201016984 六、發明說明： 【發明所屬之技術領域】 本發明是一種散熱元件扣具及散熱裝置，特別是一種可使用於不同規 格之基座（Socket)的散熱元件扣具及散熱裝置。 _ 【先前技術】 隨著電子產業之蓬勃迅速發展，中央處理器（CPU)的電晶體密度曰 益增加，雖然運行頻率愈來愈高，但消耗的功率以及產生的熱量也越來越 增加。為了讓中央處理器能穩定運作，係於中央處理器上設置由複數鰭片 ® 組成之散熱片，並可於散熱片上設置風扇，使中央處理器於運算時所產生 之大部份熱量可由散熱片所吸收’並可同時啟動風扇運轉強化散熱片之散 熱效果》 電路板之表面預先焊設有中央處理器，為了將散熱片組合於中央處理 器上’散熱片之表面對應中央處理器的四端角對稱開設有穿孔，電路板則 於中央處理器的四端角相對散熱片穿孔之相對位置，對應設有相同孔徑之 透孔，再將插柱插入穿孔與透孔而將散熱片穩固於中央處理器之表面上。 此外’隨著中央處理器規格的不同，電路板配合各種基座（socket)及 散熱器固定架所制定之孔位並不相同，例如Intel c〇re2 Duo處理器所適用 之基座（Socket)有 socket 775、socket 1160 及 socket 1366 三種，至於K8 或其他處理器亦是適用不同基座（Socket)。因此，業者必須針對不同規格 之中央處理器備有不同之散熱器固定架，不僅相當麻煩，也容易造成備料 存貨過多之問題。 【發明内容】 有鑑於此’本發明提出一種散熱元件扣具，配合複數鎖固元件與設有 201016984 複數穿孔之電路板，以扣持散熱元件於電路板，散熱元件扣具包含：框鱧， 用以套設散熱元件；複數定位件，位於框體之側邊，每一定位件包含一個 定位孔，定位孔位置對應電路板之複數穿孔位置，每一定位孔内包含不 - 同位置的複數定位部；及複數定位套件，分別通過複數定位孔並卡合於複 - 數定位部其中之一’以供複數鎖固元件穿設對應之定位孔固定於電路板的 該穿孔，並扣持散熱元件於電路板。 本發明亦提出一種散熱裝置，配合複數鎖固元件而固定於設有複數穿 ❿ 孔之電路板，散熱裝置包含：散熱元件，位於電路板上；及散熱元件扣具， 用以扣持散熱元件於電路板’包含；框體，用以套設散熱元件；複數定位 件’位於框體之側邊’每一定位件包含一個定位孔，定位孔位置對應於電 路板之複數穿孔位置，每一定位孔内包含不同位置的複數定位部；及複數 定位套件，分別通過複數定位孔並卡合於複數定位部其中之一，以供複數 鎖固元件穿設對應之定位孔固定於電路板的穿孔’而使散熱元件扣具扣持 散熱元件於電路板。 〇 本發明於散熱元件扣具上設有定位用之定位孔，並使定位套件通過定 位孔並卡合於複數定位部其中之一，使用時僅需使鎖固元件穿設對應之定 位孔固疋於電路板的穿孔，即可使散熱元件扣具扣持散熱元件而定位於電 - 路板上，藉此可使散熱元件扣具通用於各種不同之電子元件及基座 (Socket)，而不須因應不同規格之電子元件及基座採用不同扣具，不但使 扣具的庫存管理恳為容易，並可免除多種扣具之備料問題。 以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其内容足以 使任何熟習相關技藝者瞭解本發明之技術内容並據以實施，且根據本說明 5 201016984 書所揭露之内容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理 解本發明相關之目的及優點。 【實施方式】 - 請參M 1 ®至第6B圖所示’係為本咖第-實施靖揭露之散熱裝 置，散熱裝置1技置於具有電子元件51之電路板5上，電路板5於設置電 子元件51之側邊設有複數穿孔52，在此，電子元件51可為十央處理器 (CPU)，然、非以此為限’本發明亦可設置於其他發熱之電子元件上而提供 ❹散熱之用，此外，電子元件S1可預先焊設於電路板5上，或是裝設於電路 板5之基座（Socket) 55上。散熱裝置！包含有散熱元件u、散熱元件扣 具12、複數鎖固元件15、複數定位套件16。 散熱元件11 ’位於電子元件51上’用以傳導電子元件51所產生之熱 量，在此，散熱元件11較佳地可為由複數韓片lu所組成之散熱鰭片組， 但本發明不限於此。 散熱元件扣具12，用以扣持散熱元件u使其可貼緊電子元件51之表 ❹面’而散熱元件扣具12主要可由框體121、複數連接臂124及複數定位件 125所組成，其中，框體121較佳地概呈圓形狀而套設散熱元件u上，但 -框體121亦可依實際設計或結構需求採用其他適合的形狀，再者，框體121 可以對稱方式延伸設置複數連接臂124，並於每一連接臂124之末端延伸設 置定位件125。此外，定位件125穿設有長形之定位孔126，其中，複數定 位孔126位置對應於電路板5之複數穿孔52位置，且定位孔126設有不同 位置的複數定位部1261 (如第3圖所示）。 於前述說明中，框體121可延伸設置複數抵壓片122，於框體121套設 201016984 散熱元件η上時以複數抵壓片122抵壓散熱元件u。在此，複數抵壓片 ⑵可對應複數連接臂124設置，或可以對稱方式設置於框體ΐ2ΐ而使抵壓 散熱元件11之力量均勻分佈。 ' 綱元件15，穿設於電路板5之穿孔52 定於對射孔52之 .定位孔126 ’使散熱元件扣具12定位於電路板5上，在此，鎖固元件15可 為Μ扣式鎖栓（pushpin)(如第6Α圖所示），或可為彈菁螺絲（如第册圖 所示），但本發明不限於此。 • 定位套件16，具有定位凸點161，於定位套件16裝人定佩126内， 定位凸點⑹狀定位部1201而使定位套件16定位於定位孔⑼内定 位凸點161可藉由喪入不同定位部1261改變定位套件16的位置。 使用時先將電子元件5!裝設於電路板5之基座（s〇cket) %，並將散 熱元件11安裝於電子元件51上，再將散熱元件扣具12套設散熱元件u 上，以複數抵麼片m抵磨散熱元件11後，將定位套件1ό裝入定位孔126 内，並藉由喪入不同定位部1261調整定位套件16之位置使其對準電路板5 參之穿孔52 ’績以鎖固元件15通過相對應之定位孔126以固定於穿孔52， 使散熱兀件扣具12穩固地定位於電路板5上，即可使散熱元件u之複數 • 鰭片111傳導電子元件51所產生之熱量。由於定位套件16可調整其於定 . 位孔126内之位置’因此當電子元件51及電路板5之基座（s〇cket) 55、 穿孔52的規格或位置改變，僅需使定位凸點161藉由嵌入不同定位部i26i 調整定位套件16之位置，使其對準電路板5之穿孔52即可（如第5A圖至 第5C囷所示），有效提升散熱元件扣具12之共用性。 請參閲第7圖、第8A圖及第8B圖所示，係為本發明第二實施例所揭 201016984 露之散熱裝置。在本實施例中’為了提升散熱元件11之散熱效率，可於散 熱元件11上方加裝風扇18。在此，散熱元件扣具12可於框體121延伸設 置複數扣鉤127，風扇18則設有對應複數扣鉤127之複數扣持部181，以 扣鉤127扣持與其相對應之扣持部181，使風扇18可穩固地定位於散熱元 ' 件扣具12之框體121上。在此，散熱元件11、散熱元件扣具12、複數鎖 固元件15、複數定位套件16等元件之結構相同於前述說明’在此不再累述。 於前述說明中，散熱元件扣具12可於框體121延伸設置複數定位柱 ❿ 128 ’風扇18則設有對應複數定位柱128之複數透孔182，於安裝風扇18 時將定位柱128穿入透孔182内（如第8A圖及第8B圖所示），再以扣鉤 127扣持扣持部181而使風扇18定位於散熱元件扣具12上。 本發明以一體成型製成扣具，並於散熱元件扣具上設有定位用之定位 孔’並於定位孔内適當位置處設置定位套件，由於不同位置之定位套件對 應不同規格之電路板的穿孔，因此在使用時僅需穿設鎖固元件於電路板之 穿孔及相對應之定位孔，即可使扣具扣持散熱鰭片組而定位於電路板上， ❿使得散熱元件扣具可通麟各種不同之電子元件及基座（s〇cket)，而不須 因應抑規格之電子藉.及基座朗製料隨格之扣具，因此藉由本發 - 明可使扣具的庫存管理更為容易，不僅解決扣具之備料問題，並可達到降 - 低庫存成本之目的。 雜本發_技躺容6經雜佳實補揭露如上，雜麟用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神所作些許之更動與 湖飾，皆應涵蓋於本發明的範嘴内，因此本發明之保護範圍當視後附之申 請專利範圍所界定者為準。 201016984 【圖式簡單說明】 第1圖為本發明第一實施例之分解示意圖。 第2圖為本發明第一實施例之外觀示意圖β 第3圖為本發明第一實施例之扣具的示意圖（一）。 第4Α圖為本發明第一實施例之定位套件的示意圖（―）。 第4Β圖為本發明第一實施例之定位套件的示意圖（二）。 第5Α圖為本發明第一實施例調整鎖固元件位置之示意圖（―）。 第5Β圖為本發明第一實施例調整鎖固元件位置之示意圖（二）。 第5C圖為本發明第一實施例調整鎖固元件位置之示意圖（三）。 第6Α圖為本發明第一實施例之鎖固元件的示意圖（〆）。 第6Β圓為本發明第一實施例之鎖固元件的示意圖（二）。 第7圖為本發明第二實施例之分解示意圖。 ❹ 第8Α圖為本發明第二實施例組裝風扇之示意圖（一）。 第8Β圖為本發明第二實施例組裝風扇之示意圖（二）。 【主要元件符號說明】 I ..............散熱裝置 II ..............散熱元件 III .............鰭片 12..............散熱元件扣具 121 .............框體 122 .............抵壓片 124 連接臂 201016984 125 .............定位件 126 .............定位孔 1261.............定位部 127 .............扣鉤 128 .............定位柱 15 ..............鎖固元件 16 ..............定位套件201016984 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating component clip and a heat dissipating device, and more particularly to a heat dissipating component clip and a heat dissipating device which can be used for different specifications of a Socket. _ [Prior Art] With the rapid development of the electronics industry, the density of transistors in the central processing unit (CPU) has increased. Although the operating frequency has become higher and higher, the power consumed and the amount of heat generated have also increased. In order to make the central processing unit stable, a heat sink composed of a plurality of fins is disposed on the central processing unit, and a fan is disposed on the heat sink, so that most of the heat generated by the central processing unit during operation can be dissipated. The film absorbs 'and can start the fan operation to enhance the heat dissipation effect of the heat sink.' The surface of the circuit board is pre-welded with a central processing unit. In order to combine the heat sink on the central processor, the surface of the heat sink corresponds to the central processor. The end angle is symmetrically opened with a perforation, and the circuit board is opposite to the perforation of the heat sink by the four end angles of the central processing unit, corresponding to the through holes of the same aperture, and then the insertion post is inserted into the through hole and the through hole to stabilize the heat sink. On the surface of the central processor. In addition, with the different specifications of the central processing unit, the board has different hole positions for various sockets and heat sink holders, such as the socket for the Intel c〇re2 Duo processor. There are three types of socket 775, socket 1160 and socket 1366. As for K8 or other processors, different Sockets are also available. Therefore, the manufacturer must have different heat sink holders for different sizes of CPUs, which is not only troublesome, but also prone to excessive stocking. SUMMARY OF THE INVENTION In view of the above, the present invention provides a heat dissipating component fastener, which cooperates with a plurality of locking components and a circuit board provided with a plurality of perforated holes of 201016984 to hold a heat dissipating component on a circuit board, and the heat dissipating component fastener includes: a frame, The plurality of positioning members are disposed on the side of the frame body, and each of the positioning members includes a positioning hole, wherein the positioning hole position corresponds to a plurality of perforation positions of the circuit board, and each of the positioning holes includes a plurality of positions in the same position The positioning portion and the plurality of positioning kits respectively pass through the plurality of positioning holes and are engaged with one of the plurality of positioning portions to fix the plurality of locking elements to the perforations of the circuit board through the corresponding positioning holes, and to hold the heat dissipation The component is on the board. The invention also provides a heat dissipating device, which is fixed to a circuit board provided with a plurality of through holes by means of a plurality of locking elements, the heat dissipating device comprises: a heat dissipating component, which is located on the circuit board; and a heat dissipating component buckle for holding the heat dissipating component The circuit board includes: a frame for arranging the heat dissipating component; the plurality of positioning members are located at the side of the frame. Each of the positioning members includes a positioning hole, and the positioning hole position corresponds to a plurality of perforation positions of the circuit board, and each The positioning hole includes a plurality of positioning portions at different positions; and the plurality of positioning kits respectively pass through the plurality of positioning holes and are engaged with one of the plurality of positioning portions, so that the plurality of locking elements are pierced by the corresponding positioning holes and fixed to the circuit board. 'Allow the heat-dissipating component clip to hold the heat-dissipating component on the board. The present invention is provided with a positioning hole for positioning on the heat-dissipating component fastener, and the positioning kit is passed through the positioning hole and is engaged with one of the plurality of positioning portions, and only the locking component is required to pass through the corresponding positioning hole. The perforation of the circuit board enables the heat dissipating component clip to be fastened to the electric board by the heat dissipating component, thereby allowing the heat dissipating component clip to be used for various electronic components and Sockets. It is not necessary to use different fasteners for electronic components and pedestals of different specifications, which not only makes the inventory management of the buckles easy, but also eliminates the problem of preparing various fasteners. The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient to enable the skilled person to understand the technical contents of the present invention and to implement the present invention, and the content disclosed in the Japanese Patent Application No. The related objects and advantages of the present invention will be readily understood by those skilled in the art. [Embodiment] - Please refer to the heat dissipation device of the present invention disclosed in M 1 ® to 6B. The heat sink 1 is placed on the circuit board 5 having the electronic component 51, and the circuit board 5 is The side of the electronic component 51 is provided with a plurality of through holes 52. Here, the electronic component 51 can be a ten-phase processor (CPU). However, the present invention can also be disposed on other heat-generating electronic components. The electronic component S1 can be soldered to the circuit board 5 in advance or mounted on the Socket 55 of the circuit board 5. Heat sink! A heat dissipating component u, a heat dissipating component fastener 12, a plurality of latching components 15, and a plurality of positioning kits 16 are included. The heat dissipating component 11' is located on the electronic component 51 for conducting heat generated by the electronic component 51. Here, the heat dissipating component 11 may preferably be a heat dissipating fin set composed of a plurality of Korean lu, but the invention is not limited thereto. this. The heat dissipating component fastener 12 is configured to hold the heat dissipating component u so as to be in close contact with the surface of the electronic component 51. The heat dissipating component fastener 12 can be mainly composed of the frame body 121, the plurality of connecting arms 124 and the plurality of positioning members 125. The frame body 121 preferably has a circular shape and is disposed on the heat dissipating component u. However, the frame body 121 may adopt other suitable shapes according to actual design or structural requirements. Further, the frame body 121 may be extended in a symmetric manner. A plurality of connecting arms 124 are disposed, and a positioning member 125 is extended at an end of each connecting arm 124. In addition, the positioning member 125 is provided with an elongated positioning hole 126. The position of the plurality of positioning holes 126 corresponds to the position of the plurality of holes 52 of the circuit board 5, and the positioning holes 126 are provided with a plurality of positioning portions 1261 at different positions (eg, the third Figure shows). In the above description, the frame body 121 can be extended with a plurality of pressing pieces 122. When the frame body 121 is sleeved with the 201016984 heat dissipating element η, the plurality of pressing pieces 122 are pressed against the heat dissipating element u. Here, the plurality of pressing pieces (2) may be disposed corresponding to the plurality of connecting arms 124, or may be disposed symmetrically to the frame ΐ2ΐ to uniformly distribute the force of the pressing heat dissipating member 11. The splicing element 15 is disposed on the circuit board 5, and the locking element 15 can be a snap fastener. A push pin (as shown in Fig. 6), or may be a spring screw (as shown in the book diagram), but the invention is not limited thereto. • The positioning kit 16 has a positioning bump 161, and is positioned in the positioning sleeve 16 to position the protrusion 126, and the positioning protrusion 16 is positioned in the positioning hole (9) to locate the protrusion 161. The different positioning portions 1261 change the position of the positioning kit 16. In use, the electronic component 5! is first mounted on the base of the circuit board 5, and the heat dissipating component 11 is mounted on the electronic component 51, and the heat dissipating component fastener 12 is placed on the heat dissipating component u. After the heat sinking element 11 is abutted by the plurality of pieces, the positioning kit 1 is inserted into the positioning hole 126, and the position of the positioning kit 16 is adjusted by the different positioning portions 1261 to align the board 5 with the hole 52. The performance of the locking element 15 is fixed to the perforation 52 through the corresponding positioning hole 126, so that the heat-dissipating clip 12 is firmly positioned on the circuit board 5, so that the plurality of heat-dissipating elements u • the fins 111 conduct electrons The heat generated by element 51. Since the positioning kit 16 can adjust its position within the positioning hole 126, so when the specifications or positions of the shackles 55 and the perforations 52 of the electronic component 51 and the circuit board 5 are changed, only the positioning bumps need to be made. The 161 adjusts the position of the positioning kit 16 by embedding the different positioning portions i26i so as to be aligned with the through holes 52 of the circuit board 5 (as shown in FIGS. 5A to 5C), thereby effectively improving the commonality of the heat dissipating component clips 12. . Please refer to FIG. 7 , FIG. 8A and FIG. 8B , which are the heat dissipation device of the 201016984 disclosed in the second embodiment of the present invention. In the present embodiment, in order to improve the heat dissipation efficiency of the heat dissipating member 11, a fan 18 may be attached above the heat dissipating member 11. Here, the heat dissipating component fastener 12 can extend a plurality of clasps 127 on the frame body 121, and the fan 18 is provided with a plurality of latching portions 181 corresponding to the plurality of clasps 127, and the hooks 127 are fastened to the corresponding latching portions. 181, the fan 18 can be stably positioned on the frame 121 of the heat dissipating member. Here, the components of the heat dissipating component 11, the heat dissipating component clip 12, the plurality of latching components 15, the plurality of positioning kits 16, and the like are the same as those described above, and will not be described again. In the foregoing description, the heat dissipating component fastener 12 can extend a plurality of positioning posts ❿ 128 in the frame 121. The fan 18 is provided with a plurality of through holes 182 corresponding to the plurality of positioning posts 128. When the fan 18 is installed, the positioning post 128 is inserted. In the through hole 182 (as shown in FIGS. 8A and 8B ), the hook portion 127 is used to fasten the fan 18 to the heat dissipating component clip 12 . The invention is integrally formed into a buckle, and a positioning hole for positioning is provided on the heat-dissipating component buckle, and a positioning kit is disposed at an appropriate position in the positioning hole, because the positioning kits of different positions correspond to different specifications of the circuit board. Perforation, so only need to wear the locking component to the perforation of the circuit board and the corresponding positioning hole during use, so that the buckle can be fixed on the circuit board by holding the heat dissipation fin set, so that the heat dissipation component buckle can be Tonglin's various electronic components and pedestals are not required to be used in accordance with the specifications of the electronic and the pedestal of the pedestal. Therefore, the inventory of the fasteners can be obtained by the present invention. Management is easier, not only to solve the problem of stocking of the fasteners, but also to achieve the purpose of lowering and lowering the inventory cost.杂 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The scope of the invention is therefore defined by the scope of the appended claims. 201016984 [Simplified Schematic Description] Fig. 1 is an exploded perspective view showing a first embodiment of the present invention. 2 is a schematic view showing the appearance of a first embodiment of the present invention. FIG. 3 is a schematic view (1) of the buckle according to the first embodiment of the present invention. Figure 4 is a schematic view (-) of the positioning kit of the first embodiment of the present invention. Figure 4 is a schematic view (2) of the positioning kit of the first embodiment of the present invention. Fig. 5 is a schematic view (-) showing the position of the locking member in the first embodiment of the present invention. Figure 5 is a schematic view (2) of adjusting the position of the locking member according to the first embodiment of the present invention. FIG. 5C is a schematic view (3) of adjusting the position of the locking component according to the first embodiment of the present invention. Figure 6 is a schematic view (〆) of the locking member of the first embodiment of the present invention. The sixth round is a schematic view (2) of the locking element of the first embodiment of the present invention. Figure 7 is an exploded perspective view of a second embodiment of the present invention. ❹ Figure 8 is a schematic view (1) of assembling a fan according to a second embodiment of the present invention. Figure 8 is a schematic view (2) of assembling a fan according to a second embodiment of the present invention. [Description of main component symbols] I..............heat sink II..............heat radiating element III ......... ....Fin 12..............heating element clip 121.............frame 122........ ..... resisting piece 124 connecting arm 201016984 125 ............. positioning piece 126 ............. positioning hole 1261..... ........ positioning part 127 ............. clasp 128 ............. positioning post 15 ....... .......locking element 16 .............. positioning kit
161.............定位凸點 18........... · · · ·風扇 181 .............扣持部 182 .............透孔 5..............電路板 51 ..............電子元件 52 ..............穿孔 55..............基座161..................Positioning bumps 18......... · · · · Fan 181 .............Bucking Department 182 .............through hole 5..............circuit board 51 ..............electronic Element 52 ..............Perforated 55..............Base