KR20090024413A - Cooling system for a computer by using a thermoelectric module - Google Patents

Abstract

A computer cooling device using a thermoelectric module is provided to solve the partial generation of heat from computer parts by using the thermoelectric module, thereby reducing the whole temperature inside a computer. A low temperature part(10) has a heat sink(12) for cooling and a cooling fan(14). The heat sink is mounted inside a computer case. The cooling fan provides circular air. A high temperature part(30) has a heat sink(32) for radiating heat and a heat-radiating fan(34). The heat sink is mounted outside the computer case. The heat-radiating fan provides circular air. A thermoelectric module(20) is mounted between the heat sinks to absorb the heat from the cooling heat sink and discharge the heat to the heat sink for heat-radiating. A duct part(40) transfers cooling air to a CPU, GPU and power supply device from the cooling heat sink and supplies the cooling air into the computer.

Description

Cooling System For A Computer By Using A Thermoelectric Module

The present invention relates to a computer cooling system, and more particularly, it is possible not only to solve partial heat generation of computer components by using a thermoelectric module, but also to lower the overall temperature inside the computer to effectively reduce the heat generated inside the system. The present invention relates to an improved cooling system for computers that can be discharged to the outside to improve the performance of the computer.

Generally, a computer used for home or industrial use consists of a combination of numerous semiconductors and other peripherals, and a cooling system using an atmospheric circulation such as a fan for dissipating heat generated by the operation of these components to the outside is used. Is being applied.

In particular, components that generate relatively high heat such as CPUs, graphics cards, and power supplies have a cooling device that is a combination of a heat sink and a fan, and other parts may be equipped with a cooling device such as a heat sink.

Meanwhile, the conventional computer cooling apparatus 200 that cools heat generated from the main board, the hard disk, and the power supply during the operation of the computer is, for example, a CPU (Central Processing Unit) 220 as shown in FIG. The heat sink 240 is mounted on one side of the motherboard 230 to which the fan is mounted, and a fan assembly 250 that generates a flow of air following the heat sink 240 is mounted.

As shown in FIG. 2, the heat sink 240 is formed to have a predetermined thickness and a predetermined area to be in contact with the CPU 220 of the main board 230 and the contact surface part 241. The heat dissipation fin part 242 is formed to extend to have a predetermined thickness and area perpendicular to one surface of the fan), the fan assembly 250 is a fan 252 and the fan motor 253 in the fan housing 251 ) Is mounted, and is coupled by a plurality of bolts 260 following the heat dissipation fin part 242 of the heat sink 240.

In the conventional computer cooling apparatus 200 as described above, when power is first applied to the computer to operate the computer, high temperature heat is generated in the CPU 220 of the main board 230 and is generated in the CPU 220. The heat to be transferred is through the heat sink 240. At the same time, the fan assembly 250 mounted to the heat sink 240 operates to generate a flow of air, and one side of the main body case 210 by the flow of air generated by the fan assembly 250. As the outside air flows through the through-holes (not shown) formed in the heat sink, the heat transmitted to the heat sink 240 is radiated to cool the CPU 220 of the main board 230.

However, the conventional computer cooling apparatus 200 as described above generates a flow of air to cool the CPU 220 of the main board 230, so the amount of heat that cools the CPU 220 is very small. There is a disadvantage of not cooling enough.

In particular, due to the development of the Information Society, the data processing speed of the computer is rapidly increasing and the data processing capacity is enormously increased. In addition, the CPU is not only highly integrated but also high performance of other components is generated during the operation of the computer. The amount of heat to be increased is greatly increased.

As a result, when the CPU 220 that is highly integrated with the conventional cooling device 200 of the computer is cooled, a large amount of heat generated by the CPU 220 may not be sufficiently cooled, causing a malfunction due to overheating of the CPU 220. Or even cause a failure.

Such a conventional computer cooling device is applied to not only a CPU but also to a graphics card and a power supply, respectively, and the conventional computer cooling device 200 focuses only on cooling of individual components. There is a lack of research to improve the efficiency of the system through the entire body cooling.

The present invention is to solve the conventional problems as described above, the purpose of which can not only solve the partial heat generation of the computer parts, but also to improve the performance of the computer by lowering the overall temperature inside the computer It is to provide a computer cooling device using the thermoelectric module.

And another object of the present invention is to provide a computer cooling apparatus using an improved thermoelectric module to improve the performance of the computer by cooling the inside of the computer effectively by showing a high performance cooling performance even in a small device structure.

In order to achieve the above object, the present invention, in the device for cooling the heat generated during operation of the computer,

A low temperature unit having a cooling heat sink mounted inside the computer case and a fan providing circulation air;

A high temperature unit having a heat dissipation heat sink mounted to the outside of the computer case and a fan providing circulation air; And

A thermoelectric module mounted between the cooling heat sink and the heat dissipation heat sink, and absorbing heat from the cooling heat sink, and dissipating heat to the heat dissipation heat sink. It provides a computer cooling device using a thermoelectric module, characterized in that configured to lower the temperature.

The present invention preferably further includes a duct unit configured to transfer cooling air from the heat sink for cooling the low temperature unit to a CPU, a GPU, a power supply, and the like, and to supply cooling air to the inside of the computer. It provides a computer cooling device using.

In another aspect, the present invention preferably provides a computer cooling device using a thermoelectric module, characterized in that the duct unit is supplied to each of the CPU, GPU and power supply from the cooling heat sink for the low temperature portion to supply cooling air.

And the present invention preferably provides a computer cooling apparatus using a thermoelectric module, characterized in that the heat sink for cooling the low temperature portion is formed smaller in size than the heat sink for heat dissipation of the high temperature portion.

In another aspect, the present invention provides a computer cooling device using a thermoelectric module, characterized in that the cooling heat sink and the heat dissipation heat sink are each formed in the air flow path in the vertical direction.

And the present invention preferably provides a computer cooling apparatus using a thermoelectric module, characterized in that for collecting the condensed water by mounting the drain receiving on the lower portion and the high temperature portion.

In another preferred embodiment of the present invention, the low temperature unit is a thermoelectric module, characterized in that the fan is mounted on the upper side of the cooling heat sink in the inside of the computer case to circulate the air in the body from the top to the bottom of the cooling heat sink. It provides a computer cooling device using.

And preferably the high temperature portion is a thermoelectric module characterized in that the fan is mounted on the upper side of the heat dissipation heat sink from the outside of the computer case to circulate air from the top to the bottom of the heat dissipation heat sink from the computer It provides a computer cooling device using.

In another aspect, the present invention preferably comprises a thermoelectric module characterized in that the fan is mounted at the center of the heat sink for heat dissipation outside the computer case to circulate air outside the computer from the center of the heat sink for heat dissipation up and down. Provides a computer cooling device used.

The computer cooling device using the thermoelectric module according to the present invention circulates the air inside the computer case to transfer the cooling air from the cooling heat sink of the low temperature portion to the CPU, GPU, and power supply to cool, thereby partially heating the computer components. In addition to solving the problem, the overall temperature inside the computer can be lowered, thereby greatly improving the performance of the computer.

In addition, according to the present invention, since the thermoelectric module having excellent cooling capability is used, the performance of the computer can be further improved by effectively cooling the inside of the computer by exhibiting high performance cooling performance even with a compact device structure.

1 is a partially cutaway perspective view of a computer cooling device according to the prior art;

2 is a cross-sectional view of a computer cooling apparatus according to the prior art;

3 is a perspective view of a computer case equipped with a computer cooling device according to the present invention;

4 is an exploded perspective view showing a computer cooling device according to the present invention;

5 is a perspective view showing a heat sink for cooling, a thermoelectric module and a heat dissipation provided in the computer cooling apparatus according to the present invention;

6 is a detailed view of a computer cooling device according to the present invention;

a) a structure in which the fan of the high temperature portion is arranged on the upper portion of the heat sink for heat dissipation,

b) is a structure in which the fan of the high temperature portion is arranged in the center of the heat sink for heat dissipation,

7 is a cross-sectional view of a computer cooling apparatus according to the present invention,

a) The fan is mounted on the top of the heat sink for heat dissipation, and the duct section supplies low-temperature air near the CPU fan and the VGA card fan.

b) The fan is mounted on the top of the heat sink for heat dissipation, the duct is connected to the CPU fan side, and the low temperature air is supplied near the VGA Card fan.

c) is a structure in which a fan is attached to the center front of the heat sink for heat dissipation and low-temperature air is supplied near the CPU fan and the VGA card fan.

<Description of Symbols for Major Parts of Drawings>

1 ..... Computer cooling apparatus using thermoelectric module of the present invention

5 ..... Computer 5a .... Computer Case

10 ... low temperature 12 .... cooling heatsink

12a, 32a .... Air Euro 14 .... Fan

20 .... Thermoelectric module 30 .... High temperature part

32 .... Heat Sink 34,34 '... Fan

40 .... Duct 42 .... CPU Fan

44 .... VGA Card Fan 50 .... Drain

72 .... Cover 200 .... Conventional Computer Cooler

220 .... Central Processing Unit (CPU) 230 .... Motherboard

240 .... heatsink 250 .... fan assembly

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 3 and 4, the computer cooling apparatus 1 using the thermoelectric module of the present invention is an apparatus for efficiently cooling the computer internal body as well as heat generated from a CPU, a GPU, a power supply, and the like. . The present invention is mounted separately from the individual cooling devices provided in the existing CPU, GPU, and power supply unit to further increase the overall cooling effect of the computer 5.

The computer cooling apparatus 1 using the thermoelectric module according to the present invention attaches the cooling heat sink 12 and the fan 14 of the low temperature unit 10 to the inside of the computer case 5a and thermoelectrics to the outside of the computer case 5a. The module 20, the heat dissipation heat sink 32 of the high temperature part 30, and the fan 34 are attached, and the drain pan 50 is attached to the lower part of the low temperature part 10 and the high temperature part 30. FIG.

That is, the computer cooling device 1 using the thermoelectric module according to the present invention includes a low temperature unit 10 mounted inside the computer case 5a, and the low temperature unit 10 includes a cooling heat sink 12 and circulation air. Has a fan 14 to provide.

The low temperature unit 10 is a fan 14 is mounted on the upper side of the cooling heat sink 12 in the computer case 5a, the cooling heat sink 12 is an air flow path 12a in the vertical direction ) Is formed so that the fan 14 circulates air in the computer case 5a from the top to the bottom of the cooling heat sink 12.

In this configuration, since the drain receiver 50 to be described later is mounted on the lower portion of the cooling heat sink 12 to receive and treat the water generated by condensation, the arrangement of the component parts is easy.

The present invention has a high temperature portion 30 having a heat dissipation heat sink 32 mounted to the outside of the computer case 5a and a fan 34 for providing circulating air. As shown in FIG. 6A, the high temperature part 30 has a fan 34 mounted on an upper side of the heat dissipation heat sink 32 outside the computer case 5a, and the air flow path 32a in the vertical direction. ) May be formed to circulate the low temperature air from the top to the bottom of the heat dissipation heat sink 32.

In this arrangement, since the drain receiver 50 is mounted below the heat dissipation heat sink 32, the arrangement of the parts is easy and the parts are easily assembled and installed.

In addition, in the present invention, unlike the above, the high temperature part 30 is mounted at the center of the heat dissipation heat sink 32 outside the computer case 5a, as shown in FIG. 6B of the fan 34 '. The air flow path 32a 'is formed in the vertical direction to circulate the low temperature air from the center of the heat dissipation heat sink 32 to the upper and lower parts. This arrangement makes it possible to increase the cooling capacity while simplifying the configuration of the device by using one large-capacity fan 34 '.

Meanwhile, the present invention has a structure in which the cooling heat sink 12 of the low temperature part 10 is smaller in size than the heat sink 32 for heat radiation of the high temperature part 30. Such a structure allows the cooling heat sink 12 to occupy a small volume in the inside of the computer case 5a so that the duct part 40 can be arranged in various ways, and the degree of freedom in arranging the internal computer components can be increased. .

In addition, the present invention is mounted between the cooling heat sink 12 and the heat dissipation heat sink 32, and absorbs heat from the cooling heat sink 12, and discharges heat to the heat dissipation heat sink 32. And 20.

The power of the thermoelectric module (TEM) 20 is to use the power power used in the computer 5, and when the power is supplied to the thermoelectric module 20, cooling air is supplied from the low temperature part 10 side. Can provide.

In the thermoelectric module 20, when a DC current is applied to the P and N types, the negatively charged metal / semiconductor contact moves electrons absorbing thermal energy from the surroundings to the inside of the thermoelectric semiconductor, resulting in an endotherm. At the contacts charged with), heat is generated by the release of heat energy of electrons.

By using this thermoelectric cooling principle, the endothermic portion is brought into surface contact with the cooling heat sink 12 of the low temperature portion 10, and the heat generation portion is made with the heat dissipation heat sink 32 of the high temperature portion 30. Contact.

Therefore, when power is supplied to the thermoelectric module 20 as described above, heat transfer from the low temperature unit 10 to the high temperature unit 30 is performed.

In addition, the present invention includes a duct portion 40 to transfer the cooling air from the cooling heat sink 12 of the low temperature portion 10 to the CPU, GPU, and the power supply.

The duct unit 40 may be configured to supply cooling air by being branched for each CPU, GPU, and power supply, for example, as illustrated in FIGS. 7A, 7B, and 7C. have.

That is, as shown in Figure 7a, it is possible to provide the low-temperature air from the cooling heat sink 12 of the low temperature portion 10 into the computer case 5a, which is a heat sink for heat radiation in the high temperature portion 30 The fan 34 is mounted on the upper part of the upper part 32. In the low temperature part 10, the duct part 40 supplies the low temperature air near the CPU fan 42 and the VGA card fan 44. (5a) It may have a structure which supplies low temperature air also inside.

As shown in FIG. 7B), the high temperature unit 30 mounts the fan 34 on the heat dissipation heat sink 32, and the low temperature unit 10 moves the duct unit 40 toward the CPU fan 42. The low temperature air may be supplied to the vicinity of the VGA card fan 44, and the low temperature air may be supplied to the inside of the computer case 5a to cool the same.

In addition, as shown in FIG. 7C, the high temperature unit 30 attaches a fan 34 ′ to the center front surface of the heat dissipation heat sink 32 to suck in air, and the low temperature unit 10 includes the CPU fan 42. The low temperature air is supplied to the vicinity of the VGA card fan 44, and in this process, the low temperature air may be supplied to the inside of the computer case 5a.

As described above, the present invention individually transfers the low temperature air from the heat sink 12 for cooling the low temperature unit 10 to the CPU, GPU, power supply, and the like, and simultaneously supplies the low temperature air to the inside of the computer case 5a. To cool the entire interior of the computer 5. Therefore, the present invention can not only eliminate partial heat generation of computer components, but also cool the entire computer 5, thereby improving computer performance.

In addition, the present invention is the heat transfer from the low temperature portion 10 to the high temperature portion 30 in this process, condensation occurs in the cooling heat sink 12, the thermoelectric module 20 and the heat dissipation heat sink 32, etc. Moisture in the air is condensed, and the condensate generated in this manner falls downward along the air passages 12a and 32a disposed in the vertical direction, and is located on the lower side of the low temperature portion 10 and the high temperature portion 30. The condensed water is collected through the drain receiver 50.

Reference numeral 72 is a cover that covers the heat sink 32 for heat dissipation.

The computer cooling apparatus 1 using the thermoelectric module according to the present invention configured as described above has the upper fan 14 and the high temperature unit 30 of the cooling heat sink 12 of the low temperature unit 10 simultaneously with the operation of the computer 5. Power is supplied from a computer power supply (not shown) to the fan 34 and thermoelectric module 20 of the heat sink 32 for heat dissipation.

When the power is supplied in this way, the thermoelectric module 20 is supplied with a DC power source, the thermoelectric module 20 is an endothermic action occurs on the one side through the movement of the electrons absorbed thermal energy therein, the opposite side of the electron Exothermic action occurs due to the release of thermal energy. Therefore, since the heat absorbing side of the thermoelectric module 20 is in contact with the cooling heat sink 12 of the low temperature unit 10 mounted inside the computer case 5a, the cooling heat sink 12 of the low temperature unit 10 is The temperature is lowered and the temperature is increased because the heat generating side is in surface contact with the heat sink 32 for heat dissipation of the high temperature portion 30.

As such, the fan 14 of the low temperature unit 10 operates to circulate air in the computer case 5a through the cooling heat sink 12 of the low temperature unit 10 having a low temperature, thereby cooling the low temperature unit 10. The air passing through the heat sink 12 is lowered to a low temperature, which provides the low temperature air through the duct 40 to the individual cooling devices 1 provided in the CPU, GPU, and power supply.

On the other hand, on the heat dissipation heat sink 32 side of the high temperature unit 30, thermal energy is provided through the thermoelectric module 20 to increase the temperature, but the fan 34 provided in the high temperature unit 30 supplies air outside the computer 5. The heat dissipation heat sink 32 of the high temperature part 30 is cooled by circulating.

Through this process, the continuous heat transfer from the cooling heat sink 12 of the low temperature part 10 to the heat dissipation heat sink 32 of the high temperature part 30 is performed, and the inside of the computer case 5a is cooled as a whole. .

In the above-described series of operations, the duct portion 40 is a separate cooling device, for example, CPU provided in various CPU, GPU and power supply, as shown in Figure 7a), b), c) The fan 42, the GPU fan 44, and the power supply fans (not shown) provide low temperature air, while simultaneously providing low temperature air to the entire interior of the computer case 5a to cool it. The condensate generated in the cooling process collects water through the drain receiver 50 provided on the lower side of the low temperature unit 10 and the high temperature unit 30.

As described above, according to the present invention, the air is circulated inside the computer case 5a to individually transfer cooling air from the cooling heat sink 12 of the low temperature part 10 to the CPU, GPU, and power supply, and at the same time, the computer case. (5a) Since the low temperature air is also supplied and cooled inside, the partial heat generation of the computer parts and the overall temperature inside the computer can be lowered, thereby greatly improving the performance of the computer.

In the present invention, since the thermoelectric module 20 having excellent cooling capability is used between the heat sink 12 for cooling of the low temperature unit 10 and the heat sink 32 for heat dissipation of the high temperature unit 30, a compact device structure is used. In addition, the high-performance cooling performance can be effectively cooled inside the computer, thereby further improving the performance of the computer.

Although the present invention has been described in detail with reference to the accompanying drawings, the present invention is not limited to such a specific structure. Those skilled in the art will be able to variously modify or change the embodiments of the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. Nevertheless, it will be apparent that all such modifications or design modifications to such simple embodiments will clearly fall within the scope of the present invention.

Claims (9)

A device for cooling heat generated during operation of a computer, A low temperature unit having a cooling heat sink mounted inside the computer case and a fan providing circulation air; A high temperature unit having a heat dissipation heat sink mounted to the outside of the computer case and a fan providing circulation air; And A thermoelectric module mounted between the cooling heat sink and the heat dissipation heat sink, and absorbing heat from the cooling heat sink, and dissipating heat to the heat dissipation heat sink. Computer cooling apparatus using a thermoelectric module, characterized in that configured to lower the temperature. The thermoelectric module of claim 1, further comprising a duct unit configured to transfer cooling air from the cooling heat sink for cooling to the CPU, GPU, power supply, and the like, and to supply cooling air to the inside of the computer. Used computer chiller. The computer cooling apparatus of claim 2, wherein the duct unit is branched by the CPU, GPU, and power supply unit from the cooling heat sink of the low temperature unit to supply cooling air. The computer cooling apparatus of claim 1, wherein the cooling heat sink of the low temperature portion is smaller in size than the heat sink for heat dissipation of the high temperature portion. The computer cooling apparatus of claim 4, wherein the cooling heat sink and the heat dissipation heat sink are each formed with an air flow path in an up and down direction. The computer cooling apparatus of claim 1, wherein the low temperature part and the high temperature part are provided with a drain receiver at a lower side thereof to collect condensed water. 7. The thermoelectric module according to claim 6, wherein the low temperature unit includes a fan mounted at an upper side of the cooling heat sink in the computer case to circulate air in the main body from the top to the bottom of the cooling heat sink. Used computer chiller. The thermoelectric module according to claim 6, wherein the high temperature part includes a fan mounted at an upper side of the heat dissipation heat sink outside the computer case to circulate air outside the computer from the top to the bottom of the heat dissipation heat sink. Used computer chiller. The thermoelectric module according to claim 6, wherein the high temperature part is a fan mounted at the center of the heat sink for heat dissipation outside the computer case to circulate air outside the computer from the center of the heat sink for heat dissipation up and down. Computer chiller.