1321440 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種固定裝置，尤係指一種將冷卻電子 元件之散熱器固定於電路板上之散熱器固定裝置。 【先前技術】 隨著電腦產業不斷發展，電子元件（尤其係安裝在顯 卡視頻圖像卡上之晶片）運行頻率和速度不斷提升，發 熱量越來越大，若不及時排除，熱量累積引起溫度升高， 影響發熱電子元件之正常運行。 通常業界通常係通過—扣具將散熱器安裝在電子元件 Hi助其散熱。由於顯+忐鉬瓶国你上τ .1321440 IX. Description of the Invention: [Technical Field] The present invention relates to a fixing device, and more particularly to a heat sink fixing device for fixing a heat sink for cooling an electronic component to a circuit board. [Prior Art] With the continuous development of the computer industry, the operating frequency and speed of electronic components (especially those mounted on the video image card of the video card) are constantly increasing, and the heat generation is getting larger and larger. If not eliminated in time, the heat accumulation causes temperature. Raise, affecting the normal operation of the heating electronic components. Usually, the industry usually installs the heat sink on the electronic component by means of a clip to help it dissipate heat. Because of the display + 忐 molybdenum bottle country you are on τ.
心令穷牡铞作中損壞周圍之其他電子元件 【發明内容】Other electronic components that damage the surrounding oysters in the heart [Invention]
安全之散Safety
連接之連接桿， 將一散熱器固定在電路板 面之背板以及可將所述背 該連接桿包括可卡在散熱 6 1321440 '' 器上之第一端以及可依次穿過散熱器、電路板及背板第二 端，所述背板設置有與所述連接桿第二端配合之扣線。 ' 上述散熱器固定裝置通過連接桿與背板下面之扣線配 合，將散熱裝置穩固在電子元件上，其安裝過程無需借助 任何相關工具，既簡單方便，又安全可靠。 【實施方式】 圖1至圖5揭示本發明第一實施例中之散熱器固定裝 鲁置30，該散熱器固定裝置30用於將散熱裝置20固定在電 路板10上，對安裝在電路板10上之電子元件12進行散熱。 該電路板10可為顯卡、視頻圖像卡或主機板等，其上安裝 之電子元件12係圖片處理晶片等高功率電子元件，其在運 行時會釋放出大量之熱。該電子元件12周圍對稱開設有供 散熱器固定裝置30使用之四穿孔14。 如圖1所示，該散熱裝置20包括一基座22、焊接至基 座22上之複數散熱鰭片24、一安裝於基座22並位於散熱 籲鰭片24 —側之風扇26及一罩設於基座22上之蓋體21，該 蓋體21可將散熱鰭片24及風扇26罩設于蓋體21與基座 22之間。該基座22邊緣處設有四階梯孔220，該等階梯孔 220分別與電路板10上之穿孔14對應，該階梯孔220具有 一臺階部2202及透孔2204。該風扇26設置於基座22之一 端，正對散熱鰭片24形成之空氣流道。該蓋體30具有一 頂壁210及自該頂壁210向下延伸設置之側壁212,該頂壁 210與基座22相隔設置，該頂壁210正對風扇26處設有一 1321440 . 進風口 214，該蓋體21與基座22之間形成一出風口 216， 該出風口 216出風方向與進風口 214之進風方向垂直。 ' 請參閱圖4,該散熱器固定裝置30包括複數套設有彈 簧33之連接桿32、一供連接桿32穿設之背板34以及二設 於背板34下方與連接桿32扣合之扣線36。該連接桿32 由彈性良好之塑膠材料一體成型，連接桿32包括一柱體 324、一形成於柱體324 —端之凸緣322及一形成於柱體324 另一端之倒鈎326，該凸緣322呈六棱柱狀，該倒鈎326 ^ 中間開設一扣孔3260，在自然狀態下，該彈性倒鈎326之 圍徑小於凸緣322且大於柱體324之圍徑。該彈簧33套設 在柱體324上面並位於凸緣322與倒鈎326之間，彈簧321 之外徑略小於散熱裝置20基座22上階梯孔220之臺階部 2202之直徑，以使在連接桿32之倒鈎326穿過階梯孔220 之透孔2204時，彈簧321抵壓在臺階部2202上面。 該背板34由金屬材料製成，其具有一大致呈矩形之本 _ 體340，該本體340周緣向下彎折形成側緣342，以起到加 固背板34防止變形之作用。本體340之四個角落上分別設 置有一圓臺344，該圓臺344上開設有與散熱裝置20基座 22上之階梯孔220及電路板10之穿孔14對應、供連接桿 32穿設之通孔3440。該本體340中央位置開設有一鉚合部 346，該鉚合部346由本體340向下沖折出之兩矩形片體並 相對彎折形成。 該扣線36可由金屬線彎折而成，其大體呈U形彎曲， 扣線36中部具有一平直之結合部分362 ’該結合部分362 1321440 兩端分別同向成鈍角彎折形成彎曲之彈性扣臂（未標號）， ^ 該扣臂中部相對背板34突起彎曲，且其末端形成扣鈎 • 364，該扣鈎364由彈性臂提供彈力而向上翹起。其中該結 合部分362與背板34之鉚合部346鉚合在一起，扣鈎364 穿過連接桿32底部扣孔3260與連接桿32連接。 安裝散熱裝置20時，先將散熱裝置20放置於電路板 10上，並使其基座22上之階梯孔220與電路板10上之穿 孔14對準，同時將背板34放置於電路板10下，並使其圓 •臺34上之通孔3440對齊穿孔14。接著下壓連接桿32使其 底端之倒鈎326依次穿過散熱器20基座22上之透孔 2204、電路板10之穿孔14以及背板34之通孔3440,並突 — 出於背板34下方，此時套設在連接桿32上之彈簧321被 • 壓縮在凸緣322與基座22之臺階部2202之間。然後對固 定在背板34下之扣線36施力使其變形彎曲，並使扣線36 末端之扣鈎364穿過倒鈎326上之扣孔3260，緊接著解除 籲外力使連接桿32與扣線34卡掣固定，如此依次安裝其餘 之連接桿32，使兩扣線36末端之扣鈎364分別與各連接桿 32之扣孔3260卡扣固定，從而將散熱器20穩固安裝在電 路板10上。 上述散熱器固定裝置30通過連接桿32與背板34下面 之扣線36配合，將散熱裝置20穩固在電子元件上，其安 裝過程無需借助任何相關工具，既簡單方便，又安全可靠。 如圖6至圖8所示，本發明第二實施例中之散熱器固 定裝置30’與第一實施例中散熱器固定裝置30之不同點 i 9 1321440 在於第—實施中之連接桿38之係由剛度較大之金屬線變折 而成，該連接桿38包括一形成於連接桿38第一端之凸緣 382、一形成於連接桿38第二端之扣部386及一連接兩端 之連接部384，該連接桿38上套設有彈簧％ ,其中該凸緣 382、連接部384及扣部386均由一金屬線一體彎折而成， 該凸緣382呈圓圈狀，由金屬線之一端彎折形成，該金屬 線之另鈿垂直凸緣382向一侧延伸再彎折回到凸緣382 籲之圓圈内，該彎折部形成圓圈狀扣部386，該扣部中間 之孔為扣孔3860，連接部384由彎折緊靠之兩段金屬線形 成。可見，該連接桿38之構造與第一實施例中連接桿32 之構造大同小異，實現之功能一致，它們之安裝過程亦完 全一樣，但該連接桿38由金屬線彎折而成，成本相對較低。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 _或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例中散熱器固定裝置及使用該 散熱器固定裝置之散熱裝置之立體分解圖。 圖2係圖1之立體組合圖》 圖3係圖2中散熱器固定裝置與散熱裝置之底部視圖。 圖4係圖1中散熱器固定裝置之部分分解圖。 圖5係圖2中散熱器固定裝置與散熱裝置之側視圖。 1321440 圖6係本發明第二實施例中散熱器固定裝置與散熱裝 置之立體分解圖。 ' 圖7係圖6中散熱器固定裝置與散熱裝置組合之底部 視圖。 圖8係圖6中連接桿之放大圖。 【主要元件符號說明】Connecting a connecting rod, fixing a heat sink to the backplane of the circuit board surface, and connecting the connecting rod to the first end of the heat sink 6 1321440 '', and sequentially passing through the heat sink, the circuit a second end of the plate and the back plate, the back plate being provided with a buckle line that cooperates with the second end of the connecting rod. The above-mentioned heat sink fixing device cooperates with the buckle line under the back plate to stabilize the heat sink on the electronic components, and the installation process is simple, convenient, safe and reliable without any relevant tools. 1 to 5 show a heat sink fixing device 30 in a first embodiment of the present invention. The heat sink fixing device 30 is used to fix the heat sink 20 on the circuit board 10, and is mounted on the circuit board. The electronic component 12 on the 10 performs heat dissipation. The circuit board 10 can be a video card, a video image card or a motherboard, etc., and the electronic components 12 mounted thereon are high-power electronic components such as picture processing chips, which release a large amount of heat during operation. Four through holes 14 for use in the heat sink fixture 30 are symmetrically disposed around the electronic component 12. As shown in FIG. 1 , the heat sink 20 includes a base 22 , a plurality of heat dissipation fins 24 soldered to the base 22 , a fan 26 mounted on the base 22 and located on the side of the heat dissipation fin 24 , and a cover. The cover 21 is disposed on the base 22, and the cover 21 can cover the heat dissipation fins 24 and the fan 26 between the cover 21 and the base 22. Four stepped holes 220 are defined in the edge of the base 22, and the stepped holes 220 respectively correspond to the through holes 14 on the circuit board 10. The stepped holes 220 have a step portion 2202 and a through hole 2204. The fan 26 is disposed at one end of the base 22 and faces the air flow path formed by the heat dissipation fins 24. The cover body 30 has a top wall 210 and a side wall 212 extending downward from the top wall 210. The top wall 210 is spaced apart from the base 22. The top wall 210 is opposite to the fan 26 and is provided with a 1321440. The air inlet 214 An air outlet 216 is formed between the cover 21 and the base 22, and the air outlet 216 is perpendicular to the air inlet direction of the air inlet 214. Referring to FIG. 4 , the heat sink fixing device 30 includes a plurality of connecting rods 32 provided with springs 33 , a backing plate 34 through which the connecting rods 32 are disposed, and two disposed under the backing plate 34 and fastened with the connecting rods 32 . Buckle line 36. The connecting rod 32 is integrally formed of a plastic material with good elasticity. The connecting rod 32 includes a cylinder 324, a flange 322 formed at the end of the cylinder 324, and a barb 326 formed at the other end of the cylinder 324. The edge 322 has a hexagonal prism shape, and a buckle hole 3260 is defined in the middle of the barb 326 ^. In the natural state, the diameter of the elastic barb 326 is smaller than the flange 322 and larger than the circumference of the cylinder 324. The spring 33 is sleeved on the cylinder 324 and located between the flange 322 and the barb 326. The outer diameter of the spring 321 is slightly smaller than the diameter of the step portion 2202 of the stepped hole 220 on the base 22 of the heat sink 20, so that the connection is made. When the barb 326 of the rod 32 passes through the through hole 2204 of the stepped hole 220, the spring 321 is pressed against the step portion 2202. The backing plate 34 is made of a metal material and has a substantially rectangular body 340. The periphery of the body 340 is bent downward to form a side edge 342 for reinforcing the backing plate 34 to prevent deformation. A circular table 344 is disposed on each of the four corners of the main body 340. The circular table 344 is provided with a stepped hole 220 on the base 22 of the heat sink 20 and a through hole 14 of the circuit board 10 for the connection of the connecting rod 32. Hole 3440. A rivet portion 346 is formed at a central portion of the body 340. The rivet portion 346 is formed by bending the two rectangular sheets downwardly from the body 340 and relatively bent. The buckle wire 36 can be bent from a metal wire and is generally U-shaped. The middle portion of the buckle wire 36 has a flat joint portion 362. The two ends of the joint portion 362 1321440 are bent at an obtuse angle to form a bending elastic. Buckle arm (not labeled), ^ The middle of the buckle arm is bent relative to the back plate 34, and the end thereof forms a hook 364 which is biased upward by the elastic arm to provide an elastic force. The engaging portion 362 is riveted to the riveting portion 346 of the backing plate 34, and the clasp 364 is connected to the connecting rod 32 through the bottom button hole 3260 of the connecting rod 32. When the heat sink 20 is installed, the heat sink 20 is first placed on the circuit board 10, and the stepped holes 220 on the base 22 are aligned with the through holes 14 on the circuit board 10, and the back plate 34 is placed on the circuit board 10. Next, the through holes 3440 on the circular table 34 are aligned with the perforations 14. Then, the connecting rod 32 is pressed down so that the barbs 326 at the bottom end thereof sequentially pass through the through holes 2204 on the base 22 of the heat sink 20, the through holes 14 of the circuit board 10, and the through holes 3440 of the back plate 34, and protrude from the back Below the plate 34, the spring 321 sleeved on the connecting rod 32 is compressed between the flange 322 and the step portion 2202 of the base 22. Then, the buckle wire 36 fixed under the back plate 34 is biased and deformed, and the hook 364 at the end of the buckle wire 36 is passed through the buttonhole 3260 on the barb 326, and then the external force is released to make the connecting rod 32 and The buckle wire 34 is fixed, so that the remaining connecting rods 32 are sequentially installed, so that the hooks 364 at the ends of the two fastening wires 36 are respectively fastened with the fastening holes 3260 of the connecting rods 32, thereby firmly mounting the heat sink 20 on the circuit board. 10 on. The heat sink fixing device 30 cooperates with the buckle wire 36 under the back plate 34 through the connecting rod 32 to stabilize the heat sink 20 on the electronic component, and the installation process is simple, convenient, safe and reliable without any related tools. As shown in FIG. 6 to FIG. 8 , the difference between the heat sink fixing device 30 ′ in the second embodiment of the present invention and the heat sink fixing device 30 in the first embodiment is i 9 1321440 in the first embodiment. The connecting rod 38 includes a flange 382 formed on the first end of the connecting rod 38, a buckle portion 386 formed on the second end of the connecting rod 38, and a connecting end. The connecting portion 384 is provided with a spring %, wherein the flange 382, the connecting portion 384 and the buckle portion 386 are integrally bent by a metal wire, and the flange 382 is formed in a circle shape and is made of metal. One end of the wire is bent, and the other vertical flange 382 of the wire extends to one side and is bent back into the circle of the flange 382. The bent portion forms a circular buckle portion 386, and the middle portion of the buckle portion For the buttonhole 3860, the connecting portion 384 is formed by two metal wires that are bent against each other. It can be seen that the structure of the connecting rod 38 is similar to that of the connecting rod 32 in the first embodiment, and the functions are the same. The installation process is also the same, but the connecting rod 38 is bent by a metal wire, and the cost is relatively high. low. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing a heat sink fixing device and a heat sink using the same according to a first embodiment of the present invention. 2 is a perspective view of the heat sink fixture and heat sink of FIG. 2. FIG. Figure 4 is a partially exploded view of the heat sink fixture of Figure 1. Figure 5 is a side elevational view of the heat sink fixture and heat sink of Figure 2. 1321440 Fig. 6 is an exploded perspective view showing the heat sink fixing device and the heat dissipating device in the second embodiment of the present invention. Figure 7 is a bottom view of the heat sink fixture and heat sink combination of Figure 6. Figure 8 is an enlarged view of the connecting rod of Figure 6. [Main component symbol description]
電路板 10 電子元件 12 穿孔 14 散熱裝置 20 蓋體 21 頂壁 210 側壁 212 進風口 214 出風口 216 基座 22 階梯孔 220 臺階部 2202 透孔 2204 散熱鰭片 24 風扇 26 散熱器固定裝置 30 連接桿 32 凸緣 322 柱體 324 倒鈎 326 扣孔 3260 彈簧 33 背板 34 本體 340 側緣 342 圓臺 344 通孔 3440 鉚合部 346 扣線 36 結合部分 362 扣釣 364 散熱器扣合裝置 30’ 11 1321440 連接桿 38 凸緣 382 連接部 384 扣部 386 扣孔 3860 彈簧 39Circuit board 10 Electronic component 12 Perforation 14 Heat sink 20 Cover body 21 Top wall 210 Side wall 212 Air inlet 214 Air outlet 216 Base 22 Stepped hole 220 Step 2202 Through hole 2204 Heat sink fin 24 Fan 26 Heat sink fixture 30 Connecting rod 32 Flange 322 Cylinder 324 Barb 326 Buckle 3260 Spring 33 Back plate 34 Body 340 Side edge 342 Round table 344 Through hole 3440 Riveting part 346 Buckle wire 36 Joint part 362 Buckle fishing 364 Radiator fastening device 30' 11 1321440 Connecting rod 38 Flange 382 Connection 384 Buckle 386 Buckle hole 3860 Spring 39
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