M343191 八、新型說明： 【新型所屬之技術領域】 =乍：有關於一種散熱模組，尤指一種可調式散熱 杈組及具有该可調式散熱模組的顯示卡。 【先前技術】 近年來電知科技的快速發展，使得電腦處理器及盆 速度愈來愈快;然而運算速度之加快則帶 I :二更大置的廢熱；因此，電腦主機相關的電子設 '、、、問顧成為各家業者所研究的課題。 習知的顯示卡包含可插接於 :::=處理_子零件，而於== 熱體之末端:再時所產生之廢熱將會傳至散 击.妙品、曰由電知主機内部的空氣對流將廢熱帶 以此習知顯^11 ft的㈣理器'之功率大幅增加，所 因此：散熱裝置的散熱效能已不敷使用。 述習知顯示卡社構之冰 顯不卡之散熱裝置，除上 口構之外’於散熱體之一 — 羽，其電力係由電腦主機内的電 供 ^、、風 風扇對散熱體強制吹拂散執，可供，利用散熱 至還出現配置雙風扇之散熱裝置。！更好的散熱效能，甚 問題然二=示卡之散熱裝置在實際使用上所存在的 ^異過於散熱風扇數量多 且若在散熱裝置中配置兩個以上的：夕餘的電力損耗， 大『而佔去電腦主機内部可運用的空間，且過 5 M343191 夕的風扇運轉時也會有噪音的問題，是以，如何有效提升 顯不卡之散熱裝置的散熱效能，又不會損耗多餘的電力還 能節省空間，即成為本創作人所研究的課題。 【新型内容】 本^作之-㈣，在讀供—種具有可調式散熱模組 :執:t:藉由導槽係與導柱相互配合滑接，可依實際的 放…、而求來調整風扇的位置。 為了達成上述之目的，本創作係提供一種可調式散熱 該固 杈組’包括一散熱體、一固定架以及—風扇，盆中 定架配置於該散熱體之一側，該固定架之兩相㈣應側分 有—導柱，該風扇兩側分別成型有對應於該導柱的 導札，該導槽係與該導柱相互配合滑接。 為^達成上述之目❺，本創作係提供-種可調式散熱 杈、、且，包括一散熱體、一 定架配置於該胸…: 扇，其中，該固 η^^^- 側’ 5亥固疋架之兩相對應側分別 又⑬疋位孔，該風扇兩側凸伸成型有對應於該等定 =的一定位塊，該定位塊可選擇性地與該等定位孔固定 袓的：創：之f一目的’在於提供-種具有可調式散熱模 、、且的顯不卡’糟由導槽係與導柱相互配合滑 ，散熱需求來調整風扇的位置，而使位於顯示卡外側= f可吸入該處較低溫的空氣，對散熱體進行吹拂散熱，以 提升散熱效能。 ;、、、達成上述之目的，本創作係提供一種具有可調式 6 M343191 不，，包括一電路板以及-可調式散熱槎 可調式散熱模組包括：一散熱體、—固二加 :散熱體之底面貼接於該電路板，該固 體之-側並連接於該散熱體，該固定架之兩 -導柱，該風扇兩側分別成型有對應於 該導槽係與該導柱相互配合滑接。λ、 有關本創作之詳細說明及技術内容 下，然而所附圖式僅提供參考與說明用 作加以限制者。 〇月參閱第一至二圖，係為本創作之立體分解圖、立體 組合圖以及第二圖沿α—α剖面線之剖視圖，本創作係提^ 一種可調式散熱模組及具有該散熱模組的顯示卡，顯^M343191 VIII. New description: [New technical field] =乍: There is a heat dissipation module, especially an adjustable heat dissipation unit and a display card having the adjustable heat dissipation module. [Prior Art] In recent years, the rapid development of the electronic technology has made the computer processor and the basin faster and faster; however, the speed of the calculation is faster with the I: two more waste heat; therefore, the computer-related electronic device', , and the question has become a subject of research by various industry players. The conventional display card includes pluggable in:::=processing_sub-parts, and at the end of == hot body: the waste heat generated at the time will be transmitted to the slamming. The air convection will increase the power of the waste tropics by the conventional 11 ft (four) processor, so the heat dissipation performance of the heat sink is no longer sufficient. It is said that the heat-dissipating device of the ice-display card of the display card community is not only one of the heat-dissipating body except the upper mouth structure, but the power is forced by the electric power supply in the computer main body and the wind fan to the heat sink. Blowing loose, available, use heat to the heat sink with dual fans. ! Better heat dissipation performance, even the problem = the heat dissipation device of the card is actually used in the actual use. The number of cooling fans is too large. If more than two are disposed in the heat sink, the power loss is large. It takes up the space that can be used inside the computer host, and there is also a noise problem when the fan of 5 M343191 is running. How to effectively improve the heat dissipation performance of the heat sink of the card without losing the excess power? It also saves space, which is the subject of research by this creator. [New content] This is made - (4), in the reading supply - has an adjustable heat dissipation module: Hold: t: by the channel joint and the guide column cooperate with each other, can be adjusted according to the actual release... The location of the fan. In order to achieve the above object, the present invention provides an adjustable heat dissipation unit comprising a heat sink, a fixing frame and a fan, wherein the fixed shelf is disposed on one side of the heat sink, and the two phases of the fixing frame (4) The guide column should be divided into two sides, and the guides corresponding to the guide post are respectively formed on both sides of the fan, and the guide groove is slidably coupled with the guide post. In order to achieve the above objectives, the creation department provides an adjustable heat sink, and includes a heat sink and a certain frame disposed on the chest...: fan, wherein the solid η^^^- side '5hai The two opposite sides of the solid truss are respectively 13-position holes, and the two sides of the fan are formed with a positioning block corresponding to the fixed=, and the positioning block is selectively fixed to the positioning holes: Chuang: The purpose of f is to provide a kind of adjustable heat-dissipating mold, and the display card is not slid by the guide channel and the guide column, and the heat dissipation requirement is used to adjust the position of the fan, so that it is located outside the display card. = f can absorb the lower temperature of the air and blow the heat sink to improve the heat dissipation. ; , , , to achieve the above purpose, the creation of the system provides an adjustable 6 M343191 no, including a circuit board and - adjustable heat sink adjustable thermal module including: a heat sink, - solid two plus: heat sink The bottom surface of the fan is attached to the circuit board, and the solid side is connected to the heat dissipating body, and the two guide pillars of the fixing frame are respectively formed on the two sides of the fan to be matched with the guide rail system and the guide post. Pick up. λ, the detailed description and technical content of the present invention, however, the drawings are only provided for reference and description. Referring to the first to second figures of the month, this is a three-dimensional exploded view, a three-dimensional combination picture and a cross-sectional view of the second figure along the α-α section line. The present invention provides an adjustable heat dissipation module and has the heat dissipation mode. Group of display cards, display ^
散熱模組的顯 組，其中，該 以及一風扇， 配置於該散熱 側分別成型有 柱的一導槽， 【實施方式】 配合圖式說明如 並非用來對本創 係連接於—電腦主機㈣，該電腦主機包括具有複數散熱 孔的-側板，該顯示卡包括一電路板10以及一可 模組20，其中·· 電路板1G ’係為-近矩形之板體，其上連接有一顯示 曰日片11 ’顯示晶片（Vlde〇 chipset;)也叫圖形處理器或視覺 處理器(GPU或VPU)，電路板10之一側具有一匯流排介面 12，使電路板10可插接於一主機板上（見第八圖）。 可调式散熱模組20，包括一散熱體μ、一固定架22、 一風扇23、一第一罩蓋24以及一第二罩蓋25 ;散熱體2〇包 含一底板211以及從底板211向上凸伸的複數散熱片 212 ，而任二散熱片212之間形成有一散熱通道b ;而底 7 M343191 複數固定元件30穿設並 為限。 鎖固於定位孔223 ，但不以此型 態 列優!此本創作之具有可調式散熱模組的顯示卡具有下 月匕° 1氣：由：扇23可滑移至較接近散熱孔4ΐι的位 制…使風扇23可吸入較低溫的空氣而提高散熱效 能，機構來提升散熱裝置的散熱效 較為耗電的問題風扇或更多風扇而 其他電子裝置。卩’電力，使電源供應器之電可用於 較能3:動機構來散熱即可嶋 題。 、又几羽或更夕風扇運轉時所造成的噪音問 卡已：當知本創作之具有可調式散熱模組的顯示 =已:有產_祕、新龍與 亦未冒見於同類吝口 η、 个剃忭之構造 【圖式簡單說明】 弟一圖 弟二圖 卓三圖 第四圖 第五圖 係本創作之立體分解圖。 係本創作之立體組合圖。 系第—圖沿Α_Α剖面線之剖視圖。 係本創作之一實施例之使用狀態圖（ 係本創作之一實施例之使用狀態圖（ M343191 第六圖 係第五圖沿B-B剖面線之剖視圖 第七圖係本創作之一 第八圖係本創作另一 【主要元件符號說明】 10 電路板 11 顯示晶片 20 可n周式散熱模組 21 散熱體 211 底板 212 散熱片 22 固定架 221 導杈 223 定位孔 23 風屬 231 導接塊 232 固定凸塊 24 第〜罩蓋 241 111定孔 25 第二罩蓋 30 固定元件 40 電觸主機 41 側板 42 主機板 b 敬熱通道a display group of the heat dissipation module, wherein the fan and the fan are respectively disposed on the heat dissipation side, and a guide groove is formed on the heat dissipation side, and the following description is not used to connect the present system to the computer host (4). The computer mainframe includes a side panel having a plurality of heat dissipation holes, the display card includes a circuit board 10 and a module 20, wherein the circuit board 1G' is a nearly rectangular plate body, and a display is connected thereto. The slice 11' display chip (Vlde〇chipset;) is also called a graphics processor or a visual processor (GPU or VPU), and one side of the circuit board 10 has a bus interface 12, so that the circuit board 10 can be plugged into a motherboard. On (see Figure 8). The adjustable heat dissipation module 20 includes a heat sink body, a fixing frame 22, a fan 23, a first cover 24, and a second cover 25. The heat sink 2 includes a bottom plate 211 and is convex upward from the bottom plate 211. A plurality of fins 212 are extended, and a heat dissipating channel b is formed between any two fins 212; and the bottom portion 7 M343191 is provided with a plurality of fixing members 30. Locked in the positioning hole 223, but not in this type! This display card with adjustable cooling module has the next month 匕 ° gas: by: the fan 23 can slide to the closer to the cooling hole 4ΐ The position system... allows the fan 23 to inhale lower temperature air to improve heat dissipation performance, and the mechanism to improve the heat dissipation effect of the heat sink is more power-consuming than the fan or more fans and other electronic devices.卩 'Electric power, so that the power of the power supply can be used for more energy: the mechanism can be used to dissipate heat. The sound card caused by a few more fans or more fans running the clock has been: When the knowledge of this creation has an adjustable heat dissipation module display = already: production _ secret, new dragon and also not seen in the same kind of mouth η , a shaved structure [simple description of the schema] brother one brother two map Zhuo three map fourth map fifth map is the three-dimensional exploded view of the creation. This is a three-dimensional combination of the creation. A section of the figure along the Α_Α section line. A state diagram of the use of an embodiment of the present invention (the use state diagram of one embodiment of the present creation (M343191, the sixth diagram, the fifth diagram, the fifth diagram along the BB section line, the seventh diagram of the eighth diagram of the creation) This creation is another [main component symbol description] 10 circuit board 11 display wafer 20 n-type heat dissipation module 21 heat sink 211 bottom plate 212 heat sink 22 fixing frame 221 guide 223 positioning hole 23 wind 231 guide block 232 fixed Bump 24 ～ cover 241 111 fixed hole 25 second cover 30 fixing element 40 electric contact host 41 side plate 42 main board b heating channel
實施例之使用狀態圖（三） 實施例之俯視圖。 12 匯流排介面 2111 鎖孔 222 進風口 2311 導槽 233 定位塊 26 固定板 411 散熱孔Example of use state of the embodiment (3) Top view of the embodiment. 12 Busbar interface 2111 Keyhole 222 Air inlet 2311 Guide groove 233 Positioning block 26 Fixing plate 411 Cooling hole