KR20090097989A - Heat sink for multiple heat sources - Google Patents

Heat sink for multiple heat sources Download PDF

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Publication number
KR20090097989A
KR20090097989A KR1020080023101A KR20080023101A KR20090097989A KR 20090097989 A KR20090097989 A KR 20090097989A KR 1020080023101 A KR1020080023101 A KR 1020080023101A KR 20080023101 A KR20080023101 A KR 20080023101A KR 20090097989 A KR20090097989 A KR 20090097989A
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South Korea
Prior art keywords
heat
distributed
cooling
plate
cooling plate
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KR1020080023101A
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Korean (ko)
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이진영
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이진영
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink for multiple heat sources is provided to use space efficiently by processing internal distributed heat sources of a magnetic device in one place. Heat occurs in a distributed heating element, and is absorbed to a cooling plate(31). The absorbed heat is gathered in a main cooling plate(32) through a heat pipe(41), and is cooled through the cooling surface of a thermoelectric module(21). The heat is transmitted to a heat sink(11) at a high temperature surface of the heating element, and is discharged to the outside air through a cooling fan(12).

Description

분산 열원용 히트싱크{HEAT SINK FOR MULTIPLE HEAT SOURCES}Heat Sinks for Distributed Heat Sources {HEAT SINK FOR MULTIPLE HEAT SOURCES}

본 발명은 열전소자를 이용하여 전자기기 내부에 산재하여 있는 여러 발열원을 효과적으로 냉각시키기 위한 방열냉각장치에 관한 것이다.The present invention relates to a heat dissipation cooling apparatus for effectively cooling various heat sources scattered in an electronic device using a thermoelectric element.

컴퓨터와 같은 전자기기 내부의 발열 전자소자의 방열을 위하여, 도 1에 도시되어 있는 것과 같은 냉각팬(12)과 결합된 히트싱크(11)가 현재 많이 사용되고 있다. 최근 컴퓨터의 발전과 함께 컴퓨터 내부에는 고 발열 전자부품의 수가 상당히 증가하여 여러 곳에 발열원이 산재하고 있으며, 발열 전자소자 각각에 상기 형태의 히트싱크(53, 54)를 장착하여 방열이 이루어지고 있다.For heat dissipation of heat generating electronic devices inside electronic devices such as computers, heat sinks 11 combined with cooling fans 12 as shown in FIG. 1 are currently used. Recently, with the development of computers, the number of high heat generating electronic components increases considerably inside the computer, and heat sources are scattered in various places, and heat sinks 53 and 54 of the above types are mounted on each of the heat generating electronic elements.

전자기기 내 장착공간이 협소한 곳에 위치한 고 발열 전자소자 또는 발열부품의 경우에는 종래 히트싱크의 장착이 여의치 않아 방열성능이 현저히 낮아지고 궁극적으로 전자기기의 신뢰성과 내구성을 감소시키는 직접적인 원인이 되고 있다.In the case of high heat electronic elements or heat generating parts located in a narrow space for mounting an electronic device, heat dissipation performance is remarkably lowered, which is a direct cause of reducing the reliability and durability of the electronic device. .

상기한 바와 같이 협소한 전자기기 내부의 여러 위치에 산재한 고 발열 전자소자 또는 고 발열체의 효과적인 방열을 위하여, 도 2에 도시한 바와 같은 DC전원에 의해 냉각 가능한 열전소자, 히트파이프, 냉각판, 히트싱크, 냉각팬을 결합한 분산 열원용 히트싱크(20)를 발명하게 되었다. 도 3에 본 발명의 히트싱크(20)를 분해하여 도시하였다. 도 3에 있어서, 본 발명의 히트싱크(20)는 분산 열원 각각에 부피가 크고 무거운 히트싱크(11)를 장착하지 않고, 단순히 히트파이프(41)가 연결된 냉각판(31)과 고정판(42)를 장착하여 분산열원의 열을 흡수하고 주 냉각판(32)으로 이송하여 열전소자(21)와 히트싱크(11), 냉각팬(12)를 통해 외기로 방열하게 된다. 따라서 협소한 곳에 장착된 분산 열원의 열을 한 곳으로 모아 처리함으로써 공간을 효율적으로 사용할 수 있고 냉각장치의 장착효율이 증가하게 된다.Thermoelectric elements, heat pipes, cooling plates, heats that can be cooled by a DC power source as shown in FIG. 2 for effective heat dissipation of the high heating electronic device or the high heating element scattered in various locations inside the narrow electronic device as described above. A heat sink 20 for distributed heat sources combining a sink and a cooling fan has been invented. 3 shows an exploded view of the heat sink 20 of the present invention. In FIG. 3, the heat sink 20 of the present invention does not mount the bulky and heavy heat sink 11 to each of the heat dissipation heat sources, and simply the cooling plate 31 and the fixed plate 42 to which the heat pipe 41 is connected. Mounted to absorb the heat of the distributed heat source and transferred to the main cooling plate 32 to radiate heat to the outside through the thermoelectric element 21, the heat sink 11, the cooling fan 12. Therefore, by collecting and treating the heat of the distributed heat source mounted in a narrow place in one place, the space can be used efficiently and the mounting efficiency of the cooling device is increased.

전자기기 내부의 협소한 공간에 산재하여 있는 분산열원에 본 발명의 분산 열원용 히트싱크를 장착함으로써, 전자기기 내부 분산열원의 열을 한 곳으로 모아 처리할 수 있게 되므로 공간을 효율적으로 사용할 수 있게 되고 냉각장치의 성능 개선 및 장착효율 증가를 달성할 수 있다.By distributing the heat sink for the distributed heat source of the present invention to a distributed heat source scattered in a narrow space inside the electronic device, the heat of the distributed heat source in the electronic device can be collected and treated in one place, so that the space can be used efficiently. In addition, it is possible to achieve improved performance of the cooling system and increased mounting efficiency.

도 3에 분해 도시되어 있는 본 발명의 분산 열원용 히트싱크(20)는 냉각팬(12), 히트싱크(11), 열전소자(21), 주고정판(43), 주 냉각판(32), 여러 개의 히트파이프(41)와 분산열원 장착을 위한 냉각판(31), 히트파이프 고정판(42)으로 구성된다. 분산열원의 수가 증가하면 그 수에 따라 히트파이프(41), 냉각판(31), 히트파이프 고정판(42)을 추가하여 분산열원의 방열을 수행할 수 있다. 먼저 분산 발열체에 발생한 열은 냉각판(31)으로 흡수되고, 흡수된 열은 히트파이프(41)를 통해 주 냉각판(32)으로 모이고 여기에 모인 열은 DC 전원에 의해 구동하는 열전소자(21)의 냉각면에 의해 냉각된다. 열전소자(21)의 고온면은 히트싱크(11)로 이동하여 냉각팬(12)를 통해 외기로 방열된다.The dissipation heat source heat sink 20 of the present invention shown in FIG. 3 includes a cooling fan 12, a heat sink 11, a thermoelectric element 21, a high fixing plate 43, a main cooling plate 32, It consists of several heat pipes 41, a cooling plate 31 for mounting a distributed heat source, and a heat pipe fixing plate 42. When the number of dissipation heat sources increases, heat dissipation of the dissipation heat source may be performed by adding the heat pipe 41, the cooling plate 31, and the heat pipe fixing plate 42 according to the number. First, heat generated in the distributed heating element is absorbed by the cooling plate 31, and the absorbed heat is collected into the main cooling plate 32 through the heat pipe 41, and the heat collected therein is a thermoelectric element 21 driven by a DC power source. It is cooled by the cooling surface of). The high temperature surface of the thermoelectric element 21 moves to the heat sink 11 and radiates heat to the outside air through the cooling fan 12.

도 3에서 히트파이프의 개수와 직경은 분산 발열체 각각의 발열량에 따라 결정된다. 또는 주 냉각판과 결합되는 히트싱크(11)는 분산 발열체의 총 발열량과 열전소자의 발열량을 방열하는데 충분하도록 설계한다. 본 발명에서 사용되는 히트파이프(41)의 재질은 연성이 있는 구리이므로 분산 발열체로의 장착은 매우 용이하다. 발열체로의 장착은 접착력이 있는 서말패드를 사용하거나 서말그리스를 접촉면에 넣고 기구물을 사용하여 고정할 수 있다.In FIG. 3, the number and diameter of the heat pipes are determined according to the amount of heat generated by each of the distributed heating elements. Alternatively, the heat sink 11 coupled with the main cooling plate is designed to be sufficient to dissipate the total amount of heat generated by the distributed heating element and the amount of heat generated by the thermoelectric element. Since the material of the heat pipe 41 used in the present invention is ductile copper, the heat pipe 41 is very easy to mount to the distributed heating element. Mounting to the heating element can be fixed by using an adhesive thermal pad or by inserting thermal grease into the contact surface.

고정판(42), 냉각판(31), 주 냉각판(32) 및 주 고정판(43)에는 분산 열원으로부터의 히트파이프(41)를 다수 장착할 수 있도록 복수의 그루브(61)가 가공되어 있다. 고정판(42), 냉각판(31), 주 고정판(42) 및 주 냉각판(31)에 가공되어 있는 그루브(61)는 분산 열원의 발열량에 따라 직경과 개수가 다른 히트파이프의 장착이 가능하도록 히트파이프의 갯수 및 직경에 따라 복수로 존재하며 다른 직경을 갖는다.A plurality of grooves 61 are processed in the stationary plate 42, the cooling plate 31, the main cooling plate 32, and the main stationary plate 43 so that a large number of heat pipes 41 from the distributed heat source can be mounted. The grooves 61 processed on the fixed plate 42, the cooling plate 31, the main fixing plate 42, and the main cooling plate 31 may be equipped with heat pipes of different diameters and numbers depending on the amount of heat generated by the distributed heat source. It exists in plurality depending on the number and diameter of heat pipes, and has a different diameter.

도 1은 기존 컴퓨터의 전자 부품을 냉각시키는 히트싱크를 도시한 것이다.1 illustrates a heat sink for cooling electronic components of a conventional computer.

도 2는 본 발명에 따른 분산 열원용 히트싱크이다.2 is a heat sink for a distributed heat source according to the present invention.

도3은 본 발명에 따른 분산 열원용 히트싱크의 분해도이다.3 is an exploded view of a heat sink for a distributed heat source according to the present invention.

* 도면의 주요 부분에 대한 부호설명 ** Explanation of Signs of Major Parts of Drawings *

11: 히트싱크 12: 냉각팬 20: 분산 열원용 히트싱크11: heat sink 12: cooling fan 20: heat sink for distributed heat source

21: 열전소자 31: 냉각판 32: 주 냉각판21: thermoelectric element 31: cooling plate 32: main cooling plate

41: 히트파이프 42: 고정판 43: 주 고정판41: heat pipe 42: fixed plate 43: main fixed plate

51: 컴퓨터 메인보드 52: 그래픽카드 53: 메인보드 냉각장치51: computer motherboard 52: graphics card 53: motherboard cooling device

54: 그래픽카드 냉각장치 56: CPU 냉각장치54: Graphics Card Cooler 56: CPU Cooler

Claims (3)

냉각팬, 히트싱크, 열전소자, 주 고정판, 주 냉각판, 여러 개의 히트파이프와 전자 기기 내부의 여러 위치에 산재하여 있는 분산열원으로의 장착을 위한 냉각판 및 고정판으로 구성된 분산 열원용 히트싱크.A heat sink for a distributed heat source consisting of a cooling fan, a heat sink, a thermoelectric element, a main fixed plate, a main cooling plate, a plurality of heat pipes, and a cooling plate and a fixed plate for mounting to distributed heat sources scattered in various places inside an electronic device. 제 1 항에 있어서, 주 냉각판과 주 고정판은 분산 열원으로부터의 히트파이프를 다수 장착할 수 있도록 복수의 그루브가 가공되어 있는 것을 특징으로 하는 히트싱크.The heat sink according to claim 1, wherein the main cooling plate and the main fixing plate are provided with a plurality of grooves so as to mount a plurality of heat pipes from a distributed heat source. 제 1 항에 있어서, 분산 열원의 발열량에 따라 직경과 개수가 다른 히트파이프의 장착이 가능하도록 고정판, 냉각판, 주 고정판, 주 냉각판에 복수의 다른 직경을 가진 그루브가 가공된 것을 특징으로 하는 히트싱크.The grooves of claim 1, wherein grooves having a plurality of different diameters are processed in the fixed plate, the cooling plate, the main fixing plate, and the main cooling plate so that heat pipes having different diameters and numbers can be mounted according to the amount of heat generated by the distributed heat source. Heatsink.
KR1020080023101A 2008-03-13 2008-03-13 Heat sink for multiple heat sources KR20090097989A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8841015B2 (en) 2010-05-24 2014-09-23 Samsung Sdi Co., Ltd. Battery pack
CN110062565A (en) * 2019-04-25 2019-07-26 中国船舶重工集团公司第七一六研究所 Soaking plate based on thermoelectric cooling technology reinforces server efficient radiating apparatus and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8841015B2 (en) 2010-05-24 2014-09-23 Samsung Sdi Co., Ltd. Battery pack
CN110062565A (en) * 2019-04-25 2019-07-26 中国船舶重工集团公司第七一六研究所 Soaking plate based on thermoelectric cooling technology reinforces server efficient radiating apparatus and method

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