M382513 . ' 五、新型說明： 【新型所屬之技術領域】 本創作係提供-種散熱裝置，尤指座體與蓋板間抵貼有 把憶體模組’並於座體二組散熱#卿設之容置槽内結合有 風扇，便可藉由風扇將冷空氣吹向於相鄰散熱片間所形成之 通道朝外側快速導出’辅以空氣對流降溫、散熱者。 ~ 【先前技術】 • 按，現今電腦科技以日新月異之速度成長，使電腦發展 趨勢皆朝運算功能強、速度快方向邁進，隨㈣腦相關應用 領域也趨向高速、高紐展，而將直接導致電齡機内部之 電子元件及記憶體模組等產生許多熱量，然若以記憶體模組 的存取頻寬來說，從早期頻寬為8 Q QMB/s#展至現今 DDR 5 0 0頻寬已達4.0GB/S，甚至是多通辭 台則可將頻寬大幅增加至二倍以上，使其無論是工作時脈或 • 是傳輸頻寬，明顯都是為了能配合主機板上之中央處理器維 - 持高速的運算處理。 再者，電腦進行高速的運算處理下，勢必將導致記憶體 拉組所相應產生之溫度急遽突升，不僅影響整體執行效能、 降低系統穩定度，且該熱量亦將囤積於記憶體晶片上，造成 S己憶體模組散熱不良，或是過熱、燒毁所導致之機能失效， 因此，要如何有效解決記憶體模組溫升的問題，即是各廠商 必須面對、解決的關鍵所在。 3 …然若以記憶雖組插接於羯板上之鋪内來說，由於 每個插槽相Μ贿騎小，而此_無法再加裝有其他具 風扇之散熱裝置，只能單缝腦主_部有限空間額外設置 散熱風扇’或是改採用其他發熱源上設置之風扇來間接導引 氣流至記憶體模組表面上輔以對流散熱，不過此種方式仍然 無法將熱量有效導出而快速排散，是以，便有業者在記憶體 模組二側夾持抵貼有散刻，其雖可達到將記憶體晶片運作 時所產生之熱量快速且平均傳導至散細表面上，但因傳統 散熱片考量製造加工上之便利性，大都利用金屬片材直接沖 屢方式-體成型，料成型出可有_助散熱之設計，所以 整體散熱效當植，有餘前述賴㈣展㈣與各種 缺點，以及製造_間競爭激烈，而任何—點有利於散熱片 散熱之結構料，都將可能影響產品銷售量與市佔率，即為 有待業者進一步研究改善之所在。 【新型内容】 故創作人有鑑於上述之問題與缺失，乃搜集相關資料 ’經由多方的評估及考量，並利用從事於此行業多年研發經 驗不斷試作與修改’始設計出此種散錄置新型誕生者。 本創作之主要目的乃在於座體所具之基部為朝外延伸有 夹板’並於夾板上對接結合有蓋板，且夾板與蓋板間夾持抵 貼有記憶體漁，俾#記髓獅上之記舰“運作時所 產生之熱里岐且平均傳導至散熱做，即可透過夾板另側M382513 . ' V. New description: 【New technology field】 This creation department provides a kind of heat dissipation device, especially when the seat body and the cover plate are attached with a memory module and the two groups are cooled. #卿The fan is arranged in the accommodating groove, and the fan can be used to blow the cold air toward the channel formed between the adjacent fins to quickly lead out to the outside, and the air convection is cooled and dissipated. ~ [Prior Art] • Press, today's computer technology is growing at an ever-changing speed, so that the development trend of computers is moving toward a powerful computing function and a fast speed. With (4) brain-related applications, it is also moving toward high-speed and high-speed exhibitions, which will directly lead to The electronic components and memory modules inside the computer generate a lot of heat, but in terms of the access bandwidth of the memory module, from the early bandwidth of 8 Q QMB/s# to the current DDR 5 0 0 The bandwidth has reached 4.0GB/S, and even the multi-channel resignation can greatly increase the bandwidth by more than double, so that whether it is the working clock or the transmission bandwidth, it is obviously to match the motherboard. Central processor dimension - high speed computing. Furthermore, the computer's high-speed arithmetic processing will inevitably lead to a sudden rise in the temperature of the memory pull group, which not only affects the overall performance, reduces the system stability, but also the heat will be accumulated on the memory chip. The problem caused by the poor heat dissipation of the S-memory module, or the failure caused by overheating and burning, therefore, how to effectively solve the problem of temperature rise of the memory module is the key that all manufacturers must face and solve. 3 ... However, if the memory is inserted into the shop on the seesaw, because each slot is a small bribe, this can not be equipped with other heat sinks with fans, only a single seam The main _ part of the limited space is additionally provided with a cooling fan' or the fan set on other heat sources is used to indirectly guide the airflow to the surface of the memory module to supplement the convection heat, but this way still cannot effectively derive the heat. Quickly dissipating, so that the manufacturer can hold the scatter on both sides of the memory module, which can quickly and evenly conduct heat generated on the memory chip to the fine surface, but Due to the convenience of traditional heat sinks in manufacturing and processing, most of them use metal sheets to directly punch the body-by-body molding. The material can be molded to help the heat dissipation. Therefore, the overall heat dissipation effect is more than the above. All kinds of shortcomings, as well as manufacturing, are fiercely competitive, and any structural material that is beneficial to the heat dissipation of the heat sink will affect the sales volume and market share of the product, which is the further research and improvement of the unemployed. [New content] Therefore, in view of the above-mentioned problems and shortcomings, the creators have collected relevant information's through the evaluation and consideration of many parties, and have used the years of research and development experience in this industry to continuously try and modify the design. The birther. The main purpose of this creation is that the base of the seat body has a splint extending outwards and a butt joint on the splint, and the clamp plate and the cover plate are clamped against the memory fish, 俾#记髓狮On the other side of the ship, the heat generated by the operation of the ship is transmitted to the heat.