M310360 八、新型說明·· 【新型所屬之技術領域】 本創作係有_-射央處理器散熱模組之驗結構，尤指一種 可提升腳絲體及確財央處理辟轉平穩紅腳座結構。 【先前技術】 、按’電細的運异及運作主要係藉由中央處理器（cpu)丄來完成， 然而隨著中央處理器！運作的速度越來越快，中央處理器]之發熱量 也隨著越來越大，為了使中央處·丨能韓之運作，所以電腦業者 皆會在中央處理器丄上設置散熱模組2。 習知之中央處理器1L之散熱模組2，如圖一所示，主要係在中央 處理裔1上裝設-散熱器2 1，且在散熱器2 1之上方設置一散熱風 扇2 2 ’藉由散熱n 2丨來射央處理器丨之熱源吸收，再藉由散熱 風扇2 2將熱源排除，而得以降低中央處理器丄之工作溫度，俾可令 中央處理器1可在適當的溫度環境下運作。 錄熱模組2之安裝，如圖―、二所示，主要在電路基板3之底 侧設-腳座2 3，該腳座2 3之四隅分別延設有安裝支臂2 3丄，該 支臂2 31上設有貫穿之穿孔2 3 i i，該穿孔2 3 i丄可供螺检元 件2 5之套牙。另在散熱風扇2 2之四隅亦延設有固定鎖管2 21， 翻定鎖管2 1 2與支臂2 3 1之穿孔2 3 ! χ成減應，另固定鎖 官2 2 1可供螺固元件2 7之穿設其中，該螺目元件2 7之外周面套 设有彈性το件2 8。藉此散熱模組2可藉由螺㈣件2 3自散熱風扇 22之固定鎖管221穿人，並穿過電路基板3之穿孔31，而可與 M310360 〒央處理斋1能穩固之貼合。 *惟，如吾人所知’該電路基板3之剛性強度原本就較弱，為免因 散熱模組2之鎖固而造成電路基板3之變形，進: 〜音判中央處理器 1之運作，所以龍組2不能紐_在電板3上，而必需藉助 在電路基板3之背面設置安裝腳座23，因此腳座23必需具=當 之剛性強度，才能讓散熱模組2能有-定之穩定定位。是以，目前的 業者皆以金屬材質來製作腳座2 3，以祈獲得較佳之剛性強度。各腳 座2 3係為金屬材質所製成時，業者為避免金屬腳座2 3影響到電路 基板3之電路通路，所以會在腳座2 3與電路基板3之間設置—絕緣 件2 4 ’該絕緣件2 4之形狀完全與腳座2 3成相對應，在其四隅同 樣的延設有支臂24 1，該支臂24 1上亦設有穿孔241工。藉由 絕緣件2 4之設置，確實可避免腳座2 3干擾到電路基板3之電路通 路。 另，習知之散熱模組2在組裝時，係先將腳座2 3與絕緣件2 4 配置成一塊，再將腳座2 4上的螺栓元件2 5穿過電路基板3之穿孔 31上，為使腳座2 3與絕源件2 4在電路基板3上有一穩定之暫付 定位，必需在螺栓元件2 5上端套設一c型扣環2 6，藉由C型扣環 2 6來形成阻擋，或以貼膠方式，以避免腳座2 3及絕緣件2 4，在 裝配生產線流程中自電路基板3上脫落，而可便利生產線下一站之裝 配0 習用之散熱模組2固然可令中央處理器1達成散熱之目的，但習 6 M310360 用之熱散模Μ2之結構，仍至少具有下列之缺失： d之正吊電路通路造成影響，如產生電場干擾等。 2 ·習知的散熱模組2，必需要在·2 3與電 置絕緣件2 8及背膠作業，而造成成本之增加。 板3之間配 —3 ·制散熱模組2其腳座2 3在電路基板3上作暫付時，必恭 猎由一C型扣環2 6來完成，而使安裝工程之工作程序增加。而 為了避免f知金難狀職2 3產生上述之缺失，於 職出以制陶度之麵㈣成之歷，該嶋料製成之腳 =以塑膠射_成’細，由於瓣射㈣較容易有熱漲冷縮之現象， 吊導致腳座之表面產生不平穩之狀態，當中央處理器運轉時，常會因 腳座之表面不平穩產生震動或噪音。 是以’如何缺善f知職之缺失，實為齡亟雜 題。 、 木 【新型内容】 本創作之主要目的，乃在改善央處理器散熱麵之腳座容 易因塑轉雌成時，容科熱漲冷縮之縣，導致_之表面產生 不平L之紅w巾央處職運轉時，常因腳座之表面不平穩產生震 動或噪音。 為b本紹乍之之技術手段，乃在提供一種中央處理器散熱模組 之腳座結構，該職之巾蚁鳴之支紅㈣設有糊部，該頂制 縣由腳縣體向上凸設凸出塊喊，藉由該糊部找置，來令腳 M310360 座具有確域躺平整φ，射bt_輸愤電絲請，可與電 路基板有-獻及確切之接觸，並且藉由該頂制部之設立，可有效提 升腳座之整體強度’進錢提种域理處器散顏組之腳座之使用 功效。 【實施方式】 為使貴審查員能更易於了解本創作之結構及所能達成之功效， 茲配合圖式說明如下： 首先請參關三所示，本創作之中央處理錄熱模組之結構，其 中該散麵組4，至少包括有-散熱n5、散熱風扇6、以及一腳座 7 〇 該散熱風扇6係設於散熱器5之上方，散熱風扇6之四隅設有固 定鎖管61 ’該固定鎖管6!可供螺固元件6 2穿設，該螺固元件6 2外周面套設-彈性树6 3，另於_树6 2之下端設有螺紋部 6 21，在螺紋部6 21之上方設有-環槽6 2 2，該環槽6 2 2可 供0里扣％6 4之套設，藉此當螺固元件6 2穿入固定鎖管61 後如里扣6 4再扣於環槽6 2 2形成阻擋，俾可令螺固元件6 2 於固定鎖管6 1内自由的上下活動，而不會自固絲管“中脫離。 該腳座7係由具高剛性強度之塑膠材料製成，並在腳座7四隅延 設有支臂7 1，在支臂7 1JL—體賴卡固機構7 2，該卡固機構7 2係在支臂7 1上延設有餅7 2 1所構成，該擔件7 2 i之上端係 成向内縮之錐狀’藉此來令該卡固機構7 2具有勾卡之功能，另卡固 麵7 2於成型時一體包覆有螺栓元件7 3，其中，該腳座了之表面 M310360 f頂制47 4，該頂制部74係位於腳座7之中央及四隅之支臂7 糊m74係由腳座7本體向上凸設凸出塊而成，且該中央之 4健間隔狀設置’且其頂端係為圓弧狀設計。M310360 VIII. New Description·· 【New Technology Fields】 This creation department has the structure of the _-Central processor cooling module, especially one that can improve the foot body and ensure the financial processing. structure. [Prior Art], the operation and operation of the system are mainly done by the central processing unit (cpu), but with the central processing unit! The speed of operation is getting faster and faster, and the heat generated by the central processing unit is getting bigger and bigger. In order to make the operation of the central office, the computer industry will set the heat dissipation module on the central processing unit. . The heat dissipation module 2 of the central processing unit 1L, as shown in FIG. 1 , is mainly provided with a heat sink 2 1 on the central processing unit 1 and a cooling fan 2 2 ' The heat source n 2丨 is used to absorb the heat source of the central processor, and then the heat source is removed by the cooling fan 22, thereby reducing the operating temperature of the central processing unit, so that the central processing unit 1 can be in an appropriate temperature environment. Under work. The mounting of the recording module 2 is as shown in FIGS. 2 and 2, and the footrest 2 3 is mainly disposed on the bottom side of the circuit board 3, and the mounting arm 2 3丄 is respectively extended by the four sides of the foot holder 2 3 . The arm 2 31 is provided with a perforation 2 3 ii which is available for the thread of the screwing element 25. In addition, a fixed locking tube 2 21 is also extended in the fourth fan of the cooling fan 2 2 , and the perforation 2 3 2 of the locking tube 2 1 2 and the arm 2 3 1 are reduced, and the fixed locking 2 2 1 is available. The screwing member 27 is inserted therein, and the outer peripheral surface of the screw member 27 is sheathed with a resilient member 28. Therefore, the heat dissipation module 2 can be worn by the fixed locking tube 221 of the cooling fan 22 through the screw (4) member 2, and passes through the through hole 31 of the circuit substrate 3, and can be firmly adhered to the M310360. . *However, as we know, the rigidity of the circuit board 3 is originally weak, so as to avoid deformation of the circuit board 3 due to the locking of the heat dissipation module 2, the operation of the central processing unit 1 is Therefore, the dragon group 2 cannot be placed on the electric board 3, but the mounting foot 23 must be provided on the back surface of the circuit board 3. Therefore, the foot base 23 must have a rigid strength to enable the heat dissipation module 2 to have a certain Stable positioning. Therefore, the current industry is making metal feet 2 3 to obtain better rigidity. When the legs 2 3 are made of a metal material, in order to prevent the metal foot 23 from affecting the circuit path of the circuit board 3, an insulator 2 4 is provided between the foot holder 23 and the circuit board 3. The shape of the insulating member 24 is completely corresponding to the foot 2 3, and the arm 24 is similarly extended on the four sides thereof. The arm 24 1 is also provided with a through hole 241. By the arrangement of the insulating member 24, it is possible to avoid the circuit of the circuit board 3 from being disturbed by the foot holder 23. In addition, the conventional heat dissipating module 2 is assembled into a piece of the foot piece 2 3 and the insulating piece 24, and then the bolt member 25 on the foot piece 24 is passed through the through hole 31 of the circuit board 3. In order to ensure a stable temporary positioning of the foot holder 23 and the source member 24 on the circuit board 3, a c-type buckle 2 6 must be placed on the upper end of the bolt member 25, and the C-type buckle 26 is used. Forming a barrier, or by sticking, to prevent the foot base 23 and the insulating member 24 from falling off the circuit substrate 3 in the assembly line process, and facilitating the assembly of the next station of the production line. The central processor 1 can achieve the purpose of heat dissipation, but the structure of the heat dissipation module 习2 used by the 6 M310360 still has at least the following defects: d The influence of the positive suspension circuit path, such as the generation of electric field interference. 2 · The conventional heat dissipating module 2 must be used in the case of the electrical insulation member 28 and the adhesive operation, resulting in an increase in cost. When the board 3 is equipped with a 3) heat dissipation module 2, when the foot holder 2 3 is temporarily paid on the circuit board 3, it must be completed by a C-type buckle 26, and the working procedure of the installation project is increased. . In order to avoid the above-mentioned lack of the knowledge of the gold, the job is made out of the surface of the pottery (four) into the calendar, the foot made of the material = plastic shot _ into 'fine, due to the flap shot (four) It is easier to have the phenomenon of heat rise and contraction, and the suspension causes the surface of the foot to be unstable. When the central processor is running, vibration or noise is often generated due to the uneven surface of the foot. It is based on the lack of good knowledge and the lack of knowledge. Wood [New Content] The main purpose of this creation is to improve the heat sink of the central processor. When the towel is in operation, vibration or noise is often generated due to the uneven surface of the foot. For the technical means of B Shaoshao, it is to provide a foot structure of the central unit heat dissipation module, and the ants of the ants are voicing (4) with a paste, and the top county is convex upwards from the foot county. Set the bulge to shout, and use the paste to find the foot, so that the foot M310360 seat has a flat lie, and the bt_ anger wire can be used to provide exact contact with the circuit board. The establishment of the top-made department can effectively improve the overall strength of the foot's use of the money to raise the use of the foot of the group. [Embodiment] In order to make it easier for your examiner to understand the structure of the creation and the functions that can be achieved, the following is a description of the following: First, please refer to the structure of the central processing thermal module of this creation. The surface group 4 includes at least a heat dissipation n5, a heat dissipation fan 6, and a footrest 7. The heat dissipation fan 6 is disposed above the heat sink 5, and the heat dissipation fan 6 is provided with a fixed lock tube 61' The fixed locking tube 6! is provided for the screwing member 6 2, the outer peripheral surface of the screwing member 6 2 is sleeved with an elastic tree 63, and the lower end of the tree 6 2 is provided with a threaded portion 6 21 at the threaded portion. Above the 6 21, there is a ring groove 6 2 2, and the ring groove 6 2 2 can be sleeved by 0%, so that when the screwing element 6 2 penetrates the fixed locking tube 61, the buckle 6 is buckled. 4, and then buckled in the ring groove 6 2 2 to form a blockage, so that the screw-solid element 6 2 can freely move up and down in the fixed lock pipe 61, and does not detach from the wire tube. Made of high-strength plastic material, the arm 7 is extended on the foot 7 and the arm 7 1L is attached to the clamping mechanism 7 2 . The clamping mechanism 7 2 is attached to the arm 7 1 . The cake 7 2 1 is formed, and the upper end of the support member 7 2 i is tapered inwardly to thereby make the fastening mechanism 7 2 have the function of hooking, and the other fastening surface 7 2 When forming, the bolt member 73 is integrally covered, wherein the surface of the foot is M310360 f is formed 47 4 , and the top portion 74 is located at the center of the foot 7 and the arm of the fourth arm 7 is covered by the foot 7 The main body is formed by projecting a convex block upward, and the central portion of the center is arranged in a spaced shape and the top end thereof is formed in an arc shape.
紋來π - Ο 3 ’係為金騎質所製成’藉此可於其内部設有螺 機構7= ^件6 2螺入，該螺检元件7 3之頭部7 31穿出於卡固 ^ 2外，麵部7 3 1機㈣询㈣徑，螺栓 =3之頭部73 1之下端設有内縮之頸部7 3 2，而卡固機構7 ^可位於螺栓元件7 3之頸部7 3 2，藉此螺栓 卡固機構72上，而不會自腳座7上脫離。 卡套、 ±本_之實施，如_所示，當散熱模組4欲裝配在電路基板8 上時’输腳座7由電路基板8之下方向上套設於電路基板8上，藉 2腳座7上之询構7 2 ?順綱之穿孔8 1内，此時卡固 、構72與螺栓元件73同時穿過電路基板8之穿孔81，電路基板 參8則恰可卡制於卡固機構7 2上，而可令腳座7暫付於電路基板8 上’再猎由鎖緊_元件6 2，來與螺栓元件7 3_，進而可令散 熱器5貼合於中央處理器9上，而電路基板⑽可藉由該腳座7頂制 部74之設置’來令腳座74具有確切的接觸平整面，而令電路基板 8與腳座7有-穩定及物之接觸，以有效提升腳座7之整體強度。 本創作之功效在於，齡在驗7之支臂7 i及中央設置頂^部 74 ’且位於中央之糊部7杨呈_狀’來增加雜，當電路美 板8與腳座7結合時，可令電路基板8確實與腳座7之糊部7仏 接觸，形成一穩固之接觸，當中央處理器9於運轉時，可避免因震動 M310360 產生不平穩之情況。 、①上所述本創作之中央處理器散熱模組之腳座結構，確實已能 有效改㈣知之缺失，耐_輯权_與功效，應已符合新穎 性:進步性以及實用性之要件，爰依法提出專利之申請，祈請貴審 查員之詳鑑，惠賜准予專利之審定，至感德便。 【圖式簡單說明】 圖一係習用散熱模組之分解圖。 圖一係習用散熱模組之實施示意圖。 圖三係本創作之分解圖。 圖四係本創作之實施例。 【主要元件符號說明】 1中央處理器 2散熱模組 21散熱器 2 2散熱風扇 2 21固定鎖管 2 3腳座 2 3 1支 臂 2 311穿孔 2 4絕緣件 2 4 1支臂 2 5螺栓元件 2 7螺固元件 3 1穿孔 2 6 C型扣環 2 8配置絕緣件 3電路基板 4散熱模組 5散熱器 6散熱風扇 61固定鎖管 62螺固元件 M310360 7腳座 8電路基板 9中央處理器 6 2 1螺紋部 6 2 2環槽 6 3彈性元件 6 4〇型扣環 7 1支臂 7 2卡固機構 7 2 1擋件 7 3螺栓元件 7 3 1頭部 7 3 2頸部 7 4頂制部 8 1穿孔The pattern π - Ο 3 ' is made of gold riding quality', whereby a screw mechanism 7 = ^ member 6 2 is screwed into the inside, and the head 7 31 of the screw detecting element 7 3 is worn out of the card Outside the solid 2, the face 7 3 1 machine (4) the (4) diameter, the head of the bolt 73 is 73. The lower end of the head 73 1 is provided with a retracted neck 7 3 2, and the fastening mechanism 7 ^ can be located at the bolt element 7 3 The neck portion 7 3 2 is thereby bolted to the mechanism 72 without being detached from the foot rest 7. The implementation of the ferrule, the _ _, as shown in _, when the heat dissipation module 4 is to be mounted on the circuit substrate 8, the shank 7 is sleeved on the circuit substrate 8 from the lower side of the circuit substrate 8, In the hole 7 1 in the block 7 of the inquiry, the card, the structure 72 and the bolt member 73 pass through the through hole 81 of the circuit board 8 at the same time, and the circuit board reference 8 is just stuck in the card. On the mechanism 7 2, the foot 7 can be temporarily paid on the circuit board 8 're-hunting the locking element 6 2 to the bolt element 7 3_, and the heat sink 5 can be attached to the central processing unit 9 The circuit board (10) can be provided with the exact contact surface of the foot 74 by the setting of the top portion 74 of the foot 7, so that the circuit board 8 and the foot 7 have a stable and physical contact for effective Increase the overall strength of the foot 7. The effect of this creation is that the arm 7 in the test 7 and the top set 74' in the center and the poplar 7 in the center are in a _ shape to increase the miscellaneous when the circuit board 8 is combined with the foot 7. The circuit board 8 can be surely brought into contact with the paste portion 7 of the foot 7 to form a stable contact. When the central processing unit 9 is in operation, the occurrence of the vibration due to the vibration M310360 can be avoided. The seat structure of the central processor heat-dissipating module of the present invention has been effectively improved (4) lack of knowledge, resistance _ _ _ _ and efficacy, should have met the novelty: progressive and practical elements,爰 Apply for a patent in accordance with the law, and ask the examiner for a detailed examination, and grant the patent approval to the patent. [Simple description of the diagram] Figure 1 is an exploded view of the conventional thermal module. Figure 1 is a schematic diagram of the implementation of the conventional heat dissipation module. Figure 3 is an exploded view of the creation. Figure 4 is an embodiment of the present creation. [Main component symbol description] 1 central processor 2 heat dissipation module 21 heat sink 2 2 cooling fan 2 21 fixed lock tube 2 3 foot 2 2 1 arm 2 311 perforated 2 4 insulation 2 4 1 arm 2 5 bolt Component 2 7 screwing element 3 1 perforation 2 6 C type buckle 2 8 arrangement insulation 3 circuit board 4 heat dissipation module 5 heat sink 6 cooling fan 61 fixed lock tube 62 screw element M310360 7 foot 8 circuit board 9 central Processor 6 2 1 threaded part 6 2 2 ring groove 6 3 elastic element 6 4 inch type buckle 7 1 arm 7 2 fastening mechanism 7 2 1 stopper 7 3 bolt element 7 3 1 head 7 3 2 neck 7 4 top part 8 1 perforation
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