1283307 九、發明說明： 【發明所屬之技術領域】 本案係關係於一種測試與調整方法，尤指一種光學 模組之測試與調整方法。 \ 【先前技術】 馨 影像擷取裝置之原理係利用光線照設於欲擷取影令 勿體上，於光線反射回來後由影像擷取裝置内之光与 杈組接收，並將光學訊號轉換為類比訊號，最後再轉卷 為可以顯不、編輯、儲存和輸出的數位訊號格式，以秦 、由顯示裝置顯示或列印裝置列印。 •…第-圖係為影像操取裝置之光學模組結構分解圖。 光予板組1主要包含有第一電路板1〇、光感測器U、聋 ，座12、透鏡13以及第二電路板14，其中第一電路古 ·=頂面佈設有各種不同之電子元件⑻。光感測器ι (ΓΜ:ς轉°疋件⑽I、互補式金屬氧化半導體感應1 /encoi·)或是其他感光元件等。光感測器u之伯 、邊=複數個接觸料⑴，接觸端子lu彳電連結於身 ::=1〇之孔洞102。鏡頭座12係由矩形框架12 加=木121向上延伸之圓筒形環架122所構成，此拜 透鏡13設[於其内部。框架121與環架12 形成有-間隔板123,於間隔板123之中心處惠 貝牙孔124。於框架121内部設有-容置室12W| 6 1283307 • 容置室125可容收設置於第一電路板ι〇上之電子元件 ·， 1 〇 1及光感測器11 ,且框架121之底面積與第一電路板 • 10之面積實質上相等。框架121另延伸有複數個定位腳 \ 126，而第二電路板丨4則設有複數個對應之定位孔141， 於框架121之定位腳126固設於第二電路板14之定位孔 141後，可使鏡頭座12與透鏡13之組合固定於第二電路 板14上，以組成光學模組1。 由於光學模組1為影像擷取裝置中·決定擷取影像品 ❿ 質之重要關鍵，因此對於光學模組1皆會進行多項的測 试與调整’例如電氣測试、核里傳遞函數（M〇du 1 at ion 、Transfer Function, MTF)測試與焦距調整、影像品質測 試等，以確保光學模組1之影像品質。第二圖係為以傳· 統方式進彳于光學核組之权里傳遞函數（Modulation ' Transfer Function，MTF)測試與焦距調整之方法流程 圖。如第二圖所示，當進行光學模組1之模量傳遞函數 (Modulation Transfer Function, MTF)测試與焦距調整 隹時，首先將組裝後之光學模組1放置於模量傳遞函數（MTF) \ 測試儀器中，如步驟S11。然後’將光學模組1移至一測 試圖（Test chart)下方，如步驟S12。接著，以光學模組 1擷取測試圖的影像，並進行光學模組1之MTF分析。之 後，依據取得的數據與圖表判斷光學模組1之影像品質 是否正常，如步驟S14。如判斷光學模組1之影像品質不 正常時，則依步驟S15，拆解光學模組、調整焦距或替換 光學元件，然後重複進行先前之測試。如判斷光學模組1 7 1283307 之影像品質正常’則續行後續之測試與調整程序，如步 , 驟 S16〇 . 然而，由於現今之光感測器Π係以表面貼裝技術 \ (SMT)設置於第一電路板1〇上，因此光感測器u的中心 點會因表面貼裝技術以及鏡頭座12之零件外型關係使其 /、透鏡13之中心點產生偏移或無法對位，而影響光學模 組1的測試精準度以及影像品質。再者，光學模組丄係 以第二電路板14上之定位孔141與鏡頭座12之定位腳 » 126定位，因此光感測器u與鏡頭座12上之透鏡丨3， 亦容易因公差因素，影響測試精準度以及影像擷取的品 N質。此外，於移動光學模組1進行測試時，會因移動時 震顫到該光學模幻，而產生測試誤判影響產品品管。再 •則，傳統的測試方式與設備無法直接依據測試結果調整 -鏡頭13之焦距範圍，造成測試與調整的不便。 有I於上述習知技術之缺失，如何有效率地測試盥 _調整，學模組，且亦可避免其他外在因素導致測試誤 判，貫為目前相關從業者所迫切需要解決之問題。 \ 【發明内容】 本#之主要目的在於提供一種光學模組之測試與調 整方法，藉以改善習知測試方法因光感測器的中心點會 因表面貼裝技術打印以及鏡頭座之零件外型關係產生公 差因素，而#響光學模組的測試精準度以及影像品質。 本茱之另目的在於提供一種光學模組之測試方 1283307 法1藉以改善習知於移動光學模組進行測試時，會因移 動％震頦到該光學模組，而產生測試誤判之問題。 為達上述目的，本案之一較廣義實施樣態為提供一 種光學模組之測試與調整方法，其中該光學模組具有— 、鏡：f、一透鏡、一光感測器、-第-電路板以及-第 —電路板，該光感卿設置於第一電路板上，該第一· :板設置於第二電路板上，該透鏡設置於鏡頭座内。： 案之方法包括步驟：⑷偵測光感測器之中心點位置以及 透鏡之中心點位置；（b)使光感測器與透鏡之中心點位置 對位，亚固定鏡頭座於第二電路板上；（c)將光學模組置 測試裝置之移動平台；⑷移動該移動平台，使光學 f組與測試裝置之—賴圖之中（點位置對位；（e)進行 影像測試與分析；⑴以測試裝置之一調焦治具挾持設置 於鏡頭座内之透鏡，並依據影像測試結果調整透鏡之隹 距範圍；以及（g)固定透鏡之焦距，俾完成光學模组之測 試與調整。 、 、。根據本案之構想’其中光感測器為電執合元件或互 補式金屬氧化半導體感應器。 根據本案之構想，其中步驟⑻係藉由黏膠固定鏡頭 座於弟二電路板。 根據本案之構想，其中步驟（c)更包括步驟（ci)利用 :試裝置之-夾具，使光學模組與移動平台之—側邊靠 緊。 根據本案之構想，其中測試裝置為模量傳遞函數測 9 Ϊ283307 試裝置。 …根據本案之構想，其中步驟（e)為進行模量傳遞函數 測試。 根據本案之構想，其中步驟（§)係藉由黏膠固定 於鏡頭座。 —為達上述目的，本案之另一較廣義實施態樣為提供 :種光學模組調整焦距之測試方法，其巾該光學模电且 二鏡頭座、-透鏡、—光感測器、—第—電路板以^ —弟-電路板，絲感測器設置於第—電路板上，該第 包路板设置於第二電路板上，該透鏡設置於鏡頭座 ’該鏡頭座設置於第二電路板上。本案之方法包括步 ，：（a)將光學模組置於—測試裝置之移動平台；⑹移 移動平台’使光學模組與測試裝置之-測試圖之中 λ 2點位置對位；⑹進行影像測試與分析；⑷以測試裝 調焦治具挾持設置於鏡頭座内之透鏡，並依據影 丨顧結果贼魏m請；以及（e)©定透鏡之焦 距，俾完成光學模組之測試與調整。 【實施方式】 體現本案特徵與優點的_ jUL Λ ^ _ 的些典型實施例將在後段的 說明中詳細敘述。應理解的县 鮮的疋本案能夠在不同的態樣上 韦各種的變化’其皆不 白+脫離本案的範圍，且其中的說 明及圖示在本質上係當作今明 h兄月之用，而非用以限制本案。 1283307 * 請參閱第三圖，其係為實施本案光學模組測試與調 ， 整方法之一示範性光學模組結構分解圖。該示範性之光 . 學模組2主要包含有第一電路板20、光感測器21、鏡頭 座22、透鏡23以及第二電路板24，其中第一電路板20 之頂面佈設有各種不同之電子元件201。光感測器21為 \ 電耦合元件（CCD)、互補式金屬氧化半導體感應器（CMOS sencor)或是其他感光元件等。光感測器21之側邊設有 複數個接觸端子211，接觸端子211可電連結於第一電路 φ 板20之孔洞202。鏡頭座22係由矩形框架221及從框架 221向上延伸之圓筒形環架222所構成，此環架222可供 透鏡23設置於其内部。框架221與環架222之相隔處形 成有一間隔板223,於間隔板223之中心處設有一貫穿孔 \ 224。於框架221内部設有一容置室225，此容置室225 \ - 可容收設置於第一電路板20上之電子元件201及光感測 器21，且框架221之底面積與第一電路板20之面積實質 上相等。於框架221藉由黏膠（未圖示）固設於第二電路 * 板24後，可使鏡頭座22與透鏡23之組合固定於第二電 路板24上，以組成光學模組2。 同樣地，由於光學模組2為影像擷取裝置中決定擷 取影像品質之重要關鍵，因此對於光學模組2皆須進行 \ λ 多項的測試與調整，例如電氣測試、模量傳遞函數 (Modulation Transfer Function, MTF)測試與焦距調 整、影像品質測試等，以確保光學模組2之影像品質。 第四圖係為以本案方式進行光學模組之模量傳遞函數 11 1283307 ' (Modulation Transfer Function, MTF)測試與焦距調整 - 之方法流程圖。如第四圖所示，當進行光學模組之模量 傳遞函數（Modulation Transfer Function，MTF)測試與 λ 焦距調整時，首先進行步驟S21，偵測光感測器21之中 心點位置以及偵測固設於鏡頭座22内之透鏡23之中心 點位置。然後，如第五圖（a)所示，將光感測器21以及 固設於鏡頭座22内之透鏡23之中心點位置對位，並以 #占膠25將鏡頭座22定位於第二電路板24上，俾使光感 ❿測器21與透鏡23精準對位。此步驟可以避免表面貼裝 技術設置光感測器21以及鏡頭座22外型尺寸造成公差 、 影響，改善影像品質。 然後，進行步驟S22，將組裝後之光學模組2置於 ' Μ T F測試裝置之移動平台上，並透過夾具夾固該光學模組 - 2，使其往移動平台之一側靠緊，以增加後續焦距調整步 驟之穩定性，使生產線容易操作，如第五圖（b )所示。之 後，進行步驟S23，移動MTF測試裝置之移動平台31，1283307 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a test and adjustment method, and more particularly to a method for testing and adjusting an optical module. \ [Prior Art] The principle of the sin-image capturing device is to use the light to be applied to the body of the image, and the light is reflected by the image capturing device and the optical signal is converted. For the analog signal, it is finally re-rolled into a digital signal format that can be displayed, edited, stored and output, and displayed by the display device or printed by the display device. • The first image is an exploded view of the optical module structure of the image manipulation device. The light board group 1 mainly comprises a first circuit board 1 , a photo sensor U, a crucible, a seat 12 , a lens 13 and a second circuit board 14 , wherein the first circuit has a different type of electronic Element (8). The light sensor ι (ΓΜ: ς 疋 ° (10) I, complementary metal oxide semiconductor sensing 1 / encoi ·) or other photosensitive elements. The light sensor u, the edge = a plurality of contact materials (1), the contact terminal lu is electrically connected to the hole 102 of the body ::=1. The lens mount 12 is constituted by a rectangular frame 12 and a cylindrical ring frame 122 extending upwardly from the wood 121, and the peripheral lens 13 is provided [inside thereof. The frame 121 and the ring frame 12 are formed with a spacer plate 123 at the center of the spacer plate 123. The inside of the frame 121 is provided with an accommodating chamber 12W| 6 1283307. The accommodating chamber 125 can accommodate the electronic components, the 〇1 and the photo sensor 11 disposed on the first circuit board, and the frame 121 The bottom area is substantially equal to the area of the first circuit board. The frame 121 further has a plurality of positioning pins 126, and the second circuit board 丨4 is provided with a plurality of corresponding positioning holes 141. The positioning legs 126 of the frame 121 are fixed to the positioning holes 141 of the second circuit board 14. The combination of the lens holder 12 and the lens 13 can be fixed on the second circuit board 14 to constitute the optical module 1. Since the optical module 1 is an important key in determining the quality of the captured image in the image capturing device, a plurality of tests and adjustments are performed on the optical module 1 'for example, electrical testing, nuclear transfer function (M 〇du 1 at ion, Transfer Function, MTF) test and focus adjustment, image quality test, etc., to ensure the image quality of the optical module 1. The second picture is a flow chart of the method of Modulation 'Transfer Function (MTF) test and focus adjustment in the optical core group. As shown in the second figure, when performing the Modulation Transfer Function (MTF) test and the focus adjustment of the optical module 1, the assembled optical module 1 is first placed in the modulus transfer function (MTF). ) \ Test the instrument, as in step S11. Then, the optical module 1 is moved below a test chart, as by step S12. Next, the image of the test chart is captured by the optical module 1, and the MTF analysis of the optical module 1 is performed. Thereafter, it is judged whether or not the image quality of the optical module 1 is normal based on the obtained data and the chart, as in step S14. If it is determined that the image quality of the optical module 1 is not normal, the optical module is removed, the focal length is adjusted, or the optical component is replaced, and the previous test is repeated. If it is judged that the image quality of the optical module 1 7 1283307 is normal, the subsequent test and adjustment procedures are continued, as in step S16. However, since the current photo sensor is based on surface mount technology (SMT) It is disposed on the first circuit board 1 ,, so the center point of the photo sensor u may be offset or unable to align with the center point of the lens 13 due to the surface mounting technology and the appearance of the lens holder 12 It affects the test accuracy and image quality of the optical module 1. Moreover, the optical module is positioned by the positioning hole 141 on the second circuit board 14 and the positioning pin » 126 of the lens holder 12, so that the photo sensor u and the lens 丨 3 on the lens holder 12 are also easily toleranced. Factors that affect the accuracy of the test and the quality of the image. In addition, when the mobile optical module 1 is tested, it will tremble to the optical phantom due to the movement, and the test misjudgment will affect the product quality control. Then, the traditional test method and equipment can not be adjusted directly according to the test results - the focal length range of the lens 13, causing inconvenience in testing and adjustment. There is a lack of the above-mentioned prior art, how to effectively test the 盥 _ adjustment, learning modules, and also avoid other external factors leading to test misjudgment, which is an urgent problem that the relevant practitioners urgently need to solve. \ [Abstract] The main purpose of this # is to provide a test and adjustment method for optical modules, in order to improve the conventional test method. Because the center point of the light sensor will be printed by the surface mount technology and the part shape of the lens holder The relationship creates tolerance factors, and the test accuracy of the #响光学模块 and image quality. Another object of the present invention is to provide a test method for an optical module. 1283307 Method 1 improves the problem of misjudging a test when the mobile optical module is tested and shaken by the optical module. In order to achieve the above object, one of the broader embodiments of the present invention provides a method for testing and adjusting an optical module, wherein the optical module has -, a mirror: f, a lens, a photo sensor, a -th circuit The board and the first circuit board are disposed on the first circuit board, and the first board is disposed on the second circuit board, and the lens is disposed in the lens holder. The method of the case includes the steps of: (4) detecting the position of the center point of the photo sensor and the position of the center point of the lens; (b) aligning the position of the photo sensor with the center point of the lens, and fixing the lens holder to the second circuit (c) placing the optical module on the mobile platform of the test device; (4) moving the mobile platform to make the optical f group and the test device in the map (point position alignment; (e) performing image testing and analysis (1) using one of the test devices to adjust the fixture to hold the lens disposed in the lens mount, and adjust the distance between the lenses according to the image test result; and (g) the focal length of the fixed lens, and complete the test and adjustment of the optical module According to the concept of the present case, the photo sensor is an electric component or a complementary metal oxide semiconductor sensor. According to the concept of the present invention, the step (8) is to fix the lens holder to the second circuit board by adhesive. According to the concept of the present invention, the step (c) further comprises the step (ci) using: the fixture of the test device to make the optical module and the side of the mobile platform abut. According to the concept of the present case, the test device is Modulus transfer function test 9 Ϊ 283307 test device. ... According to the concept of the case, step (e) is to perform the modulus transfer function test. According to the concept of the present case, the step (§) is fixed to the lens mount by adhesive. In order to achieve the above objective, another broad aspect of the present invention provides a test method for adjusting the focal length of an optical module, the optical mode of the optical module and the two lens holders, the lens, the light sensor, and the first The circuit board is disposed on the first circuit board by a wire sensor, the first circuit board is disposed on the second circuit board, and the lens is disposed on the lens holder. The lens holder is disposed on the second circuit. The method of the present invention comprises the steps of: (a) placing the optical module on the mobile platform of the test device; and (6) moving the mobile platform to position the λ 2 point in the optical module and the test device. (6) Perform image testing and analysis; (4) Hold the lens set in the lens mount with the test fixture, and according to the result, the thief Weim; and (e)© the focal length of the lens, 俾 complete the optical mode Group testing and adjustment. The typical embodiment of _ jUL Λ ^ _ embodying the features and advantages of the present invention will be described in detail in the description of the latter paragraph. It should be understood that the county 鲜 案 能够 能够 能够 能够 能够 能够 能够 能够 能够 ' ' ' ' ' ' ' ' ' Not white + out of the scope of the case, and the descriptions and illustrations in it are used in essence as the brothers and sisters of the present day, not to limit the case. 1283307 * Please refer to the third figure, which is to implement the optical mode of the case An exemplary optical module structure exploded view of one of the group test and adjustment methods. The exemplary optical module 2 mainly includes a first circuit board 20, a photo sensor 21, a lens mount 22, a lens 23, and a second circuit board 24, wherein the top surface of the first circuit board 20 is provided with various electronic components 201. The photo sensor 21 is an electric coupling element (CCD), a complementary metal oxide semiconductor sensor (CMOS sencor) or It is another photosensitive element. A plurality of contact terminals 211 are disposed on the side of the photo sensor 21, and the contact terminals 211 are electrically connected to the holes 202 of the first circuit φ board 20. The lens mount 22 is composed of a rectangular frame 221 and a cylindrical ring frame 222 extending upward from the frame 221, and the ring frame 222 is provided with a lens 23 disposed therein. A partition plate 223 is formed between the frame 221 and the ring frame 222, and a continuous hole 224 is formed at the center of the partition plate 223. An accommodating chamber 225 is disposed in the frame 221, and the accommodating chamber 225 can receive the electronic component 201 and the photo sensor 21 disposed on the first circuit board 20, and the bottom area of the frame 221 and the first circuit The areas of the plates 20 are substantially equal. After the frame 221 is fixed to the second circuit board 24 by an adhesive (not shown), the combination of the lens holder 22 and the lens 23 can be fixed to the second circuit board 24 to constitute the optical module 2. Similarly, since the optical module 2 is an important key for determining the image quality in the image capturing device, the optical module 2 must be subjected to multiple tests and adjustments, such as electrical testing and modulus transfer functions (Modulation). Transfer Function, MTF) test and focus adjustment, image quality test, etc., to ensure the image quality of the optical module 2. The fourth figure is a flow chart of the method for performing the modulus transfer function 11 1283307 ' (Modulation Transfer Function, MTF) test and focus adjustment of the optical module in this manner. As shown in the fourth figure, when performing the Modulation Transfer Function (MTF) test and the λ focal length adjustment of the optical module, first step S21 is performed to detect the center position of the photo sensor 21 and the detection. The center point of the lens 23 fixed in the lens mount 22 is fixed. Then, as shown in FIG. 5( a ), the photo sensor 21 and the center point of the lens 23 fixed in the lens mount 22 are aligned, and the lens mount 22 is positioned at the second position by the glue 25 . On the circuit board 24, the optical sensor 21 is accurately aligned with the lens 23. This step can prevent the surface mount technology from setting the optical sensor 21 and the lens mount 22 dimensions to cause tolerances, influences, and image quality. Then, in step S22, the assembled optical module 2 is placed on the mobile platform of the 'ΜTF test device, and the optical module-2 is clamped through the clamp to be close to one side of the mobile platform. Increasing the stability of the subsequent focus adjustment step makes the production line easy to operate, as shown in Figure 5(b). Thereafter, proceeding to step S23, moving the mobile platform 31 of the MTF test device,
* 使光學模組之透鏡對準測試圖32之中心點，以進行MTF \ 分析，如第五圖（c)所示。然後，進行步驟S24，以一調 焦冶具33夾持設置於鏡頭座22内之透鏡23，依據MTF 分析結果，轉動或移動調焦治具33，使鏡頭座22内之透 鏡23藉由調焦治具33之夾持而沿兩者壁面之螺紋向上 或向下移動，以調整透鏡23之焦距範圍，直至最佳之MTF 位置。之後，進行步驟S25，將調整好焦距之光學模組2 之透鏡23上膠定位於鏡頭座22,以完成光學模組2之測 12 1283307 试與調整。 - ，上所述，本案之光學模組測試與調整方法，可改 ,T^^^ ^』00旳中、點會因表面貼裝技術 2以及鏡頭座之零件外型關係產生公差因素，而影塑 '、予拉組的測試精準度以及影像品質。另外，亦可以解 5亥先學杈組，而產生測試誤判之問題。此外，本案之方 法可以增加光學模組之賴與調整效率，而且可^有效 >地提升產能，因此本案之光學模組測試與調整方法具實 用性、新穎性與進步性，爰依法提出申請。 、 ::得由熟知此技術之人士任施匠思而為諸般修 飾& s不脫如附申請專利範圍所欲保護者。 \ 【圖式簡單說明】 弟一圖：係為影像擷取裝置之光學模組結構分解圖。 > 第二圖：係為以傳統方式進行光學模組之模量傳遽 函數測试與焦距調整之方法流程圖。 、〜 第一圖·係為實施本案光學模組測試與調整方法 一示範性光學模組結構分解圖。 彳 、 第四圖：係為以本案方式進行光學模組之模 函數測试與焦距調整之方法流程圖。 〜 音圖弟五圖（a)〜（c):係為第四圖所示流程步驟之結構示 13 1283307 【主要元件符號說明】 1 :光學模組 10 :第一電路板 \ 11 :光感測器 12 :鏡頭座 13 :透鏡 14 :第二電路板 101 :電子元件 111 :接觸端子 102 :孔洞 121 :框架 122 :環架 12 3 ·間隔板 124 :貫穿孔 125 :容置室 126 :定位腳 141 :定位孔 \ 2 :光學模組 20 :第一電路板 21 :光感測器 22 :鏡頭座 a 23 :透鏡 ， 24 :第二電路板 201 :電子元件 211 :接觸端子 202 :孔洞 221 :框架 222 :環架 223 :間隔板 _ 224 :貫穿孔 225 :容置室 25 :膠 31 :移動平台 \ 32 :測試圖 33 :調膠治具 S11〜S16 :以傳統方式進行光學模組之模量傳遞函數測試與焦距 調整之步驟流程 S21〜S25 :以本案方式進行光學模組之模量傳遞函數測試與焦距 調整之步驟流程 14* Align the lens of the optical module with the center point of test chart 32 for MTF \ analysis, as shown in Figure 5 (c). Then, in step S24, the lens 23 disposed in the lens holder 22 is clamped by a focusing tool 33, and the focusing fixture 33 is rotated or moved according to the MTF analysis result, so that the lens 23 in the lens holder 22 is adjusted by focusing. The grip of the jig 33 is moved up or down along the threads of both walls to adjust the focal length of the lens 23 up to the optimum MTF position. Then, in step S25, the lens 23 of the optical module 2 with the adjusted focal length is glued to the lens mount 22 to complete the test and adjustment of the optical module 2 12 1283307. - As mentioned above, the optical module test and adjustment method of this case can be changed, and the T^^^^ 00 00 mid-point will cause tolerance factors due to the surface mount technology 2 and the part relationship of the lens mount. The accuracy of the film and the test group and the image quality. In addition, it is also possible to solve the problem of misjudgment by the test. In addition, the method of the present case can increase the efficiency of the optical module and adjust the efficiency, and can effectively increase the production capacity. Therefore, the optical module testing and adjustment method of the present case is practical, novel and progressive, and the application is made according to law. . , :: The person who is familiar with this technology can use it to modify the & s s. \ [Simple description of the drawing] A picture of the brother: an exploded view of the optical module structure of the image capturing device. > The second figure is a flow chart of the method of function measurement and focus adjustment of the optical module in the conventional manner. ~ The first picture is the implementation of the optical module test and adjustment method of this case. An exemplary optical module structure exploded view.第四 , The fourth picture is a flow chart of the method of function test and focus adjustment of the optical module in this way. ~ 音图弟五图(a)~(c): is the structure shown in the fourth diagram. 13 1283307 [Main component symbol description] 1 : Optical module 10: First circuit board \ 11: Light sense Detector 12: lens mount 13: lens 14: second circuit board 101: electronic component 111: contact terminal 102: hole 121: frame 122: ring frame 12 3 · spacer plate 124: through hole 125: accommodation chamber 126: positioning Foot 141: positioning hole \ 2 : optical module 20 : first circuit board 21 : photo sensor 22 : lens holder a 23 : lens, 24 : second circuit board 201 : electronic component 211 : contact terminal 202 : hole 221 : Frame 222 : Ring frame 223 : Spacer _ 224 : Through hole 225 : accommodating chamber 25 : Glue 31 : Mobile platform \ 32 : Test Fig. 33 : Adjusting jig S11 ~ S16 : Optical module in the conventional way Steps of Modulus Transfer Function Test and Focal Length Adjustment S21~S25: Steps of Performing Modulus Transfer Function Test and Focus Adjustment of Optical Module in the Present Mode