KR101317750B1 - Air cooler apparatus using thermoelement - Google Patents

Abstract

PURPOSE: An air cooler for a rack is provided to improve the circulation of air in a case by adding linearity to the air discharged to the case. CONSTITUTION: The front side and the rear side of a rack (10) are opened. A power supply module (20) is laminated on the rack and includes a case. A through hole is formed on the rear side (42) of the case. A thermoelectric module (30) passes through the rear side of the case.

Description

AIR COOLER APPARATUS USING THERMOELEMENT}

The present invention relates to an air cooler for a rack apparatus, and more particularly, to an air cooler for a rack apparatus capable of effectively cooling a power supply installed in a rack apparatus to which a high voltage of 10 kV or more is applied.

Generally, a power supply is a means for supplying power to various electric devices, such as an uninterruptible power supply (UPS), a switching mode power supply (SMPS), and the like. In particular, the SMPS is widely used for wired / wireless communication, computers, medical instruments, and other industrial fields because it is more efficient than a general linear type power supply, is strong in durability, and is advantageous in size and weight.

Meanwhile, the power supply structure of the power supply includes a passive heatsink structure having only a heat dissipation fin or a heat dissipation plate, and an active heat sink structure having a heat dissipation fan in addition to a heat dissipation fin or a heat dissipation plate.

The active heat sink structure has a heat dissipation effect superior to that of a passive heat sink. However, the active heat sink structure has a limitation in downsizing due to a space occupied by the heat dissipation fan, and a passive heat sink structure is mainly applied to a small power supply such as the SMPS.

Here, Korean Utility Model No. 20-0261263 discloses a structure for cooling the interior of a computer using a thermoelectric element. In the case where cooling is performed using a conventional thermoelectric element, heat generated from the heat surface, not the cooling surface, There is a problem that can not be done.

On the other hand, a power supply used in a semiconductor, LCD, or LED manufacturing apparatus is inserted in a slidable manner in a rack device having a narrow cooling space, and it is difficult to effectively cool the device due to a narrow space.

Particularly, in a device for manufacturing semiconductor, LCD or LED, high voltage of 10 kV or more is used due to the characteristics of the process. In a power supply installed in a rack apparatus to which a high voltage is applied, short circuit is generated by only a small amount of moisture or condensed water. There is a difficulty in performing cooling.

Korean Registered Utility Model 20-0261263

An object of the present invention is to provide an air cooler for a rack device capable of effectively cooling a power supply installed in a rack device to which a high voltage of 10 kV or more is applied.

One side of the present invention is an air cooler of the rack device 10 is applied to a high voltage of 10kV or more, only the front (11) and rear (12) is open, inserted into the rack device (10) and stacked, the rear ( A power supply module 20 including a case 40 in which the through hole 45 is formed only; And a thermoelectric module 30 installed to penetrate the rear surface 42 of the case 40, and the thermoelectric module 30 is disposed to penetrate the rear surface 42 of the case 40. 40) a thermoelectric housing 32 in which a cooling space 31 is formed and a heat dissipation space 33 is formed outside the case 40; Installed inside the thermoelectric housing 32 to separate the inside of the thermoelectric housing 32 into the cooling space 31 and the heat dissipation space 33, and generates cold air in the cooling space 31 by the applied power. And the heat dissipation space 33, the thermoelectric element 35 for generating heat; A cooling heat pipe 36 installed on the cooling surface of the thermoelectric element 35; A heat dissipation heat pipe 37 installed on a heat generating surface of the thermoelectric element 35; A cooling fan 38 installed in the cooling heat pipe 36 to discharge air to the cooling space 31; It is provided in the heat dissipation heat pipe 37 provides an air cooler for a rack device including a heat dissipation fan 39 for discharging air to the heat dissipation space (33).

Cooling slits 31a communicating with the cooling space 31 are formed at left and right sides of the thermoelectric housing 32 disposed in the case 40, and the thermoelectric housing 32 disposed outside the case 40. The upper and lower sides of the heat dissipation slit 33a is formed in communication with the heat dissipation space 33, the cooling slit 31a and the heat dissipation slit 33a may be disposed perpendicular to each other.

The thermoelectric element 35 may be disposed to coincide with the rear surface 42 of the case 40.

The cooling heat pipe 36 may include a cooling fin 36a and a heat pipe 36b, and the cooling fin 36a may be disposed in a horizontal direction to be parallel to the cooling slit 31a.

The heat dissipation heat pipe 37 may include a cooling fin 37a and a heat pipe 37b, and the cooling fins 37a may be disposed in a vertical direction to be parallel to the heat dissipation slit 33a.

The air cooler for the rack device according to the present invention is optimized for the flow of air in the semiconductor manufacturing device, LCD manufacturing device, LED manufacturing device, solar manufacturing process to which high voltage is applied can cool the power supply module installed inside the rack device It works.

In addition, the air cooler for the rack device according to the present invention has the effect of improving the air circulation inside the case by adding the straightness to the air discharged into the case.

1 is a perspective view of a rack apparatus according to an embodiment of the present invention;
2 is a rear perspective view of FIG.
3 is a perspective view of the power supply module shown in FIG.
4 is a plan view showing the inside of FIG.
5 is a perspective view of the thermoelectric module shown in FIG.
6 is a plan view showing the inside of FIG.
7 is a plan view of a thermoelectric module according to an exemplary embodiment of the present invention.
8 is a plan sectional view showing a thermoelectric module according to a third embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. Even if the terms are the same, it is to be noted that when the portions to be displayed differ, the reference signs do not coincide.

The terms to be described below are terms set in consideration of functions in the present invention, and may be changed according to a user's intention or custom such as an experimenter and a measurer, and the definitions should be made based on the contents throughout the present specification.

The terms first, second, etc. in this specification may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted in an ideal or overly formal sense unless explicitly defined in the present application Do not.

Also, when a part is referred to as "including " an element, it does not exclude other elements unless specifically stated otherwise.

Hereinafter, the present invention will be described in detail with reference to the drawings.

1 is a perspective view of a rack apparatus according to an embodiment of the present invention, Figure 2 is a rear perspective view of Figure 1, Figure 3 is a perspective view of the RF generator shown in Figure 1, Figure 4 is an interior of Figure 3 is shown 5 is a perspective view of the air cooler of FIG. 3.

As shown, the rack device 10 according to the present embodiment is installed in a semiconductor, LED or LCD manufacturing process, and a plurality of devices are integrated and stacked therein to minimize the installation space.

The equipment installed in the rack apparatus 10 may be a RF generator for generating plasma, and a high voltage of 10 kV or more may be applied to the RF generator.

The rack device 10 is formed of the front / rear (11, 12) is opened, the upper / lower / left / right surface is sealed. Therefore, the rack device 10 has a structure in which air can be communicated to the front 11 or the rear 12 and air cannot be communicated to up / down / left / right surfaces.

In particular, a high voltage is applied to the rack apparatus 10, and a short leakage occurs due to a high voltage difference, so that the entire apparatus is damaged. Cooling is performed through other media (cooling water or refrigerant) except air. In addition, even when the temperature difference between the rack apparatus 10 and the ambient air is out of the dew point, condensed water may be generated in the rack apparatus 10, causing damage to the apparatus.

Here, a plurality of power supply modules 20 operated through a high voltage, such as an RF generator, are disposed in the rack device 10.

The power supply module 20 has a front (41) and a rear (42) is exposed through the front / rear (11, 12) of the rack device 10, the upper / lower / left / right side is the rack device (10) Or close to the adjacent power supply module is installed in a sealed state.

The power supply module 20 includes a case 40 inserted into and fixed to the rack device 10, and a thermoelectric module 30 installed to penetrate the case 40.

The power supply module 20 is only a name according to the present embodiment, and is a voltage supply device of a generally used device used in a semiconductor, LCD, LED manufacturing process, such as an RF generator.

The case 40 is inserted into the rack device 10 and stacked, and in this embodiment, the through hole 45 is formed only on the rear surface 42, and air is communicated to the front / up / down / left / right surfaces. No through hole is formed.

In particular, the front 41 is provided with a dial for receiving a user's operation signal and various gauges or displays indicating the state of the device, the through-hole is not formed, the through-hole 45 for communicating air only to the rear 42 This is formed, and the inside of the case 40 must be cooled by air circulation through one side.

The thermoelectric module 30 is disposed to penetrate the rear surface 42 of the case 40, a cooling space 31 is formed inside the case 40, and a heat dissipation space 33 outside the case 40. The formed thermoelectric housing 32 and the thermoelectric housing 32 are disposed in the thermoelectric housing 32 to separate the interior of the thermoelectric housing 32 into the cooling space 31 and the heat dissipation space 33. The thermoelectric element 35 which generates cold air in the cooling space 31 and generates heat in the heat dissipation space 33, the cooling heat pipe 36 installed on the cooling surface of the thermoelectric element 35, and the thermoelectric element. A heat dissipation heat pipe 37 provided on the heating surface of the element 35, a cooling fan 38 installed in the cooling heat pipe 36 to discharge air to the cooling space 31, and the heat dissipation heat pipe And a heat dissipation fan 39 installed at 37 to discharge air to the heat dissipation space 33.

The thermoelectric housing 32 is divided into the cooling space 31 and the heat dissipation space 33 by the thermoelectric element 35, and air communication between the cooling space 31 and the heat dissipation space 33 is blocked. do.

Here, the position of the thermoelectric element 35 is located at the boundary of the rear surface 42 of the case 40, the outside air of the case 40 is configured to be sucked into the heat dissipation space 33, the case 40 Inner air of the air) is configured to be sucked into the cooling space 31 and discharged.

That is, the thermoelectric element 35 partitions the inside of the thermoelectric housing 32 to prevent the air inside and outside the case 40 from being mixed with each other, and coincides with the rear surface 42 of the case 40. Is placed.

Here, the thermoelectric housing 32 has a cooling slit 31a communicating with the cooling space 31 at a side disposed inside the case 40, and the heat dissipation space at the side exposed to the outside of the case 40. A heat radiation slit 33a is formed in communication with 33).

The cooling slits 31 are formed on the left and right sides of the thermoelectric housing 32, respectively, and the heat dissipation slits 33a are formed on the upper and lower sides of the thermoelectric housing 32, respectively.

The thermoelectric element 35 is cooled on the surface located on the inner surface of the case 40, and heating is generated on the surface located on the outer side of the case 40.

The thermoelectric element 35 is a thermistor, which is a device that uses a large temperature change of electrical resistance, an element using the Seebeck effect, which is a phenomenon in which electromotive force is generated by a temperature difference, and heat absorption (or generation) by a current. Peltier element using the Peltier effect, which is a phenomenon that occurs). A thermistor is a type of semiconductor device in which the electrical resistance varies greatly with temperature. The NTC thermistor is a type of semiconductor device in which electrical resistance is reduced by an increase in temperature, a positive temperature coefficient thermistor (PTC) positive temperature coefficient thermistor). Thermistors are made by sintering oxides such as molybdenum, nickel, cobalt and iron in plural components and used for stabilizing circuits and detecting heat, power and light.

The Seebeck effect is a phenomenon in which both ends of two kinds of metals are connected to each other and the temperatures at the two ends are different from each other, resulting in an electromotive force. This is applied to temperature measurement using a thermocouple pair.

The Peltier effect is a phenomenon in which two kinds of metal ends are connected to each other and a current is supplied thereto, one terminal is absorbed by the current direction and the other terminal generates heat. If semiconductors such as bismuth and tellurium having different electric conduction methods are used instead of the two kinds of metals, a Peltier device having an efficient endothermic and heat generating effect can be obtained. It is possible to switch the endotherm and the heat generation in accordance with the current direction, and the endotherm and the heat generation amount are adjusted in accordance with the amount of the current, and thus it is applied to the manufacture of a precision refrigerator with a small capacity or a precision thermostat near normal temperature.

Hereinafter, the operating principle of the thermoelectric element is a general technique to those skilled in the art, so a detailed description thereof will be omitted.

The thermoelectric element 35 is disposed to coincide with the rear surface 42 of the case 40 so that the thermoelectric element 35 is supported by the case 40, thereby being generated due to the operation of the cooling fan 38 and the heat radiating fan 39. Let each vibration cancel each other out.

That is, by adjusting the load of the inside and the outside of the thermoelectric element 35, the vibrations generated by the rotation of the cooling fan 38 and the heat radiating fan 39 are not only canceled with each other, but also transmitted to the thermoelectric housing 32. The vibration is supported by the case 40 to be absorbed.

The cooling heat pipe 36 and the heat dissipation heat pipe 37 are formed in the same structure, and are also called heat transfer tubes, and are filled with volatile liquids inside the pipes with many small holes. When heat is applied to one end of the pipe, the liquid evaporates and moves to the other end while having thermal energy, and is condensed while returning to the initial position after radiating heat at the other end of the pipe. In the evaporation and condensation process And the heat is moved.

Copper, stainless steel, ceramics, tungsten, and the like are used as the material of the main body, and porous fibers and the like are used for the inner wall. Methanol, acetone, water, mercury, etc. are used as an internal volatile substance.

The cooling heat pipe 36 and the heat dissipation heat pipe 37 are formed by a plurality of cooling fins 36a and 37a and heat pipes 36b and 37b which pass through the cooling fins 36a and 37a. The cooling fins 36a and 37a are arranged to cross at right angles.

That is, the cooling fins 36a of the cooling heat pipes 36 are disposed in the horizontal direction, and the cooling fins 37a of the heat dissipation heat pipe 37 are disposed in the vertical direction.

Here, the air sucked into the thermoelectric housing 32 through the cooling slit 31a flows between the cooling fins 36a of the cooling heat pipes 36 arranged in parallel, and the cooling fins 36a in the flow process. The resistance with) is minimized to prevent the air flow rate from being reduced.

And the case 40 is a bar that is inserted into the rack 10 is installed in the structure, the left and right widths are wider than the upper and lower height bar, the air in the case 40 should be sucked in the left and right direction to smooth the circulation of air It is done.

In addition, the heat dissipation slit 33a is disposed to be orthogonal to the direction in which the cooling slit 31a is formed, and the cooling fins 37a disposed in the heat dissipation space 33 are also vertically parallel to the heat dissipation slit 33a. To minimize resistance to air.

The outside of the case 40, that is, the rack device 10 outside the air is circulated to circulate the air in the workspace, the air cooled from the upper flows to the lower side.

The heat dissipation slit 33a is installed in the up and down direction so that air in the work space flowing in the up and down direction is easily introduced to facilitate the circulation of the air and minimize the resistance, thereby facilitating heat exchange with the cooling fins 37a. To be done.

The cooling fan 38 and the heat dissipation fan 39 are operated by an applied power source to promote heat exchange of the cooling heat pipe 36 and the heat dissipation heat pipe 37.

Here, the cooling fan 38 discharges air to the inside of the case 40 (front side), and the heat radiating fan 39 discharges air to the outside of the case 40 (back side). Source the interference at the source.

As such, the air cooler for the rack device according to the present embodiment is optimized for the flow of air in a semiconductor manufacturing device, an LCD manufacturing device, an LED manufacturing device, and a solar manufacturing process to which a high voltage is applied to cool a power supply module installed in the rack device. It can be effected.

7 is a plan view of a thermoelectric module according to an exemplary embodiment of the present invention.

As illustrated, the thermoelectric module 30 according to the present exemplary embodiment is provided with an air guide 50 for adding linearity to the discharge side air of the cooling space 31 unlike the first exemplary embodiment.

The air guide 50 includes an air guide body 52 coupled to the inner discharge side of the thermoelectric housing 32 and a guide 54 protruding in a spiral shape to the inner surface of the air guide body 52. Is formed.

Here, the cross-sectional area of the discharge side 50b is smaller than the cross-sectional area of the suction side 50a of the air guide body 52 so as to increase the flow rate when discharging air, and rotates the sucked air through the guide 54 to discharge the air. Increases the straightness of air.

In the case 40, an electronic component such as a condenser, which generates heat in a narrow space, is disposed, and an interference with an electronic component installed in the flow of air is generated, thereby cooling the air to the case 40. It is not effectively reached to the front face 41 side.

In this case, the air guide 50 may add straightness to the cooled air to allow the cooled air to reach the front side of the case 40, and the air inside the case 40 may be caused by the air to which the straightness is added. It can be circulated more smoothly and flow into the cooling slit 31a.

The rest of the configuration is the same as that of the first embodiment, so a detailed description will be omitted.

8 is a plan sectional view showing a thermoelectric module according to an embodiment of the present invention.

As shown, unlike the first embodiment, the thermoelectric module 30 according to the present embodiment is installed to protrude outside the case 40, and only the cooling space 31 communicates with the inside of the case 40. The installed and cooled air is discharged into the case 40.

Here, both the cooling space 31 and the heat dissipation space 33 may suck air outside the case 40, thereby increasing the efficiency of the thermoelectric element 32.

In addition, since the direction in which the cooling slits 31a and the heat dissipation slits 33a are formed is perpendicular to each other, even when exposed to the outside of the case 40, the directions of inhaled air may be different from each other, thereby minimizing interference.

In particular, the thermoelectric module 30 according to the present exemplary embodiment has a better cooling effect by the thermoelectric element 35 because the air flowing into the cooling space 31 is air outside the case 40.

Because the air circulated in the case 40 is circulated in a heated state to a predetermined temperature, it is inevitably higher than the temperature outside the case 40. Therefore, after cooling the air circulated in the case 40 through the thermoelectric element 35 and then cooling it by introducing external air having a lower temperature than discharged into the case 40. It is more effective to discharge the cooled air into the case 40.

Meanwhile, although not shown in the present embodiment, the air guide of the second embodiment may be installed.

The rest of the configuration is the same as that of the first embodiment, so a detailed description will be omitted.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

10 rack device 11: front
12: rear 20: power supply module
30: thermoelectric module 31: cooling space
31: cooling slit 32: thermoelectric housing
33: heat dissipation space 33a: heat dissipation slit
35: thermoelectric element 36: cooling heat pipe
37: heat dissipation heat pipe 38: cooling fan
39: heat dissipation fan 40: case
41: front 42: rear

Claims (5)

In the air cooler of the rack apparatus 10 in which a high voltage of 10 kV or more is applied and only the front face 11 and the rear face 12 are opened,
A power supply module 20 inserted into the rack apparatus 10 and stacked, and including a case 40 having a through hole 45 formed only at a rear surface thereof;
It includes a thermoelectric module 30 is installed to penetrate the rear surface 42 of the case 40,
The thermoelectric module 30 is
The thermoelectric housing 32 is disposed to penetrate the rear surface 42 of the case 40, a cooling space 31 is formed inside the case 40, and a heat dissipation space 33 is formed outside the case 40. ;
Installed inside the thermoelectric housing 32 to separate the inside of the thermoelectric housing 32 into the cooling space 31 and the heat dissipation space 33, and generates cold air in the cooling space 31 by the applied power. And the heat dissipation space 33, the thermoelectric element 35 for generating heat;
A cooling heat pipe 36 installed on the cooling surface of the thermoelectric element 35;
A heat dissipation heat pipe 37 installed on a heat generating surface of the thermoelectric element 35;
A cooling fan 38 installed in the cooling heat pipe 36 to discharge air to the cooling space 31;
A heat dissipation fan 39 installed in the heat dissipation heat pipe 37 and discharging air to the heat dissipation space 33;
Cooling slits 31a communicating with the cooling space 31 are formed at left and right sides of the thermoelectric housing 32 disposed in the case 40, and the thermoelectric housing 32 disposed outside the case 40. The upper and lower sides of the heat dissipation slit 33a is formed in communication with the heat dissipation space 33, the cooling slit (31a) and the heat dissipation slit (33a) is an air cooler for a rack device disposed perpendicular to each other.
delete The method according to claim 1,
The thermoelectric element 35 is an air cooler for a rack device arranged to match the rear surface 42 of the case 40.
The method according to claim 1,
The cooling heat pipe 36 includes a cooling fin (36a) and the heat pipe (36b), the cooling fin (36a) is arranged in a horizontal direction for the rack device arranged in parallel with the cooling slit (31a) Air cooler.
The method according to claim 1,
The heat dissipation heat pipe 37 includes a cooling fin 37a and a heat pipe 37b, and the cooling fins 37a are disposed in a vertical direction and arranged in parallel with the heat dissipation slit 33a. Air cooler.

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