TWM294693U - Improved heatsink plate structure - Google Patents

Improved heatsink plate structure Download PDF

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Publication number
TWM294693U
TWM294693U TW95202113U TW95202113U TWM294693U TW M294693 U TWM294693 U TW M294693U TW 95202113 U TW95202113 U TW 95202113U TW 95202113 U TW95202113 U TW 95202113U TW M294693 U TWM294693 U TW M294693U
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TW
Taiwan
Prior art keywords
heat sink
slot
ear
card
heat
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Application number
TW95202113U
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Chinese (zh)
Inventor
Li-Wei Fanjiang
Original Assignee
Li Yo Prec Ind Co Ltd
Li-Wei Fanjiang
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Application filed by Li Yo Prec Ind Co Ltd, Li-Wei Fanjiang filed Critical Li Yo Prec Ind Co Ltd
Priority to TW95202113U priority Critical patent/TWM294693U/en
Publication of TWM294693U publication Critical patent/TWM294693U/en

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Description

M294693 八、新型說明: 【新型所屬之技術領域】 本創作首要之目的乃在提供-種散熱片結構改良, 中央處理器之散熱器。 疋用於電腦 【先前技術】 習用之散熱器是由-板狀金屬加以沖制成單片n形散 於门形散熱片上二端弯折出二上、下折邊咖、3⑼(參閱第二圖)’= 都在其上設置凸耳棚,且在凸耳4_後端形成凹槽侧,該θ凹槽= 5〇〇賴大於凸耳400且其位置都與凸耳侧呈對應,當組合時可由相^之 门形散熱㈣的凸耳棚嵌人前—π形散熱請的凹槽侧以將兩 兩门形散熱片⑽加以組合成-散熱器,安置㈣腦中央處理器上使用 ,、因為習用之散熱片的凸耳棚結構設計雖簡單,但在卡扣組裝上經常 脫落尤其經過使用後因熱脹冷縮效應脫落情況非常嚴重,因此需要 取出維修’造成使用者_ ’也增加#者成本支出,急需立即改善缺 失。 b如何將上述缺失加以摒除,即為本案創作人所欲解決之技 術困難點之所在。 M294693 【新型内容】 邊結構改良,主要是在散熱片上形成上、下二折 對應配合的位置上报士她7, 月洛Μ卡耳 前位气料⑼丨 I此組合啦後倾細的卡耳職入 腦中内,以將兩兩散熱片組合成—散熱器組,安設於電 、虼。° ,具備了易沖製成型、快速組裝、快速散敎的饮果, 以保護及延長電腦中央處理器之使用壽命者。 f果 本創作種放熱片結構改良,卡耳 且卡扣穩固之優點。 丁良子具不易脱洛 本創作—種散熱片結構改良,卡耳及槽賊計簡單,㈣模 谷易導入自動化的組裝達到降低成本目的。 、 新額ΓΤ&quot;錄舰树〈,和編4增料’亦具備 新穎性、進步性與產業利用性為一優良創作。 【實施方式】 4百先凊參閱第二圖、第三圖、第四圖及第五圖所示,本創作一種 散熱片結構改良,是義於電财央處理器之散熱器,其實施時: 本創作於板片狀IS或銅板上沖製—單片散熱片丨於上、下兩端來 成水平折邊2,於上、下水平折邊2 _之四祕處,於上、下料 折邊2上凸伸—前由倒△形4與後連結承板5組成的卡耳3,在卡耳3 稍後的上、下水平折邊2上也都形成與前由倒⑽4與後連結承板5 組成的卡耳3呈對應驗的· ?,且在槽孔7前端雜設塊狀卡棒6 M294693 峨,龜7之自侧撕耳⑽,方便散教片 1 山、、且=易於嵌人’藉此組合時由兩相鄰之後位散熱片丨的卡耳3鎮 :二::放熱片1之槽孔7内’以將兩兩散熱片1組合成-散熱器組 (茶閱弟五圖)’安設於電辦央處麵,具備了易沖製成型、伊 ΐ組襄、快速散熱的效果,以保護及延長電腦中央處理器之使用壽命 者0 再者,本創作散熱片1的卡耳3可以改設呈τ形卡耳9,並在丁 字上之兩端修出弧® 1G_第蝴使得在組合時更練嵌,另於τ 形卡耳9稍後社、下水平折邊2上也都形成與τ形卡耳9對應的槽 孔11 ’並在槽孔11上設塊狀卡榫12使卡扣更穩固不滑脫,且槽孔U 之面鋪獻於τ形卡耳9面積,方便散刻丨組合時錄嵌入,藉 此組合時由_鄰之後位散熱片i Μ形卡耳9鑲嵌人前位散熱片i 0孔11内以將兩兩散熱片1組合成一散熱器组,安設於電腦中央 處理器作散熱利用者。 、 再者’本創作散熱片i的卡耳3可以改設由上圓形丨3連結直柱Μ 所組成之標軸彡卡耳15(參閱第七圖),並在餘形卡耳聞後的上、 下水平折邊2上也娜成與標姉卡耳15麟之槪16,並在槽孔 16切成塊狀卡榫π,使兩者結合後該不滑脫,賴孔16之面積 :稍大於標tof彡卡耳丨5面積,方便散熱片丨組合時易於嵌人,藉此組 口時由兩相鄰之後位散熱片i的標乾形卡耳15鑲嵌入前位散熱片丄之 槽孔16内’以將兩兩散熱片1組合成一散熱器組,安設於電腦中央處 理器作散熱利用者。 M294693 綜上所述,本創作在突破先前之技術下,確實已達到所欲增進之 功效,且也非熟悉該項技術者所易於思及;再者,本創作申請前未曾 公開,其所具之新穎性、進步性,顯已符合新型專利之申請要件,爰 依法提出新型申請。 惟以上所述僅為本創作之一較佳可行實施例,非因此即侷限本創 作之申請翻範圍,故舉凡朝本創作說财及圖朗容所為之等效 創作,直接或間接運用於其它相關技術領域者,均同理皆理應包含於 本創作之精神範疇的範圍内,合予陳明。 【圖式簡單說明】 第一圖係習用散熱器圖。 第一圖係本創本創作散熱片卡耳與槽孔圖。 第三圖係本創作散熱片卡耳與槽孔卡扣前動作圖。 第四圖係本創作卡耳組合剖視圖。 第五圖係本創作散熱器組合圖。 第六圖係本創作散熱片τ形卡耳圖。 第七圖係本創作散熱片標靶形卡耳圖。 上、下折邊200、300 凹槽孔500 水平折邊2 【主要元件符號說明】 散熱片100 凸耳400 散熱片1 M294693 卡耳3 倒△形4 承板5 塊狀卡榫6 槽孔7 散熱器組8 T形卡耳9 弧圓10 槽孔11 塊狀卡榫12 圓形13 直柱14 標靶形卡耳15 槽孔16 塊狀卡榫17M294693 VIII. New Description: [New Technology Field] The primary purpose of this creation is to provide a heat sink structure improvement and a central processor heat sink.疋Used in computer [Prior Art] The conventional radiator is made of - plate metal to make a single piece of n-shaped scattered on the door-shaped heat sink. The two ends are bent out of the upper and lower sides, 3 (9) (see the second Figure] '= all have a lug shed on it, and a groove side is formed at the rear end of the lug 4_, the θ groove = 5 大于 is larger than the lug 400 and its position corresponds to the lug side, When combined, the lug shackles of the junction-shaped heat dissipation (4) can be embedded in the front side of the π-shaped heat dissipation groove to combine the two two-door heat sinks (10) into a heat sink, and the (four) brain central processor is used. Because the design of the lug shed structure of the conventional heat sink is simple, but it often falls off in the buckle assembly, especially after the use, the detachment due to the thermal expansion and contraction effect is very serious, so it is necessary to take out the repair 'causing the user _ ' Increasing the cost of # people, there is an urgent need to improve the shortfall immediately. b How to eliminate the above-mentioned defects, that is, the technical difficulties that the creators of this case want to solve. M294693 [New content] The edge structure is improved, mainly on the heat sink, which forms the upper and lower two folds corresponding to the position of the reporter. She, 7, Yueluo Ka'er front gas (9) 丨I, this combination is a fine In the brain, the two heat sinks are combined into a heat sink set, which is installed in electricity and electricity. °, with easy-to-crush, fast-assembling, fast-dissolving drink to protect and extend the life of the computer's central processing unit. f Fruit The improved heat release sheet has the advantages of improved structure, card holder and stable buckle. Ding Liangzi is not easy to take off. This creation—the structure of the heat sink is improved, the card ear and the slot thief are simple, and (4) the mold is easy to introduce the automated assembly to achieve the purpose of reducing costs. The new amount of ΓΤ&quot;recording ship tree <, and editing 4 added materials' also has novelty, progress and industrial utilization as an excellent creation. [Embodiment] Referring to the second, third, fourth and fifth figures, the present invention provides a heat sink structure improvement, which is a heat sink of the electric energy central processor. : This creation is made on a sheet-shaped IS or copper plate - a single fin is placed on the upper and lower ends to form a horizontal flange 2, and the upper and lower horizontal edges are 2 _ the fourth secret, above and below The flange 2 is protruded from the front side - the front ear 3 is formed by the inverted Δ shape 4 and the rear connecting plate 5, and the upper and lower horizontal hem 2 of the rear ear 3 are also formed with the front (10) 4 The card 3 composed of the rear connecting plate 5 is correspondingly tested, and a block-shaped bar 6 M294693 杂 is arranged at the front end of the slot 7, and the self-side tearing ear (10) of the turtle 7 is convenient for the scattered teaching piece 1 mountain, And = easy to embed 'by this combination by two adjacent rear fins 卡 3 3: 2:: inside the slot 7 of the heat release sheet 1 to combine the two heat sinks 1 into a radiator set (The tea reading brother's five maps) 'Installed in the office of the central office, with the effect of easy-to-crush, Yiqi group, fast heat dissipation, to protect and extend the service life of the computer central processor. , The ear 3 of the heat sink 1 can be modified to be a τ-shaped ear 9 and the arc is made at both ends of the T-® 1G_ butterfly so that it can be more embedded in the combination, and the τ-shaped ear 9 later The slot holes 11' corresponding to the τ-shaped latches 9 are also formed on the lower horizontal flange 2, and a block-shaped latch 12 is formed on the slot holes 11 to make the buckles more stable and not slippery, and the surface of the slot holes U It is laid out in the area of the τ-shaped card ear, which is convenient for recording and embedding when the 丨 丨 combination, by the _ adjacent rear position heat sink i Μ-shaped card ear 9 inlaid with the front heat sink i 0 hole 11 to two or two The heat sink 1 is combined into a heat sink set and installed in a computer central processor for heat dissipation. Furthermore, the ear 3 of the created heat sink i can be modified by the upper circular 丨 3 connected to the straight column Μ 15 (see the seventh figure), and after the lingering The upper and lower horizontal hem 2 are also formed into the 姊 槪 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , : Slightly larger than the area of the standard tof 彡 丨 丨 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , to The slot 16 is configured to combine the two heat sinks 1 into a heat sink set and is installed in a computer central processor for heat dissipation. M294693 In summary, this creation has achieved the desired effect under the previous technology, and it is not easy for anyone who is familiar with the technology to think about it. Moreover, this creation has not been disclosed before the application. The novelty and progressiveness have been consistent with the application requirements of the new patents, and new applications have been filed according to law. However, the above description is only a preferred and feasible embodiment of the present invention, and thus the application for the creation of the creation is not limited, so the equivalent creation of the original creation and the use of the image is directly or indirectly applied to the other. All relevant technical fields should be included in the scope of the spirit of this creation and be combined with Chen Ming. [Simple description of the figure] The first picture is a conventional heat sink diagram. The first picture shows the creation of the heat sink card ear and slot pattern. The third figure is the action diagram of the front of the heat sink clip and the slot buckle. The fourth picture is a cross-sectional view of the combination of the creation of the card. The fifth picture is a combination of the creation of the radiator. The sixth picture is the τ-shaped calogram of the heat sink. The seventh picture is the target shape of the heat sink. Upper and lower hem 200, 300 Groove hole 500 Horizontal hem 2 [Description of main component symbols] Heat sink 100 Lug 400 Heat sink 1 M294693 Ear 3 Inverted △ 4 Plate 5 Block 榫 6 Slot 7 Radiator set 8 T-shaped ear 9 arc round 10 slot 11 block card 12 round 13 straight column 14 target shaped ear 15 slot 16 block card 17

Claims (1)

M294693 九、申請專利範圍: 1· 一種散熱片結構改良,是適用於電腦中央處理器之散熱器,包 括·· 散熱片於上、下兩端形成水平折邊,於上、下水平折邊兩側之四 角洛處’於上、下水平折邊上凸伸—前由倒⑽與後連結承板组成的 卡耳’在卡耳概的上、τ水平折邊上也娜成與前由嫩形與後連 結承板組成的卡耳呈對應鑲嵌的槽孔,且在槽孔前端壁緣設塊狀卡棒 使配合更加穩固; 猎此組合時由兩相鄰之後位散熱片的卡耳鑲嵌入前位散熱片之槽 孔内’以將兩兩散熱片組合成—散熱器組,安設於電腦中央處理器使 用’具備了料製顔、快雜裝、快速雜的絲,雜護及延長 電腦中央處理器之使用壽命者。 2.如申請專利範圍第i項所述之散熱片結構改良,該散熱片的卡 耳可以改設呈T形卡耳,並在Τ字上之_修綠圓使得在組合時更 易鑲嵌’另於τ形卡耳的上、下水平折邊上也娜成與了形卡耳 2應的槽孔’並在槽孔上設塊狀卡榫使卡扣更細不滑脫,藉此組合 時由兩相鄰之後位散熱;ί的τ形卡耳鑲欽前位散細之槽孔内以 ;…散”、、片1、、且&amp;成一散熱器組,安設於電腦中央處理器作散敎 用者。 W 3·如申請專利範圍第i項所述之散熱片結構改良,另、該散熱片的 卡耳可以改.又由上圓形連結直柱所組成之標乾形卡耳,並在標姉卡 耳稍後的上、下水平折邊上也都形成無姉卡耳職之槽孔,並在 M294693 槽孔城成塊狀卡榫,使岭結合後㈣不滑脫; 猎此組合時由m_之後位散熱片的餘形卡耳鑲欲人前位散熱 片之槽孔内’以將兩兩散熱片i組合成—散熱器組,安設 理器作散熱_者。 f央處M294693 IX. Patent application scope: 1. A heat sink structure is improved. It is a heat sink suitable for computer central processing unit. It includes... The heat sink forms horizontal folds on the upper and lower ends, and horizontally folds on the upper and lower sides. The four corners of the side are extended on the upper and lower horizontal flanges. The front of the card is composed of the inverted (10) and the rear connecting plate. On the card's outline, the horizontally folded edge is also formed by the front and the front. The ear formed by the shape and the rear connecting plate is correspondingly inserted into the slot, and a block-shaped bar is arranged at the front edge of the slot to make the cooperation more stable; when the combination is used, the ear mounting of the two adjacent rear heat sinks is used. Into the slot of the front heat sink, 'to combine the two heat sinks into a heat sink set, installed in the computer's central processor, using 'materials, quick miscellaneous, fast miscellaneous silk, miscellaneous and Extend the life of the computer's central processing unit. 2. If the structure of the heat sink according to item i of the patent application is improved, the ear of the heat sink can be modified into a T-shaped ear, and the green circle on the Τ word makes it easier to set in the combination. On the upper and lower horizontal folds of the τ-shaped ear, it is also formed with the slot of the shape of the ear 2 and a block-shaped snap is provided on the slot to make the buckle thinner and not slippery. The heat is dissipated by two adjacent positions; the τ-shaped card ear is embedded in the slot of the front part of the slot; the "scatter", the piece 1, and the &amp; into a heat sink set, installed in the computer central processor For the purpose of dispersing the user. W 3 · The heat sink structure as described in item i of the patent application is improved, and the card of the heat sink can be modified, and the dry card composed of the upper circular connecting straight column The ear, and the slot on the upper and lower horizontal folds of the standard card ear, also form the slot of the cardless ear, and form a block in the M294693 slot city, so that the ridge is combined (four) does not slip off When hunting this combination, the residual shape of the heat sink after the m_ is inserted into the slot of the front heat sink to combine the two heat sinks into a heat sink set. For heat dissipation _. 1111
TW95202113U 2006-01-27 2006-01-27 Improved heatsink plate structure TWM294693U (en)

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