M335717 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱墊，尤指一種可節省電能及提 高電子裝置之散熱效率的散熱墊，例如筆記型電腦等。 【先前技術】 於一般電子裝置内，皆會組設有多個電子元件，其並 配合電路設計，以達成前述電子裝置所欲具有之功能，例 如電視、錄放影機、電腦等。 ㈣腦^)’近年來由於科技日新月異，不論是個人 或者公司，於處理工作事務日4 為了達到更多使用功能，電月;知需仰賴電腦來完成，且 ^ .,..,电％所使用的電子元件也愈趨複 雜、數1也愈多，例如中央處理哭、a 、二 些電子元件在使用過程中，比合00日日 、，而廷 熱源，並且於電腦處理資料二:f生熱量而成為所謂的發 影響下，上述電子元件所速度的提升等因素之 再以筆記型電腦為例，同^也因此大為轉加。 因上述同樣·而產生熱量，^道理’筆記型電腦亦會 述熱量移除，其便會使‘型電=„有效地將前 工作環境溫度升S，⑽❹J部之好70件的 電子元件㈣，造差，嚴重者甚至會使 因此，如何創作出一種 能及提高電子裝置之散=散熱塾可節省電 之處。；疋本創作所欲積極揭露 M335717 【新型内容】 有鑑於上述習知散熱之需求，創作人憑其從事該項產 業多年之累積經驗，進而研發出一種散熱墊’以期達到節 省電能及提高電子裝置之散熱姝率的目的。 本創作之主要目的在提供/種散熱墊，其藉由散熱墊 具有通道之設計，使得電子裝ί所產生之熱量傳遞至散熱 墊後，可利用自然對流之方式進行散熱，而因此達到節省 電能及提高電子裝置之散熱效率的目的。 為達上述目的，本創作之散熱墊包含一頂板、一前板、 一底板以及一後板，其中，頂板、前板、底板以及後板係 彼此依序連接並圍繞出一中空多間，且此中空空間包含二 侧邊開口，同時，此中空空間分隔成連通二側邊開口之複 數個通道。 另外，散熱墊之頂板貫設有複數個通孔，此複數個通 孔係對應連通中空空間之複數個通道。 因此，藉由散熱墊具有通道之設計，使得電子裝置所 產生之熱量傳遞至散熱墊後，可利用自然對流之方式進行 散熱，而因此達到節省電能（不需另外加裝必須以電力驅 動之散熱風扇）及提高電子裝置之散熱效率的目的。 本創作之散熱墊之另一種形式係同樣包含一頂板、一 前板、-底板以及-後板，其中，頂板、前板、底板以及 後板係彼此依序連接並圍繞出一中空空間，且此中空空間 包含二侧邊開口，同時，此中空空間分隔成連通二側邊開 口之複數個通道' M335717 藉此，本創作另-種形式之散熱墊同樣可利用自 然對流之方式進行散熱，並因此達到節省電能（不需另外 加裝必須以電力驅動之散熱風扇）及提高電子裝置2散熱 效率的目的。 【實施方式】 為充分瞭解本創作之目的、特徵及功效，茲藉由下述 _ 具體之實施例，並配合所附之圖式，對本創作做一詳細說 明，說明如後： 請參閱第一圖，其係為本創作第一較佳具體實施例之 分解圖，於圖式中顯示有一本創作之散熱墊2，且此散熱 墊· 2包含一頂板2 1、一前板2 2、一底板2 3、一後板 2 4以及二柵板2 6。 上述散熱墊2之頂板2 1、前板2 2、底板2 3以及 後板2 4係彼此依序連接，並圍繞出一中空空間2 5，而 _ 此中空空間2 5包含二侧邊開口 2 5 1，至於二柵板2 6 則是分別對應蓋合於二侧邊開口 2 5 1。此外，前述之中 空空間2 5並分隔成連通二側邊開口 2 5 1之複數個通道 2 5 2，且散熱墊2之頂板2 1貫設有複數傭通孔2 1 2 ’而且此複數個通孔2 1 2係對應連通中空空間2 5之 複數個通道2 5 2 〇 請同時參閱第一圖及第二圖，其中之第二圖係為本劍 作第一較佳具體實施例之立體圖，其係顯示第一圖之散熱 塾2於組合完成後之立體態樣。 M335717 於本實施例中，散熱墊2之前板2 2具有一前板高度 dl，散熱墊2之後板24具有一後板高度D1，且後板 高度D 1係大於前板高度d 1。因此，散熱墊2之頂板2 1會呈現由後板2 4向前板2 2方向傾斜之狀態，亦即頂 板21會呈現斜面態樣。 請同時參閱第三圖及第四圖’其中’第三圖係為本創 作第一較佳具體實施例之使用狀態之立體圖，第四圖係為 本創作第一較佳具體實施例之使用狀態之後側視圖，於圖 式中，顯示本創作之散熱墊2係配合一電子裝置1使用， 於本實施例中，此電子裝置1係一筆記型電腦，且其包含 一底面1 1，同時此底面1 1包含一後部區域1 1 1以及 複數個腳墊1 1 2 〇 此外，散熱墊2之頂板2 1係位於上述電子裝置1底 面11之後部區域111並鄰接於部分複數個腳墊11 2，且頂板2 1係與後部區域11 1間隔出一空隙2 1 1。 因此，當電子裝置1 (筆記型電腦）於使用時，其會 因運作而產生熱量，而且此熱量會傳遞至散熱墊2，並由 散熱墊2頂板21所貫設之複數個通孔212傳遞至中空 空間2 5之複數個通道2 5 2，之後，利用冷、熱空氣之 溫差造成氣流流動之原理，而會以自然對流之方式進行散 熱（如第四圖箭號所示）。亦即上述之結構設計，可藉由散 熱墊2具有複數個通道2 5 2之設計，使得電子裝置1所 產生之熱量傳遞至散熱墊2後，可利用自然對流之方式進 行散熱，而因此達到節省電能及提高電子裝置1之散熱效 M335717 率的目的。 另欲說明的是，散熱墊2之頂板2 1、前板2 2、底 板2 3以及後板2 4係可以一體成型方弍製造，例如可利 用擠製方式成型。此外，散熱墊2之頂板2 1係呈現斜面 悲樣，故於操作電子裝置1時，例如搡作其觸控板1 2時， 可付合人體工學之設計而可更容易於操作。 "月同日卞參閱第五圖及第六圖，其中，第五圖係為本創 鲁作第一車父佳具體實施例之分解圖，第六圖係為本創作第二 較佳具體實施例之立體圖，於本實施例中，其主要結構與 上述第一較佳具體實施例相同，即圖式t之散熱墊3同樣 包含一頂板3 1、一前板3 2、一底板3 3、一後板3 4 以及·一拇板3 6 〇 上述政熱墊3之頂板3 1、前板3 2!、底板3 3以及 後板3 4係彼此依序連接並圍繞出一中空空間3 5，且此 中空空間3 5包含二侧邊開口 3 5 1，至於二柵板3 6則 φ 是分別對應蓋合於二側邊開口 3 5 1，同時，中空空間3 5並分隔成連通二側邊開口 3 5 1之複數個通道3 5 2。 於本實施例中，上述散熱墊3之前板3 2同樣包含一 前板高度d 2，散熱墊3之後板34同樣包含一後板高度 D 2，且後板高度D 2係大於前板高度d 2。因此，散熱 墊3之頂板3 1會呈現由後板3 4向前板3 2方向傾斜之 狀態，亦即頂板3 1會呈現斜面態樣。 請同時參閲第七圖及第八圖’其中’第七圖為本創作 第二較佳具體實施例之使用狀態之立體圖，第八圖為本創 M335717 作第二車父佳具體實施例之使用狀態之後侧視圖，於圖式 中，顯示散熱墊3係同樣配合一電子裝置1使用，於本實 施例中，電子裝置1係與上述第一較佳具體實施例相同而 為一筆記型電腦，且其同樣包含一底面丄丄，同時此底面 1 1同樣包含一後部區域1 1 1以及複數個腳墊i i 2。 此外，散熱墊3之頂板3 1係位於上述電子裝置工底 面1 1之後部區域i i i並鄰接於部分複數個腳墊丄工 2，且頂板3 1係與後部區域1 1 1間隔出一空隙3 1 1。 因此’當電子裝置1 (筆記型電腦）於使用時，其會 因運作而產生熱量，而且此熱量會傳遞至散熱墊3，之後， 藉由散熱墊3頂板3 χ與電子裝置i底面i i之後部區域 1 11所間隔之空隙3』i，以及散熱墊3中空空間3 5 之複數個通道3 5 2之設計，可使電子裝置1所產生之熱 1傳遞至散熱墊3後，利用冷、熱空氣之溫差造成氣流流 動之原理，而會以自然對流之方式進行散熱（如第八圖箭 號所示），而因此達到節省電能及提高電子裝置i之散熱效 率的目的’亦即此第二較佳具體實施例所述之結構，同樣 可達成上述第一較佳具體實施例所述之各種功效。 另外，同樣的，如同上述第一較佳具體實施例所述， 本實施例散熱墊3之頂板3 1、前板3 2、底板3 3以及 後板3 4係可以一體成型方式製造，例如利用擠製方式成 型。此外’頂板3 1係呈現斜面態樣，故於操作電子裝置 1時，例如操作其觸控板1 2時，可符合人體工學之設計 而可更容易於操作。 M335717 如上所述，本創作完全符合專利三要件：新穎性、、 步性和產業上的可利用性。以新穎性和進步性而古，， 由空隙以及通道之設計，可使電子裝置所產生之:量Z 至散熱塾後，利用冷、熱空氣之溫差造成氣流流動之原理& 而以自然對流之方式進行散熱，並因此達到節省電能、， 需另外加裝必須以電力驅動之散熱風扇）及提高 之散熱效率的目的；就產業上的可利用性而言用^置 作所衍生的產品，當可充分滿足目前市場的需求本創 本創作在上文中已以較佳實施例 項 :者應理解的是，該實施例僅用於描繪本創作: 效之變化與置換，均二= 與該實施例等 ，本創作之保護範圍:=盍:本創作之範，内。因此 準。圍田以下文之申請專利範圍所界定者為 • 【圓式簡單說明】 I:^本創作第—較佳具體實施例之分解圖。 #:<、、本創作第—較佳具體實施例之立體圖。 體圖弟目為本創作第一較佳具體實施例之使用狀態之立 侧視^四圖為本創作第一較佳具體實施例之使用狀態之後 2圖為本創作第二較佳具體實施例之分解圖。 弟、圖為本創作第二較佳具體實施例之立體圖。 M335717 第七圖為本創作第二較佳具體實施例之使用狀態之立 體圖。 第八圖為本創作第二較佳具體實施例之使用狀態之後 侧視圖。 【主要元件符號說明】 1 電子裝置 11 底面 111 後部區域 11 2 腳墊 12 觸控板 2 散熱墊 2 1 頂板 2 1 1 空隙 2 1 2 通孔 2 2 前板 2 3 底板 2 4 後板 2 5 中空空間 2 51 側邊開口 2 5 2 通道 2 6 柵板 3 散熱墊 3 1 頂板 12 M335717 3 11 空隙 3 2 前板 3 3 底板 3 4 後板 3 5 中空空間 3 5 1 側邊開口 3 5 2 通道 3 6 柵板 ’ d 1 前板南度 D 1 後板高度 d 2 前板1¾度 D 2 後板高度M335717 VIII. New Description: [New Technology Field] This creation is about a heat sink, especially a heat sink that saves energy and improves the heat dissipation efficiency of electronic devices, such as notebook computers. [Prior Art] In a general electronic device, a plurality of electronic components are arranged, which are combined with circuit design to achieve the functions desired by the aforementioned electronic device, such as a television, a video recorder, a computer, and the like. (4) Brain ^) 'In recent years, due to the rapid development of science and technology, whether it is an individual or a company, in dealing with work day 4 in order to achieve more use of functions, electricity month; knowing depends on the computer to complete, and ^.,.., electricity% The electronic components used are becoming more and more complicated, and the number is also increased. For example, the central processing is crying, a, and some electronic components are in use, compared with 00 days, and the heat source is processed, and the data is processed by the computer: f Under the influence of the heat generation, the speed of the above-mentioned electronic components is increased, and the like, and the notebook computer is taken as an example, and the same is also greatly increased. Because of the same heat generated above, ^Note 'note computer will also describe the heat removal, which will make 'type electricity = „ effectively increase the temperature of the front working environment by S, (10) 好 70 parts of the 70 electronic components (four) If you create a difference, you may even create a way to save the power of the electronic device. If you want to save the electricity, you can actively expose the M335717. [New content] In view of the above-mentioned conventional heat dissipation The demand, the creator based on his accumulated experience in the industry for many years, and then developed a cooling pad 'to achieve the purpose of saving energy and improving the heat dissipation rate of electronic devices. The main purpose of this creation is to provide / kind of cooling pad, The heat dissipation pad has a channel design, so that the heat generated by the electronic device can be transferred to the heat dissipation pad, and the heat can be dissipated by natural convection, thereby achieving the purpose of saving power and improving the heat dissipation efficiency of the electronic device. For the above purpose, the heat sink of the present invention comprises a top plate, a front plate, a bottom plate and a rear plate, wherein the top plate, the front plate, the bottom plate and the rear plate The plurality of spaces are connected to each other in a sequence, and the hollow space includes two side openings, and the hollow space is divided into a plurality of channels connecting the two side openings. In addition, the top plate of the heat dissipation pad is provided with a plurality of channels Through holes, the plurality of through holes correspond to a plurality of channels connecting the hollow spaces. Therefore, the heat dissipation pad has a channel design, so that the heat generated by the electronic device is transmitted to the heat dissipation pad, and the natural convection can be performed. Cooling, thus saving energy (no need to install a cooling fan that must be driven by electricity) and improving the heat dissipation efficiency of the electronic device. Another form of the cooling pad of the present invention also includes a top plate and a front plate. a bottom plate and a rear plate, wherein the top plate, the front plate, the bottom plate and the rear plate are sequentially connected to each other and surround a hollow space, and the hollow space comprises two side openings, and the hollow space is separated into two sides. A plurality of channels that are open at the side of the M335717, in this way, another form of thermal pad can also be used in the form of natural convection. Heat, and thus achieve the purpose of saving electrical energy (no additional need to install a cooling fan that must be driven by electricity) and improving the heat dissipation efficiency of the electronic device 2. [Embodiment] In order to fully understand the purpose, characteristics and efficacy of the creation, The following is a detailed description of the present invention with reference to the accompanying drawings, and the following is a detailed description of the present invention. Please refer to the first drawing, which is an exploded view of the first preferred embodiment of the present invention. The figure shows a created thermal pad 2, and the thermal pad 2 comprises a top plate 2 1 , a front plate 2 2 , a bottom plate 2 3 , a rear plate 2 4 and a second grid 26 . 2, the top plate 2 1, the front plate 2, the bottom plate 2 3 and the rear plate 2 4 are sequentially connected to each other and surround a hollow space 25, and the hollow space 25 includes two side openings 2 5 1, As for the two grids 2 6 , they are respectively corresponding to the two side openings 2 5 1 . In addition, the foregoing hollow space 25 is divided into a plurality of channels 2 5 2 connecting the two side openings 2 5 1 , and the top plate 2 1 of the heat dissipation pad 2 is provided with a plurality of service through holes 2 1 2 ' and the plurality of The through hole 2 1 2 corresponds to a plurality of channels connecting the hollow space 2 5 2 2 2 Please refer to the first figure and the second figure at the same time, wherein the second figure is a perspective view of the first preferred embodiment of the sword. , which shows the three-dimensional aspect of the heat dissipation 塾2 of the first figure after the combination is completed. M335717 In the present embodiment, the front plate 2 2 of the heat sink pad 2 has a front plate height dl, the rear plate height 24 of the heat sink pad 2 has a rear plate height D1, and the rear plate height D 1 is greater than the front plate height d 1 . Therefore, the top plate 21 of the heat dissipating pad 2 is in a state of being inclined by the rear plate 24 from the front plate 22, that is, the top plate 21 is in a beveled state. Please also refer to the third and fourth figures, wherein 'the third figure is a perspective view of the use state of the first preferred embodiment of the creation, and the fourth figure is the use state of the first preferred embodiment of the creation. After the side view, in the figure, the heat sink 2 of the present invention is used in conjunction with an electronic device 1. In this embodiment, the electronic device 1 is a notebook computer and includes a bottom surface 1 1 and at the same time The bottom surface 1 1 includes a rear portion 1 1 1 and a plurality of foot pads 1 1 2 . Further, the top plate 21 of the heat dissipation pad 2 is located in the rear portion 111 of the bottom surface 11 of the electronic device 1 and adjacent to a plurality of the plurality of foot pads 11 2 . And the top plate 21 is spaced from the rear region 11 1 by a gap 2 1 1 . Therefore, when the electronic device 1 (note type computer) is in use, it generates heat due to the operation, and the heat is transferred to the heat dissipation pad 2, and is transmitted by the plurality of through holes 212 through which the top plate 21 of the heat dissipation pad 2 is disposed. To a plurality of channels 2 5 2 of the hollow space 2, after that, the principle of the air flow is caused by the temperature difference between the cold and the hot air, and the heat is radiated by natural convection (as shown by the arrow in the fourth figure). In the above-mentioned structural design, the heat dissipation pad 2 has a plurality of channels 252, so that the heat generated by the electronic device 1 is transmitted to the heat dissipation pad 2, and the heat can be dissipated by natural convection. The purpose of saving power and improving the heat dissipation efficiency of the electronic device 1 is M335717. It is to be noted that the top plate 2 1 , the front plate 2 2 , the bottom plate 23 , and the rear plate 24 of the heat-dissipating mat 2 may be integrally formed, for example, by extrusion molding. In addition, the top plate 21 of the heat-dissipating pad 2 exhibits a beveled shape. Therefore, when the electronic device 1 is operated, for example, when the touch panel 12 is used, the ergonomic design can be operatively made and the operation can be more easily performed. "Monthly in the same day, please refer to the fifth and sixth figures. The fifth picture is the exploded view of the specific embodiment of the first car of the founder of Lu, and the sixth picture is the second best implementation of the creation. In the present embodiment, the main structure is the same as that of the first preferred embodiment. The heat sink 3 of the drawing t also includes a top plate 3 1 , a front plate 3 2 , and a bottom plate 3 3 . a rear plate 3 4 and a top plate 3 6 顶 the top plate 3 1 of the above-mentioned political heating pad 3, the front plate 3 2!, the bottom plate 3 3 and the rear plate 34 are sequentially connected to each other and surround a hollow space 3 5 And the hollow space 3 5 includes two side openings 3 5 1 , and the two grids 3 6 respectively correspond to the two side openings 3 5 1 , and the hollow space 3 5 is separated into two sides. A plurality of channels 3 5 2 are opened by 3 5 1 . In the embodiment, the front plate 3 2 of the heat dissipation pad 3 also includes a front plate height d 2 , and the heat dissipation pad 3 after the plate 34 also includes a rear plate height D 2 , and the rear plate height D 2 is greater than the front plate height d 2. Therefore, the top plate 31 of the heat dissipating pad 3 is in a state of being inclined by the rear plate 3 4 in the direction of the front plate 3 2, that is, the top plate 31 will exhibit a beveled surface. Please refer to the seventh and eighth figures, respectively, in which the seventh figure is a perspective view of the use state of the second preferred embodiment of the present invention, and the eighth figure is the second embodiment of the invention of the M335717. In the figure, the heat sink 3 is also used in conjunction with an electronic device 1. In this embodiment, the electronic device 1 is the same as the first preferred embodiment described above and is a notebook computer. And it also includes a bottom surface, and the bottom surface 1 1 also includes a rear region 1 1 1 and a plurality of foot pads ii 2 . In addition, the top plate 31 of the heat dissipation pad 3 is located in the rear region iii of the bottom surface of the electronic device and is adjacent to a plurality of foot pads 2, and the top plate 31 is separated from the rear region 11 1 by a gap 3 1 1. Therefore, when the electronic device 1 (notebook computer) is used, it generates heat due to the operation, and the heat is transferred to the heat dissipation pad 3, after which the bottom plate 3 of the heat dissipation pad 3 and the bottom surface ii of the electronic device i are The gap 3′i of the portion of the region 1 11 and the plurality of channels 3 5 2 of the hollow space 3 5 of the heat dissipation pad 3 enable the heat 1 generated by the electronic device 1 to be transferred to the heat dissipation pad 3, and then cold, The temperature difference between the hot air causes the airflow to flow, and the heat is radiated by natural convection (as shown by the arrow in the eighth figure), thereby achieving the purpose of saving power and improving the heat dissipation efficiency of the electronic device i. The structure described in the second preferred embodiment can also achieve the various functions described in the first preferred embodiment. In addition, as described in the first preferred embodiment, the top plate 3 1 , the front plate 3 2 , the bottom plate 3 3 , and the rear plate 34 of the heat dissipation pad 3 of the present embodiment can be integrally formed, for example, by using Extrusion molding. Further, the top plate 31 is inclined, so that when the electronic device 1 is operated, for example, when the touch panel 12 is operated, it can be ergonomically designed to be easier to operate. M335717 As mentioned above, this creation is fully in line with the three requirements of the patent: novelty, procedural and industrial availability. In terms of novelty and advancement, the design of the gap and the passage can be made by the electronic device: after the amount Z reaches the heat dissipation, the principle of the airflow is caused by the temperature difference between the cold and the hot air, and the natural convection The way to dissipate heat, and thus to save energy, the need to additionally install a cooling fan that must be driven by electricity) and to improve the heat dissipation efficiency; in terms of industrial availability, the products derived from the use of When the needs of the current market can be fully satisfied, the present creation has been described above with preferred embodiments: it should be understood that this embodiment is only used to depict the creation: effect change and permutation, both = and Examples, etc., the scope of protection of this creation: = 盍: the scope of this creation, within. Therefore accurate. The definition of the patent application scope below is: • [Circular Simple Description] I: ^ This creation is an exploded view of the preferred embodiment. #:<,, a perspective view of a preferred embodiment of the present invention. FIG. 4 is a second preferred embodiment of the present invention after the first preferred embodiment of the present invention is used. Exploded view. The figure is a perspective view of a second preferred embodiment of the present invention. M335717 The seventh figure is a perspective view showing the state of use of the second preferred embodiment of the present invention. Figure 8 is a side elevational view of the second preferred embodiment of the present invention. [Main component symbol description] 1 Electronic device 11 Bottom surface 111 Rear area 11 2 Foot pad 12 Touch pad 2 Thermal pad 2 1 Top plate 2 1 1 Clearance 2 1 2 Through hole 2 2 Front plate 2 3 Base plate 2 4 Rear plate 2 5 Hollow space 2 51 Side opening 2 5 2 Channel 2 6 Grid 3 Thermal pad 3 1 Top plate 12 M335717 3 11 Clearance 3 2 Front plate 3 3 Base plate 3 4 Rear plate 3 5 Hollow space 3 5 1 Side opening 3 5 2 Channel 3 6 grid 'd 1 front panel south D 1 rear panel height d 2 front panel 13⁄4 degrees D 2 rear panel height