丄 JM477 -九、發明說明： 【發明所屬之技術領域】 a本發明係-種散熱器固定裝置，特別涉及一種針對電 腦主機板上發熱元件所需散熱器之固定農置。 【先前技術】 Ρ 遗著積體電路製造技術日新月異之發展，電子元件朝 ^更快之運算速度邁進。由於電子元件之運算速度越來越 φ快’電子70件在高速運作時伴隨產生之熱量也越來越多。 若電子元件產生之熱量不被及時導出，將會導致電子元件 之咖度持續升高，從而影響其運行之穩定性。為此，業界 m產生熱量較多之電子元件頂㈣設—散熱器，再透 過系統風扇之協助排出熱量。 目前將散熱H安裝在電子元件上有乡種^ ===固定，照圖I散熱器14透過四呈正 上，每一固4 16固疋在電腦主機板10之發熱元件12 疋16之下端為一彈性扣爪162,每一扣爪162 呈倒錐體狀，當安裝散熱器14 等固定柱16之扣爪162穿頁用力向下按壓，使該 腦主機柘心广 電腦主機板1〇並卡扣於電 細主機板！〇之底面，拆卸時，縣該等固定柱心 ^機板H)解鎖，才能將該散熱器Μ拆下，二種/ 式疋借助於複雜之機構來實現，域 【發明内容】 政…、态之成本。 定裝【。上述内合’有必要提供一種拆裝方便之散熱器固 5 1334477 種政熱器固定裝置，用於將一散熱器固定於一主機 板上，該散熱器固定裝置包括至少兩設置於該散熱器底部 之固疋件與可裝設於主機板上與該等固定件對應配合之至 少兩卡扣件，每一固定件為螺旋狀，每一卡扣件包括一柱 體，柱體上間隔設有兩凸塊，每一固定件卡扣於對應卡扣 件之兩凸塊之間。 相較習知技術，只須旋轉散熱器使該等固定件脫離對 應之卡扣件，即可將該散熱器取下，無須將該等卡扣 電腦主機板解鎖，拆裝方便。 一 【實施方式】 请參照圖6,為本發明散熱器固定裝置之一較佳實施 方式，用於將—散熱器24固定在—電射機板如之一發 熱凡件22上。該散熱器固定裝置，包括四呈正交方向設置 底部之固定件242與四固定在電腦主機板 ϋ $ Λ Γ 243 ’該等固定件242與對應之卡扣件243 之摩擦力進行卡扣配合，將該散熱器Μ 發熱7G件22上。 請參照圖2至圖4，每―固^件242呈螺旋狀，一端 固定於散熱n 24之底部，另—端為自 2 243包括一柱體244， 母卡扣件 ，該扣爪246呈倒錐體狀Γ卜之下端為—彈性扣爪 之奸大，…：其部直徑比該柱體244 其下直徑比該柱體244之直獲小. 之上端沿柱體橫截面方向自 〜柱體244 該兩u形凸塊247間設有―段 /凸塊247 百&距離，該柱體244自該扣爪 6 133.4477 246底部自下而上開設一内槽248，該内槽248延伸至鄰近 該扣爪246之U形凸塊247處，使該扣爪246平均分成兩 半。該等固定件242及該等卡扣件243均為彈性材質。 请參照圖5與圖6，將該等扣爪246穿透該電腦主機 板20之安裝孔’即可將該等卡扣件⑷固定於電腦主機板 上。安襄散熱器時，將該等固定件242之自由端對準對應 卡扣件243之兩U形凸塊247之間，順時針 W使該等岐件242卡入對應卡扣件243之兩U形凸塊 247之間並貼緊柱體244,❿u形凸塊247與對應固定件 242之間、柱體244與對應固定件242之間均產生較大摩 擦力，使該等固定件242與該等卡扣件243緊密卡扣配合 並自鎖，使該散熱器24不易產生回轉，即可將該 Μ固定在該發熱元件22上；取下散熱器時，逆時収轉 散熱器24,該等固定件242自由端即可彈出對應卡扣件⑷ 之兩U形凸塊247之間之區域’即可卸下該散熱器％。 …以上該僅為本發明之較佳實施方式，本發明^該等固 疋件之數量可為兩、三或四以上，根據實際需求進行增減； 本發明中之發熱元件可以為處理器、晶片組等其他發熱電 子元件。 、 … 【圖式簡單說明】 圖1係習知散熱器固定裝置用於將一散熱器固定於一 主機板上之正視圖。 圖2係本發明散熱器固定裝置較佳實施方式與一散熱 器之立體分解圖。 … 7 丄《4477 圖3係圖2之組裝圖。 圖4係本發明散熱器固定裝置較佳實施方式之卡扣件 之立體圖。丄 JM477 - IX, invention description: [Technical field to which the invention pertains] a The present invention relates to a heat sink fixing device, and more particularly to a fixed agricultural device for a heat sink required for a heating element on a main board of a computer. [Prior Art] 遗 With the rapid development of integrated circuit manufacturing technology, electronic components are moving toward faster computing speeds. Since the operation speed of electronic components is getting faster and faster, the amount of heat generated by the 70 electronic components at high speed is also increasing. If the heat generated by the electronic components is not exported in time, the electronic components will continue to rise in height, which will affect the stability of their operation. To this end, the industry m generates a heat-generating electronic component top (four) set-heat sink, and then through the system fan to help discharge heat. At present, the heat sink H is mounted on the electronic component and has a common type of ^=== fixed. As shown in Fig. 1, the heat sink 14 is vertically connected through the four, and each solid 4 16 is fixed at the lower end of the heating element 12 疋16 of the computer motherboard 10 An elastic claw 162, each of the claws 162 has an inverted cone shape, and when the claw 162 of the fixing post 16 such as the heat sink 14 is mounted, the punching force is pressed downward, so that the brain main body is widened and the computer main board is folded. Buckle on the electric motherboard! On the underside of the raft, when the disassembly, the fixed column core plate H) of the county is unlocked, the radiator Μ can be removed, and the two kinds of 疋 are realized by means of a complicated mechanism, the domain [invention] The cost of the state. Finishing [. It is necessary to provide a heat dissipating device for disassembling and disassembling a heat sink fixing device, which is used for fixing a heat sink to a motherboard, and the heat sink fixing device comprises at least two heat sinks disposed on the heat sink. The bottom fixing member and the at least two fastening members that can be mounted on the main board and corresponding to the fixing members, each fixing member is spiral, each of the fastening members includes a cylinder, and the cylinder is spaced apart There are two bumps, and each fixing member is buckled between the two bumps of the corresponding snap member. Compared with the prior art, the heat sink can be removed only by rotating the heat sink to disengage the fixing members from the corresponding fasteners, and the card motherboard is not required to be unlocked, and the assembly and disassembly is convenient. [Embodiment] Please refer to Fig. 6, which is a preferred embodiment of the heat sink fixing device of the present invention, for fixing the heat sink 24 to a heat radiating plate such as a heat generating member 22. The heat sink fixing device comprises four fixing members 242 arranged in the orthogonal direction and four fixings on the computer motherboard ϋ $ Λ 243 243 ′ 'the fixing members 242 and the corresponding fastening members 243 are frictionally engaged with each other. The heat sink Μ heats up on the 7G piece 22. Referring to FIG. 2 to FIG. 4 , each of the fixing members 242 has a spiral shape, one end is fixed to the bottom of the heat dissipating n 24 , and the other end is from the 2 243 including a cylinder 244 and a female fastening member. The lower end of the inverted cone-shaped cymbal is - the elastic claw, the diameter of the portion is smaller than the diameter of the cylinder 244. The upper end is smaller than the cross-section of the cylinder. The cylinder 244 is provided with a section/bump 247 and a distance between the two u-shaped bumps 247. The cylinder 244 defines an inner groove 248 from the bottom of the claw 6 133.4477 246 from the bottom to the bottom. Extending to the U-shaped projection 247 adjacent the pawl 246, the pawl 246 is equally divided into two halves. The fixing members 242 and the fastening members 243 are all elastic materials. Referring to Figures 5 and 6, the claws 246 are inserted through the mounting holes of the main body board 20 to fix the fasteners (4) to the computer motherboard. When the heat sink is installed, the free ends of the fixing members 242 are aligned between the two U-shaped bumps 247 of the corresponding latching members 243, and the clockwise W is used to snap the picking members 242 into the corresponding latching members 243. The U-shaped bumps 247 are in close contact with the cylindrical body 244, and a large frictional force is generated between the U-shaped convex block 247 and the corresponding fixing member 242 and between the cylindrical body 244 and the corresponding fixing member 242, so that the fixing members 242 are provided. The snap fastener 243 is tightly snap-fitted and self-locked, so that the heat sink 24 is less likely to rotate, and the cymbal can be fixed on the heating element 22; when the heat sink is removed, the heat sink 24 is reversed. The fixing member 242 can eject the area between the two U-shaped bumps 247 of the corresponding fastening member (4) at the free end to remove the heat sink %. The above is only a preferred embodiment of the present invention, and the number of the solid components of the present invention may be two, three or more, and may be increased or decreased according to actual needs; the heating element in the present invention may be a processor, Other heat-generating electronic components such as wafer sets. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing a conventional heat sink fixing device for fixing a heat sink to a main board. Figure 2 is an exploded perspective view of a preferred embodiment of the heat sink fixture of the present invention and a heat sink. ... 7 丄 "4477 Figure 3 is an assembly diagram of Figure 2. Fig. 4 is a perspective view of a fastening member of a preferred embodiment of the heat sink fixing device of the present invention.
圖5是圖3中標號為V部分之放大圖。 圖6是本發明散熱器固定裝置較佳實施方式用於將一 散熱器固定於一 主機板之正視圖。 【主要元件符號說明 ] [習知] 電腦主機板 10 發熱元件 12 散熱器 14 固定柱 16 扣爪 162 [本發明] 電腦主機板 20 發熱元件 22 散熱器 24 固定件 242 卡扣件 243 柱體 244 扣爪 246 U形凸塊 247 内槽 248Figure 5 is an enlarged view of the portion labeled V in Figure 3. Figure 6 is a front elevational view of a preferred embodiment of the heat sink securing device of the present invention for securing a heat sink to a motherboard. [Main component symbol description] [Practical] Computer motherboard 10 Heating element 12 Heat sink 14 Fixing post 16 Buckle 162 [Invention] Computer motherboard 20 Heating element 22 Heat sink 24 Fixing member 242 Fastening member 243 Cylinder 244 Buckle 246 U-shaped bump 247 inner groove 248