Μ419Γ32 五、新型說明： 【新型所屬之技術領域】 本創作係一種散熱模組之固定裝置，尤指藉由一彈性件在彈性作用下 將散熱模組向機板壓靠，進而使散熱模組寸%密貼合在機板上者。 .【先前技術】 按’一般用於電腦機板上發熱元件之散熱模組之固定結構（該機板可 為主機板、介面卡；該發熱元件可為晶片、微處理器），請參照第丨圓所示， 其為台灣專利第93214499號專利案，該結構揭露有一底座100，該底座1〇〇 • 係位於機板200下，且該底座1〇〇各端邊分別設有向上延伸之支柱1〇1，該 等支柱恰可穿過機板200上之孔洞201，且該等支柱1〇1中分別設有螺 孔102 ’另’在機板200上則設有位於孔洞201間之微處理器3〇〇，該微處 理器300上壓靠有一散熱模組400 ’該散熱模組400在面對微處理器3〇〇 一 面上套設有一扣件110，該扣件110 ♦心設有一圓環111 ,該圓環lu係套 設固定在散熱模組400上，而該圓環111週邊則設有向外延伸之支腳112， 該等支腳112末端分別設有一卡勾113，該等卡勾113係與支柱1〇ι相對， 如此一來，雖可藉由螺絲120穿過卡勾113而鎖合在支柱ιοί之螺孔 ^ 中’使支腳112卡扣在螺絲120上，而使散熱模組4〇〇固定在微處理器3〇〇 上，惟因螺絲120會有鬆動之情形，造成散熱模組4〇〇無法緊密貼靠在微 處理器300上，且因螺絲120係位於機板200與散熱模組4〇〇間，令使用 者將支腳112卡扣在螺絲120時，會因空間狹窄，增加操作之困難及增加 作業時間及成本。 再請參照第2囷所示’其設有一固定件5〇〇，該固定件5〇〇係固定在散 熱模組600之背面上，且該固定件500兩端分別接設有與之垂直之卡勾 510，另，該散熱模組600下設有一微處理器700或一個以上之晶片，該微 處理器700係固定在一機板800上，該機板800在微處理器7〇〇週邊分別 設有一個以上之穿孔810，該等穿孔810係與卡勾510相對且恰可供卡勾 3 M419132 510穿套而過；又，該機板800下設有一絕緣墊體52〇 ,該絕緣墊體52〇各 端邊分別設有一孔洞521，以供卡勾510穿套而過，且該絕緣墊體52〇下設 有一底座530，該底座530與$洞521相對位置上分別設有一開孔531，以 供卡勾510穿套而過並凸露在其上，且該底座53〇上設有兩兩相對之開槽 532，該等開槽532相鄰邊分別設有凸出樞孔533，該等樞孔533分別嵌扣 有一扣件534,該等扣件534兩端分別設有向内背折之支腳5341，該等支 腳5341自由端分別可卡扣在卡勾510中’且該扣件534上設有與支腳5341 反向延伸之把手5342，該等把手5342係與支腳5341在同一平面上。 此種裝置在使用時’雖可將散熱模組6〇〇置放在機板8⑽之微處理器 700上，再使卡勾510穿過機板800並凸露在底座53〇上，而將樞設在底座· 530之扣件534支腳5341壓靠在卡勾510上，並卡扣其中，唯因該等扣件 534係極接在底座530上，不但組裝時欲扣不易，且容易因受到底座530魔 迫之力量，從樞接處脫落，在使用上非常不理想。 更何況’上述兩種習用裝置’無論是扣件11〇或是底座53〇或扣件534 在製造上，無法用機器大量生產’某些工序，仍需要人工來完成，在成本 上是很大負擔。 【新型内容】 創作人有鑑於上述一般散熱模組之固定裝置於實施時之缺失，麦精心 鲁 研究’再進一步發展出本案散熱模組之固定裝置。 本創作之一目的，在提供一種散熱模組之固定裝置，其係一種將散熱 裝置固定在機板之裝置，該裝置上設有一散熱模組，該散熱模組底部設有 固定柱，該固定柱上穿過機板下一端設有嵌槽，且該固定柱穿過機板下的 一端設有一彈性件，該彈性件係呈一片體狀，且向外延伸之兩端與直線延 伸方向呈a角之突出，該a角為大於〇度角，使該彈性件之兩端經向下施 壓產生型變’而嵌扣在固定柱之嵌槽上；如此，再透過彈性件之彈性回復 作用，而使散熱模組向機板壓靠，這樣一來，不但使用簡單方便，更不會 4 Μ419Γ32 有空間限制，且所有零件都可以機器大量生產，而能節省製造成本。 本創作之另一目的，於該固定柱上可套設一*^扣件，該卡扣件係疊置 在彈性件上，並使該卡扣件當嵌扣在固定柱之嵌槽上時增加嵌扣之可靠度。 本創作之又一目的，在提供一種散熱棋組之固定裝置，其彈性件與機板間 設有絕緣墊片，不但可加強彈性件與機板間之緊密度，且可作為絕緣用。 本創作之再一目的，在提供一種散熱模組之固定裝置，其彈性件在端 緣上設有緩衝缺孔，以方便彈性件壓靠在固定柱上時，可增加緩衝力，使 彈性件容易進入固定柱令。 【實施方式】 本創作係一種散熱模組之固定裝置，其係一種令散熱模組及機板能緊 密地結合在一起之裝置’請參照第3、4、5圖所示，該裝置設有一固定於 散熱模組10底部之固定柱20，於本實施例為一金屬製成之柱體，該固定柱 2〇係與散熱模組1 〇固定在一起，且該固定柱2〇遠離該散熱模組10之一端 上設有環狀之嵌槽21，又，如第4圖所示，該固定柱20之嵌槽21端係穿 過機板30(於本實施例為介面卡)及相對位於該機板3〇另一側之一絕緣墊片 40(於本實施例為橡膠或塑膠等具有塑性絕緣材料製成之片體），該絕緣墊 片40兩端分別設有一穿孔41，以供固定柱2〇穿套而過，且該絕緣墊片4〇 於遠離該機板30之一側上疊置有一彈性件5〇，該彈性件5〇於本實施例為 金屬製成之片體’該彈性件50並透過絕緣墊片4〇上之固定釘51固定在絕 緣塾片40上’且該彈性件5〇向外延伸之兩端係與直線延伸方向呈^角之 突出，該a角為大於〇度角（如第4圈所示），使該彈性件5〇之兩端經向下 按壓後’在彈性作用下將散熱模組1〇向機板3〇壓靠，以使在機板3〇上之 散熱模組10緊密貼合固定在機板3〇上；又，該彈性件5〇之兩端分別設有 與穿孔41相對之孔52; 使用時，先將散熱模組1〇上之固定柱2〇穿過機板3〇，再使固定柱 20穿過在機板30下之絕緣墊片40之穿孔41 ,並穿過彈性件5〇之孔52， 5 M419132 使孔52固定在嵌槽21中，可透過絕緣墊片40及彈性件50之彈性作用， 緊壓在機板30下，而使在機板30上之散熱模組1〇緊貼機板； 另，在固定柱20上亦可套設有一·^扣件60，於本實施例為一環圈，該 卡扣件60上設有一嵌孔61，該嵌孔61端緣連接有一延伸至卡扣件60邊緣 之間隙62，且該卡扣件60係*置在彈性件5〇上，以令使用時，先將散熱 模組10上之固定柱20穿過機板30 ,使固定柱20穿過在機板30下之絕緣 塾片40之穿孔41，並穿過彈性件50之孔52 ’再將卡扣件60嵌扣在固定 柱20之嵌槽21，使卡扣件60之嵌孔61藉由間隙62之擴展，輕易套設在 嵌槽21 ;其中，絕緣墊片40不但可加強彈性件5〇與機板30間之緊密度， 且可作為絕緣用，再透過彈性件50之彈性作用，緊壓在機板3〇下，而使 在機板30上之散熱模組10緊貼機板3〇(如第3、5囷所示），如此，不但使 用簡單方便，更不會有空間限制，且所有零件都可以機器大量生產，而能 節省製造成本。 請参照第6、7圖所示，其為本創作之另一實施例，該裝置設有一固定 於散熱模'组10(請参照第3圏所示)底部之固定柱2〇，於本實施例為一金屬 製成之柱體’該固定柱20係與熱模組1〇固定在一起，且該固定柱2〇遠離 該散熱模組10之一端上設有環狀之欲槽21 ,又，該固定柱2〇之欲槽21端 係穿過機板30(於本實施例為介面卡)及相對位於該機板3〇另一側之一絕緣 塾片40(於本實施例為橡膝或塑膝等具有塑性絕緣材料製成之片趙），該絕 緣墊片40兩端分別設有一穿礼41，以供固定柱20穿套而過，且該絕緣墊 片40於遠離該機板30之一侧上疊置有一彈性件5〇，於本實施例為金屬製 成之片體，該彈性件50並透過固定釘51固定在絕緣墊片4〇上，且該彈性 件50向外延伸之兩端係與延伸方向呈大於〇度角之突出，使該彈性件5〇 之兩端經向下按壓後，在彈性作用下將散熱模組1〇向機板3〇壓靠，該彈 性件50大於〇度角之突出之兩端分別設有與穿孔41相對之孔兕，使用時’ 先將散熱模組10上之固定柱20穿過機板30，使固定柱2〇穿過在機板3〇 下之絕緣墊片40之穿孔41 ,並穿過彈性件50之孔52，使孔52固定在嵌 M4191.32 槽21中（圖未示）； 此外’該彈性件50在端緣上亦可設有緩衝缺孔53，該緩衝缺孔53並 與孔52相連接，使孔52具有緩衝擴展性，以方便彈性件5〇壓靠在固定柱 20上時’可增加緩衝力，使彈性件50容易進入固定柱20，而讓固定柱易 由孔穿套而過’使用時’先將散熱模組10上之固定柱2〇穿過機板3〇，使 固定柱20穿過在機板3〇下之絕緣墊片40之穿孔41，並穿過彈性件50之 孔52 ’使孔52固定在嵌槽21中，其中，絕緣墊片40不但可加強彈性件 50與機板30間之緊密度，且可作為絕緣用，再透過絕緣墊片4〇與彈性件 50之彈性作用，緊壓在機板3〇下，而使在機板3〇上之散熱模組1〇緊貼機 籲板3〇(如第6、7固所示）。 綜上所述，本創作之一種散熱模組之固定裝置，在產業上具有报大之 利用價值，且可改良習用技術之各種缺點，在使用上能增進功效，合於實 用’充份符合創作專利之要件，實為一理想之創作，故申請人爰專利法之 規定，向鈞局提出新型專利申請，並懇請早曰賜准本案專利，至感德便。 【圖式簡單說明】 第1圖為台灣專利第93214499號之裝置示意圖。 第2圖為另一習知裝置示意圓。 • 第3圖為本創作使用時之立體示意圖。 第4圖為本創作之立體分解圖。 第5圖為本創作之立體組裝示意圖。 第6囫為本創作另一實施時之立體分解示意圓。 第7圖為本創作另一實施時之立體組裝示意圓。 【主要元件符號說明】 散熱模組 10 固定柱 20 嵌槽 91 7 M419132 機板 30 絕緣墊片 40 穿孔 41 彈性件 50 固定釘 51 孔 52 緩衝缺孔 53 卡扣件 60 嵌孔 61 間隙 62 8Μ 419Γ32 V. New Description: [New Technology Field] This creation is a kind of fixing device for the heat dissipation module, especially the elastic module is pressed against the board by the elastic member, so that the heat dissipation module Inch% is closely attached to the board. [Prior Art] According to the fixed structure of the heat dissipation module generally used for the heating elements on the computer board (the board can be the motherboard, the interface card; the heating element can be the chip, the microprocessor), please refer to It is shown in the Japanese Patent No. 93214499. The structure discloses a base 100. The base 1 is located under the plate 200, and each end of the base 1 is respectively extended upward. The pillars 1〇1, the pillars can pass through the holes 201 in the board 200, and the pillars 1〇1 are respectively provided with screw holes 102′′, and the board 200 is disposed between the holes 201. The microprocessor 300 is pressed against a heat dissipation module 400. The heat dissipation module 400 is provided with a fastener 110 on a side facing the microprocessor 3. The fastener 110 ♦ The core is provided with a ring 111, and the ring is sleeved and fixed on the heat dissipation module 400, and the periphery of the ring 111 is provided with outwardly extending legs 112, and the ends of the legs 112 are respectively provided with a hook 113, the hooks 113 are opposite to the pillars 1 ,, so that the screws 120 can pass through the hooks 113 and locked in the screw hole ^ in the pillar ιοί, the foot 112 is snapped on the screw 120, and the heat dissipation module 4 is fixed on the microprocessor 3, but the screw 120 is loosened. In this case, the heat dissipation module 4〇〇 cannot be closely attached to the microprocessor 300, and the screw 120 is located between the board 200 and the heat dissipation module 4, so that the user buckles the leg 112 to the screw 120. At the time, the space is narrow, the operation difficulty is increased, and the operation time and cost are increased. Referring to FIG. 2, the fixing member 5 is fixed on the back surface of the heat dissipation module 600, and the two ends of the fixing member 500 are respectively perpendicular to the fixing member. The hook 510 is further provided with a microprocessor 700 or more than one chip under the heat dissipation module 600. The microprocessor 700 is fixed on a board 800, and the board 800 is surrounded by the microprocessor 7. One or more perforations 810 are respectively disposed, and the perforations 810 are opposite to the hook 510 and can be passed through the hook 3 M419132 510; and the insulating plate 52 is disposed under the plate 800. Each of the end faces of the pad body 52 is provided with a hole 521 for the hook 510 to pass through, and a base 530 is disposed under the insulating pad body 52. The base 530 and the hole 521 are respectively provided with an opening position. The hole 531 is provided for the hook 510 to pass over and protrudes thereon, and the base 53 is provided with two opposite slots 532, and the adjacent sides of the slots 532 are respectively provided with protruding pivot holes. 533, the pivot holes 533 are respectively fastened with a fastening member 534, and the two ends of the fastening members 534 are respectively provided with legs 5341 which are folded inwardly. 5341 and the free ends may be provided with a snap, with the handle on the same plane extending leg of the reverse 5341 of the handle 5342 such legs 5342 and 5341 based on the hook fastener 534 510 '. When the device is in use, the heat dissipation module 6 can be placed on the microprocessor 700 of the board 8 (10), and then the hook 510 is passed through the board 800 and protruded on the base 53 , The fastener 534 leg 5341 pivoted on the base 530 is pressed against the hook 510 and snapped therein, because the fastener 534 is fastened to the base 530, which is not easy to buckle during assembly, and is easy to be Due to the force of the base 530, it is off the pivotal joint, which is very unsatisfactory in use. Moreover, the above two conventional devices, whether the fasteners 11〇 or the base 53〇 or the fasteners 534 are manufactured, cannot be mass-produced by the machine. Some processes still need to be done manually, which is very costly. burden. [New content] The creator has developed the fixing device of the heat dissipation module of this case in view of the lack of the fixing device of the above general heat dissipation module. One of the purposes of the present invention is to provide a fixing device for a heat dissipating module, which is a device for fixing a heat dissipating device to a machine board. The device is provided with a heat dissipating module, and a fixing post is arranged at the bottom of the heat dissipating module. The lower end of the column passes through the bottom plate of the machine plate, and the fixing column is provided with an elastic member at one end of the lower plate. The elastic member has a body shape, and the two ends extending outwardly extend in a straight line. a protrusion of a angle, the angle a is greater than the angle of twist, so that the two ends of the elastic member are pressed downward to produce a shape change and are embedded on the groove of the fixed column; thus, the elastic response of the elastic member is further transmitted. The function is to press the heat dissipation module against the board, so that the use is not only simple and convenient, but also has no space limitation of 4 Μ 419 Γ 32, and all parts can be mass-produced by the machine, and the manufacturing cost can be saved. Another purpose of the present invention is to provide a fastening member on the fixing post, the fastening member is stacked on the elastic member, and the locking member is embedded on the groove of the fixing column. Increase the reliability of the buckle. Another object of the present invention is to provide a fixing device for a heat-dissipating chess set, wherein an insulating gasket is arranged between the elastic member and the machine plate, which not only enhances the tightness between the elastic member and the machine plate, but also serves as an insulation. A further object of the present invention is to provide a fixing device for a heat dissipating module, wherein the elastic member is provided with a buffering hole on the end edge to facilitate the cushioning force when the elastic member is pressed against the fixing column, so that the elastic member is added Easy access to fixed column commands. [Embodiment] The present invention is a fixing device for a heat dissipating module, which is a device for enabling a heat dissipating module and a machine board to be tightly coupled together. Please refer to Figures 3, 4 and 5, which is provided with a device The fixing post 20 fixed to the bottom of the heat dissipation module 10 is a cylinder made of metal in the embodiment, and the fixing post 2 is fixed to the heat dissipation module 1 ,, and the fixing post 2 is away from the heat dissipation. One end of the module 10 is provided with an annular recess 21, and as shown in FIG. 4, the end of the slot 21 of the fixed post 20 passes through the board 30 (in this embodiment, an interface card) and An insulating spacer 40 (in the embodiment, a sheet made of a plastic insulating material such as rubber or plastic) is disposed on the other side of the board 3, and a through hole 41 is respectively disposed at each end of the insulating spacer 40. The fixing post 2 is passed through the sleeve, and the insulating spacer 4 is disposed on a side away from the side of the machine board 30, and an elastic member 5 is disposed on the side of the board 30. The elastic member 5 is a piece made of metal in this embodiment. The elastic member 50 is fixed to the insulating cymbal 40 through the fixing nails 51 on the insulating spacer 4 and the elastic member 5 is turned The two ends of the extension are protruded from the direction in which the straight line extends, and the angle a is greater than the angle of twist (as shown in the fourth circle), so that the ends of the elastic member 5 are pressed downward to be 'elastically acting' The heat-dissipating module 1 is pressed against the board 3〇 so that the heat-dissipating module 10 on the board 3 is tightly fitted and fixed on the board 3; The hole 52 is opposite to the through hole 41; in use, the fixing post 2 of the heat dissipation module 1 is first passed through the plate 3, and then the fixing post 20 is passed through the insulating spacer 40 under the plate 30. The through hole 41 and the hole 52 of the elastic member 5, 5 M419132, the hole 52 is fixed in the slot 21, and can be pressed under the plate 30 through the elastic action of the insulating spacer 40 and the elastic member 50, and The heat-dissipating module 1 on the board 30 is fastened to the board. In addition, a fastening member 60 can be disposed on the fixing post 20. In this embodiment, a ring is provided, and the latch 60 is provided. There is a recessed hole 61. The end of the inserting hole 61 is connected with a gap 62 extending to the edge of the latching member 60, and the latching member 60 is placed on the elastic member 5〇, so that the heat-dissipating module is first used. 10 on The fixing post 20 passes through the plate 30, and the fixing post 20 passes through the through hole 41 of the insulating cymbal 40 under the plate 30, and passes through the hole 52' of the elastic member 50, and then the snap member 60 is fastened to the fixed post. The slot 21 of the latching member 61 allows the insertion hole 61 of the latching member 60 to be easily sleeved in the slot 21 by the expansion of the gap 62. The insulating spacer 40 can not only strengthen the tightness between the elastic member 5 and the board 30. Degree, and can be used as insulation, and then through the elastic action of the elastic member 50, pressed under the plate 3, so that the heat dissipation module 10 on the plate 30 is close to the plate 3 (such as the third, fifth囷)), not only is it easy to use, but it does not have space constraints, and all parts can be mass-produced by machines, which can save manufacturing costs. Please refer to FIG. 6 and FIG. 7 , which is another embodiment of the present invention. The device is provided with a fixing post 2 固定 fixed to the bottom of the heat dissipation mold set 10 (please refer to FIG. 3 ). For example, a column made of metal is fixed to the heat module 1 , and the fixed column 2 is disposed at an end of the heat dissipation module 10 and has an annular groove 21 . The fixing post 2 is intended to pass through the plate 30 (in the present embodiment, an interface card) and an insulating cymbal 40 opposite to the other side of the plate 3 (in this embodiment, the rubber a piece of plastic insulating material, such as a knee or a plastic knee, is provided with a gift 41 on both ends of the insulating spacer 40 for the fixing post 20 to pass through, and the insulating spacer 40 is away from the machine. An elastic member 5 is stacked on one side of the plate 30. In this embodiment, the metal member is fixed to the insulating spacer 4 through the fixing nail 51, and the elastic member 50 is oriented. The two ends of the outer extension are protruded at a greater angle than the extension angle, so that the two ends of the elastic member 5 are pressed downward, and the heat dissipation module 1 is elastically acted upon. Pressing against the plate 3 of the elastic member 50, the two ends of the protruding portion of the elastic member 50 are respectively provided with holes opposite to the through holes 41. When used, the fixing column 20 on the heat dissipation module 10 is first passed through the plate. 30, the fixing post 2 〇 passes through the through hole 41 of the insulating spacer 40 under the cymbal plate 3, and passes through the hole 52 of the elastic member 50, so that the hole 52 is fixed in the slot M4191.32 (not shown) In addition, the elastic member 50 may be provided with a buffering hole 53 on the end edge, and the buffering hole 53 is connected to the hole 52, so that the hole 52 has a cushioning property to facilitate the elastic member 5 to be pressed against When the column 20 is fixed, the buffering force can be increased, so that the elastic member 50 can easily enter the fixing column 20, and the fixing column can be easily passed through the hole. When the 'in use, the fixing column 2 on the heat dissipation module 10 is first passed through. The plate 3 is folded so that the fixing post 20 passes through the through hole 41 of the insulating spacer 40 under the plate 3 and passes through the hole 52' of the elastic member 50 to fix the hole 52 in the slot 21, wherein the insulating pad The sheet 40 can not only strengthen the tightness between the elastic member 50 and the plate 30, but also can be used as insulation, and then penetrates through the elastic action of the insulating spacer 4 and the elastic member 50, and is pressed against 3〇 lower plate, the heat dissipation module on board of the 1〇 3〇 Calls plate against 3〇 machine (6, 7 as shown in solid). In summary, the fixing device of the heat dissipating module of the present invention has the use value of the newspaper in the industry, and can improve various shortcomings of the conventional technology, can improve the function in use, and is suitable for practical use. The requirements of the patent are actually an ideal creation. Therefore, the applicant has filed a new patent application with the Bureau of the Patent Law, and he is requested to grant the patent in the case as soon as possible. [Simple description of the drawing] Fig. 1 is a schematic view of the device of Taiwan Patent No. 93214499. Figure 2 is a schematic representation of another conventional device. • Figure 3 is a three-dimensional illustration of the creation of the creation. Figure 4 is an exploded perspective view of the creation. Figure 5 is a three-dimensional assembly diagram of the creation. The sixth is a three-dimensional decomposition schematic circle for another implementation of the creation. Figure 7 is a perspective assembly circle of another implementation of the creation. [Main component symbol description] Heat dissipation module 10 Fixing post 20 Insert groove 91 7 M419132 Machine plate 30 Insulation gasket 40 Perforation 41 Elastic member 50 Fixing nail 51 Hole 52 Buffering hole 53 Fastener 60 Insert hole 61 Clearance 62 8