application, the screw further penetrates the signal adapter board, the electrical connection module, and the signal adapter board along a thickness direction of the signal adapter board. The test circuit board, so that the pressing board presses the signal transfer board, the electrical connection module, and the test circuit board, and makes the two ends of the plurality of vertical conductive structures abut against each other One of the connection pads and a plurality of the metal pads; wherein, any electrical transmission path between the test circuit board and the signal transfer board is not achieved by a soldering material. The probe card testing device according to the first item of the patent application, wherein the signal transfer board is further provided with a solder resist layer on its top surface, and the solder resist layer covers a plurality of the transfer pads .

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