TWI226982B - Flexible high-density cooling fin set and cooler - Google Patents

Abstract

The invention relate to a flexible high-density cooling fin set and cooler. The cooling fin set comprises multiple fins in form of successive plug-in arrangement. Each fin is at least installed a card buckling part and a free end in opposite to the buckling part forms the card edge. Between each of the card buckling parts is installed a link piece respectively to link all fins as a cooling fin set so as to arrange the cooling fin set in form of curved sector using the card bucking part as the bending fulcrum. The cooler comprises a heat dissipation base with curved surface and the previous cooling fin set. The cooling fin set is set up on the curved surface by bundling with the curved surface deflection of the heat dissipation base.

Description

1226982 " -------- V. Description of the invention (1) The present invention relates to a device, especially-a kind of application device; == radiating fin group and scattered fins are provided with the radiating Korean sheet The speed of the cooling fins on the base of the group benefits from: electricity: = speed upgrade 'makes the operating sub-elements of the electronic components: its: plus, therefore, the ability to heat. On the surface of the cow, it can increase the heat dissipation. Mechanical: work = Γ extrusion and pressure type heat dissipation. Due to time constraints, it is necessary to increase the resumption and carry a larger volume of electronic components in the heat ^ ^ /, volume & 鬲 heat dissipation capacity, but The tongue is increased by 3 t, and with most fins stacked P, the piece weight I is thinner and can be connected by continuous stacking ^ = ^ When it is a lighter and higher electronic component, its = force IK product It is also more convenient to use. 7 ~ Ping 乂 隹, so that in order to make the girls, this kind of heat sinking fins composed in a pile way will be, wood 3 = not loose, so in the past, it has been emphasized on the fastening method ; = Push effect, so that this type of heat sinking fin set can only be applied to-^ = and heat conduction base, so the heat sinking fin set must be arranged in a curved The surface fan-shaped combination has a curved heat-conducting base, which obviously cannot be used. 7 Or with the above, it can be seen from the above that the conventional heat-dissipating fin set has obvious inconvenience and lack of use, and can be modified. The covert is not due to the fact that the inventor feels that the above-mentioned deficiency can be improved, but

I Page 4 1226982 V. Description of the invention (2) Study and cooperate with the above-mentioned missing fins of the present invention. The fins of the fins are connected to form a moderately curved fin. The fins have high-density cooling fins, which can help In order to achieve the density of the heat dissipation fins, a single fin is formed on the self-end to fasten each chip group to the heat conduction base between the fin buckles of the heat dissipation fins in a stacked arrangement. And the buckle parts on each side are connected to form a curved fulcrum, and this loose application finally proposes a reasonable and rational design. The main purpose of the present invention is to form a flexible action with heat dissipation to cooperate with the heat fin group, and the heat transfer effect To form the above-mentioned sheet group, at least a plate edge is provided, and the fin part is bent to form the above-mentioned heat dissipation; the sheet, each of which is a track of the card holder, and the device is bent, and may have the fins of the song group. The purpose of the increase includes many --- ^ This binding piece is provided with a side curved heat heater which can use a high-density self-enclosed surface; the pieces advance between the pieces, and several pieces of this hair use the buckle part to dissipate heat. Form a song 'this book includes at least a connector on a thermal fin' to provide a heat-dissipating fin around the key to provide a conductive base. Due to the density of the ring, the Ming system can be used to raise the continuous card. The curved surface group is provided with one, and the heat dissipation type bendable band-like square piece group is formed into a curved shape seat, which is arranged on the diffuser and has a better heat dissipation efficiency for a buckle array. card Separately set; so as to provide a kind of heat conduction with a majority of the buckle portion, the heat sink fin fin set effectively improves the high-density type will most make it shape or form a heat-resistant surface with less resistance 〇 Curved high fins, one of each buckle has a directional base of the radiating fins and a continuous stack, and each of the card groups is fitted to the curved surface. In order for the review committee to further understand the present invention Characteristics and

Page 5 1226982 V. Description of the invention (3) For the technical contents, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention. Please refer to the first figure, which is an assembly diagram of the heat dissipation fin set of the present invention. The invention provides a bendable high-density heat dissipation fin group, which includes a plurality of fins 10, and the fins 10 are arranged in a continuous engagement manner, and a card is provided on each fin 10 A buckle 11 (at least at least one fin buckle 1 1 must be provided on each of the fins 10), and a connecting piece 12 is respectively clamped between the buckle portions 11 to order each link The pieces 12 are both fastened between the two buckling portions 11 to connect the fins 10 to a heat dissipation fin group 1 and the outer female ο, 1 ο the fins 1 and the holes 1 to 1 through 1 There are some buckles to open the card 1 above 1, and the buckle card A is shown in the figure, and the bending edge is 1 ±

2 open 1 minute 1 stand, stand 1 2 1 is 1 or hole-shaped buckle two J have a harness factory less one to show okay, ο) sketch hole C factory type ligature as

J pieces ο Knot 2 and 1 hooks on the card, there is a stretch C and the figure is bent. The next step is to share the two pictures of the ginseng card one by one at the same time as the other pictures, and the bottom 2 one by one, please tie the pieces 2 hook 1 ο hook 1 the card 1 in a hole another The mother is here, 1 card, 1 series, 2 parts, 1 buckle, 2 card, 1 hole, 2 hooks, 1 buckle on the card, 1 card description, 1 part of the front part, buckle the middle card, example 1 》 一 刚 1— 本本 Let this be a card such as

IX IX

τ-Η IX IX 1 knot on 2 1 _- β, t 1 stand up to the hole buckle, the other two buckle; one of the buckle mesh buckle on the end ο one end 1 back 2 pieces 1 1 fin, 2 pieces, etc. 1 knot, the hook connecting card, etc.

Page 6 No. 1226982 V. Description of the invention (4) 2 The hooks 1 2 0, 1 2 3 are provided to provide: the upper m is respectively provided with a longitudinal slot;! 2 2 and the 2 snap action. , '2 0, 1 2 1 has better elasticity, please refer to the skirt. The above can be used :::: As shown in the second figure, the main group 1 of the heat sink fin is connected to each of the buckles. , While making the scattered two movements, at the same time, each fin 3 has a moderate f pendulum like a chain edge 1 September 1 ◦ relative to its snap Qiu 4 J Gongquzhi 3 to keep 彳 & [6] One side of the mouth 1 is formed with a disk that can be moved toward the edge of the plate, and can be moved two times. Therefore, the buckling part 1 ^ ^ of each fin 丄 0 10 is deformed strangely, but each fin is more ， Ii must be set at the same bending radius of 14 shi 'to stabilize the fin door: # 1 ◦ can also be bent on its outer edge to set a fold 15 strength and reduce contact 埶: inch with the same heat dissipation fin Sheet, group 1 structural folds! 5In the bend I resist it; the surface =; = ㈣ the r the distance P, the top surface of the door VIII, 4 1 1 to make the fold 1 ^ blind is roughly equivalent to the thickness of the body of the connector 12 The heat dissipation fin b1, the surface is tangent to the top surface of the connecting member 12, and then it is beneficial for the contact person 1 and the heat conduction base 20 (described later) to be a better surface and surface key piece fi13. A fold can also be provided (Figure (Omitted), its size is less than the distance between 辁 ^ 0, to stabilize the bending size, increase the strength of the structure, and 4 small contact thermal resistance and other effects. Li Xibu u • As shown in the fourth figure, 'is a schematic illustration of the assembly of another embodiment of the bendable high-density coiled disk of the present invention; it is for the convenience of assembling the connecting pieces / Korean pieces 〇 Therefore, these connecting pieces 12 are connected side by side with a pull-out connecting belt 16 in series.

Page 7 V. Description of the invention (5) The pieces 10, such as skewed corners, can also have a streamlined radian (not shown in the figure) or, the direction of the flow ', thereby improving the cooling efficiency. High density heat dissipation. Fins, groups. The structure of the present invention can be obtained by bending. Please refer to Section I ^ of the heater and the heat source: Solution: Figure ′ are the scatter diagrams of the present invention, respectively. The present invention provides: two schematic diagrams and states of use indicating that the scattered term includes a 敎 conduction == heat sink 'fin heat sink': 傅 FU v base 2 〇 and a heat sink fin group 其; which = eg As mentioned above, it will not be repeated here. It can also be plate-shaped ΐ, ring ::: If made of a good material, extruded and made ==: Γ " for the heat-conducting pedestal 2 is provided on the base of the 传导 — 肖肖 ： And the right curve is such that the heat-conducting fin group 1 matches the curve of the inner wall 22 and the heat-dissipating fin group 1 is located at the door of the accommodation? !! To the 4th curve, at the same time, the heat conduction is good; i will be glued, welded #, pressing 5 and the inner wall of the heat conduction base 2 [2: 5 1 fold at the outer edge 1 1 can be set on the surface. 22 for bonding, so that the bottom of the heat conduction base 20 of the heat dissipation fin group is a receiving surface 2 2 3 for connecting with a heating source 3 ^ and ..., surface; or may be heated before the heating Surface 23 bottom =:!; :: 3 to disperse ..., the diffusion element 24, and then make the thermal & door ..., the fifth of the conductivity coefficient, the description of the invention 'to improve the thermal shoulder contact by the thermal diffusion element 24. .... '^ ir ώ ^ ^ m ί Scattering element 2 4 can be made of copper, aluminum and other heat conducting effects. In addition, a heat conduction plate 25 can be connected to the loose edge 1 3 to increase the distribution of the cooling airflow ^ The temperature distribution of the fin group 1 is more uniform; Also, between the show hot surface 2 3 A heat-conducting column 26 may be provided, which is arranged between the heat-conducting plate 25 and the heat-conducting base 2 so as to make the temperature distribution of the heat sink 2 more uniform. Furthermore, the heat-conducting base 2 is one of One end of the end surface moon channel 27, and the other 2 8 2 of the flexible air channel 27 is composed of the above structure by adding the radiator 2 by the fan 28, and the thermal fin group can be punished. Of the radiator. Therefore, it can be bent by the present invention:! The d radiator has a ring design; ::: degree of heat dissipation fins on the curved surface of the salmon. The sheet: the density is better and the flow resistance is improved: and the heat dissipation efficiency can be improved. . To sum up, ‘the present invention can indeed achieve the pre-deletion, and because of: |: i JL | p / utilitarian application requirements, 2 novelty and progress, patents’ to protect the rights of the inventor. ° "Please ^ effect" and the material of the thermal expansion L or the plate-like thermal fin group 1 at the same time, the heat conduction plate 25 and the inner wall 22 of the heat conduction column 2 6 0 set A fan is provided at a flexible wind end to dissipate heat. The present invention has a high-heat fin set, an energy-effect fin set and a heat-conducting-based heat sink; due to the ′, the heat-dissipating fins contribute to the heat-transfer effect. The purpose is to solve the problem that Yuanquan is in line with the invention investigation and grants this case. 1226982

Page ί 1212982 Brief description of the drawings The first diagram is an assembly diagram of the heat dissipation fin set of the present invention. The first picture A is an enlarged detailed view of part A of the first picture. The first picture B is an enlarged detailed view of part B of the first picture. The first picture C is an enlarged detailed view of part C of the first picture. The second figure is a schematic side view of the heat dissipation fin group of the present invention after being bent. The third figure is a side cross-sectional view of the heat dissipation fin group of the present invention. The fourth figure is an assembly view of another embodiment of the heat dissipation fin set of the present invention.

The fifth figure is an exploded view of a radiator and a heat source according to the present invention. The sixth figure is a schematic diagram of a combination of a radiator and a heat source according to the present invention. The seventh figure is a schematic diagram of the use state of the radiator and the heat source of the present invention. Explanation of symbols: [present invention]

1 Radiating fin group 1 0 Fin 1 1 Buckle 1 1 0 Female hole 1 1 1 Buckle L 1 1 2 Buckle L 1 2 Connector 1 2 0 Hook 1 2 1 Hook 1 2 2 Slot 1 2 3 Grooved 1 3 Sheet edge 1 4 Bending radius 1 5 Folding part 1 6 Connecting band

Page 11 1226982

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Claims (1)

1226982 6 4 6 7 The scope of patent application, a foldable fin-fin class with a high-density ugly engagement arrangement, including a plurality of pieces to be continuously opposed to one of each of the fastening portions = at least one fastening portion is provided on the piece, and The system is respectively provided with a pair of ^ plates to form a plate edge, and each of the buckling portions is provided with a heat dissipation fin group; thereby, the order of the two fins is connected to form a curved surface arrangement. 7 ^ &quot; 、、 The fin group uses the buckling part as a bending support, such as the patent application section cymbal group, where each of the rotating pieces ^ = ί flexible high-density heat dissipation fins, such as the second patent application scope Jg ^ Two folds are provided on the outer edge. Sheet group, in which the top surface of the folded portion is curved with a high-density heat dissipation fin, such as the band in the scope of patent application. The top surfaces of each cymbal connector are tangent. A set of fins, in which each of the fins passes a curved, high-density heat-dissipating fin. It has a streamlined radian or a deflected angle: Application = two sets of bends as described in the scope "below," so that each sequel is smaller than each fin with a fold on its edge The distance between the folds and the bendable high-density film set as described in item 丄 of the patent application range, wherein the buckle portion is folded by the outer edge of the fold. * ,,, _ ,, , Japan, the flexible high-density loose chain set as described in the item of the scope of patent application, wherein the buckle part is provided with a female hole for the connection member ^: connection. Hum, if the scope of patent application The flexible high-density loose chain link group as described in item 7, wherein the female hole is in the shape of "Η" or two independent ^ ..., said "I" shape. Closed Page 13 1226982 6. Scope of patent application 9, such as patent application film group, which should be buckled to 10 respectively, such as patent application film group, where 1 1, such as patent application fins connected one to two, one by one There are a series of hot songs 3, such as the bad group of the film group 4, such as the circle of the film group 5, such as the film group for the group, which body. A kind of thermal fin group having a high curved surface, and the conductive base surfaces are respectively clamped on the fins. Patented heat sink-type heat pipe or patented heat sink-shaped, oval-patented heat sink The heat dissipation fin enclosure described in item 1 of the high-density high-density heat dissipation fin connection is respectively extended at its two sides Hook, two buckle parts. Fan-shaped high-density heat dissipation as described in item 9 The hook is provided with a slot. The flexible high-density heat dissipation described in the first item of the scope. These connectors are a heat sink with a flexible connection with a string of density heat dissipation fins, including: a heat conductive base; and: a plurality of fins in a continuous stack The arranged fins are provided with a buckle portion, and between each of the buckle portions: a connecting piece, and the heat dissipation fin group is matched with the curved surface f-curve to set the heat dissipation fin group on the stem] : 12 It has high-density heat-dissipating fins as described in item 2. The heat-conducting base can be a plate heat pipe or a general winding heat pipe. The high-density bond described in the item 12 of the range, wherein the end of the heat-conducting base has a cut surface shape or a rectangular shape with rounded corners. The high-density chain as described in the item 12 of the scope, wherein the heat-conducting base is provided with an accommodation space and a chip set is arranged therein. Page 14 1226982 VI. Scope of patent application — 162 ::: Scope of item 12 with high-density heat dissipation fin force and political heat benefit, in which the bottom of the heat conduction base is 17 pieces of heat ::: m Korean item with high density heat dissipation as described in 16f. Government ... · ^, where the heat-receiving surface is further provided with a heat diffusing element 1 piece set :: consumption] with high-density heat transfer as described in item 17, 9, such as: special, two or two of which the heat diffusing element system It is a plate heat pipe. 2 〇 = The outer edge of the fin with high-density heat dissipation is bent upwards; there is a fold: each of the fins of the Zhengre Han film group is in its group! = I = 乾 f item / 9 With high-density fins tangent. ‘’ ’,’, And the top surface of the fold is connected to the top of each of the connecting pieces. 2 Fans: == has a high-density heat dissipation <2 2 arc of streamline. &quot;, each of the fins of the yoke group has a heat sink as No. 12 in the patent scope, where #, said it has high-density heat dissipation fins; -end of the engaging structure: into; fins Each of the sequels is connected to the conductive plate. Each of the plate edges is connected with a heat sink such as the heat sink of the patent scope of the patent application, where the holder n has a curved pipe for heat dissipation, and a heat conduction column is vertically arranged between the fins. Guide plate 〃, 2 at the bottom of the heat-conducting base, 4 with high-density heat dissipation as described in the patent application __ 2 Korea 1226982 6. Outer edge of the patent application film group 2 5. Mother of the film application group Holes, 26, such as the stand of the Shenping Group 2 7, the side of the Shenping Group 2 8, the 29 of the Shenping Group, the flexible 3 0 of the Shenping Group, and the bend of the radiator And please patent the radiator for the patented radiator "I Please patent the radiator Please do not extend please patent the radiator Please patent the connection of the radiator Please patent the radiator, which is the first. Scope of the first, where the knot buckle Range 2, where the "" font. The first range, where there is a hook, the second range, where the first range, wherein the buckle portion with a series of fins in series is a fin with high-density fins as described in item 2 A link is opened on the buckle part of the film group. The female holes with high-density heat-dissipating fins described in item 5 are “Η” -shaped or are two unique joints with south-density heat-dissipating seam groups, and two of them are fastened to two buckle portions. Said to have high-density heat-dissipating fins. The connecting member with the high-density heat dissipation fin group is a heat sink with a range of the first fin group, and one end of the more-enclosed channel and the other end of the heat conduction channel are separated from the heat dissipation fins of the fan 2 respectively. Attach 7 items to the 2 item heat sink fins. The high-density heat-dissipating fins described in item 2 include a pull-out air duct and a fan 'one end surface of the wind base, and the wind phase is provided. Page 16