1327459 九、發明說明： 【發明所屬之技術領域】 本發明關於一種散熱裝置，尤係一種用於通訊機櫃、 交換機等電子設備的散熱裝置。 【先前技術】 目觔市％上的大多通訊機櫃、交換機等電子設備需要 安裝散熱裝置’對其電路板的電子元件予以散熱。而目前 業界採用的散熱裝置大多數整體方式壓鑄成型，如圖5所 不°亥政熱裝置包括具有不同功能的兩部分結構：一種是 蓋體100’設置於散熱裝置的底部大致呈薄板狀，其大小與 電路板相應，該蓋體100的周緣上適當位置設有數個固定 件110,用來與機櫃壁面（或交換機殼體）等鎖固，該蓋體 1〇〇係用來遮罩電路板予以保護或防電磁幹擾等，該蓋體 7上亦設有數個定孔（0未示），心與電路板鎖固； 另一種是散熱部200,係由蓋體1〇〇對應電子元件的位置向 ^的，型政熱片210，而上述蓋體1〇〇對應電子元件的 =置設有凹凸結構使散熱部與電子元件接觸進而吸 熱/散熱。 3 Λ的是’為了 f省製造成本上述散熱裝置以整 1 坚鑄成型，然而由此産生以下問題：i)導熱係數較 :=Γ、如，6063或AI 1070型號的材料，由於材料特 性^’因此該散熱裝置無法使用該科熱/散熱 4好的材料；2)適合開壓鑄模的材質，如ADC10或1327459 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic device such as a communication cabinet or a switch. [Prior Art] Most of the electronic equipment such as communication cabinets and switches on the market of the city need to be equipped with a heat sink to dissipate heat from the electronic components of the board. At present, most of the heat dissipating devices used in the industry are die-casting, as shown in Fig. 5. The Heizhen thermal device includes a two-part structure having different functions: one is that the cover 100' is disposed at the bottom of the heat dissipating device and has a substantially thin plate shape. Corresponding to the size of the circuit board, a plurality of fixing members 110 are disposed at appropriate positions on the periphery of the cover body 100 for locking with the wall surface of the cabinet (or the switch housing), and the cover body 1 is used for masking. The circuit board is protected or protected against electromagnetic interference, and the cover body 7 is also provided with a plurality of fixed holes (not shown), and the core and the circuit board are locked; the other is the heat dissipating portion 200, which is composed of the cover body 1 corresponding to the electronic The position of the component is the same as that of the type of heat sheet 210, and the cover body 1 is corresponding to the electronic component. The concave-convex structure is disposed so that the heat-dissipating portion contacts the electronic component to absorb heat/heat dissipation. 3 Λ 是 ' 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了'Therefore, the heat sink cannot use the material of the heat/heat dissipation 4; 2) the material suitable for the die-casting mold, such as ADC10 or
6 型號的材料，由於其導熱係數低無法^系统散孰 明：T材料製成的散熱裝置散熱性能較低'、’、’、 有蓥於此，有必要提供1散_ 較低的散熱裝置。 了且衣&成本 一種散熱裂置，用於對電路板上的電子元件散献，盆 1相互分離的用於遮罩電路板的蓋體及與電子元件接觸 =熱部’該蓋體對應電路板的電子騎設有―，該散 熱部通過該開口與電子元件接觸。 、生與習知技術相比，該散熱裝置的蓋體與散熱部分離製 k ’可根據=者所需功能的不同採用不同的材料和工藝製 成可以適备控制製造成本的㈣，_ 熱性能，使散熱襄置具有雙重優勢。 艮好的散 【實施方式】 』本發明散熱農置是用來安裝在通訊機櫃、交換機等電 =没備的電路板（圖未示）i，散除其電子元件産生的熱 量。 、 明參閱圖1至圖3，本發明一實施例的散熱裝置包括壓 麵成型的蓋體10及播型的散熱部2〇。 蓋體10係由炫融狀態下流動性較好的材料通過壓缚方 式製造的薄板狀結構’其大小與電路板大小相應。該蓋體 10對應電路板的多數電子元件設有多個開孔12，安裳時將 該等電子兀件或散熱部的與電子元件接觸的部分結構從該 1327459 開口 12露出。該蓋體ι〇周緣設有數個固定件14，用來與通 '訊機櫃壁面（或交換機殼體）相鎖固，該蓋體1〇板體上亦 •設有數個與電路板相固定用的固定孔（圖未示）及與散熱 部20鎖固的數個螺孔16。其中，製造該蓋體1〇的材料可以 係ADC-10或ADC_12等型號的鋁合金，其材料成本及製造成 本白較低，並且元全可以滿足固定、遮罩等機構上的要求。 散熱部20係由導熱性較佳的金屬材料通過擠壓方式製 造的鰭形板，具有一底座22及底座22表面向外延伸的複數 散熱籍片24 ’其底座22表面對應電子元件的位置凸出設有 接觸部26並其周圍還設有與蓋體1〇鎖固的螺孔28。其中， 製造該散熱部20的材料可以是AI 6063或AI 1070型號等的 鋁擠壓型材，其導熱係數較高，與習知技術中壓鑄成型的 散熱裝置相比大副提高散熱性能。 上述蓋體10和散熱部20通過螺絲等鎖固件預先連接在 一起’亦可以相繼安裝於電路板上。 本發明的散熱裝置相對習知技術，由於將具有不同功 能的蓋體10和散熱部20由對應的不同材料分開製造後組合 形成，不僅同時滿足了機構要求及散熱要求，而且製造成 本比較適當。 上述實施例中’散熱部20由於需要同時對數個電子元 件進行散熱，故其尺寸較大，但對擠型件來講需要大頓位 機台，且擠型的表面平面度較難管控。為此，如圖4所示， 本發明進一步提供另一實施例的散熱裝置，其與上述實施 S ) U27459 例不同點在於：該散熱裝置包括並列組合的三個小尺寸散 ‘熱部30,來代替上述實施例的大尺讀熱㈣，本實施例 ‘的散熱部30數量可以是兩個或兩個以上。如此本實施例的 散熱裝置無需大頓位的模具，大幅降低模具成本，而且能 夠有效控制散熱部30的表面平面度。 综上所述，本發明符合發明專利要件，麦依法提出專 ^申請。m該者僅為本發明之較佳實施例，舉凡熟 心本案技藝之人士，在爰依本發明精神所作之等效修飾 k化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明一實施例散熱裝置的立體分解圖。 圖2係圖1中散熱部的立體仰視圖。 圖3係圖1的立體組裝圖。 圖4係本發明另一實施例散熱裝置的立體分解圖。 圖5係習知技術中散熱裝置的立體圖。 【主要元件符號說明】 (本發明） 蓋體 10 開孔 12 固定件 14 螺孔 16、28 散熱部 20、30 底座 22 散熱鰭片 24 接觸部 26 (習知） 蓋體 100 固定件 110 散熱部 200 散熱片 2106 types of materials, due to its low thermal conductivity can not be ^ system scattered: T material made of heat sink cooling performance is lower ', ', ', there is a need to provide a loose _ lower heat sink . The clothing & cost is a heat dissipation split for distributing electronic components on the circuit board, the cover 1 for covering the circuit board and the contact with the electronic component = the hot part 'the cover body The electronic board of the circuit board is provided with "the heat radiating portion is in contact with the electronic component through the opening. Compared with the conventional technology, the cover of the heat dissipating device and the heat dissipating portion are separated by k', which can be controlled by different materials and processes according to the functions required by the person (4), _ heat Performance makes the heat sink a double advantage.实施 散 【 实施 实施 【 』 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本1 to 3, a heat dissipating device according to an embodiment of the present invention includes a press-formed cover body 10 and a heat-dissipating portion 2 of a broadcast type. The cover 10 is a thin plate-like structure manufactured by a pressure-bonding method from a material having a good fluidity in a molten state, and its size corresponds to the size of the circuit board. The cover 10 is provided with a plurality of openings 12 corresponding to the majority of the electronic components of the circuit board, and the portion of the electronic components or the heat-dissipating portion that is in contact with the electronic components is exposed from the opening 12 of the 1327459. The cover body is provided with a plurality of fixing members 14 for locking the wall surface of the cabinet (or the switch housing), and the cover body 1 is also provided with a plurality of fixed circuit boards. A fixing hole (not shown) and a plurality of screw holes 16 locked to the heat radiating portion 20 are used. The material for manufacturing the cover 1 can be made of an alloy such as ADC-10 or ADC_12, and the material cost and manufacturing cost are low, and the components can meet the requirements of fixing, masking and the like. The heat dissipating portion 20 is a fin-shaped plate manufactured by extrusion of a metal material having better thermal conductivity, and has a base 22 and a plurality of heat-dissipating fins 24 extending outward from the surface of the base 22, and the surface of the base 22 corresponds to the position of the electronic component. A contact portion 26 is provided and a screw hole 28 is formed around the cover body 1 . The material for manufacturing the heat dissipating portion 20 may be an aluminum extruded profile such as AI 6063 or AI 1070, which has a high thermal conductivity and greatly improves heat dissipation performance compared with the heat-dissipating device of the prior art. The cover body 10 and the heat dissipating portion 20 are previously connected together by a fastener such as a screw, and may be successively mounted on the circuit board. Compared with the prior art, the heat dissipating device of the present invention is formed by combining the cover body 10 and the heat dissipating portion 20 having different functions from corresponding different materials, which not only meets the requirements of the mechanism and the heat dissipating requirements at the same time, but also has a relatively high manufacturing cost. In the above embodiment, the heat dissipating portion 20 has a large size because it needs to dissipate a plurality of electronic components at the same time, but a large-sized machine is required for the extruded member, and the surface flatness of the extruded type is difficult to control. To this end, as shown in FIG. 4, the present invention further provides a heat dissipating device of another embodiment, which is different from the above-described implementation S) U27459 in that the heat dissipating device includes three small-sized dispersing 'hot portions 30, which are combined in parallel. Instead of the large-scale reading heat (four) of the above embodiment, the number of heat radiating portions 30 of the present embodiment ' may be two or more. Thus, the heat sink of the present embodiment does not require a large-sized mold, greatly reduces the mold cost, and can effectively control the surface flatness of the heat radiating portion 30. In summary, the present invention complies with the requirements of the invention patent, and the Mai has filed a special application. The present invention is only a preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalents of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a heat sink according to an embodiment of the present invention. 2 is a perspective bottom view of the heat dissipating portion of FIG. 1. 3 is a perspective assembled view of FIG. 1. 4 is an exploded perspective view of a heat sink according to another embodiment of the present invention. Figure 5 is a perspective view of a heat sink in the prior art. [Main component symbol description] (Invention) Cover 10 Opening 12 Fixing member 14 Screw hole 16, 28 Heat radiating portion 20, 30 Base 22 Heat sink fin 24 Contact portion 26 (General) Cover 100 Fixing member 110 Heat sink 200 heat sink 210