、M318309 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種散熱片扣具結構，侧係有關—種可拆卸之散 熱片扣具結構，儀特殊材料成形技術使散熱片—次成形，可節省製 造時間及簡化製知’又，利用扣具與散熱片分離之設計，使用者配合 不同尺寸之扣具即可將散刻安裝於各式域板上，可充分節省成本。 •【先前技術】 如第一圖所示，習知的散熱片1上表面設有複數個散熱鰭片2, 侧邊利用二次加工方式以成形出複數個固定部3，每一固定部3上皆 具有-穿孔4，散熱>；1藉由固錢銷5穿過峡部3及電路板了之 固定孔6固定於電路板7上，且散熱片i之下表面與晶片8貼合；由 於習知的散熱片1之固定部3係與本體一體成形，但因電路板7上之 晶片8規格眾多，故孔位或孔距皆不一致，因此需要很多種尺寸之散 春熱片來配合’使料成本增加及管理上產生不便，因此，創作人基於 前述理由，因而進行改良習知技術所具有之缺失。 【新型内容】 本創作之政熱片扣具結構係有關一種可拆卸之散熱片扣具結構， 利用特殊材料成形技術使散熱片一次成形，可節省製造時間及簡化製 程，又，利用扣具與散熱片分離之設計，使用者配合不同尺寸之扣具 即可將散熱片安裝於各式主機板上，可充分節省成本。 、M318309 基於刖述目的，本創作之散熱片扣具結構，包含一散熱座，具有 一上表面及一下表面，該上表面設置複數個散熱元件；及一扣具，具 有一對應該散熱座外形之扣具框，該扣具框設置有一定位結構以防止 該散熱座發生位移及至少一内扣件，該扣具之外緣設置有至少兩個位 於相對位置之外扣件，每一外扣件上設有一固定穿孔，該内扣件將該 扣具疋位於該散熱座之表面後，使該扣具蓋設於該散熱座之上表面並 '使該散熱座與該定位結構卡合。 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更詳細的說明， 俾使熟習該項技藝者在研讀本說明書後能據以實施。 第二圖顯示本創作散熱片扣具結構第一實施例之立體分解圖；如圖 所示，本創作第一實施例之散熱片扣具，包含一圓形散熱座1〇a，具 有一上表面100及一下表面1〇1，上表面100設置複數個散熱元件11; _及一裱形扣具20a，具有一對應該散熱座外形之環形扣具框2卜扣具 •框21内緣設置有一散熱座卡槽21〇(定位結構)環繞扣具框21之内緣及 ‘兩個位於才晴位置之内扣件22，環形扣具2加之外緣設置有兩個位於 相對位置之外扣件23，每一内扣件22上設有一穿孔22〇，每一外扣件 23上設有-固定穿孔Z30，内扣件π之穿孔⑽套合於圓形散熱座 l〇a之散熱元件11後，使環形扣具2〇a蓋設於圓形散熱座1〇&之上表 面100並使圓形散熱座l〇a與散熱座卡槽21〇卡合。 第三A圖，顯示本創作散熱片扣具結構第一實施例中第一種使用 * M318309 .狀態示意圖；第三B圖係顯示本創作散熱片扣具結構第一實施例中第 二種使用狀態示意圖；如圖所示，環形扣具2〇a套設在_散熱座收 並藉由-固定插銷33穿過外扣件23之固定穿孔23〇及電路板3〇之固 定孔32將圓形散熱座恤固定於電路板3〇上，使圓形散熱座收之 •下表面101與晶片31貼合以散熱，如第三A圖所示，當晶片31面積 小於圓職熱座l〇a之面積時，圓形散熱座1〇a φ積時，圓形散熱座10a之散熱元件u具有較長之長度。 . 細圖顯示本創作散熱片扣具結構第二實施例之立體分解圖；如 圖所示，本創作第二實施例之散熱片扣具，包含—圓形散熱座i〇a， 具有-上表面_及-下表面m，上表面·設置複數個散熱元件 11 ;及-環形扣具20c，具有一對應該散熱座1〇a外形之環形扣具框 2卜扣具框21⑽環繞設置有一散熱座卡槽no(定位結構），以及從 扣具框21内緣延伸出兩平行桿體並橫跨於扣具框21作為内扣件24， 籲兩平打桿體之間保持可容納散熱元件n之間距⑷，環形扣具撕之 -外緣設置有兩鎌於相對位置之外扣件23，每一外扣件Μ上設有一 口疋穿孔230内扣件24之間距套合於圓形散熱座之對應排散熱 一牛的同時，其他散熱元件11則位於内扣件24兩侧之鏤空部，使 環形扣具2〇C蓋設於圓形散熱座l〇a之上表面100，並使圓形散執座 10a與散熱座卡槽21〇卡合。 壯％ ^ A圖示本創作散熱片扣具結構第二實施例中第-種使用 、’。示Ί ’第五B圖係顯示本創作散熱片扣具結構第二實施例中第 、M318309 ‘ ;如圖所示，環形扣具2Ge套設在圓形散熱座 糟由内扣件24之兩平行桿體壓掣於散熱座施之上表面1〇〇， .再以一固定插銷33穿過外扣件23之固定穿孔23〇及電路板3〇之 孔f ’將圓形散熱座1〇a固定於電路板3〇上，使圓形散熱座收之 下表面101與晶片31達到緊密貼合之效果。如第五A圖所示，者曰 片31面積小於圓形散熱座1〇a之面積時，圓形散熱座收之散献I: ^有較短之長度’如第五B圖所示，當晶片31面積大於圓形散熱 座°^a之面積時，圓形散熱座10a之散熱元件n具有較長之長度。 第六圖係顯示本創作散刻扣具結構第三實施例之立體分解圖； .如圖所不，本創作第三實施例之散熱片扣具結構，包括一六邊形散熱 •座10b，具有一上表面100及一下表面10卜上表面100設置複數個散 熱兀件11 ;及-六邊形扣具2〇b ’具有一對應該散熱座外形之六邊形 扣具框21，扣具框21内緣設置有一散熱座卡槽21〇環繞扣具框21之 内緣及兩個位於相對位置之内扣件22，六邊形扣具2〇b之外緣設置有 兩個位於相對位置之外扣件23，每一内扣件22上設有一穿孔22〇，每 • 一外扣件23上設有一固定穿孔230,内扣件22之穿孔22〇套合於六 邊形散熱座l〇b之散熱元件u後，使六邊形扣具 i設於六邊形散 熱座10b之上表面1〇〇，並使六邊形散熱座丨⑽與散熱座卡槽以^卡 合0 第七A圖係顯示本創作散熱片扣具結構第三實施例中第一種使用 狀悲不意圖；第七B圖係顯示本創作散熱片扣具結構第三實施例中第 一種使用狀悲示思圖；如圖所示，六邊形扣具2〇b套設在六邊形散熱 片l〇b，並藉由一固定插銷33穿過外扣件23之固定穿孔230及電路 M318309 板30之固定孔32將六邊形散熱片10b固定於電路板3〇上，使六邊形 .散熱片l〇b之下表面1〇1與晶片31貼合以散熱，如第七a圖所示’ 當晶片31面積小於六邊形散熱座i〇b之面積時，六邊形散熱座l〇b 之散熱元件11具有較短之長度，如第七3圖所示，當晶片31面積大 於六邊形散熱座10b之面積時，六邊形散熱座10b之散熱元件u具有 較長之長度。 如上所述之散刻扣具結構，利用特殊材料成形技術使散熱片一 ⑩次成形，可節省製造時間及簡化製程，此外，並利用扣具與散熱片可 •刀離之设計，使用者配合不同尺寸之扣具即可將散熱片安裝於各式主 為板上可充刀節省成本，再者，散熱片上之散熱元件長度可依不同 的需要在生產製造時做出適當的調整。 以上所述者僅為用以解釋本創作之較佳實施例 ’並非企圖據以對 本創作做购形紅之關，如，凡有在_之_㈣下所作有 鲁關本創作之任何修飾或變更，皆仍應包括在本創作意圖保護之範嘴。 、M318309 【圖式簡單說明】 第一圖係顯示習知散熱組件之立體分解圖。 第二圖係顯示本創作散刻扣具結構第—實施例之立體分解圖。 不意圖 第三A _本_散熱片扣具結實施财第—種使用狀態 第三示本創作散熱片扣具結構第—實施例中第二種使用狀態 不意圖。 ♦第四圖係顯示本創作散熱片扣具結構第二實施例之立體分解圖。 第五A圖係顯不本創作散熱片扣具結構第二實施例中第一種使用狀態 不意圖。 第五B圖係顯示本創作散熱片扣具結構第二實施例中第二種使用狀態 示意圖。 第/、圖係顯示本創作散熱片扣具結構第三實施例之立體分解圖。 第七A圖係顯示本創作散熱片扣具結構第三實施例中第一種使用狀態 #示意圖。 第七B圖係顯示本創作散熱片扣具結構第三實施例中第二種使用狀態 ’示意圖。 【主要元件符號說明】 1·散熱片 2·散熱鰭片 3·固定部 • M318309, M318309 VIII, new description: [New technology field] This creation is about the kind of heat sink clip structure, the side is related to a kind of detachable heat sink clip structure, the instrument special material forming technology makes the heat sink - times Forming, which saves manufacturing time and simplifies the manufacturing process. In addition, the design of the separation of the buckle and the heat sink is used. The user can mount the fasteners on various types of domain boards with different sizes of fasteners, which can save costs. • [Prior Art] As shown in the first figure, the conventional heat sink 1 has a plurality of heat dissipating fins 2 on its upper surface, and the side is formed by a secondary processing method to form a plurality of fixing portions 3, each of which is fixed. The upper surface has a perforation 4, heat dissipation >; 1 is fixed on the circuit board 7 through the fixing hole 6 of the isthmus 3 and the circuit board by the solid coin 5, and the lower surface of the heat sink i is attached to the wafer 8; Since the fixing portion 3 of the conventional heat sink 1 is integrally formed with the main body, since the size of the wafer 8 on the circuit board 7 is large, the hole position or the hole pitch are inconsistent, so that a variety of sizes of spring heat sheets are required to match 'Increased cost increase and management inconvenience, therefore, the creator has made a lack of improved conventional technology based on the above reasons. [New Content] The political hot clip fastener structure of this creation is related to a detachable heat sink clip structure. The special material forming technology enables the heat sink to be formed at one time, which can save manufacturing time and simplify the process, and utilize the buckle and The design of the heat sink separation allows the user to install the heat sink on various types of motherboards with different sizes of fasteners, which can save costs. M318309 Based on the purpose of the description, the heat sink clip structure of the present invention comprises a heat sink having an upper surface and a lower surface, the upper surface is provided with a plurality of heat dissipating components; and a buckle having a pair of heat sink profiles a fastener frame, the fastener frame is provided with a positioning structure to prevent the heat sink from being displaced and at least one inner fastener, and the outer edge of the buckle is provided with at least two fasteners located at opposite positions, each buckle The fixing member is provided with a fixing through hole, and the inner fastening member is disposed on the surface of the heat dissipation seat, so that the buckle is disposed on the upper surface of the heat dissipation seat and 'the heat dissipation seat is engaged with the positioning structure. [Embodiment] The embodiments of the present invention will be described in more detail below with reference to the drawings and the component symbols, so that those skilled in the art can implement the present invention after studying the present specification. The second figure shows an exploded perspective view of the first embodiment of the present heat sink fastener structure. As shown in the figure, the heat sink clip of the first embodiment of the present invention includes a circular heat sink 1a, having an upper The surface 100 and the lower surface 〇1, the upper surface 100 is provided with a plurality of heat dissipating elements 11; _ and a 扣-shaped fastener 20a having a pair of circular fastener frames 2 of the shape of the heat sink; There is a heat sink card slot 21〇 (positioning structure) surrounding the inner edge of the clip frame 21 and 'two fasteners 22 located in the clear position, and the outer loop of the loop fastener 2 is provided with two buckles located at opposite positions. The inner fastening member 22 is provided with a perforation 22 〇, each outer fastening member 23 is provided with a fixing perforation Z30, and the perforation (10) of the inner fastening member π is fitted to the heat dissipating component of the circular heat dissipating seat l〇a. After the 11th, the annular buckle 2〇a is placed on the upper surface 100 of the circular heat sink 1& and the circular heat sink l〇a is engaged with the heat sink slot 21〇. The third A figure shows the first type of the use of the original heat sink clip structure in the first embodiment of the use of * M318309. The third diagram shows the second use of the first embodiment of the present heat sink clip structure. State diagram; as shown in the figure, the ring fastener 2〇a is sleeved on the _heat sink and closed by the fixing pin 33 through the fixing hole 23 of the outer fastener 23 and the fixing hole 32 of the circuit board 3〇 The heat-dissipating t-shirt is fixed on the circuit board 3〇, so that the circular heat-dissipating seat receives the lower surface 101 and the wafer 31 to be attached to dissipate heat, as shown in FIG. 3A, when the area of the chip 31 is smaller than the round-shaped hot seat. In the case of a area, when the circular heat sink 1 〇 a φ is accumulated, the heat dissipating member u of the circular heat sink 10a has a long length. The fine view shows a perspective exploded view of the second embodiment of the present heat sink fastener structure; as shown in the figure, the heat sink clip of the second embodiment of the present invention includes a circular heat sink i〇a, having - Surface _ and - lower surface m, upper surface · a plurality of heat dissipating elements 11; and - ring fastener 20c, having a pair of circular fastener frames 2 that should be arranged in the shape of the heat sink 1 〇a, a buckle frame 21 (10) is provided with a heat dissipation The seat card slot no (positioning structure), and two parallel rods extending from the inner edge of the clip frame 21 and spanning the clip frame 21 as the inner buckle member 24, and the two flat rod bodies are held to accommodate the heat dissipating member n Between the distances (4), the toroidal buckle is torn - the outer edge is provided with two fasteners 23 opposite to the relative position, and each outer fastener is provided with a cymbal perforation 230. The inner fastening member 24 is sleeved in a circular heat dissipation. At the same time as the corresponding heat dissipation of the seat, the other heat dissipating elements 11 are located at the hollow portions on both sides of the inner fastening member 24, so that the annular buckle 2〇C is placed on the upper surface 100 of the circular heat sink l〇a, and The circular diffuser 10a is engaged with the heat sink card slot 21〇.壮% ^ A shows the first use of the second embodiment of the present heat sink clip structure, '.第五 'The fifth B picture shows the second embodiment of the creation of the heat sink fastener structure, M318309 '; as shown, the circular fastener 2Ge is set on the circular heat sink seat by the inner fastener 24 The parallel rod body is pressed against the upper surface of the heat sink seat, and then a fixed pin 33 is passed through the fixed through hole 23 of the outer fastener 23 and the hole f' of the circuit board 3'. A is fixed on the circuit board 3〇, so that the circular heat sink bottom surface 101 and the wafer 31 are brought into close contact with each other. As shown in FIG. 5A, when the area of the cymbal 31 is smaller than the area of the circular heat sink 1 〇a, the circular heat sink is provided with a short length I: ^ has a shorter length as shown in FIG. When the area of the wafer 31 is larger than the area of the circular heat sink, the heat dissipating member n of the circular heat sink 10a has a longer length. The sixth figure shows an exploded perspective view of the third embodiment of the present invention. The heat sink fastening structure of the third embodiment of the present invention includes a hexagonal heat dissipation seat 10b. Having an upper surface 100 and a lower surface 10, the upper surface 100 is provided with a plurality of heat-dissipating elements 11; and - a hexagonal fastener 2〇b' has a pair of hexagonal fastener frames 21 which should have a heat sink shape, the buckle The inner edge of the frame 21 is provided with a heat sink card slot 21, which surrounds the inner edge of the clip frame 21 and two fasteners 22 located at opposite positions. The outer edge of the hexagonal clip 2〇b is provided with two opposite positions. The outer fasteners 22 are provided with a perforation 22〇, and each of the outer fasteners 23 is provided with a fixing through hole 230, and the through hole 22 of the inner fastening member 22 is sleeved on the hexagonal heat dissipation seat. After the heat dissipating component u of the b, the hexagonal clip i is disposed on the upper surface of the hexagonal heat sink 10b, and the hexagonal heat sink (10) and the heat sink card slot are engaged with each other. The seventh A figure shows that the first type of use in the third embodiment of the creation of the heat sink fastener structure is not intentional; the seventh picture B shows the creation of the heat dissipation The third embodiment of the buckle structure is in a sad manner; in the figure, the hexagonal fastener 2〇b is sleeved on the hexagonal fins l〇b, and by a fixing pin 33 The hexagonal fins 10b are fixed to the circuit board 3〇 through the fixing holes 230 of the outer fastening member 23 and the fixing holes 32 of the circuit M318309. The hexagonal surface of the heat sink l〇b is 1〇1. Bonding with the wafer 31 to dissipate heat, as shown in FIG. 7A. 'When the area of the wafer 31 is smaller than the area of the hexagonal heat sink i〇b, the heat dissipating member 11 of the hexagonal heat sink lb has a shorter length. As shown in FIG. 3, when the area of the wafer 31 is larger than the area of the hexagonal heat sink 10b, the heat dissipating member u of the hexagonal heat sink 10b has a longer length. The squeezing fastener structure as described above utilizes special material forming technology to form the heat sink 10 times, which can save manufacturing time and simplify the process. In addition, the utility model can be designed by using the buckle and the heat sink. With different sizes of fasteners, the heat sink can be mounted on various main boards to save costs. Moreover, the length of the heat sink on the heat sink can be adjusted according to different needs during production. The above description is only for explaining the preferred embodiment of the present invention. It is not intended to make a purchase of this creation. For example, any decoration or modification made under __(4) Changes should still be included in the protection of this creative intent. M318309 [Simple description of the drawing] The first figure shows an exploded view of a conventional heat dissipating component. The second figure shows an exploded perspective view of the first embodiment of the present invention. It is not intended that the third A_this_heatsink buckle implementation implements the first use state. The third embodiment of the present heat sink fastener structure-the second use state in the embodiment is not intended. ♦ The fourth figure shows an exploded perspective view of the second embodiment of the present heat sink fastener structure. The fifth A diagram shows the first use state in the second embodiment of the heat sink fastener structure. Fig. 5B is a view showing a second state of use in the second embodiment of the present heat sink fastener structure. The figure / is a perspective exploded view showing the third embodiment of the heat sink clip structure of the present invention. The seventh drawing shows the first usage state # schematic diagram of the third embodiment of the present heat sink fastener structure. Fig. 7B is a view showing a second use state in the third embodiment of the present heat sink fastener structure. [Description of main component symbols] 1. Heat sink 2. Heat sink fins 3. Fixing part • M318309
4. 穿子L 5. 固定插銷 * 6. 固定孔 7. 電路板 8. 晶片 l〇a.圓形散熱座 '10b.六邊形散熱座 • 11·散熱元件 20a.環形扣具 20b.六邊形扣具 20c.環形扣具 21. 扣具框 22. 内扣件 23. 外扣件 鲁24·内扣件 ，241.間距 \ 30.電路板 31. 晶片 32. 固定孔 33. 固定插銷 100. 上表面 101. 下表面 M318309 210.散熱座卡槽 220.穿孔 230.固定穿孔4. Pedestrian L 5. Fixed pin * 6. Fixed hole 7. Circuit board 8. Wafer l〇a. Round heat sink '10b. Hexagonal heat sink · 11 · Heat dissipating component 20a. Ring fastener 20b. Edge fastener 20c. Ring fastener 21. Buckle frame 22. Inner fastener 23. Outer fastener Lu 24· Inner fastener, 241. Spacing\ 30. Circuit board 31. Wafer 32. Fixing hole 33. Fixing pin 100. upper surface 101. lower surface M318309 210. heat sink card slot 220. perforation 230. fixed perforation