TWM512156U - Heat dissipation device and memory thereof - Google Patents

Description

Heat sink and its memory

The present invention relates to a heat sink, and more particularly to a heat sink for a memory.

With the ever-changing technology, the computer hardware has begun to develop in the direction of high speed and high frequency, so as to improve the efficiency of computer operation. However, computer hardware will operate in high-speed and high-frequency environments for a long time. Many thermal energy; in terms of memory modules, in order to match the high-speed operation of the processor, both the working clock and the transmission bandwidth tend to develop at high speed and high frequency. In contrast, the operating temperature of the memory varies with the working time. Increasingly high, the resulting heat energy is also considerable. In addition, the rising temperature will inevitably affect the performance of the memory module, and even worse, it will lead to memory damage.

The conventional heat dissipation structure 1 has a first heat dissipation member 10 and a second heat dissipation member 11 , and the first heat dissipation member is a conventional heat dissipation structure 1 that is commonly used in the market to help the heat dissipation of the memory. The first heat sink 10 has a first hook 101 and a first buckle 102 at the top, and the second heat sink 11 has a second hook 111 and a second buckle 112 at the top.

When the first heat dissipating member 10 and the second heat dissipating member 11 are assembled to each other, the first hook 101 of the first heat dissipating member 10 is located below the second detent 112 and is coupled to the second detent 112. The second hook 111 of the second heat dissipating member 11 is located below the first buckle groove 102, and is buckled with the first buckle groove 102, so that the first hook 101, the second hook 111, and the first A buckle groove 102 and the second buckle groove 112 are connected in a manner of being aligned above and below.

Therefore, when the first heat sink 10 and the second heat sink 11 are turned outward, the first hook 101 and the second buckle 112 and the second hook 111 and the first buckle 102 may be vertically moved. The first hook 100 and the second hook 111 are respectively separated from the first buckle 102 and the second buckle 112, so that the first heat sink 10 and the second heat sink 11 are lost. The original combination should lead to inconvenience in assembly.

However, in order to improve the loosening of the turning, a conventional heat dissipating structure through a sliding connection appears on the market. Referring to FIG. 2, the conventional heat dissipating structure 2 is mainly composed of a first heat dissipating body 20 and a The second heat sink 21 is constructed.

The first heat sink 20 has two first sliding members 201 at the top thereof, and the first sliding member 201 has a first stopping portion 202 formed by the top of the first heat radiating body 20 and a first stopping portion. The first plug portion 203 of the second heat sink 21 has two second sliding members 211, and the second sliding member 211 has a second stopping portion 212 formed by the top of the second heat radiating body 21 And a second plug portion 213 perpendicular to the second stopping portion 212.

The first insertion portion 203 slides inside the second stopper portion 212, and the second insertion portion 213 slides through the inside of the first stopper portion 202 to make the first stopper portion 202 and The second stopping portions 212 are in contact with each other, so that the first sliding member 201 and the second sliding member 211 are slidably coupled to each other.

Since the first heat dissipating body 20 and the second heat dissipating body 21 are slidably connected to each other through the first sliding member 201 and the second sliding member 211, the first heat dissipating body 20 and the second heat dissipating body are operatively operated. The body 21 is applied parallel to the first plug portion 203 or the second plug portion 213, and the first heat sink 20 and the second heat sink 21 are offset from each other and separated.

In view of the above, the conventional heat dissipating structure still has some disadvantages when it is turned outward, and it is necessary to improve the conventional heat dissipating device. By improving the structure of the first heat dissipating body and the second heat dissipating body, the conventional heat dissipating device is When it is turned outward, it can be easily detached, and there is no need to worry about the heat sink separating when operating.

The main purpose of this creation is to quickly assemble the two heat sinks, and the two heat sinks are not easily separated from each other when they are turned outward.

The secondary purpose of this creation is that the two heat sinks are not easily separated from each other by external forces during operation.

In order to achieve the above object, the present invention relates to a heat dissipating device for use with a memory circuit substrate, and is mainly composed of a first heat sink and a second heat sink.

The first heat sink has a first top plate portion and a first heat dissipating medium, and the first top plate portion extends outwardly to form a first engaging member and a first abutting member, and the first engaging member has a first engaging member The first convex portion and the first engaging portion formed by the first convex portion are convex, and the first engaging portion and the top portion are perpendicular to each other.

The first abutting member has a first inclined portion extending outward from the first top plate portion and a first combined portion, and the first inclined portion and the first top plate portion together form at least one first hook space And the first inclined portion has a first positioning surface adjacent to the first combined section and a first supporting portion that generates a vertical height difference from the first top plate portion.

The second heat sink has a second top plate portion and a second heat dissipating medium. The second top plate portion extends outwardly to form a second engaging member and a second abutting member. The second engaging member has a second engaging member. The second convex portion and a second engaging portion formed by the second protruding portion are convex, and the second engaging portion and the top portion are perpendicular to each other.

The second abutting member has a second inclined portion extending outward from the second top plate portion and a second combined portion, and the second inclined portion and the second top plate portion together form at least one second hook space And the second inclined portion has a second positioning surface adjacent to the second combined section and a second supporting portion that generates a vertical height difference from the second top plate portion.

Wherein, when the first convex portion and the second convex portion are respectively combined in the first combined portion and the second combined portion, the first inclined portion and the second inclined portion are alternately arranged on the first convex portion And the second protruding portion, wherein the first card abutting portion and the second card portion are respectively located in the first hook space and the second hook space, thereby restricting the first heat sink and the second heat dissipation The front and rear displacements between the sheets, and the first convex portion and the second convex portion respectively abut the first positioning surface and the second positioning surface, thereby restricting between the first heat sink and the second heat sink When the first heat sink and the second heat sink are combined with each other, the first support portion and the second support portion are in contact with the first top plate portion and the second top plate portion, respectively.

Furthermore, the first engaging member has the same structure as the second engaging member, and the first abutting member has the same structure as the second abutting member.

In a preferred embodiment, the first heat sink and the second heat sink respectively have two first hook spaces and two second hook spaces, and the first engaging member and the second engaging member respectively have The first convex portion and the second convex portion extend in the opposite direction to the first engaging portion and the second engaging portion.

Further, the first inclined portion, the second inclined portion, the second convex portion, and the first convex portion are alternately arranged in an obliquely upward manner.

In another preferred embodiment, the first engaging member and the second engaging member respectively have the first protruding portion and the second protruding portion extending toward the single direction to form the first engaging portion and the second portion. Card to the Ministry. Further, the first inclined portion, the second inclined portion, the second convex portion, and the first convex portion are alternately arranged in an obliquely downward manner.

It can be seen from the foregoing description that the first heat sink and the second heat sink are respectively disposed through the first engaging portion and the second engaging member in the first combined section and the second combined section. Both the first heat sink and the second heat sink can be quickly assembled in alignment.

In addition, the first abutting member, the second abutting member, the first engaging member and the second engaging member respectively have a height difference between the first heat dissipating member and the top end of the second heat dissipating member, so that the first When the heat sink and the second heat sink are flipped outward or inward, the first engaging member and the second engaging member can continue to be located in the first hook space and the second hook space, thereby making the first When a heat sink and a second heat sink are turned outward or inward, they are not easily separated from each other.

Furthermore, when the first heat sink and the second heat sink are actuated by an external force, the first convex portion and the second convex portion are respectively connected to the first positioning surface and the second positioning surface through contact, so that the first heat sink and the first heat sink The two heat sinks are not easily displaced left and right.

In order to further understand the structure, use and characteristics of this creation, we have a deeper and clearer understanding and understanding. The preferred embodiment is described below with reference to the following:

Referring to FIG. 3 , the heat sink 3 of the present invention is mainly composed of a first heat sink 30 and a second heat sink 40 .

The first heat sink 30 has a first side plate portion 31 and a first top plate portion 32 which is formed by bending the top portion of the first side plate portion 31. The first side plate portion 31 has a first heat transfer medium 33, and the above A top plate portion 32 extends obliquely downward to form a first abutting member 34 and a first engaging member 35.

The first abutting member 34 has a first inclined portion 341 extending obliquely downward from the first top plate portion 32, a first supporting portion 342 extending from an end portion of the first inclined portion 341, and a first combined portion. The first inclined portion 341 and the first top plate portion 32 together form at least one first hook space 344, and the first inclined portion 341 is adjacent to the first combined portion 343 and has a first positioning. The surface 341a has a height lower than the first top plate portion 32 of the first heat sink 30. As shown, the first heat sink 30 has two first hook spaces 344.

The first engaging member 35 is mainly composed of a first protruding portion 351 and a first engaging portion 352. The first convex portion 351 is formed to extend downward from the first top plate portion 32, and the first locking portion 352 is opposite to the first convex portion 351 by the end of the first convex portion 351. The direction of the extension is formed, whereby the first protruding portion 351 and the first engaging portion 352 together cause the first engaging member 35 to assume a T-like state.

However, the first supporting portion 342 of the first abutting member 34 and the first engaging portion 352 of the first engaging member 35 are lower than the first top plate portion 32 for convenience of description, and are not limited. As shown in FIG. 4, the first abutting member 34 has the first position of the first abutting portion 352, the first supporting portion 342, and the first top plate portion 32. The inclined portion 341 is such that the first supporting portion 342 is higher than the first top plate portion 32, and the first engaging member 35 has a first protruding portion 351 extending upward, so that the first engaging portion 352 is also higher than The first top side portion described above. As shown in FIG. 5, the first supporting portion 342 of the first abutting member 34 is lower than the first top plate portion 32, and the first engaging portion 352 of the first engaging member 35 is higher than the first Top plate portion 32.

The second heat sink 40 has a second side plate portion 41 and a second top plate portion 42 formed by bending the top portion of the second side plate portion 41. The second side plate portion 41 has a second heat transfer medium 43. The two top plate portions 42 respectively extend downwardly to form a second abutting member 44 and a second engaging member 45.

The second abutting member 44 has a second inclined portion 441 extending obliquely downward from the second top plate portion 42 , a second supporting portion 442 extending from an end portion of the second inclined portion 441 , and a second combined portion In the segment 443, the second inclined portion 441 and the second top plate portion 42 together form at least one second hook space 444, and the second inclined portion 441 is adjacent to the second combined portion 443 and has a second positioning. The surface 441a and the second support portion 442 are lower in height than the second top plate portion 42 of the second heat sink 40. As shown, the second heat sink 40 has two second hook spaces 444.

The second engaging member 45 is mainly composed of a second protruding portion 451 and a second engaging portion 452. The second protruding portion 451 is formed by the second top plate portion 42 extending downward, and the second locking portion 452 is opposite to the second locking portion 452 by the end of the second protruding portion 451. The direction of the extension is formed, whereby the second protruding portion 451 and the second engaging portion 452 together cause the second engaging member 45 to assume a T-like state.

However, both the second supporting portion 442 of the second abutting member 44 and the second engaging portion 452 of the second engaging member 45 are lower than the top side of the second top plate portion 42 for convenience of explanation, and The structural positional relationship between the second abutting portion 452, the second supporting portion 442 and the second top plate portion 42 is restricted. As shown in FIG. 4, the second abutting member 44 has the above-mentioned upwardly inclined extension. The second inclined portion 441 has the second supporting portion 442 higher than the second top plate portion 42, and the second engaging member 45 has a second protruding portion 451 extending upward, so that the second engaging portion 452 is the same Higher than the second top side portion described above. As shown in FIG. 5, the second supporting portion 442 of the second abutting member 44 is higher than the second top plate portion 42, and the second engaging portion 452 of the second engaging member 45 is lower than the second portion. Top plate portion 42.

Referring to FIG. 3 and FIG. 6 , the first abutting member 34 and the second abutting member 44 are respectively located on the second engaging member 45 and the first engaging member 35 , and the first heat sink 30 is The second heat dissipating fins 40 are assembled close to each other, and the first card abutting portion 352 passes through the second combined section 443, so that the first card abutting portion 352 is located in the second hooking space 444, and the touch is positioned In the second abutting member 44, the first protruding portion 351 of the first engaging member 35 and the second positioning surface 441a of the second abutting member 44 abut each other. The second card abutting portion 452 passes through the first combination portion 343, so that the second card abutting portion 452 is located in the first hook space 344 and touches the first abutting member 34. The second inclined portion 451 of the second engaging member 45 and the first positioning surface 341a of the first abutting member 34 abut each other, and the first inclined portion 341 and the second inclined portion 441 are alternately arranged in the above A convex portion 351 and a second convex portion 451.

An accommodating space 50 for accommodating the first heat conductive medium 33 and the second heat conductive medium 43 is formed between the first heat sink 30 and the second heat sink 40, and is further transmitted through the first card abutting portion 352. The second card abutting portion 452 is located in the first hook space 344 and the second hook space 444, so that the first heat sink 30 and the second heat sink 40 can be turned outward to be in an unfolded state. Turns inward and presents a closed state. Moreover, the front-back displacement between the first heat sink 30 and the second heat sink 40 is restricted.

It can be seen from the above description that the first abutting member 34 and the second abutting member 44 have the same structure, and the first engaging member 35 and the second engaging member 45 have the same structure. However, the first abutting The top member 34 and the second abutting member 44 are identical in structure, and the first engaging member 35 and the second engaging member 45 are identical in structure for convenience of explanation, and the structural form thereof is not limited.

As shown in the figure, when the first heat sink 30 and the second heat sink 40 together assume a closed state, the first top plate portion 32 and the second top plate portion 42 are respectively located at the second support portion 442 and the first support portion 342. The second support portion 442 and the first support portion 342 are respectively in contact with each other.

When the first heat sink 30 and the second heat sink 40 are actuated by an external force, the first convex portion 351 and the second convex portion 451 respectively abut the first positioning surface 341a and the second positioning surface 441a. The left and right displacements between the first heat sink 30 and the second heat sink 40 are restricted, thereby achieving the effect of being difficult to separate and release.

Referring to FIG. 7 , in the embodiment, the first engaging member 35 and the second engaging member 45 are both in a T-shaped manner, so that the first engaging member 35 and the second engaging member 45 respectively When the first combination section 343 and the second combination section 443 are disposed, the first card abutting portion 352 and the second card abutting portion 452 are respectively located in the two first hook space 344 and the second second hook space. 444.

However, the first engaging member 35 and the second engaging member 45 are both T-shaped for convenience of description, and the shapes of the first engaging member 35 and the second engaging member 45 are not limited. As shown in FIG. 8 , the first engaging member 35 and the second engaging member 45 respectively have the first protruding portion 351 and the second protruding portion 451 extending in a single direction to form the first card. The first slanting portion 351 and the first yoke portion 452 together cause the first engaging member 35 to assume an L-shaped state while the second slanting portion The second engaging member 45 and the second engaging member 45 are respectively disposed in the L-shaped state, and the first engaging member 35 and the second engaging member 45 are respectively disposed in the first combination. In the section 343 and the second combination section 443, the first card abutting portion 352 and the second card abutting portion 452 are respectively located in one of the two first hook spaces 344 and the two second hook spaces 444. one.

Referring to FIG. 9 , in a specific application, the first heat sink 30 and the second heat sink 40 are transmitted through the first card abutting portion 352 of the first engaging component 35 and the second card of the second latching member 45 . The abutting portion 452 is respectively disposed on the first combination portion 343 and the second combined portion 443, so that the first card abutting portion 352 and the second card abutting portion 452 respectively touch the first hook space 344 and the first The second hooking space 444 causes the first heat sink 30 and the second heat sink 40 to together exhibit an unfolded state.

The first heat sink 30 and the second heat sink 40 are moved over a memory circuit board 60, and the memory circuit board 60 is placed in the accommodating space 50. Next, the first heat sink 30 and the first heat sink 30 The two heat sinks 40 are turned inwardly, so that the first heat sink 30 and the second heat sink 40 together are in a closed state. At this time, the memory circuit substrate 60 is located in the first heat conductive medium 33 and the second heat conductive medium 43. between. Thereby, the thermal energy generated by the memory circuit board 60 can transmit thermal energy to the air through the first heat sink 30, the second heat sink 40, the first heat transfer medium 33, and the second heat transfer medium 43 to prevent the above. The temperature of the memory circuit substrate 60 is too high.

When the first heat sink 30 and the second heat sink 40 are turned outward, the first abutting member 34, the second abutting member 44, the first engaging member 35, and the second engaging member 45 are passed through. Each of the first top plate portion 32 and the second top plate portion 42 has a height difference, and the first engaging member 35 and the second engaging member 45 can continuously contact the first hook space 344 and The second hook space 444 can thereby make the first heat sink 30 and the second heat sink 40 difficult to separate from each other when the first heat sink 30 and the second heat sink 40 are turned outward or inward.

In summary, the first heat sink and the second heat sink are respectively passed through the first engaging member and the second engaging member through the first combined portion and the second combined portion, thereby A heat sink and a second heat sink can be quickly assembled and aligned.

In addition, the first abutting member, the second abutting member, the first engaging member and the second engaging member respectively have a height difference between the first heat dissipating member and the top end of the second heat dissipating member, so that the first When the heat sink and the second heat sink are flipped outward or inward, the first engaging member and the second engaging member can continue to be located in the first hook space and the second hook space, thereby making the first When a heat sink and a second heat sink are turned outward or inward, they are not easily separated from each other.

Furthermore, when the first heat sink and the second heat sink are actuated by an external force, the first convex portion and the second convex portion are respectively connected to the first positioning surface and the second positioning surface through contact, so that the first heat sink and the first heat sink The two heat sinks are not easily displaced left and right.

The above embodiments are not intended to limit the scope of the present invention. It is included in the scope of the following patent application.

[study]
1‧‧‧Learning heat dissipation structure
10‧‧‧First heat sink
101‧‧‧First card hook
102‧‧‧First buckle
11‧‧‧second heat sink
111‧‧‧Second card
112‧‧‧Second buckle
2‧‧‧Learning heat dissipation structure
20‧‧‧First heat sink
201‧‧‧First slide
202‧‧‧First stop
203‧‧‧First plug-in
21‧‧‧second heat sink
211‧‧‧Second slide
212‧‧‧Second stop
213‧‧‧Second plug-in department [this creation]
3‧‧‧heating device
30‧‧‧First heat sink
31‧‧‧First side panel
32‧‧‧First top board
33‧‧‧First heat transfer medium
34‧‧‧First abutment
341‧‧‧First inclined part
341a‧‧‧First positioning surface
342‧‧‧First support
343‧‧‧First combination section
344‧‧‧First hook space
35‧‧‧First card fittings
351‧‧‧First slant
352‧‧‧ First card arrival
40‧‧‧second heat sink
41‧‧‧Second side panel
42‧‧‧Second top board
43‧‧‧Second thermal medium
44‧‧‧Second abutment
441‧‧‧Second inclined part
441a‧‧‧Second positioning surface
442‧‧‧second support
443‧‧‧Second combination section
444‧‧‧Second hook space
45‧‧‧Second fittings
451‧‧‧second slant
452‧‧‧Second card arrival
50‧‧‧ accommodating space
60‧‧‧ memory circuit board

1 is an exploded view of a conventional heat sink device; FIG. 2 is an exploded view of another conventional heat sink device; FIG. 3 is a first card abutting portion, a second card abutting portion, a first combined portion and a second combination The four segments are lower than the exploded view of the first heat sink and the second heat sink; FIG. 4 is the first card abutting portion, the second card abutting portion, the first combined segment and the second combined segment. It is higher than the exploded view of the first heat sink and the second heat sink; FIG. 5 is that the first card abutting portion, the second card abutting portion, the first combined segment and the second combined segment are respectively lower than / An exploded view of the first heat sink and the second heat sink; FIG. 6 is a schematic view showing the first heat sink and the second heat sink together in an unfolded/closed state; FIG. 7 is a first card abutting portion and a second card; The abutting portions are respectively located on opposite sides of the first combined section and the second combined section; FIG. 8 is that the first engaging portion and the second engaging portion are respectively located on the side of the first combined section and the second combined section FIG. 9 is a schematic diagram showing the application of the heat sink device with the memory circuit substrate.

3‧‧‧heating device

30‧‧‧First heat sink

31‧‧‧First side panel

32‧‧‧First top board

33‧‧‧First heat transfer medium

34‧‧‧First abutment

341‧‧‧First inclined part

341a‧‧‧First positioning surface

342‧‧‧First support

343‧‧‧First combination section

344‧‧‧First hook space

35‧‧‧First card fittings

351‧‧‧First slant

352‧‧‧ First card arrival

40‧‧‧second heat sink

41‧‧‧Second side panel

42‧‧‧Second top board

43‧‧‧Second thermal medium

44‧‧‧Second abutment

441‧‧‧Second inclined part

441a‧‧‧Second positioning surface

442‧‧‧second support

443‧‧‧Second combination section

444‧‧‧Second hook space

45‧‧‧Second fittings

451‧‧‧second slant

452‧‧‧Second card arrival

Claims (14)

A heat dissipating device includes: a first heat sink having a first top plate portion, wherein the first top plate portion extends outwardly to form a first engaging member and a first abutting member, wherein the first engaging member has a first protruding portion and a first engaging portion formed by the first protruding portion, wherein the first engaging portion and the top portion are perpendicular to each other, and the first abutting member has a first inclined portion extending outward from the first top plate portion and a first combined portion, wherein the first inclined portion and the first top plate portion together form at least one first hook space, and the first inclined portion Having a first positioning surface adjacent to the first combined section; and a second heat sink having a second top plate portion, the second top plate portion extending outwardly to form a second engaging member and a second a second abutting member, the second engaging member has a second protruding portion and a second engaging portion formed by the second protruding portion, and the second engaging portion and the top plate portion are generated a vertical height difference, and the second abutting member has a second a second inclined portion extending outwardly from the plate portion and a second combined portion, wherein the second inclined portion and the second top plate portion together form at least one second hook space, and the second inclined portion has an adjacent a second positioning surface of the second combined section; wherein the first inclined portion and the second protruding portion are respectively combined with the first combined portion and the second combined portion, the first inclined portion and the second portion The inclined portions are staggered in the first protruding portion and the second protruding portion, so that the first engaging portion and the second engaging portion are respectively located in the first hook space and the second hook space. The front and rear displacements between the first heat sink and the second heat sink are restricted, and the first convex portion and the second convex portion respectively abut the first positioning surface and the second positioning surface, thereby limiting the above Left and right displacement between the first heat sink and the second heat sink. The heat dissipating device according to claim 1, wherein the first inclined portion edge is further provided with a first supporting portion that generates a vertical height difference from the first top plate portion, and the second inclined portion end edge further Providing a second support that generates a vertical height difference from the second top plate portion In this way, when the first heat sink and the second heat sink are combined with each other, the first support portion and the second support portion are in contact with the first top plate portion and the second top plate portion, respectively. The heat dissipating device according to claim 1, wherein the first engaging member has the same structure as the second engaging member, and the first abutting member has the same structure as the second abutting member. The heat dissipating device of claim 1, wherein the first heat sink and the second heat sink respectively have two first hook spaces and two second hook spaces, and the first engaging members and the second Each of the engaging members has the first engaging portion and the second engaging portion extending in opposite directions from the first convex portion and the second convex portion. The heat dissipating device according to claim 1, wherein the first engaging member and the second engaging member respectively have the first protruding portion and the second protruding portion extending toward the single direction to form the first card. The abutting part and the second card abutting part. The heat dissipating device according to claim 1, wherein the first inclined portion, the second inclined portion, the second convex portion, and the first convex portion are in the same manner as obliquely upward or obliquely downward. staggered. The heat dissipating device according to claim 1, wherein the first abutting member has a first heat dissipating medium, and the second abutting member has a second heat dissipating medium. A memory device having a heat dissipating device, comprising: a memory circuit substrate; and a heat dissipating device; comprising a first heat sink having a first top plate portion, wherein the first top plate portion extends outward to form a first card And a first abutting member, the first engaging member has a first protruding portion and a first engaging portion formed by the first protruding portion, and the first engaging portion is The top plate portion generates a vertical height difference, and the first abutting member has a first inclined portion extending outward from the first top plate portion and a first combination section, the first inclined portion and the first top plate portion together form at least one first hook space, and the first inclined portion has a first positioning surface adjacent to the first combined section And a second heat sink having a second top plate portion, the second top plate portion extending outwardly to form a second engaging member and a second abutting member, wherein the second engaging member has a second convex portion a second card abutting portion formed by the second protruding portion, wherein the second card abutting portion and the top plate portion generate a vertical height difference, and the second abutting member has a second a second inclined portion extending outwardly from the top plate portion and a second combined portion, wherein the second inclined portion and the second top plate portion together form at least one second hook space, and the second inclined portion has an adjacent portion a second positioning surface of the second combination section; wherein the first inclined portion and the second convex portion are respectively combined with the first combined portion and the second combined portion, the first inclined portion and the first inclined portion The two inclined portions are staggered in the first convex portion and the first The first inclined portion and the second card are respectively located in the first hook space and the second hook space, thereby restricting the first partial heat sheet and the second heat sink The front and rear displacements, and the first convex portion and the second convex portion respectively abut the first positioning surface and the second positioning surface, thereby restricting the left between the first heat sink and the second heat sink, Right displacement. The memory device having a heat dissipating device according to claim 8, wherein the first inclined portion edge is further provided with a first supporting portion that generates a vertical height difference from the first top plate portion, and the second tilting portion The end edge is further provided with a second support portion that generates a vertical height difference from the second top plate portion, whereby the first support portion and the second support portion are combined when the first heat sink and the second heat sink are combined with each other Do not contact the first top plate portion and the second top plate portion. According to the memory device having the heat dissipating device of claim 8, the first engaging member has the same structure as the second engaging member, and the first abutting member has the same structure as the second abutting member. . The memory device having a heat dissipating device according to claim 8 , wherein the first heat sink and the second heat sink respectively have two first hook spaces and two second hook spaces, and Each of the first engaging member and the second engaging member has the first engaging portion and the second engaging portion extending in opposite directions by the first protruding portion and the second protruding portion. The memory device having a heat dissipating device according to claim 8, wherein the first engaging member and the second engaging member respectively have a first protruding portion and a second protruding portion extending toward a single direction. The first card abutting portion and the second card abutting portion. The memory device having a heat dissipating device according to claim 8, wherein the first inclined portion, the second inclined portion, the second convex portion, and the first convex portion are inclined upward or obliquely downward. One of the ways is staggered. The memory device having a heat dissipating device according to claim 8 , wherein the first abutting member has a first heat dissipating medium, and the second abutting member has a second heat dissipating medium.