200823633 九、發明說明： 【發明所屬之技術領域】 特別是一種散熱器安裝或支 本發明係有關一種散熱器結構 撐之配置手段。 【先前技術】 隨著資訊科技的高度發展以及電腦產業的應用普及，散執哭 =用更加廣泛，諸如電腦、筆記型電腦等其他各歸密電;^ =品1裝設紐熱H裝置。賴電子翻巾之軒猶會在 齡運作擁喊生缝，如巾央處琴元晶料辦積體電路 寺由於工作溫度對於電子設備是否當機的影響極大，所以處理 控制可㈣子設财較高可驗及_麵電料件的穩 '八為求散熱器達到最大散熱功效，散熱器與欲散熱之電子元件 2緊A貼合〜全傳導熱度，方能更有效率的將電子元件的溫 X低’是以目前散熱器的鎖附方式概略有鎖固式及彈片式兩 種。鎖固式，主要是將散熱器底部的導熱體貼合於 2用螺絲或卡榫’由導鋪上的孔槽穿人，直接向下伽或卡固 ;7電路板上的穿孔，藉由螺絲或卡榫鎖合或卡固的力量，直 接對放熱—以-下壓的力量，使導熱體與發熱元件貼合；或者 S絲或卡榫上套設—彈簧，同樣將_或卡榫由導熱體上的孔 曰It ’並直接向下鎖附或卡固於印刷電路板上的穿孔，但可利 用無黃被1 祕散熱器及螺絲之間_復力，對散熱ϋ施以-向 下貼附於發熱70件的力量，使散熱器與發熱元件間的接觸更為緊 200823633 密’以達到傳導熱度的目的。彈片式’主要是在印刷電路板上發 熱元件的周圍增設固定座或支架，且固定座或支架上裝設有彈^ 臂或扣具，並設有可供彈性臂或扣具扣合的卡扣部；先將散熱器 的導熱體貼合於發熱元件上，再將彈性臂或扣具扣壓於散熱器上 方，並扣合於卡扣部上，利用彈性臂或扣具的固定作用，對散熱 器施以一向下堡力，使散熱器的導熱體與發熱元件緊密貼合，: 將熱度傳導到散熱器，達到散熱的功效。 鎖固式與彈片式兩種方法都是利用螺絲、卡榫、彈性臂、戋 扣具，對散熱H施以-壓力，使散熱II與電子元件貼合以達到散 熱之目的，但此兩種方法皆為由散熱H上方施以i定散熱器二 壓力，所崎散熱ϋ上必須穿設容置獅或卡榫之穿孔，或是可 供彈性臂或扣具等施力組件組扣之位置，而由於穿孔或組扣位置 的设置’散熱器基板上可設置散熱片的位置即大幅縮減，使得散 熱面積受到了限制，將會影響散熱效率。 Μ293475號專利案揭露了 一種散熱器， 設置於複數個固定柱，於印刷電路板上 穿孔，而於機殼對應崙埶哭At ,、 而為解決散熱器散熱鰭片設置位置的課題，如台灣公告第 475案係於散熱器的下方200823633 IX. Description of the invention: [Technical field to which the invention pertains] In particular, a heat sink installation or support is directed to a configuration of a heat sink structure. [Prior Art] With the rapid development of information technology and the popularization of the application of the computer industry, the sorrowful cry = more widely used, such as computers, notebook computers and other various secret electricity; ^ = product 1 installed New Heat H device. Lai electronic sneakers will still be screaming at the age of operation, such as the towel at the central office, Qin Yuanjing material office, the circuit of the temple, because the working temperature has a great impact on the electronic equipment, so the processing control can be (four) sub-finance Higher and _ surface electrical material stability 'eight for the heat sink to achieve maximum heat dissipation, the heat sink and the electronic components to be cooled 2 tight A ~ full conduction heat, in order to more efficient electronic components The temperature of the low X is based on the current locking method of the radiator, which is generally locked and shrapnel. Locking type, mainly to the heat conductor at the bottom of the heat sink is attached to the 2 with a screw or cassette 'wearing from the hole in the guide, directly down or stuck; 7 perforation on the circuit board, with screws Or the force of the locking or clamping of the card, directly to the heat-to-down force, so that the heat conductor and the heating element are attached; or the S wire or the card sleeve is sleeved-spring, the same _ or card The hole 曰It ' on the heat conductor and directly locks down or clamps the perforation on the printed circuit board, but can use the non-yellow quilt between the radiator and the screw to apply heat to the heat sink Attached to the heat of 70 pieces of heat, the contact between the heat sink and the heating element is tighter 200823633 dense to achieve the purpose of conduction heat. The shrapnel type is mainly to add a fixing seat or bracket around the heating element on the printed circuit board, and the fixing seat or the bracket is provided with a spring arm or a buckle, and a card for the elastic arm or the buckle to be fastened is provided. The buckle portion is first attached to the heat-generating component of the heat sink, and then the elastic arm or the buckle is buckled on the heat-dissipating device and fastened to the buckle portion, and the heat-dissipating function of the elastic arm or the buckle is used to dissipate heat. The device applies a downward force to make the heat conductor of the heat sink and the heat-generating component closely fit: The heat is transmitted to the heat sink to achieve the heat dissipation effect. Both the locking and shrapnel methods use screws, cassettes, elastic arms, and cymbal fasteners to apply heat to the heat sink H, so that the heat sink II and the electronic components are attached to each other to achieve heat dissipation. The method is to apply the pressure of the radiator to the top of the heat sink H. The heat sink must be equipped with a perforation for accommodating the lion or the cassette, or the position of the force component of the elastic arm or the buckle. However, due to the setting of the perforation or the position of the buckle, the position of the heat sink on the heat sink substrate can be greatly reduced, so that the heat dissipation area is limited, which will affect the heat dissipation efficiency. The 293475 patent discloses a heat sink which is disposed on a plurality of fixed columns and is perforated on a printed circuit board, and the chassis is corresponding to the problem of setting the position of the heat sink fins, such as Taiwan. Announcement No. 475 is under the radiator
斤甲，一般多會設計自動或半自動組裝治 然而採用螺接之方式並無法設計自動或半 200823633 自動組裝治具，生產線之工作人員必 固定柱上，固定柱之數目鉞夕略、恤也將固定件鎖附於 疋柱之數目越夕，所需鎖附之動作越多 附的過程t私齡;簧衫 / 、、 用雜叫 維也套叹於固疋件，因此採 的増Γ產組裝程序較為複雜，並將會導致整體生產成本 【發明内容】 白知之散熱器固定方式或有直接鎖固或彈片組 ;接鎖固或彈片組扣都將會佔據散熱，讀片可設 體散熱面積，或有散埶器直接 n韻樣與固定件螺接之設計來 述的問題，然而採㈣接之設計將不利於生產製造，習知 之散熱器固定方式都仍非散熱器固定手段之最佳設計。有鑑於 处播2脉於提供—種可_組裝治具進行_作業之散熱器 結構及其組裝治具設計。 —根據本發明所揭露之散熱器結構，其包括有-導熱體、一彈 件及-扣片，其中導熱體具有第—面及第二面，第—面設置 有減们政熱鰭>|，第二面用以與—發熱元件接觸，並於第二面 上設有—對固錄，於—印㈣路板上設有-發熱元件，並於印 刷包路板上鄰近發熱元件處設有穿孔，賴定柱可穿過印刷電路 板上的牙孔’固定柱末端設有一扣槽並供彈性元件套設，而扣片 可套設於扣槽，並令元件抵概印職路板及扣狀間，而 使導熱體的第二面能與發熱元件間能夠緊密接觸而進行熱傳遞。 此散熱器結構可藉由簡易的固定柱、彈性元件及扣片的組 合，快速地將散熱器緊密貼附於發熱元件上，峨行熱傳遞，且 200823633 為了更便利且快物裝此散熱器結構，本發明更提供—種組裝治 具其包括有-固定件，此固定件具有容置槽，此容置槽内設置 有-彈簧及-移動件，彈簧抵頂於該移動件，使該移動件至少呈 有一伸出於該容置槽外之第—位置及—縮人於該容體内之k 位置，其中當該移動件位於__位置，可供該扣狀該彈性元 件依序套置，將該軸件對應於_定柱，推動麵定柱即可使 Γ =私動件由第位置朝第二位置移動，使轉性元件套入於該固 定柱上，並且使該扣片卡扣於該扣槽。 :^據本U所揭路之散熱器結構及其組裝治具，其散熱器底 =一對穿越過印刷電路板之岐柱，將可增加散鋪片設置 白、=亚且透過組裝治具可快速地將散熱器固定於印刷電路板 „ ’七、件上可以大111田即癌所需之組裝時間以及所需之作業人 貝，將可有效地降低組裝散熱器所需之成本。 =之關於本發咖容之說明及以下之實施方式之說明係用 進一步之解釋。 ^供本發明之專利申請範圍更 【實施方式】 置於nr所揭露之散熱器結構及其組裝治具，散熱器係設 置於-印刷電路板之發熱元件上，以對發 :=::τ統之中央處理器，然咖^ 之中央處理器為欲進行散熱之發熱元件，在以下的 貝知例中’將以針對電腦系統之中央處理器作為進行散熱之 0 200823633 考5熱兀件為本發明之最佳實施例。 請茶閱第2圖所示，根據本發明所揭露之散熱器結構 閱第认圖及第_)，其包括散熱器2〇、中央處理器3〇、= 電路板40、以及裝置組件％。 其中散熱H 20具有-雜體22，導鋪22具有第一面Μ 以及相對於第-面24之第二面26 ;第—面24上設置有複數片散 熱轉片242，此散熱鰭片242豎立於第一面％上，可使第—面^ 快速地將吸收的熱度傳導至空氣中；第二面26用以貼覆於—因執 行運作而散發熱度財央處理H 3G，此巾央處理器3g設置於印 刷電路板40上，此印刷電路板4G#近中央處理器3()的週邊更具 有一對穿孔42;導熱體22之第二面26設有—對固定柱262，兩 固定柱262間的距離，與印刷電路板恥上之兩穿孔&間的距離 相等，且穿孔42的内徑略大於固定柱262之外徑，所以固定柱 262在與穿孔a對位後，可穿透過穿孔42而懸置於印刷電路板 40上’並與印刷電路板4〇上的中央處理器3〇貼合丨此外固定柱 262末端具有一扣槽2621。 衣置組件50包括弟一彈黃52及C型扣54，第一彈筹52用 以套置於固定柱262上，C型扣54具有撓性，可用以套設於扣槽 2+621内；由於第一彈簧52的常態長度大於散熱器結構1〇中印刷 電路板40與c型扣54間的距離，所以第一彈簧52將受到印刷電 路板40與c型扣54的壓縮，而產生一反抗壓縮的回復力，使得 弟彈耳&抵頂於印刷電路板40與C型扣54之間，由於第一彈 百52對印刷電路板40會產生一向上推動的回復力，可使得印刷 200823633 ，路板4〇受力而向上推擠，帶動中央處理器π貼近導熱體u之 弟二面26，使導熱體22與中央處理器3〇緊密接觸，達到熱傳遞 的功效。 明夢閱弟3A ®及$ 3B圖所示，本發明提供一練熱器結構 1〇之組裝治具60，其包括有—平台62，平台以上設有一對固定 件64，此固定件64具有容置槽⑷，容置槽642内設置有—第二 彈簧644及-移動件646，此第二彈簧⑷抵頂於移動件_ 使移動件646不受外力作用技，#4士 〜 乍用守保持一伸出於容置槽042外的狀 :=_件646受外力作用時，第二彈普6糾也可隨著移動件 6又力後向下作動而被壓縮；此外由於容置槽⑷之 Γ動⑽之外徑，且移動件_之長度小於容置⑽3 i及時，可在，於容置槽642外之第-位 备目於谷置才曰642内之第二位置(請 圖)間活動，當移動件646位 ☆ 口及弟4Β -彈簧™，當移動件 52及C型扣54將因為移動件_的向下運—動，=二::簧 並卡置於觸642上。此外平 ^峨杯動件_ 40之升降承座66，可放:更“有一承載印刷電路板 ^ 40 42 降承座㈣平台62移動，使電路板•裝;^力^將升 請參閱第5A、5B、5C罔淋- 、、、件50接觸。 合种央處理器30上，使第:縣器2〇的導熱體22貼 路板40的穿孔42 & 1固定柱262穿設於印刷電 將放熱盗20與印刷電路板40放置於升 10 200823633 降承座66上，令空7丨„ °牙孔42的固定柱262與移動件646正確對 平台遍麵於移動件646上方，施力使升降承起向 口》’使侍固定柱262向下壓迫移動件646，使得移動件 646向下運動#筮—踩竣， 丨、m夕职干 第-位… 縮，令移動件646由第-位置朝 弟一位置移動，並縮入容 於第-彈^ ^ , 内，由於移動件646的外徑小 ^ ^ 52及C型扣54之内徑，則第—及 會因移動件646縮入容置 臼2内而脫離移動件646，轉而被套 叹於固疋柱262上；此時第一遝益 彈更52套设於固定柱262，C型扣 54則被套投於扣槽2621内·曰出 ，且由於C型扣54的内徑略小於扣槽 尹、位置，使弟-彈簧&不會滑落脫離固定柱施 型扣54的壓迫，而呈—厭…社^ ^ 細狀恶抵頂於印刷電路板40及C型扣 54之間，使導熱體22與中 ^ . 、处里σσ 30間此夠緊密接觸而進行熱 得 2^。 、 如上，然其並非用以限定本 雖然本發明以前述之實施例揭露 2。在不脫離本發明之精神和範_，所為之更動與潤飾，均 ^發^之專利賴翻。_本發騎界定之保護範圍請 所附之申請專利範圍。 气 【圖式簡單說明】 第1Α圖為散熱器結構之立體圖。 第1Β圖為散熱器結構之剖面圖。 第2圖為散熱器結構之分解圖。 第3Α圖為散熱器結構之組裝治具立體圖。 11 200823633 第3B圖為散熱器結構之組裝治具剖面圖。 第4A圖為散熱器結構組裝治具之第一位置示意圖。 第4B圖為散熱器結構組裝治具之第二位置示意圖。 第5A、5B、5C圖為散熱器結構組裝動作圖。 【主要元件符號說明】 10 散熱器結構 20 散熱器 22 導熱體 24 第一面 242散熱鰭片 26 第二面 262固定柱 2621扣槽 30 中央處理器 40 印刷電路板 42 穿孔 50 裝置組件 52 第一彈簧 54 C型扣 60 組裝治具 62 平台 64 固定件 642容置槽 200823633 644第二彈簧 646移動件 66 升降承座In general, it will be designed with automatic or semi-automatic assembly. However, it is impossible to design automatic or semi-200823633 automatic assembly fixtures by means of screwing. The staff of the production line must be fixed on the column. The number of fixed columns will be 钺 略, and the shirt will also be The number of fasteners attached to the mast is on the eve of the night, the more the movements required to be attached, the more the process is attached to the private age; the reeds/, and the miscellaneous sighs also sigh on the solid parts, so the tannins are harvested. The assembly procedure is more complicated and will lead to the overall production cost. [Inventive content] Baizhi's heat sink fixing method may have a direct locking or shrapnel group; the locking lock or the shrapnel group buckle will occupy heat dissipation, and the reading film can be set to dissipate heat. The area, or the design of the direct n-like sample of the diffuser and the screwing of the fixed part, but the design of the (four) connection will not be conducive to the production, the conventional heat sink fixing method is still the most Good design. In view of the fact that the 2 pulse is provided, the heat sink structure and the assembly fixture design of the _ assembly jig are provided. A heat sink structure according to the present invention, comprising: a heat conductor, a spring member and a buckle, wherein the heat conductor has a first surface and a second surface, and the first surface is provided with a heat-reducing fin> The second side is for contacting the heating element, and is provided on the second surface for the fixed recording, and the heating element is disposed on the printing board (four), and is adjacent to the heating element on the printing envelope board. Perforated, the Lai Ding column can pass through the hole in the printed circuit board. The end of the fixing column is provided with a buckle groove for the elastic component to be sleeved, and the buckle piece can be sleeved in the buckle groove, and the component can be printed on the road board and The button-like space allows the second surface of the heat conductor to be in close contact with the heat generating element for heat transfer. The heat sink structure can quickly attach the heat sink to the heat generating component by a simple combination of a fixing column, an elastic member and a buckle, and heat transfer is performed, and 200823633 is more convenient and fast. The present invention further provides an assembly fixture comprising a fixing member, the fixing member having a receiving groove, wherein the receiving groove is provided with a spring and a moving member, and the spring abuts against the moving member, so that the The moving member has at least a first position extending outside the receiving groove and a position k which is reduced in the body, wherein when the moving member is located at the __ position, the elastic member can be sequentially arranged Locating, the shaft member is corresponding to the _ fixed column, and pushing the surface fixing column enables the Γ=private member to move from the first position to the second position, so that the rotatory member fits over the fixed column, and the buckle is The piece is snapped into the buckle groove. : ^ According to the radiator structure and assembly fixture of the road disclosed in this U, the radiator bottom = a pair of masts that pass through the printed circuit board, which will increase the arrangement of the scattered sheets, white, and through the assembly fixture. The heat sink can be quickly fixed to the printed circuit board. VII 'The upper assembly time and the required assembly time and the required workmanship can effectively reduce the cost of assembling the heat sink. The description of the present invention and the following description of the embodiments are further explained. ^The scope of the patent application for the present invention is more [embodiment] The heat sink structure and assembly fixture disclosed in nr, heat dissipation The device is disposed on the heating element of the printed circuit board, and is connected to the central processing unit of the system: =:: τ, and the central processing unit is the heating element for heat dissipation, in the following example: The heat sink for the computer system is used as the best embodiment of the invention. Please refer to Figure 2 for the heat sink structure disclosed in the present invention. Figure and _), which includes the heat sink 2 The central processing unit 3, the circuit board 40, and the device component %. wherein the heat dissipation H 20 has a --hetero 22, the guide 22 has a first surface Μ and a second surface 26 relative to the first surface 24; A plurality of heat dissipating fins 242 are disposed on the surface 24, and the heat dissipating fins 242 are erected on the first surface %, so that the first surface can quickly conduct the absorbed heat into the air; the second surface 26 is used for attaching _ _ due to the implementation of the operation of the heat dissipation of the financial processing H 3G, the towel processor 3g is disposed on the printed circuit board 40, the printed circuit board 4G # near the central processor 3 () has a pair of perforations 42; The second surface 26 of the heat conductor 22 is provided with a pair of fixing posts 262. The distance between the two fixing posts 262 is equal to the distance between the two perforations of the printed circuit board, and the inner diameter of the through holes 42 is slightly larger than the fixed column. The outer diameter of 262, so that after the alignment post 262 is aligned with the perforation a, it can penetrate the perforation 42 and be suspended on the printed circuit board 40' and fits with the central processing unit 3 on the printed circuit board 4丨. The end of the fixing post 262 has a buckle groove 2621. The clothing assembly 50 includes a black spring 52 and a C-shaped buckle 54, first The C-shaped buckle 54 is sleeved on the fixing post 262, and the C-shaped buckle 54 has flexibility, and can be sleeved in the buckle groove 2+621; since the normal length of the first spring 52 is larger than the printed circuit board of the heat sink structure 1〇 The distance between the 40 and the c-type buckle 54 is such that the first spring 52 will be compressed by the printed circuit board 40 and the c-type buckle 54 to generate a restoring force against the compression, so that the younger ear & Between 40 and C-type buckle 54, since the first elastic wave 52 pairs of the printed circuit board 40 will generate an upward pushing force, the printing of 200823633, the road board 4 〇 force and push up, driving the central processing unit π Close to the two sides 26 of the heat conductor u, the heat conductor 22 is in close contact with the central processing unit 3 to achieve heat transfer. As shown in the figure 3A ® and $ 3B, the present invention provides an assembly fixture 60 of a heat exchanger structure, comprising a platform 62 having a pair of fixing members 64 disposed above the platform, the fixing member 64 having The accommodating groove (4) is provided with a second spring 644 and a moving member 646. The second spring (4) abuts against the moving member _ to prevent the moving member 646 from being subjected to an external force. #4士～ 乍The guard keeps a shape that protrudes out of the accommodating groove 042: when the _ member 646 is subjected to an external force, the second ejector 6 can also be compressed as the moving member 6 is forced to move downward; (4) The outer diameter of the turbulence (10), and the length of the moving member _ is less than the accommodating (10) 3 i in time, and the second position outside the accommodating groove 642 can be placed in the second position in the valley setting 642 (please Figure) between the activities, when the moving parts 646 ☆ mouth and brother 4 Β - spring TM, when the moving parts 52 and C-type buckle 54 will be moved by the moving parts _, = two:: spring and stuck in the touch 642. In addition, the lifting cup 66 of the flat cup _ 40 can be placed: more "has a carrying printed circuit board ^ 40 42 lower bearing seat (four) platform 62 moves, so that the circuit board can be installed; ^ force ^ will rise please refer to 5A, 5B, 5C - - , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The printed electric device places the heat-dissipating pirate 20 and the printed circuit board 40 on the hoisting 10 200823633 drop-bearing seat 66, so that the fixing post 262 and the moving member 646 of the venting hole 42 are correctly aligned over the moving member 646. Applying force to lift the lift to the mouth "" causes the fixed column 262 to press the moving member 646 downward, so that the moving member 646 moves downwards #筮-竣竣, 丨, m 夕干干--... 646 is moved from the first position to the younger one position, and is retracted into the first-elastic ^^, because the outer diameter of the moving member 646 is small ^^52 and the inner diameter of the C-shaped buckle 54, the first and the The moving member 646 is retracted into the accommodating 臼2 and detached from the moving member 646, and is then sighed on the solid struts 262; at this time, the first 弹 弹 弹 is set on the fixed column 262, and the C-shaped buckle 54 is quilted. The inside of the buckle groove 2621 is thrown out, and since the inner diameter of the C-shaped buckle 54 is slightly smaller than the buckle groove and the position, the brother-spring & does not slip off the pressure of the fixed-column buckle 54 and becomes annoying. ...^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ As above, it is not intended to limit the present invention. Although the present invention is disclosed in the foregoing embodiments. Without departing from the spirit and scope of the present invention, the changes and refinements of the present invention are all patented. _ The scope of protection of this hair riding definition is attached to the scope of the patent application. Gas [Simple description of the diagram] The first diagram is a perspective view of the radiator structure. The first drawing is a cross-sectional view of the heat sink structure. Figure 2 is an exploded view of the heat sink structure. The third drawing is a perspective view of the assembly fixture of the heat sink structure. 11 200823633 Figure 3B is a cross-sectional view of the assembly fixture of the heat sink structure. Figure 4A is a schematic view of the first position of the heat sink structure assembly jig. Figure 4B is a schematic view of the second position of the heat sink structure assembly jig. Figures 5A, 5B, and 5C show the assembly operation diagram of the heat sink structure. [Main component symbol description] 10 heat sink structure 20 heat sink 22 heat conductor 24 first surface 242 heat sink fin 26 second surface 262 fixing post 2621 buckle groove 30 central processing unit 40 printed circuit board 42 perforation 50 device assembly 52 first Spring 54 C-type buckle 60 Assembly fixture 62 Platform 64 Fixing member 642 accommodating groove 200823633 644 Second spring 646 Moving member 66 Lifting seat