M323643 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱模組及應用該散熱模組之液冷 式散熱裝置，尤指一種作為記憶體晶片散熱用途之散熱裝 置° 【先前技術】 當電腦應用軟體愈先進，意味對硬體的需求即相對提 _ 高。以微軟新推出的作業系統Vista為例，微軟官方訂定 的硬體規格指記憶體須在512M以上，但根據玩家試用及 以往微軟推出Windows xp時宣稱記憶體在256M以上即 可正常運作，但實際上卻須51 2M以上方能運作順暢的經 驗’ Vista作業系統欲順暢的運作，一般咸認記憶體須在 1 G以上。 由上述可知，當應用軟體愈先進，記憶體的工作頻率 _ 必須相對愈快，但在如是狀況下，記憶體工作時產生的廢 '熱即相對愈高，甚至與cpu相同，必須採用獨立的散熱 措加。如我國專利公報公告新型專利權第M292738號「 記憶體晶片散熱結構」，即為—種專為記憶體而設的散熱 技術，如其第一圖揭露的具體實施例所示，主要係以兩散 熱板（2)相對地將記憶體晶片板（11)夾持其間，又兩散熱板 (2)係呈矩形片狀，其相對的外表面形成複數橫肋狀的凸出 部（21 )，以增加散熱面積。主要特徵則在於兩散熱板（2)於 對應的同糕上形成一半圓形截面的樞接部（22)，藉此在 M323643 兩樞接部（22)之間設有一導管（3)，該導管（3)係供冷卻用流 體通過。當記憶體晶片板（11)上的記憶體晶片（1)工作時: 其產生的大量熱能透過熱接觸傳導至散熱板（2)上，而散熱 板（2)上的熱能除部分藉由凸出部（21)擴大的散熱面積揮散 外，部分經其樞接部（22)傳導至導管（3)，由導管（3)内部通 • 過的冷卻流體挾帶排除，以達成加速散熱之目的。 ， 前述專利案雖提供一加強效率之散熱裝置，惟在散熱 效率的增進上仍屬有限：如前揭所述，該專利案係利用導 • 管（3)内流動冷卻流體以挾帶排出散熱板（2)上累積的熱能 ，然而兩散熱板（2)係以一端呈半圓形截面的樞接部（22)將 導管（3)夾持其間，在此狀況下，導管（3)欲發揮冷卻作用 ，其外管壁必須與樞接部（22)内壁完全接觸，且即使接觸 緊岔，熱傳導效果亦必然在樞接部（22)與導管（3)的接面上 產生損耗’因而影響其散熱效果。 【新型内容】 馨由上述可知，已知記憶體晶片散熱結構雖針對記憶體 晶片提供了獨立的散熱措施，並以液冷技術加強散熱效率 ，惟因結構設計未能考慮熱傳導能力在接面上的損失，以 致使政熱效果未能充分發揮，故有待進一步檢討及謀求可 行的解決方案。 因此’本創作主要目的在提供一種記憶體晶片散熱模 組’其利用在散熱件上一體形成供冷卻液通過的流體通道 ’藉以構成無接面的熱傳導路徑，而得避免因接面產生的 4 M323643 損失’並大幅增進散熱效率。 ^為達成前述目的採取的主要技術手段係令前述散熱模 二於散熱件上―體形成―管狀的流體通道，該散熱件進 7步包含相對的第一散熱片與第二散熱片，該第一/第二 散熱^具^當間距而形成一容置^間，供記憶體容置其間 並=第/第二散熱片相對夾持而構成熱接觸； 、酋藉此，“己憶體工作而產生大量熱能時，其熱能將傳 :至第-/第二散熱片±，部分直接由第一/第二散熱片 ,、面揮散’部分傳導至流體通道，由流體通道内流動的冷 :液挾帶排出；由於散熱件與其上的流體通道同為一體， 其間無任何接面，故可使流體通道的冷卻作用發揮到極致 ’而大幅増進散熱效率。 刚述第一 /第二散熱片係為一體式結構。 前述第-/第：散熱片為分離式結構，其巾，第一散 签、片係呈—「職面，其水平㈣錢體通道—體銜接， 第片呈丨形截面，係以上端結合於第一散熱 ^的自由端端部上。 成右、散熱件的第一 /第二散熱片於相對的外表面上形 成有：數的鰭肋，以增加散熱面積。 前述散熱件上流體通道的内管壁 以增加熱交換面積。 /风’稷數〜肋 前述散熱件上的流體福、皆& &、 以俑“ X 體通道兩端分別形成有-銜接管， 便外接冷卻液的輸送管線。 本創作又一目的在接彳妓 ^ 隹知供一種記憶體的液冷式散熱裝置 5 M323643 ’其包括有： 複數的散熱模組，每一散熱模組的散熱件具有不同長 度’而令其上的流體通道位於不同高度上； 一輸送管線，係由複數導管組成，部分導管銜接於各 散熱模組的流體通道間； 一冷卻設備，係與前述輸送管線連結，以便對輸送管 - 線内傳送的冷卻液進行冷卻； 由於前述散熱模組的流體通道位在不同高度上，因而 • 配合輸送管線構成一曲折狀管路，藉以提高冷卻液的流動 性’而增進散熱效率。 【實施方式】 有關本創作之一較佳實施例，請參閱第一、二圖所示 ，主要係於一呈门形截面的散熱件（1〇)上端一體形成一中 空管狀的W通道（1〇1);其中： - 該散熱件（10)主要由兩呈矩形片狀且相對的第一散熱 参片（11)與第二散熱片（12)所組成，該第一散熱片（11)與第二 散熱片（12)平行相對且形成一間距，而於二者間形成一容 置空間； 又第一散熱片（11)與第二散熱片（1 2)於相對的外表面 上分別形成有複數與長邊平行的鰭肋（110)(12〇)，藉此增 加第一 /第二散熱片（11 )/(12)的散熱面積。其中： 該流體通道（101)係呈中空管狀，其内管壁進一步形成 有複數鰭肋（103)’可增加熱交換面積；就實施技術而^， 6 M323643 月J述政,，、、件（1G)與其上端的流體通道（1可 出成型⑷擠型），因而該第一 /第二散熱片（11才^ 體通道_)的内管壁之間將構成一無接面的熱傳^路)^ 該弟/第二散熱片⑴)/(12)上的熱能得以無接面損失 地充分地傳導至流體通道（1〇1)處，並為流體通道（ι〇υ内 接冷卻液的輸送管線 H的t卻液所挾帶排出。於本實施例中，該流體通道 、，兩端刀別形成有一較小外徑的銜接管〇 〇2)，以便外M323643 VIII. New Description: [New Technology Area] This is a heat-dissipating module and a liquid-cooled heat sink using the heat-dissipating module, especially a heat-dissipating device used as a heat sink for memory chips. 】 When the computer application software is more advanced, it means that the demand for hardware is relatively high. Take Microsoft's new operating system Vista as an example. Microsoft's official hardware specification means that the memory must be above 512M, but according to the player's trial and Microsoft's previous Windows XP, it claims that the memory works above 256M, but In fact, it is necessary to have a smooth experience of 51 2M above. The Vista operating system needs to operate smoothly. Generally, the memory must be above 1 G. It can be seen from the above that when the application software is more advanced, the working frequency of the memory must be relatively fast, but in the case of the memory, the waste generated by the memory is relatively high, even if it is the same as the cpu, it must be independent. Cooling measures. For example, in our patent publication, the new patent No. M292738 "memory chip heat dissipation structure" is a heat dissipation technology specially designed for the memory, as shown in the specific embodiment disclosed in the first figure, mainly by two heat dissipation. The plate (2) relatively sandwiches the memory wafer plate (11) therebetween, and the two heat dissipation plates (2) are rectangular-shaped, and the opposite outer surfaces thereof form a plurality of transverse rib-shaped projections (21) to Increase the heat dissipation area. The main feature is that the two heat dissipation plates (2) form a pivotal portion (22) of a semi-circular cross section on the corresponding cake, whereby a conduit (3) is disposed between the two pivotal portions (22) of the M323643. The conduit (3) is for passage of a cooling fluid. When the memory chip (1) on the memory chip board (11) is operated: a large amount of thermal energy generated is transmitted to the heat sink (2) through the thermal contact, and the heat energy on the heat sink (2) is partially convex. The expanded heat dissipation area of the outlet (21) is partially transmitted to the conduit (3) via its pivotal portion (22), and is removed by the cooling fluid enthalpy passing through the conduit (3) for accelerated heat dissipation. . Although the foregoing patent provides a heat-dissipating device for enhancing efficiency, it is still limited in the improvement of heat dissipation efficiency: as disclosed in the foregoing, the patent uses the cooling fluid flowing in the guide tube (3) to discharge the heat-dissipating heat. The heat accumulated on the plate (2), however, the two heat sinks (2) hold the conduit (3) with a pivotal portion (22) having a semicircular cross section at one end, in which case the conduit (3) is intended The cooling effect is exerted, and the outer pipe wall must be in full contact with the inner wall of the pivoting portion (22), and even if the contact is tight, the heat conduction effect is inevitably caused by the loss at the joint between the pivoting portion (22) and the conduit (3). Affect the heat dissipation effect. [New Content] Xin is known from the above. It is known that the memory chip heat dissipation structure provides independent heat dissipation measures for the memory chip, and the liquid cooling technology enhances the heat dissipation efficiency. However, the thermal conductivity is not considered on the junction due to the structural design. The loss of the political heat has not been fully realized, so further review and seeking a viable solution are needed. Therefore, the main purpose of the present invention is to provide a memory chip heat dissipating module which utilizes a fluid passage for integrally forming a coolant passage on the heat dissipating member to form a heat conduction path without a joint surface, thereby avoiding the occurrence of a junction surface. M323643 Loss' and greatly improved heat dissipation efficiency. The main technical means for achieving the foregoing purpose is to cause the heat dissipating mold to form a tubular fluid passage on the heat dissipating member, and the heat dissipating member includes the first first heat sink and the second heat sink in the seventh step. The first/second heat sink has a space for forming a space for the memory to be accommodated therebetween and the second/second heat sink is opposite to the clamp to form a thermal contact; When a large amount of thermal energy is generated, its thermal energy will pass to: the / / second heat sink ±, partially directly from the first / second heat sink, the surface volatilization 'portion to the fluid channel, the cold flowing through the fluid channel: The liquid helium band is discharged; since the heat dissipating member is integrated with the fluid passage thereon, there is no joint between them, so that the cooling effect of the fluid passage can be maximized and the heat dissipation efficiency is greatly increased. Just described the first/second heat sink The first-/the: heat sink is a separate structure, and the towel, the first loose label, the film system is - "face, its level (four) money body channel - body connection, the first piece is in the shape of a dome Cross section, the upper end is combined with the first heat sink The first/second heat sink of the heat sink is formed on the opposite outer surface with a plurality of fin ribs to increase the heat dissipation area. The inner tube wall of the fluid passage on the heat sink is increased. Heat exchange area. /Win's number ~ ribs on the heat sink above the fluid, both && & 俑 俑 "X body channel respectively formed with a - connecting tube, then the external coolant transfer line. Another purpose of this creation is to provide a liquid-cooled heat sink for a memory. The M323643 'includes: a plurality of heat-dissipating modules, each of which has a different length of heat-dissipating members' The upper fluid passage is located at different heights; a transfer pipeline is composed of a plurality of conduits, and some conduits are connected between the fluid passages of the heat dissipation modules; a cooling device is connected with the aforementioned transfer pipeline so as to be connected to the pipelines - in-line The transferred coolant is cooled; because the fluid passages of the heat dissipating module are at different heights, the mixing duct is formed into a meandering pipeline to improve the fluidity of the coolant to improve the heat dissipation efficiency. [Embodiment] A preferred embodiment of the present invention, as shown in the first and second figures, is mainly formed by integrally forming a hollow tubular W channel at the upper end of a heat dissipating member (1 〇) having a gate-shaped cross section. 〇1); wherein: - the heat dissipating member (10) is mainly composed of two rectangular fins and opposite first heat dissipating fins (11) and second heat dissipating fins (12), the first heat dissipating fins (11) Parallel to the second heat sink (12) and forming a spacing therebetween to form an accommodating space therebetween; and the first heat sink (11) and the second heat sink (12) respectively on the opposite outer surfaces A fin rib (110) (12 〇) having a plurality of parallel to the long side is formed, thereby increasing the heat dissipation area of the first/second heat sink (11)/(12). Wherein: the fluid passage (101) is hollow tubular, and the inner tube wall is further formed with a plurality of fin ribs (103)' to increase the heat exchange area; and the implementation technology is ^, 6 M323643月月J,,,,, (1G) and the fluid passage at the upper end thereof (1 can be molded (4) extruded), so that the inner tube wall of the first/second heat sink (11) will constitute a heat transfer without junction ^路)^ The thermal energy on the younger/second heat sink (1))/(12) is sufficiently transmitted to the fluid passage (1〇1) without a joint loss, and is a fluid passage (internal cooling) The fluid transfer line H of the liquid is discharged from the liquid. In the embodiment, the fluid passage, the cutters at both ends are formed with a smaller outer diameter connecting tube 2), so as to be external
刖揭所述，散熱件(10)的第一 /第二散熱片（1 ”/ (12)之間形成有容置m，係記憶體（20)容置其間，該記 憶體（20)係在_基板（21)的兩㈣表面上分設複數的晶片 (22)，而記憶體（2G)於晶片（22)處的厚度係匹配於散熱件 (1〇)上所設容置空間的寬度，當記憶體(2〇)於前述散熱件 (ι〇)、、Ό合時’係於各晶片（22)表面貼覆雙面導熱膠膜（23)( 請配合參閱第二圖所示)後再置入散熱件(10)的容置空間内 “第/第一散熱片（11)/(1 2)的内表面與記憶體（20) 的曰曰片(22)表面構成熱接觸，並同時將散熱件。〇)固定在 記憶體（20)上（請參閱第三圖所示）。 ^使用時係令冷卻液在散熱模組上的流體通道〇叫流動 ’當記憶體（20)上的晶片（22)卫作並發熱，其產生的熱能 將傳導至散熱件（1Q)，此時第-/第二散熱片（11 )/(12)除 用/、本身較大的表面積進行散熱，亦同時令熱能傳導至 /、上端的流體通道（1〇1)，而在流體通道（101)内管壁與其 間W動的冷部液進行熱交換以達成散熱目的。如前揭所述 7 M323643 ，由於散熱件（10)之第一 /第二散熱片（11 )/(1 2)與流體通 道（101)之間係構成一無接面的熱傳導路徑，故熱能得以無 接面損失地傳導至流體通道（101)處進行熱交換，而有效提 高散熱效率。 又請參閱第四、五圖所示，係本創作又一較佳實施例 ’其基本架構與前一實施例大致相同，仍係於散熱件（10)As disclosed, the first/second heat sink (1)/(12) of the heat sink (10) is formed with a receiving m, and the memory (20) is accommodated therebetween, and the memory (20) is A plurality of wafers (22) are disposed on the two (four) surfaces of the substrate (21), and the thickness of the memory (2G) at the wafer (22) is matched to the space provided in the heat sink (1). Width, when the memory (2〇) is on the heat sink (ι〇), when splicing, the surface of each wafer (22) is attached with a double-sided thermal conductive film (23) (please refer to the second figure) After being placed in the accommodating space of the heat sink (10), the inner surface of the first/first heat sink (11)/(1 2) is in thermal contact with the surface of the cymbal (22) of the memory (20). And at the same time fix the heat sink (〇) on the memory (20) (see the third figure). ^In use, the fluid channel on the cooling module is squeaked and flows. When the wafer (22) on the memory (20) is heated and heated, the heat generated by the heat is transmitted to the heat sink (1Q). The first/second heat sink (11)/(12) dissipates heat by using its own larger surface area, and also conducts heat energy to the upper end of the fluid passage (1〇1), while in the fluid passage (101) The inner tube wall exchanges heat with the W-moving cold liquid between the inner tube wall to achieve heat dissipation. 7 M323643, as described above, since the first/second heat sink (11)/(12) of the heat sink (10) and the fluid passage (101) form a heat conduction path without junction, the heat energy It can be conducted to the fluid passage (101) for heat exchange without joint loss, thereby effectively improving the heat dissipation efficiency. Please refer to the fourth and fifth figures. Another preferred embodiment of the present invention is substantially the same as the previous embodiment, and is still attached to the heat sink (10).
上端一體形成中空管狀之流體通道（101)，與前一實施例不 同處在於··本實施例中的散熱件（10，）係一兩件式構造，進 一步而言，組成散熱件（10，）的第一 /第二散熱片（11，）/ (12，）係為可分離的兩單件，該第一散熱片（11，）係呈一「形 截面，第二散熱片（12，）則呈丨形截面，其二者結合後仍呈 一门形截面。又第一散熱片（11，）的水平部上延伸形成一中 空管狀且内管壁上具鰭肋（1〇3，）的流體通道，又第一 散熱片（11，）於水平部的自由端端部及第二散熱片（12，）接近 頂端處分別形成有對應的固定孔（圖中未標號），並以螺絲 (13 )對應螺合，藉以將第一/第二散熱片)/(12,)相互 前述實施例中，雖散熱件（1〇，）之第第二 (:::):(12,)間形成有接面’但第一散熱片⑴’)與流體：道 (1〇1)之間仍構成無接面的熱傳導路徑，其散熱效 已知的記憶體散熱模組理想。 再請參閱第六圖所示，係本創作之—應用實_，盆 ===對複數記憶體(2。)進行散熱之液冷式散熱 裝置主要係於母-記憶體㈣上分別安裝—前述的散熱 8 M323643 模組，各相鄰散熱模組的散熱件（1〇)為不同長冑，藉此令 其上的流體通道（101)位在不同高度上。 接著以複數導官（31)銜接於各流體通道（1〇1)之間而構 成-冷卻液的輸送管線（30)’ #令傳輸管線（3〇)與一冷卻 設備（40)連接，該冷卻設備⑽）對冷卻液提供加壓與冷卻 功能，當冷卻液經過各散熱模組之流體通道（1〇1)，即形成 熱交換作用而使散熱件⑽散熱，當冷卻液由流體通道 (1 〇 1)抓出後因熱X換*升高温度，即送回冷卻設備（4〇)冷 卻後再送至各散熱模組。值得__提的是：本創作令各㈣ 模組的流體通道（101)位於不同高度處，因此輸送管線_ 將該處形成-曲折段，#曲折段形成的高度落差，可避免 冷卻液停滯在管線的某處，令冷卻液的輸送更順暢。 【圖式簡單說明】 第一圖·係本創作一較佳實施例之分解圖。 第二圖··係本創作一較佳實施例之組合剖視圖。 第三圖··係本創作一較佳實施例之組合立體圖。 第四圖··係本創作又一較佳實施例之分解圖。 第五圖··係本創作又-較佳實施例之組合剖視圖。 第六圖··係本創作再一較佳實施例之平面示意圖。 【主要元件符號說明】 (1〇)(1〇，)散熱件 （1〇1)(1 〇1，）流體通道 (1〇2)銜接管 第-散熱片 (1〇3)(1〇3’）（11〇)(12〇)鰭肋 M323643 (12)(12’）第二散熱片 (13’）螺絲 (20)記憶體 (21)基板 (22)晶片 (23)導熱膠膜 (30)輸送管線 (40)冷卻設備 (31)導管The upper end integrally forms a hollow tubular fluid passage (101), which is different from the previous embodiment in that the heat dissipating member (10) in this embodiment is a two-piece construction, and further, a heat dissipating member (10, The first/second heat sink (11,) / (12,) is a detachable two-piece, the first heat sink (11,) has a "shaped cross section, and a second heat sink (12, ) is a cross-section, which is still in the form of a gate-shaped cross section. The horizontal portion of the first fin (11,) extends to form a hollow tubular shape and the inner tube wall has fin ribs (1〇3, a fluid passage, and a first heat sink (11,) is formed with a corresponding fixing hole (not labeled) at a free end end of the horizontal portion and a second heat sink (12,) near the top end, and The screws (13) are correspondingly screwed, whereby the first/second heat sinks/(12,) are mutually mutually in the foregoing embodiment, although the second (:::) of the heat sink (1〇,): (12, Between the junction forming 'but the first heat sink (1)') and the fluid: the track (1〇1) still form a heat conduction path without junction, the heat dissipation effect is known The body cooling module is ideal. Please refer to the sixth figure, which is the application of the application - the actual version, the basin === the liquid cooling device for heat dissipation of the complex memory (2.) is mainly based on the mother-memory The body (4) is separately mounted—the aforementioned heat dissipation 8 M323643 module, and the heat dissipation members (1〇) of the adjacent heat dissipation modules are different lengths, so that the fluid passages (101) thereon are located at different heights. A plurality of guides (31) are connected between the fluid passages (1〇1) to form a coolant transfer line (30)'. The transfer line (3〇) is connected to a cooling device (40), the cooling The device (10)) provides a pressurization and cooling function for the coolant. When the coolant passes through the fluid passages (1〇1) of the heat dissipation modules, heat exchange is formed to dissipate heat from the heat sink (10), and when the coolant passes through the fluid passage (1) 〇1) After the grab is removed, the temperature is increased by the heat X, that is, it is sent back to the cooling device (4〇) and then cooled to the heat dissipation module. It is worthwhile to mention: the fluid channel of each (4) module is created by this creation. (101) is located at different heights, so the transfer line _ is formed at this point - a tortuous section, #形折 segment The height drop can prevent the coolant from stagnation somewhere in the pipeline, so that the coolant can be transported more smoothly. [Simplified illustration] The first figure is an exploded view of a preferred embodiment of the present invention. A cross-sectional view of a preferred embodiment of the present invention. The third drawing is a combined perspective view of a preferred embodiment of the present invention. The fourth drawing is an exploded view of another preferred embodiment of the present invention. A cross-sectional view of a combination of a preferred embodiment and a preferred embodiment. Fig. 6 is a plan view showing a further preferred embodiment of the present invention. [Description of main components] (1〇) (1〇,) heat sink ( 1〇1)(1 〇1,) Fluid channel (1〇2) Adapter tube - Heat sink (1〇3) (1〇3') (11〇) (12〇) Fin rib M323643 (12) (12 ') Second heat sink (13') Screw (20) Memory (21) Substrate (22) Wafer (23) Thermal paste film (30) Transfer line (40) Cooling device (31) Catheter