201144992 六、發明說明： 【發明所屬之技術領域】 剛—種電腦散熱键構’尤其是指—種可適用於不同電路基 板規格的散熱結構。 【先前技術] 剛*於電子裝置運作時會產生廢熱，如果沒有良好的散熱 結構將使廢熱累積於電子裝置内，並且溫度上升過多將 影響電子裝置的運作效能。由於電腦為非常精密 、南速 ❹ 冑作的電子裝置’在南速運作下會產生大量的廢熱。又 因電腦相當精密’些微的錯講將導致電腦當機，溫度過 高亦可能使電腦硬體產生永久性的損壞0 剛目此’已有許多先前專利不斯的改善應用於電腦的散熱 結構，例如中華民國專利證書第丨305879號「散熱方法及 其機構」，該前案中揭示的散熱方法器在中央處理器上 設立一散熱裝置，用以使該中央處理器之產生熱量部份 或全部傳導至該散熱裝置。同時在北橋晶片上設置一送 Q 氣裝置，用以帶走北橋晶片所產生的部份或全部熱量， 並由該送氣裝置產生氣流吹向該散熱裝置。因此，該送 氣裝置除了產生氣流帶走北橋晶片所產生的熱量以外， 氣流更通過該散熱裝置，令該散熱裝置所導引的熱量亦 一併隨氣流送出。該創作可同時降低中央處理器以及北 橋晶片的溫度，並且該送氣裝置所產生的氣流同時對中 央處理器以及北橋晶片的降溫產生積極有益的效果。 [麵]另一類型的散熱裝置如中華民國專利證書第1300687號「 散熱裝置」該前案所揭示的散熱裝置包括一散熱器、安 0992034350-0 099119381 表單煸號A0101 第3頁/共16頁 201144992 裝於散熱器上之風扇，風扇之一風口安裝一導風罩。該 散熱裝置還包括一安裝於風扇風口之防護網，該防護網 夾置於風扇與導風罩中間。依該前案之圖式所示，該散 熱裝置周緣具有複數固定於電路板上的固定腳，該些固 定腳固定該散熱裝置以預設的下壓力緊貼該中央處理器 ，以導出該中央處理器的熱量，並輔以該風扇加強散熱 的速度。 [0005] 然而，上述的習知散熱器都必須要固定在電腦的主機板 上，並且電路板上配合中央處理器插槽的散熱器固定孔 也是主機板出廠時預留的。因此使用不同型態中央處理 器的主機板，預留的散熱器固定孔位置也不同，造成散 熱器無法直接適用於不同規格主機板的困擾。再者，在 工業電腦領域中，工業電腦的配備必須配合客戶不同的 效能需求而改變，除了内部的配備以外，外型與尺寸可 能也需要一併修改以供應客製化的產品。因此，不同的 客戶提出不同需求時，散熱結構也必須要隨著改變，實 造成設計人力的時間耗費以及成本的上升。 【發明内容】 [0006] 由於習知技術中，散熱裝置無法完全直接適用於不同規 格的主機板，造成設計的困難以及成本的上升。因此本 案的目的在於提供一種可配合不同主機板的散熱結構， 並且確保該散熱結構具有優良的散熱能力。 [0007] 本案為一種電腦散熱結構，係提供一電腦散熱之功能， 該電腦包括一外殼、一定位於該外殼内的主機板，而該 外殼上具有一散熱區用以組設一導熱裝置，該主機板上 099119381 表單編號 A0101 第 4 頁/共 16 頁 0992034350-0 201144992 界定出一廢熱產生區。其中該導熱裝置包含一定位於該 散熱區上的散熱體以及至少一與該主機板分離的導熱塊 ，該導熱塊與該散熱體接觸並且該導熱塊可移動的循一 軌道而移動至該廢熱產生區。 [0008] 藉此，該導熱裝置利用可移動的導熱塊移動至需要散熱 的電子元件上，將電子元件的熱量導引至導熱塊上。而 固定的散熱體與導熱塊接觸，再將熱量傳導到散熱體上 。該散熱體固定於外殼上，並且可設有複數鰭片、具有 較大的散熱面積，熱量經由導熱塊傳導至散熱體後可快 速的由散熱體將熱量散逸在空氣中。又，由於該導熱塊 可循軌道移動，因此提高了使用的彈性，可隨需求而改 變位置。且該導熱塊非連接於主機板上，不佔用主機板 的空間，即使主機板以及主機板上的電子元件規格改變 亦可適用該導熱塊導熱。 【實施方式】， [0009] 本案為一種電腦散熱結構，以下將輔以圖式說明本案之 技術手段。請參閱圖1與圖2,圖1、2中所示為一電腦100 之外觀以及分解圖，該電腦100可為一般的桌上型電腦或 者是工業電腦。該電腦100包括一外殼1以及一定位於該 外殼1内之主機板3，外殼1内除了該主機板3以外更可容 納其他電腦配備，而該電腦100所相容的其他電腦設備並 非本案之重點，故不贅述。該主機板3上界定出一廢熱產 生區，該電腦100在運作時該廢熱產生區中將積蓄廢熱。 而該外殼1上則具有一散熱區10，該散熱區10用以組設一 導熱裝置，該導熱裝置則包含一定位於該散熱區10上的 099119381 表單編號A0101 第5頁/共16頁 0992034350-0 201144992 散熱體4以及至少一與該主機板3分離的導熱塊5。該散熱 體4與導熱塊5各具有一表面相互接觸導熱，並且該導熱 塊5受一轨道6支撐，該導熱塊5可循該軌道6上移動，使 該導熱塊5可循該執道6而移動至該廢熱產生區。該軌道6 係用於導引該導熱塊5移動，且該轨道6必須支撐該導熱 塊5，使該導熱塊5與該主機板3分離，藉此使該導熱塊5 不需組裝於主機板3上，節省主機板3上的空間。再者， 由於該導熱塊5可移動、與主機板3分離，因此該導熱塊5 可適用於不同規格的主機板3，方便該電腦100替換與升 級。該軌道6可選擇連接於該散熱體4上，或者選擇連接 於該外殼1上，該軌道6亦可選擇一端連接於該外殼1以及 另端連接位於外殼1内之一支架2。在圖2所示的實施態樣 中，該外殼1内設置了支架2，令該軌道6兩端分別連接於 該外殼1及該支架2上。請再一併參閱圖1至圖4，該導熱 塊5在該轨道6上可與位於散熱區10上的散熱體4接觸，該 廢熱產生區上設有至少一產生廢熱之電子元件31，該導 熱塊5移至該廢熱產生區上與該電子元件31接觸，藉此將 電子元件31的熱量經由該導熱塊5而導引至該散熱體4上 。該導熱塊'5更可在與電子元件31接觸面設一層導熱橡膠 51，除了提供絕緣的功能以外，該導熱橡膠51的彈性更 可讓該導熱塊5適當的迫緊該電子元件31。該導熱塊5可 將電子元件31的熱量導引至該散熱體4上，為了達到良好 的散熱效果，該散熱體4的體積與面積可被設計為明顯大 於該導熱塊5，使其可吸收的熱量以及散熱面積更大。更 進一步的，該外殼1的散熱區10設置至少一鏤空之窗口 101，該窗口 101可讓該散熱體4曝露於流通的空氣中，該 099119381 表單編號A0101 第6頁/共16頁 0992034350-0 201144992 散熱體4至少在面對該窗口 101位置設有複數鰭片41，以 達到最佳的散熱效果。 [0010] 該主機板3的廢熱產生區中可包含複數產生廢熱之電子元 件31，該軌道6上亦可具有複數導熱塊5移至該廢熱產生 區上與對應之電子元件31接觸。本案之另一實施態樣， 如圖5所示該廢熱產生區中包含兩個產生廢熱的電子元件 31，而該軌道6上可設有兩個導熱塊5分別移動至該電子 元件31上吸收熱量，並將熱量導引至該散熱體4上。 [0011] 上述實施態樣中，本案並不限制該廢熱產生區中的電子 元件31以及導熱塊5數量，亦不限制該軌道6之形態。上 述的電子元件31可為主機板3上的積體電路，例如中央處 理器、北橋晶片、南橋晶片等產生大量廢熱的積體電路 。藉由上述技術，熱量可透過該導熱塊5傳導至散熱面積 較大的散熱體4，可快速的將熱量散逸在空氣中。又，由 於該導熱塊5可循軌道6移動，因此提高了使用的彈性， 可隨需求而改變位置。且該導熱塊5非連接於主機板3上 ，不佔用主機板3的空間，即使規格改變亦可適用上述的 散熱結構。 [0012] 雖然本發明已以較佳實施例揭露如上，然其並非用以限 定本發明。任何熟習此技藝者，在不脫離本發明之精神 和範圍内，而所作之些許更動與潤飾，皆應涵蓋於本發 明中，因此本發明之保護範圍當視後附之申請專利範圍 所界定者為準。 [0013] 综上所述，本發明較習知之創作增進上述功效，應已充 099119381 表單編號A0101 第7頁/共16頁 0992034350-0 201144992 分符合新穎性及進步性之法定創新專利要件， 出申請，懇請 貴局核准本件發明專利申請 ，至感德便。 【圖式簡單說明】 [0014] 圖1為本案之電腦外觀示意圖。 [0015] 圖2為該電腦之分解圖。 [0016] 圖3為該電腦之剖面圖。 [0017] 圖4為該電腦另 一方向之剖面圖。 [0018] 圖5為本案另一 實施態樣之示意圖。 【主要元件符號說明】 [0019] 1..... •外殼 [0020] 10..... •散熱區 [0021] 101..... .窗口 [0022] 2..... •支架 [0023] 3..... •主機板 [0024] 31..... •電子元件 [0025] 4..... •散熱體 [0026] 41..... •鰭片 [0027] 5..... •導熱塊 [0028] 51..... •導熱橡膠 [0029] 6..... •執道 表單編號A0101 第8頁/共16頁 爰依法提 ，以勵創作 099119381 0992034350-0 201144992 [0030] 100 電腦201144992 VI. Description of the Invention: [Technical Fields of the Invention] The rigid-type computer heat-dissipating key structure, in particular, refers to a heat-dissipating structure that can be applied to different circuit board specifications. [Prior Art] When the electronic device is operated, waste heat is generated. If there is no good heat dissipation structure, waste heat will accumulate in the electronic device, and excessive temperature rise will affect the operational efficiency of the electronic device. Because the computer is a very sophisticated, south-speed electronic device, it generates a lot of waste heat at the south speed. And because the computer is quite sophisticated, the slightest mistake will lead to the computer crashing. If the temperature is too high, it can cause permanent damage to the computer hardware. This has been improved by many previous patents. For example, the Republic of China Patent Certificate No. 305879 "heat dissipation method and its mechanism", the heat dissipation method disclosed in the previous case has a heat sink disposed on the central processing unit to enable the central processor to generate heat or All are conducted to the heat sink. At the same time, a Q-steam device is arranged on the Northbridge wafer to remove some or all of the heat generated by the Northbridge wafer, and the airflow device generates an airflow to the heat sink. Therefore, in addition to the heat generated by the air supply device carrying the north bridge wafer, the air flow device passes through the heat dissipation device, so that the heat guided by the heat dissipation device is also sent out along with the air flow. This creation can simultaneously reduce the temperature of the central processor and the north bridge wafer, and the airflow generated by the air supply device simultaneously has a positive effect on the cooling of the central processor and the north bridge wafer. [Face] Another type of heat sink such as the Republic of China Patent Certificate No. 1300687 "heat sink" The heat sink disclosed in the previous case includes a heat sink, An 0992034350-0 099119381 Form No. A0101 Page 3 of 16 201144992 A fan mounted on a radiator, an air duct is installed at one of the fan outlets. The heat sink further includes a protective net mounted to the tuyere of the fan, the guard net being placed between the fan and the air hood. According to the drawing of the preceding example, the periphery of the heat dissipating device has a plurality of fixing legs fixed on the circuit board, and the fixing legs fix the heat dissipating device to be closely attached to the central processing unit with a predetermined downward pressure to derive the central portion. The heat of the processor is supplemented by the speed at which the fan enhances heat dissipation. [0005] However, the above-mentioned conventional heat sinks must be fixed on the motherboard of the computer, and the heat sink fixing holes of the circuit board that match the central processor socket are also reserved when the motherboard is shipped from the factory. Therefore, the motherboards of different types of central processing units are used, and the positions of the fixed heat sink fixing holes are also different, so that the heat sink cannot be directly applied to the motherboard of different specifications. Furthermore, in the industrial computer field, the industrial computer must be equipped to meet the different performance needs of customers. In addition to the internal equipment, the appearance and size may need to be modified to supply customized products. Therefore, when different customers come up with different requirements, the heat dissipation structure must also change, which will result in a time-consuming design cost and an increase in cost. SUMMARY OF THE INVENTION [0006] In the prior art, the heat sink cannot be completely directly applied to motherboards of different specifications, resulting in design difficulties and cost increases. Therefore, the purpose of the present invention is to provide a heat dissipation structure that can be matched with different motherboards, and to ensure that the heat dissipation structure has excellent heat dissipation capability. [0007] The present invention is a computer heat dissipation structure, which provides a computer heat dissipation function, the computer includes a casing, a motherboard that is located in the casing, and the casing has a heat dissipation area for assembling a heat conducting device. 099119381 Form No. A0101 Page 4 of 16 0992034350-0 201144992 on the motherboard Defines a waste heat generating area. Wherein the heat conducting device comprises a heat dissipating body located on the heat dissipating area and at least one heat conducting block separated from the main board, the heat conducting block is in contact with the heat dissipating body and the heat conducting block is movable to follow the track to move to the waste heat generation Area. [0008] Thereby, the heat conducting device moves to the electronic component requiring heat dissipation by using the movable heat conducting block, and guides the heat of the electronic component to the heat conducting block. The fixed heat sink contacts the heat conducting block and conducts heat to the heat sink. The heat dissipating body is fixed on the outer casing, and can be provided with a plurality of fins and has a large heat dissipating area. After the heat is conducted to the heat dissipating body via the heat conducting block, the heat can be dissipated in the air by the heat dissipating body. Moreover, since the heat conducting block can be orbitally moved, the elasticity of use is improved, and the position can be changed as needed. Moreover, the heat conducting block is not connected to the motherboard, and does not occupy the space of the motherboard. Even if the electronic component specifications of the motherboard and the motherboard are changed, the heat conducting block can be used for heat conduction. [Embodiment], [0009] The present invention is a computer heat dissipation structure, and the technical means of the present invention will be described below with reference to the drawings. Please refer to FIG. 1 and FIG. 2. FIG. 1 and FIG. 2 show the appearance and an exploded view of a computer 100 which can be a general desktop computer or an industrial computer. The computer 100 includes a casing 1 and a motherboard 3 located in the casing 1. The casing 1 can accommodate other computer equipment in addition to the motherboard 3, and other computer devices compatible with the computer 100 are not the focus of the present invention. Therefore, I will not repeat them. A waste heat generating area is defined on the main board 3, and the waste heat is accumulated in the waste heat generating area when the computer 100 is in operation. The heat dissipation zone 10 is provided with a heat dissipation zone 10 for assembling a heat conduction device, and the heat conduction device comprises 099119381 which is located on the heat dissipation zone 10, Form No. A0101, Page 5 of 16 pages 0992034350- 0 201144992 The heat sink 4 and at least one heat conducting block 5 separated from the motherboard 3. The heat dissipating body 4 and the heat conducting block 5 each have a surface in contact with each other to conduct heat, and the heat conducting block 5 is supported by a rail 6 , and the heat conducting block 5 can be moved along the rail 6 so that the heat conducting block 5 can follow the way 6 And move to the waste heat generating area. The rail 6 is used to guide the movement of the heat conducting block 5, and the rail 6 must support the heat conducting block 5 to separate the heat conducting block 5 from the motherboard 3, so that the heat conducting block 5 does not need to be assembled on the motherboard. 3, save space on the motherboard 3. Moreover, since the heat conducting block 5 is movable and separated from the motherboard 3, the heat conducting block 5 can be applied to the motherboard 3 of different specifications to facilitate the replacement and upgrading of the computer 100. The rail 6 can be selectively connected to the heat sink 4 or alternatively connected to the outer casing 1. The rail 6 can also be connected to the outer casing 1 at one end and to the bracket 2 at the other end. In the embodiment shown in Fig. 2, a bracket 2 is disposed in the outer casing 1, so that the two ends of the rail 6 are respectively connected to the outer casing 1 and the bracket 2. Referring to FIG. 1 to FIG. 4 , the heat conducting block 5 is in contact with the heat sink 4 on the heat dissipating area 10 on the rail 6 , and the waste heat generating area is provided with at least one electronic component 31 for generating waste heat. The heat conducting block 5 is moved to the waste heat generating region to be in contact with the electronic component 31, whereby the heat of the electronic component 31 is guided to the heat sink 4 via the heat conducting block 5. The heat conducting block '5 is further provided with a layer of heat conductive rubber 51 on the surface in contact with the electronic component 31. In addition to providing an insulating function, the heat of the heat conducting rubber 51 allows the heat conducting block 5 to properly press the electronic component 31. The heat conducting block 5 can guide the heat of the electronic component 31 to the heat sink 4. In order to achieve a good heat dissipation effect, the volume and area of the heat sink 4 can be designed to be significantly larger than the heat conducting block 5, so that it can be absorbed. The heat and heat dissipation area are larger. Further, the heat dissipation area 10 of the outer casing 1 is provided with at least one hollow window 101, which can expose the heat dissipation body 4 to the circulating air. The 099119381 form number A0101 page 6/16 pages 0992034350-0 201144992 The heat sink 4 is provided with a plurality of fins 41 at least in front of the window 101 to achieve an optimal heat dissipation effect. [0010] The waste heat generating area of the motherboard 3 may include a plurality of electronic components 31 for generating waste heat, and the rails 6 may also have a plurality of heat conducting blocks 5 moved to the waste heat generating regions to be in contact with the corresponding electronic components 31. In another embodiment of the present invention, as shown in FIG. 5, the waste heat generating zone includes two electronic components 31 for generating waste heat, and the rails 6 may be provided with two heat conducting blocks 5 respectively moved to the electronic component 31 for absorption. The heat is directed to the heat sink 4 . [0011] In the above embodiment, the present invention does not limit the number of the electronic component 31 and the heat conducting block 5 in the waste heat generating zone, nor does it limit the form of the track 6. The electronic component 31 described above may be an integrated circuit on the motherboard 3, such as a central processor, a north bridge wafer, a south bridge wafer, or the like, which generates a large amount of waste heat. According to the above technique, heat can be conducted through the heat conducting block 5 to the heat radiating body 4 having a large heat dissipating area, and the heat can be quickly dissipated in the air. Further, since the heat transfer block 5 can be moved by the track 6, the elasticity of use is improved, and the position can be changed as needed. Moreover, the heat conducting block 5 is not connected to the motherboard 3, and does not occupy the space of the motherboard 3. Even if the specification is changed, the above heat dissipation structure can be applied. While the invention has been described above in the preferred embodiments, it is not intended to limit the invention. Any modification and refinement made by those skilled in the art without departing from the spirit and scope of the present invention are intended to be included in the present invention. Therefore, the scope of the present invention is defined by the scope of the appended claims. Prevail. [0013] In summary, the present invention enhances the above-mentioned effects by the conventional creation, and should be filled with 099119381 Form No. A0101 Page 7 / Total 16 Page 0992034350-0 201144992 points are in accordance with the novelty and progressive statutory innovation patent requirements, To apply, you are requested to approve the application for this invention patent. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is a schematic view of the appearance of a computer of the present invention. 2 is an exploded view of the computer. 3 is a cross-sectional view of the computer. 4 is a cross-sectional view of the computer in another direction. [0018] FIG. 5 is a schematic diagram of another embodiment of the present invention. [Main component symbol description] [0019] 1..... • Case [0020] 10..... • Heatsink [0021] 101..... Window [0022] 2..... Bracket [0023] 3..... • Motherboard [0024] 31..... • Electronic components [0025] 4..... • Heat sink [0026] 41..... • Fin [ 0027] 5..... • Thermal block [0028] 51..... • Thermally conductive rubber [0029] 6..... • Execution form number A0101 Page 8 of 16励作099119381 0992034350-0 201144992 [0030] 100 computers
099119381 表單編號A0101 第9頁/共16頁 0992034350-0099119381 Form No. A0101 Page 9 of 16 0992034350-0