TWM311237U - Fixing plate of heat sink - Google Patents

Fixing plate of heat sink Download PDF

Info

Publication number
TWM311237U
TWM311237U TW095216535U TW95216535U TWM311237U TW M311237 U TWM311237 U TW M311237U TW 095216535 U TW095216535 U TW 095216535U TW 95216535 U TW95216535 U TW 95216535U TW M311237 U TWM311237 U TW M311237U
Authority
TW
Taiwan
Prior art keywords
heat sink
heat
fixing plate
plate
group
Prior art date
Application number
TW095216535U
Other languages
English (en)
Inventor
Ying-Lin Hsu
Kun-Feng Tu
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW095216535U priority Critical patent/TWM311237U/zh
Publication of TWM311237U publication Critical patent/TWM311237U/zh
Priority to US11/896,650 priority patent/US20080066309A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/30—Safety or protection arrangements; Arrangements for preventing malfunction for preventing vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y10T29/49378—Finned tube

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M311237 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱片固定 、 定板，以防止-熱管式散熱器之末 尤❿種利用散熱片固 不而政熱片脫離熱管而掉落。 【先前技術】 按，一般習知之熱管式散埶槎έ 個麵，而於穿設完成時，還 分夾斷去除，其結果如同第一圖所示，访寺政熱片之邠 斷後呈現-圓錐狀，因而該等散Μ 、官7之端部7 1因夾 管7之接觸部分呈現-空隙9，使得节=端散熱片8 1與該熱 7之接合力減弱，故該末端散熱片β該熱管 別是於該賴肋運送途巾，目震動⑽^崎賴管7，特 而一般習知解決上述缺失之方式為，〜 其讓熱管7穿過之圓孔較小，以使得與該二，製之散熱片， 較緊密之結合，然而此種做法由於該熱:山之&部7 1具有 狀’且經夾壓後之形狀為不規則，因 =7 1為一圓錐 之結合力還是欠佳，故經-定程度之震動片與該熱管7 脫離熱管7 ’故此無法防止該末端散熱片散熱片還是會 是以上述習知之解決方法，顯然具有缺失，改進者 【新型内容】 本創作之目的係提供一種散熱片固定柄， 定板之複數個扣部扣合於散熱片組於熱管上，^ ’用該散熱片固 之末端散熱片脫離熱管。肖止該散熱片組 為了達成上述之目的，本創作係提供1 重散熱片固定板，其 M311237 〃用於固定一散熱片組於熱管上，該散熱片組係由複數個散熱片所 •組成，該等散熱片兩兩間隔於一間隙，該散熱片固定板其包括： 一板體，其蓋於該散熱片組之頂端；複數個侧板，其分別設置於 該板體之兩相對侧邊；以及複數個扣部，其分別設置於該等侧 板，該等扣部係分別扣合於該等散熱片。 本創作係提供另一種散熱片固定板，其用於固定一散熱片組 於熱管上，該散熱片固定板其包括：一板體，其蓋於該散熱片組 之頂端；二側板，其分別設置於該板體之兩相對侧邊；以及二扣 部，其分別設置於該二側板之末端；其中該板體係蓋於該散熱片 F 組之頂端，該二扣部係扣合於該散熱片組之末端。 本創作係提供另一種散熱片固定板，其用於固定一散熱片組 於熱管上，該散熱片組係由複數個散熱片所組成，該等散熱片之 兩相對侧邊係分別具有複數個凹槽，該散熱片固定板其包括：一 板體，其蓋於該散熱片組之頂端；二側板，其分別設置於該板體 之兩相對側邊；以及複數個扣部，其分別設置於該二侧板之侧 邊；其中該板體係蓋於該散熱片組之頂端，該等扣部係扣合於該 等散熱片之該等凹槽。 I 為了能更進一步暸解本創作為達成預定目的所採取之技 術、手段及功效，請參閱以下有關本創作之詳細說明與附圖，相 信本創作之目的、特徵與特點，當可由此得一深入且具體之瞭 解，然而所附圖式僅提供參考與說明用，並朴用來對本創作加以 - 限制者。 【實施方式】 請參考第二圖所示，係為本創作第一實施例之散熱片固定板 之立體圖，該散熱片固定板10 0係包括一板體1、複數個侧板 6 •M311237 2、複數個扣部3。 該等側板2係分別設置於該板體1之兩相對側邊，該等側板 2係可由該板體1之側邊向下延伸，該等扣部3係分別設置於該 等侧板2之末端。 請參考第三圖，該散熱片固定板丄〇 〇之該板體丄及該侧板 2，可因散熱之考量而分別設置至少一個開孔丄丄及至少一個散 熱孔2 1，該等板體1係可向下延伸設置複數個固定部4，以作 辅助定位之用。
其請I考第四圖所示，其為該散熱片固定板1QQ使用於一熱 吕式放熱杈組之使用狀態圖，該熱管式散熱模組係包括一散熱片 組5及，數個熱管6，該散熱片組5係由複數個散熱片5丄顺 成」亥等散熱>1 5 1兩兩間卩鬲於-間隙5 2，該等熱管6係穿設 熱片組5，該等熱管6之端部6 1係露出於該散熱片組5 (禾立而〇 γ 固定板1QQ之板體1係蓋於該散熱片組5之頂 而熱管6之端部61係可穿過該至少—開 使 ίί, 1：：：^ 兮料」： 可使該等散熱片5 1不至於脫落於 板:固定部4卡合於該散熱片組5之側邊，可使該 板體1更能穩固地設置於該散熱片組5上。 使=亥 •施實施例之散熱片固定板，請參考第五圖，血第- 整覆蓋於該散熱片組5 (第 〇山0之遠板胆1 a並未完 组5頂踹$ /目I β卜 ）之頂古而，而僅覆蓋於該散埶片 、㈣知之-側。该寺侧板2 a係 :文：二 1 a之兩相對側。本實施例以二個 该板體 卡合於該散熱片組5頂端的兩側，^ t ”板2 0 ◦其分別 減夕復盍於該散熱片組5之 7 .M311237 面積’以加強散熱效果。 本創作第三實施例之散熱片固定板3 〇 〇，請參考第丄圖， 與第一實施例不同之處在於，該板體1 b係具有二側板「該 二側板2 b係分別設置於該板體丄b之兩相對側邊，該二側板^ b係可由該板體1 b之侧邊向下延伸，二扣部3 b，其分別嗖置 於該二側板2 b之末端。岭板體工b係蓋於該散熱片、：5 :頂 端:該二扣部3 b係扣合於該散熱片組5之末端。而該定值部4 b係可由該二侧板2 b之兩侧延伸。 本創作第四實施例之散熱片固定板4 〇 〇，請表 與第-實施例不同之處在於，該板以c係具有二側板2 c圖兮 二側板2 c係分別設置於該板體丄c之兩相對側邊，該 ； c係可由該板體χ 0之側邊向下延伸，複數個扣部3 c为 :該二側板2 c之兩侧，該等扣部3 c之末邊係分別具有—D$ 5 等1“係蓋於該散熱片組5之頂端，而概熱片組 b之忒寻放熱片51之兩相對侧邊分別各設有二凹 扣部3 c係扣合於該等凹槽53。 5亥寺 ❿ 盘第本ίΐ第五實施例之散熱片岐板50 ◦，請參考第八圖， 同之處在於，該板體1 d係具有二側板2d該 心…分別設置於該板體1 d之兩相對側邊，該二側板 -板體1 d之侧邊向下延伸，二扣部3 d分別設置= Li側邊。該板體1 d係蓋於該散熱片組5之頂端，而 槽5 4，該ί 兩相對侧邊分別各設有二凹 ^ κ寺扣°卩3 d係扣合於該等凹槽5 4。 合於本創作之散熱片固定板係提供-種穩固之方式扣 另::二、、且’以防止該散熱片組之末端散熱片脫落。 ’ D乐—至五圖所示的本創作第-及第二實施例，係界定 8 M311237 於專利範圍第1項$τ5十 ^ 苴料f纟只宗、弗6員，弟六圖所不的本創作第三實施例， 其将被界疋於專利範圍第7項 / ? =第：考第七圖及第八圖’其特徵並界定於= 片組之末五實施㈣均能制防止散熱 隹^上所述，僅為本創作最佳之一的呈體實施例之卞如二 惟本創作之特徵並不侷限於此:並非用以限制本創 創作丨财_應叮収巾請翻範圍鱗，凡合於本 創=;2乾圍之精神與其類似變化之實施例， 心及之雙化或修飾皆可涵蓋在以下本案之專利範圍。 【圖式簡單說明】 第圖係習知之熱管式散熱模組之剖視圖； $二圖係本創作第—實關散熱μ m定板之立體圖； 第三圖係本創作第—實施例散熱w定板之立體圖，其具有開孔 及散熱孔； 第四圖係本創作第—實施例散熱片固定板之使用於—熱管式散 熱模組之使用狀態圖； 第五圖係本創作第二實施例散熱片固定板之立體圖； 第六圖係本創作第三實施例散熱片固定板與—熱管式散熱模组 之之使用狀態圖； 弟七圖係本創作第四實施例散熱片固定板與—熱管式散熱模組 之之使用狀態圖；以及 第八圖係本創作第五實施例散熱片固定板與—熱管式散熱模組 之之使用狀態圖。 M311237
【主要元件符號 [習知技術] 說明】 埶管 ί、、Ν Ρ 7 散熱片 8 空隙 9 [本創作] 散熱片固定板 10 0 板體 1 側板 2 扣部 3 固定部 4 散熱片組 5 端部 7 1 末端散熱片 81 開孔 1 散熱孔 2
熱管 6 散熱片固定板 2 0 0 板體 la 側板 2 a 散熱片固定板 3 0 0 板體 lb 側板 2 b 扣部 3 b 定位部 4 b 散熱片 5 1 間隙 5 2 凹槽 5 3 凹槽 5 4 端部 6 1 10 M311237 散熱片固定板 •板體 侧板 扣部 定位部

Claims (1)

  1. M311237 υ ' 年月日修正補充 、九、申請專利範圍·· 1、-種散熱片固定板’其用於固定—散熱片組於熱管上，該散 .熱片組係由複數偭散熱片所組成，該等散熱片兩兩間隔於一 間隙，該散熱片固定板其包括： 一板體，其蓋於该散熱片組之頂端·， 複數個側板’其分別設置於該板體之兩相對侧邊；以及 複數個扣部’其相設置於料顺，料部係分別扣合 於該蓉勒執）=5。
    如申請專利範圍第1項所述之散熱片 設有至少一開孔。 固定板，其中該板體係 等側板 如申請專利範圍第i項所述之散熱片固定板，其中該 係分別設有至少一散熱孔。 4、如申请專利範圍第1項所述散埶 人 雌片固定板，其中該等扣部 係刀別扣合於該等散熱片之一間隙。 固，板，其中該等扣部 、如申請專利範圍第1項所述之散熱片 係分別設置於該等側板之末端。 如甲請專利範圍第2項所述之散埶也 侧邊係具有複數_定邻，賴 其中該板體之 組 。有碰個固疋°卩叫助該板體定位於該散熱片 7 一種散熱片固定板，其用於固定―散執片 熱片固定板其包括·· 組於熱管上，該散 板體，其蓋於該散熱片組之頂端； ’ 側板，其分別設置於該板體之兩相對側邊；以及 12 M311237 一扣部，其分別設置於該二侧板之末端； -其巾該板體係蓋於該散熱片組之頂端，該二扣部係扣合於該 散熱片組之末端。 8、 如申請專利範圍第7項所述之散熱片固定板，其中該板體係 設有至少一開孔。 9、 如申請專利範圍第7項所述之散熱片固定板，其中該二側板 係分別設有至少一散熱孔。 ,1◦、如ΐ請專利範圍第7項所述之散熱片固定板，其中該板體 之側邊係具有複數_定部，以輔助該板體定位於該散敎片 乡且° 1 1 ' 一種散熱片固定板，其用於固散熱肢於熱管上，該 散熱片組係由複數個散熱片所組成，該等散熱片之兩相· 邊係分別具有複數個凹槽，該散熱片固定板其包括： 一板體，其蓋於該散熱片組之頂端； 一侧板，其分別設置於該板體之兩相對側邊；以及 複數個扣部，其分別設置於該二侧板之側邊； 其找板體係蓋於該散熱片組之了㈣，料扣部係扣合於該 等散熱片之該等凹槽。 12、如申請專利範圍第11項所述之散埶 …、片固疋板，其中該板 脰係故有至少一開孔。 1 3、如申請專利範圍第1 1項所述之散哉 …、片固疋板，其中該二 侧板係分別設有至少一散熱孔。 1 4、如申請專利範圍第丄丄項所述 埶 蚁熟片固定板，其中該板 13 M311237 體之侧邊係具有複數個固定部 片組。 以輔助該板體定位於該散熱 如申凊專利範圍第1 1項所述之散熱片固定板，其中該等 扣部’其分別設置於該二側板之兩相對侧邊。
    14
TW095216535U 2006-09-15 2006-09-15 Fixing plate of heat sink TWM311237U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095216535U TWM311237U (en) 2006-09-15 2006-09-15 Fixing plate of heat sink
US11/896,650 US20080066309A1 (en) 2006-09-15 2007-09-05 Fastening board for cooling fins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095216535U TWM311237U (en) 2006-09-15 2006-09-15 Fixing plate of heat sink

Publications (1)

Publication Number Publication Date
TWM311237U true TWM311237U (en) 2007-05-01

Family

ID=38742375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095216535U TWM311237U (en) 2006-09-15 2006-09-15 Fixing plate of heat sink

Country Status (2)

Country Link
US (1) US20080066309A1 (zh)
TW (1) TWM311237U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397369B (zh) * 2007-12-31 2013-05-21 Hon Hai Prec Ind Co Ltd 散熱裝置
CN103412627A (zh) * 2013-07-31 2013-11-27 昆山维金五金制品有限公司 一种新型cpu散热片

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8325608B2 (en) * 2008-08-07 2012-12-04 Qualcomm Incorporated Efficient packet handling for timer-based discard in a wireless communication system
US11523539B2 (en) * 2019-10-07 2022-12-06 Nvidia Corporation Shroud for an integrated circuit heat exchanger

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943209A (en) * 1997-10-06 1999-08-24 Liu; Yen-Wen Modularized electronic component cooling apparatus
TW516800U (en) * 2000-07-01 2003-01-01 Foxconn Prec Components Co Ltd Heat sink assembly
JP4431263B2 (ja) * 2000-09-29 2010-03-10 山洋電気株式会社 電子部品冷却装置
US6520250B2 (en) * 2001-02-23 2003-02-18 Foxconn Precision Components Co., Ltd. Fan holder
TW585386U (en) * 2001-03-13 2004-04-21 Foxconn Prec Components Co Ltd Fan fixing device
US6401806B1 (en) * 2001-03-29 2002-06-11 Foxconn Precision Components Co., Ltd. Heat sink assembly
TW534377U (en) * 2002-01-31 2003-05-21 Delta Electronics Inc Heat-dissipating assembly and its used securing device
TW520146U (en) * 2002-06-13 2003-02-01 Hon Hai Prec Ind Co Ltd Heat pipe assembly
TWM250191U (en) * 2002-08-13 2004-11-11 Jiun-Fu Liou Fastening apparatus of heat dissipation module
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
US6967845B2 (en) * 2003-11-05 2005-11-22 Cpumate Inc. Integrated heat dissipating device with curved fins
US7160080B2 (en) * 2003-12-25 2007-01-09 Asia Vital Component Co., Ltd. Fan assembly
JP2005197303A (ja) * 2003-12-26 2005-07-21 Nippon Densan Corp ヒートシンクファン
US7606028B2 (en) * 2007-12-20 2009-10-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397369B (zh) * 2007-12-31 2013-05-21 Hon Hai Prec Ind Co Ltd 散熱裝置
CN103412627A (zh) * 2013-07-31 2013-11-27 昆山维金五金制品有限公司 一种新型cpu散热片

Also Published As

Publication number Publication date
US20080066309A1 (en) 2008-03-20

Similar Documents

Publication Publication Date Title
TWM311237U (en) Fixing plate of heat sink
JP5031465B2 (ja) 折り畳み式放熱板
TW200848994A (en) Heat dissipation device
TWM298324U (en) Coating-type heat-dissipating device
TWI304927B (zh)
TWI322258B (zh)
TWI329257B (en) Heat dissipation device
TW200845879A (en) Memory module with radiator having a connecting unit
TWI308683B (en) Heat dissipation apparatus
TWM395197U (en) Memory heat dissipation module
TWM242998U (en) An improved structure of a heat dissipation grille
TWI226982B (en) Flexible high-density cooling fin set and cooler
TWM248212U (en) Fixing structure of heat dissipation fin and fan mask
TWM253207U (en) Direct conduction type high-efficiency heat dissipation device
TWM254647U (en) Heat sink
TWI234639B (en) Improved structure of heat sink assembly
TWM265894U (en) Locking device for heat sink
TWM284947U (en) Heat dissipation module
TWM288950U (en) Improved structure of stacked-type heat plates
TWM298732U (en) Improved heat dissipation device structure
TWM300835U (en) Heat sink structure having thermal guiding
TWM268890U (en) Hole-passing structure of heat dissipation fin
TW200842559A (en) Heat dissipation device with heat pipe
TWM269701U (en) Improved structure of fin for heat sink
TW201107947A (en) Heat sink

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model