TWM488181U - Light transceiver with a heat conducting structure - Google Patents

Claims (11)

An optical transceiver having a thermally conductive structure is inserted into a connector housing of a main system board, the optical transceiver comprising: a transmission module includes a circuit board, at least one electronic component disposed on the circuit board, and a duplex sub-module (BOSA) electrically connected to the circuit board; a metal casing covering the transmission module, the metal casing having a plurality of thermal conductive elastic pieces and a plurality of heat dissipation fins; The optical transceiver is connected to the connector housing, and the thermal conductive elastic sheets are pressed by the connector housing and elastically clamped between the electronic component and the connector housing, and the thermal transmission of the electronic component The thermally conductive elastic sheets and the heat dissipation fins are conducted to the connector housing. The optical transceiver of claim 1, wherein the metal housing comprises: a first metal housing covering a side of the circuit board and extending outwardly to cover a side of the duplex sub-module; a second metal housing covering the other side of the duplex module corresponding to the first metal housing, the first metal housing and the second metal housing enclosing the duplex module And forming a docking space; a thermally conductive housing coupled to one side of the second metal housing and covering the other side of the circuit board with the second metal housing, the thermally conductive housing including a bottom plate and two side plates connecting the bottom plate The bottom plate has the heat conducting elastic pieces, and the two side plates are respectively provided with the heat radiating pieces. The optical transceiver of claim 2, wherein the surface of the first metal casing is formed with a plurality of heat dissipating bumps. The optical transceiver of claim 2, further comprising a metal clip that buckles the duplex module and is positioned in the docking space. The optical transceiver of claim 2, wherein the first metal housing is provided with an air flow passage communicating with an external environment, the air flow passage being connected to the docking space. An optical transceiver having a thermally conductive structure according to claim 2, further comprising a highly thermally conductive metal sheet contacting the electronic component and thermally guiding the first metal housing. The optical transceiver of claim 6, wherein the high thermal conductivity metal sheet is a U-shaped copper foil, and the high thermal conductivity metal sheet has a thermal conductivity of 200 W/m-k or more. The optical transceiver of claim 2, further comprising a metal elastic clip, the metal elastic clip being clamped between the duplex module and the first metal housing. An optical transceiver having a thermally conductive structure according to claim 8, wherein the metal elastic clip has a triangular cross section. The optical transceiver of claim 2, wherein the thermally conductive elastic sheets are formed in parallel and spaced apart on the bottom plate, and one end of each of the thermally conductive elastic pieces is connected to the bottom plate, and the other end is in a free state. An optical transceiver having a thermally conductive structure according to claim 1 or 10, wherein each of the thermally conductive elastic pieces is a curved piece.