M347812 八、新型說明： [新型所屬之技術領域] 本創作涉及一種散熱器，尤指一種便於風流流動之散 熱器。 [先前技術] 如今電腦已經廣泛應用於各行各業，隨著應用需求之 不斷提高，要求計算機具有更多高效性能。現在電腦之運 行速度越來越快，由於電腦之運行速度主要取決於中央處 理器，因此中央處理器之運行速度也越來越快，但是對於 中央處理器這一類之積體電路電子元件來說，運行速度越 快，其單位時間產生之熱量就越多，若不及時排出，就會 引起其溫度升高，導致其運行不穩定。業界均在中央處理 器表面安裝一散熱器輔助其散熱，隨著處理器不斷推出， 其所配用之散熱器也在不斷改良。現有之散熱器之散熱鰭 片在設計時候，其面向風流之側面一般為平面設計，這樣 Φ 當風流流經該散熱器時，一部分風流受到該侧面之阻擋， 造成風流流動性不強，從而造成散熱器之熱量不能被有效 地散發。 【新型内容】 ; 鑒於以上内容，有必要提供一種便於風流流動之散熱 器。 一種散熱器，用於改善風流流經該散熱器之流動性， 該散熱器包括複數迎向風流之散熱鰭片，該散熱鰭片迎向 風流之側面為一便於風流流動之曲面。 M347812 相較於習知技術，該散熱器包括複數迎向風流之散熱 鰭片，該迎向風流之散熱鰭片之迎向風流之側面為一便於 風流流動之曲面。該散熱器便於流經該散熱器之風流流 動。 【實施方式】 請參閱圖1及圖2，一散熱器10安裝於一機殼20中 之一主機板50之一晶片（圖未示）上。 該機殼20包括一前板21及一後板22。該前板21及 該後板22分別設有一進風口 211及一出風口 221。一第一 風扇模組30固定在該前板21上並對應該進風口 211及該 散熱器10。一第二風扇模組40固定在該後板21上並對應 該出風口 221及該散熱器10。該第一風扇模組30包括一 對應該進風口 211之導風罩31及一直立之對應該散熱器 10之風扇32。 請參閱圖1、圖3及圖4,該散熱器10包括一基座11 φ 及複數自該基座11垂直延伸之第一散熱鰭片12及第二散 熱鰭片13,該第一散熱鰭片12排成一排且面向該第一風 扇模組30之風扇32。每一第一散熱鰭片12與複數第二散 熱鰭片13排成一排。相鄰之第一散熱鰭片12之間形成一 ' 用於風流流過之通風通道14。該第一散熱鰭片12垂直該 風扇32。該第一散熱鰭片12包括一面向該風扇32之側面 121，該側面121在該第一散熱鰭片12之垂直該風扇之橫 截面上之投影呈半橢圓形。當該第一風扇模組30之風扇 32工作時，風流流經該第一散熱鰭片12之側面121時， M347812 由於該側面121呈半橢圓形，只有小部分風流被該侧面121 阻擋，大部分風流可沿著該侧面121流進該散熱器10。 該散熱器10之第一散熱鰭片12與對應之第二散熱鰭 片13可合成一體。該散熱器10之第一散熱鰭片12之侧 面121可設計呈圓弧形，也可為其他便於風流流動之曲面。 請參閱圖1及圖5，在本創作散熱器之另一種實施方 式中，一散熱器10’包括一基座11’及複數自該基座11’垂 直延伸之第一散熱鰭片12’及第二散熱鰭片13’。該第一散 熱鰭片12’排成一排且面向該風扇模組30之風扇32。每一 第一散熱鰭片12’與複數第二散熱鰭片13’排成一排。相鄰 之第一散熱鰭片12’之間形成一用於風流流過之通風通道 14’。該第一散熱鰭片12’垂直該風扇32。該第一散熱鰭片 12’包括一面向該風扇32之側面12Γ，該側面12Γ在該第 一散熱鰭片12’之垂直該風扇32之橫截面上之投影呈抛物 線形。風流流經該第一散熱鰭片12’之侧面12Γ時，由於 該側面12Γ呈抛物線形，只有小部分風流被該側面12Γ 阻擋，大部分風流可沿著該側面12Γ流進該散熱器10’。 綜上所述，本創作符合新型專利之要件，爰依法提出 專利申請。惟，以上僅為本創作之較佳實施例，舉凡熟悉 本案技藝之人士，於爰依本創作精神所作之等效修飾或變 化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本創作散熱器較佳實施方式安裝於一機殼之主 M347812 機板上之立體圖。 圖2係圖1另一角度之立體圖。 圖3係本創作散熱器較佳實施方式之立體圖。 圖4係本創作散熱器較佳實施方式之俯視圖。 Θ 5係本創作政熱器較佳實施方式另一種實施方式之 俯視圖。 10 基座 11 12 側面 121 13 通風通道 14 20 前板 21 211 後板 22 221 第一風扇模組 30 40 主機板 50 10? 基座 11， 12? 側面 121 13? 通風通道 14?M347812 VIII. New description: [New technical field] This creation relates to a radiator, especially a radiator that facilitates the flow of wind. [Prior Art] Today, computers are widely used in various industries. As application requirements continue to increase, computers are required to have more efficient performance. Now the computer is running faster and faster. Since the running speed of the computer is mainly determined by the central processing unit, the central processing unit runs faster and faster, but for the integrated circuit electronic components such as the central processing unit. The faster the running speed, the more heat it generates per unit time. If it is not discharged in time, it will cause its temperature to rise, resulting in unstable operation. The industry has installed a heat sink on the surface of the central processor to assist its heat dissipation. As the processor continues to be introduced, the heat sinks it uses are constantly being improved. When the heat sink fins of the existing heat sink are designed, the side facing the wind flow is generally a plane design, so that when the wind flows through the heat sink, part of the wind flow is blocked by the side, which causes the flow of the wind to be not strong, thereby causing The heat of the heat sink cannot be effectively dissipated. [New content]; In view of the above, it is necessary to provide a heat sink that facilitates the flow of wind. A heat sink for improving the flow of a windflow through the heat sink, the heat sink comprising a plurality of heat sink fins facing the wind flow, the heat sink fins facing the side of the air flow being a curved surface for facilitating the flow of wind. M347812 Compared with the prior art, the heat sink includes a plurality of heat-dissipating fins that greet the airflow, and the side of the heat-dissipating fins facing the wind flow is a curved surface for facilitating the flow of wind. The heat sink facilitates the flow of air through the radiator. [Embodiment] Referring to FIG. 1 and FIG. 2, a heat sink 10 is mounted on a chip (not shown) of one of the motherboards 50 of a casing 20. The casing 20 includes a front plate 21 and a rear plate 22. The front panel 21 and the rear panel 22 are respectively provided with an air inlet 211 and an air outlet 221 . A first fan module 30 is fixed to the front plate 21 and corresponds to the air inlet 211 and the heat sink 10. A second fan module 40 is fixed to the rear plate 21 and corresponds to the air outlet 221 and the heat sink 10. The first fan module 30 includes a wind deflector 31 corresponding to the air inlet 211 and a fan 32 corresponding to the heat sink 10 standing upright. Referring to FIG. 1 , FIG. 3 and FIG. 4 , the heat sink 10 includes a base 11 φ and a plurality of first heat dissipation fins 12 and second heat dissipation fins 13 extending perpendicularly from the base 11 , the first heat dissipation fins The sheets 12 are arranged in a row and face the fan 32 of the first fan module 30. Each of the first heat dissipation fins 12 and the plurality of second heat dissipation fins 13 are arranged in a row. A ventilation passage 14 for the flow of wind is formed between the adjacent first fins 12. The first heat sink fin 12 is perpendicular to the fan 32. The first heat dissipation fin 12 includes a side surface 121 facing the fan 32. The side surface 121 has a semi-elliptical projection on the cross section of the first heat dissipation fin 12 perpendicular to the fan. When the fan 32 of the first fan module 30 is in operation, when the wind flows through the side 121 of the first heat dissipation fin 12, the M347812 is semi-elliptical due to the side surface 121, and only a small part of the wind flow is blocked by the side surface 121, A portion of the wind flow can flow into the heat sink 10 along the side 121. The first heat dissipation fins 12 of the heat sink 10 and the corresponding second heat dissipation fins 13 can be integrated. The side surface 121 of the first heat dissipation fin 12 of the heat sink 10 can be designed in a circular arc shape, and can also be other curved surfaces for facilitating the flow of wind. Referring to FIG. 1 and FIG. 5 , in another embodiment of the heat sink of the present invention, a heat sink 10 ′ includes a base 11 ′ and a plurality of first heat dissipation fins 12 ′ extending perpendicularly from the base 11 ′ and The second heat sink fin 13'. The first heat sink fins 12' are arranged in a row and face the fan 32 of the fan module 30. Each of the first heat dissipation fins 12' and the plurality of second heat dissipation fins 13' are arranged in a row. A ventilation passage 14' for the wind to flow is formed between the adjacent first heat dissipation fins 12'. The first heat sink fin 12' is perpendicular to the fan 32. The first heat sink fin 12' includes a side surface 12 facing the fan 32. The side surface 12 is parabolically projected on the cross section of the first heat sink fin 12' perpendicular to the fan 32. When the wind flow passes through the side 12 of the first heat dissipation fin 12', since the side surface 12 is parabolic, only a small part of the wind flow is blocked by the side surface 12, and most of the wind flow can flow into the heat sink 10' along the side 12 . In summary, this creation meets the requirements of the new patent and submits a patent application in accordance with the law. However, the above are only the preferred embodiments of the present invention. Those who are familiar with the art of the present invention should be included in the following patent claims within the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a preferred embodiment of the heat sink of the present invention mounted on a main M347812 board of a casing. Figure 2 is a perspective view of another angle of Figure 1. 3 is a perspective view of a preferred embodiment of the heat sink of the present invention. 4 is a top plan view of a preferred embodiment of the heat sink of the present invention. Θ 5 is a top view of another embodiment of a preferred embodiment of the creative heat exchanger. 10 Base 11 12 Side 121 13 Ventilation duct 14 20 Front panel 21 211 Rear panel 22 221 First fan module 30 40 Motherboard 50 10? Base 11, 12? Side 121 13? Ventilation duct 14?
【主要元件符號說明】 散熱器 第一散熱鰭片 第一散熱鰭片 機殼 通風π 出風口 第二風扇模組 散熱器 第一散熱鰭片 第二散熱鳍片[Main component symbol description] Heat sink First heat sink fin First heat sink fin Case ventilation π Air outlet Second fan module Heat sink First heat sink fin Second heat sink fin