JP2007317723A - Heating element cooling apparatus, method for cooling heating element, and heat sink mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sink mounting structure for mounting a heat sink not depending on location of a heat sink mounting hole of a printed circuit board. <P>SOLUTION: The heat sink mounting structure is divided to a heat sink body 1 and a mounting part. Moreover, the mounting part is constituted with an engagement member 5 engaged movably with a groove of the heat sink body, and a fixing member 8 movably coupled with the engagement member. The heat sink is fixed by pressing a clip with spring of the fixing member to a hole at the mounting location in the printed circuit board side by adjusting locations of the engagement member and fixing member. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat sink mounting structure in an information processing apparatus or the like, and further relates to a heat sink mounting structure that can be mounted regardless of the position of a heat sink mounting hole on a printed circuit board.

  In order to cool a heating element such as a highly integrated semiconductor such as an LSI mounted on various printed boards, a heat sink is attached in contact with the heating element. Conventionally, for mounting a heat sink, a mounting hole corresponding to the heat sink to be used is provided, and the heat sink is mounted on a printed board using a fixing member such as a clip with a spring.

  FIG. 7 is a perspective view of a conventional mounting structure, and FIG. 8 is a structural diagram of a conventional mounting method. 7 and 8, 21 is a heat sink, 22 is a heat radiation fin provided on the heat sink, 23 is a heat sink attachment portion to the printed circuit board, 24 is a clip, 25 is a tip portion, and 26 is a spring. The heat sink mounting portions 23 provided at two corners on the diagonal line of the heat sink 21 are integrated with the heat sink body to form the heat sink 21. Further, by pushing the clip 24 integrated with the heat sink mounting portion 23, the leading end portion 25 for preventing the protrusion is protruded and fixed to the back surface of the printed circuit board, and between the heat sink mounting portion 23 and the head of the clip 24. It is fixed by the stress of the spring 26 incorporated in the shaft portion.

  In such a conventional method, the mounting hole position is determined by the design requirements such as the component mounting of the printed board and the wiring conditions. Therefore, even if the heat sink has the same size, a heat sink corresponding to each heating element is used. Each time it was newly prepared, there was a problem that the cost was increased.

Patent Document 1 describes a heating element cooling device in which an escape portion is formed on a socket member provided with a heating element so as to avoid interference with a locking groove when a heat sink provided with a protruding portion is contacted / locked. ing. In Patent Document 2, protrusions are provided at both edges of the bottom surface of the heat sink, and a clip having an inverted U-shaped elasticity for fixing the heat sink is locked to the fixing hole of the printed circuit board, and a groove provided on the protrusion is A method for fixing a heat sink having a structure to be fitted by a hole in the central portion to a printed board is described. However, in any of these documents, there has been no technique for fitting in a movable manner corresponding to the mounting holes provided in the printed circuit board.
Japanese Unexamined Patent Publication No. 2000-236053 (page 1-2, FIG. 1) JP 2000-22370 A (page 1-2, FIG. 1)

  An object of the present invention is to provide a heat sink mounting structure that can be mounted independently of the mounting hole position of the printed circuit board by separating the heat sink main body and the mounting part to the printed circuit board.

  In the heat sink mounting structure according to the present invention, the heat sink main body provided with a groove portion on the side surface portion, a locking member that is movably locked in the groove portion, and a printed board side fixing that is movably fitted to the locking member And a heat sink mounting portion composed of a member, and is configured to be fitted and fixed to the mounting hole of the printed board while moving and adjusting the locking member and the fixing member.

  In the heat sink mounting structure according to the present invention, since the heat sink main body and the mounting portion are separated and the mounting portion has an adjustment function, if the difference between the mounting hole of the printed circuit board and the heat sink mounting position is within a predetermined range, It is possible to adjust and attach to the fixed mounting hole position on the printed circuit board, and the same heat sink body can be used, so there is no need to start a new heat sink body, preventing cost increase including design man-hours. it can.

The heat sink mounting structure is divided into a heat sink main body and a mounting portion, and the mounting portion further includes a locking member that is movably locked in a groove of the heat sink main body, and a fixing member that is movably fitted to the locking member. Then, the positions of the locking member and the fixing member are adjusted, and the heat sink body is attached to the attachment position on the printed board side.
(Example)
FIG. 1 is a perspective view of the mounting structure of the present invention. In FIG. 1, 1 is a heat sink body, 2 is a plurality of heat radiation fins integrally formed on the heat sink body, 3 is a groove provided on a side surface in the thickness direction of the heat sink body, and 4 is fitted into the groove 2 to be predetermined. A fitting member 5 that can be moved within a range, 5 is a latch member on the printed circuit board side that is adjusted so that it can be moved to the mounting hole position of the printed circuit board, and 6 is a locking member for a predetermined printed circuit board. A clip 7 for mounting and fixing in the mounting hole is a spring to be restrained when the clip 6 is fixed to the printed circuit board. The locking member 5, the clip 6 and the spring 7 constitute a fixing member 8 on the printed circuit board side. Yes.

  FIG. 2 is an explanatory view of a mounting method according to the embodiment of the present invention. In FIG. 2, 9 is a mounting member, and the fitting member 4 and the fixing member 8 are combined. It has a structure that is integrated so as to be movable in a perpendicular relationship. Reference numeral 10 denotes a front end portion of the clip 6, which protrudes toward the back side of the printed circuit board and fixes the locking member 5. In the following drawings, the same parts are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 3 is a structural diagram of the heat sink body 1 of the present invention, which is an embodiment provided on two sides where the grooves face each other. FIG. 4 is a structural diagram of the fitting member 4 of the mounting portion of the present invention, and FIG. 5 is a structural diagram of the locking member 5 of the mounting portion of the present invention. 2 will be described below with reference to FIGS.

  As shown in detail in FIG. 3, the heat sink main body 1 of FIG. 2 has a large number of fins 2 disposed on the upper surface and mounting grooves 3 on opposite side surfaces. 4 is inserted into the groove 3 and can be freely moved in the direction along the groove 3. Further, the fitting member 4 and the locking member 5 are combined as shown in the detailed views A and B of FIG. 2, and the locking member 5 freely moves within a predetermined range in the longitudinal direction of the fitting member 4. It can be made to. While moving and adjusting the fitting member 4 and the locking member 5 respectively, aligning the locking member 5 with the mounting hole position of the printed circuit board and then pushing the clip 6 on the opposite surface of the printed circuit board. The heat sink body 1 is fixed to the printed circuit board by being locked by the hook of the tip 10 and being pressed by the spring 7.

  FIG. 4 is a structural diagram of the fitting member 4 of the mounting portion of the present invention, and FIG. 5 is a structural diagram of the locking member 5 of the mounting portion of the present invention. In FIG. 4, the tip 41 is fitted in the groove 3 of the heat sink body 1 in the height direction of the heat sink body 1, and is moved along the groove 3 without being detached. Both ends 42 in the plan view are provided with a constriction, and an intermediate portion 43 is hollow, and is adapted to fit 55 in FIG. 5 described later.

  In FIG. 5, the fitting member 4 is inserted into the hollow portion 55 sandwiched between the protrusions 54 of the ita, and can move within a predetermined range in the longitudinal direction of the fitting member 4. A fixing portion 52 is provided with a mounting hole 53 of the clip 6 for fixing to the printed circuit board, and can be fixed to the printed circuit board by matching the position of the hole 53 with the mounting hole position of the printed circuit board. In this way, the fitting member 4 in FIG. 4 and the locking member 5 in FIG. 5 are combined and integrated, so that they can be moved at right angles as indicated by the arrows in FIG.

  FIG. 6 shows various embodiments of the mounting structure of the present invention, showing variations of the heat sink body, and also shows a method of adjusting / fixing to a predetermined position by moving the heat sink mounting portion. In the pattern 1 of the heat sink main body of FIG. 6A, the groove 3 for the locking member 4 described above is on the two sides facing each other, and in the pattern 2 of the heat sink main body of FIG. This embodiment is located on all sides, and has the effect of increasing the degree of freedom of the mounting position. The pattern 3 of the heat sink main body (c) is an embodiment in which the grooves 3 are provided on two sides that are perpendicular to each other, and the mounting strength of the heat sink main body is increased by the vertical mounting positions of the mounting portions. The effect can be expected.

  As an example of the material and material of each member, heat sink main body 1-aluminum, fitting member 4-aluminum, locking member 5-aluminum, clip 6-POM (resin), spring 7-piano wire are considered. It is done. In addition, especially as a material of the fitting member 4 of the sliding part and the latching member 5, abrasion resistance and heat conductivity are not requested | required.

The perspective view of the mounting structure of this invention Explanatory drawing of the mounting method of the present invention Structural diagram of heat sink body of the present invention Structure diagram of fitting member 4 of mounting portion of the present invention Structural drawing of the locking member 5 of the mounting portion of the present invention Various embodiments of the mounting structure of the present invention Perspective view of conventional mounting structure Structure diagram of conventional mounting method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat sink main body 2 Radiation fin 3 Groove 4 Fitting member 5 Locking member 6 Clip 7 Spring 8 Fixing member 9 Attachment member 10 Clip front-end | tip 21 Heat sink 22 Radiation fin 23 Heat-sink attachment part 24 Clip 25 Front-end | tip 26 Spring 41-43 fitting Each part 51-55 of the combined member 4 Each part of the locking member 5

Claims (4)

A heat sink body having a groove on the side surface in the thickness direction;
An attachment member having a fixing member that is movably fitted in the groove and fitted in an attachment hole of the substrate;
The heating element cooling device is characterized in that the mounting member is moved, the fixing member is fitted into the mounting hole of the substrate, and the mounting member is fixed at a predetermined position.   2. The heating element cooling device according to claim 1, wherein the groove portion provided on the side surface of the heat sink body includes at least one of two surfaces facing each other, all four surfaces, and two surfaces orthogonal to each other.   A mounting member that is movably fitted in the groove on the side surface in the thickness direction of the heat sink body and that has a fixing member that is fitted in the mounting hole of the substrate is movably fitted in the groove and attached to the substrate. A method of cooling a heating element, wherein the fixing member is fitted into a hole, and the mounting member is fixed at a predetermined position. In a device in which a heat sink that performs a cooling function in contact with the heating element is attached to the printed board having the heating element,
A heat sink body having a groove on the side surface in the thickness direction;
An attachment member having a fixing member that is movably fitted in the groove and fitted in an attachment hole of the substrate;
A mounting structure for a heat sink, wherein the mounting member is moved, the fixing member is fitted into a mounting hole of a substrate, and the mounting member is fixed at a predetermined position.

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