TWI260965B - Dissipating device and the method - Google Patents

Dissipating device and the method Download PDF

Info

Publication number
TWI260965B
TWI260965B TW93125732A TW93125732A TWI260965B TW I260965 B TWI260965 B TW I260965B TW 93125732 A TW93125732 A TW 93125732A TW 93125732 A TW93125732 A TW 93125732A TW I260965 B TWI260965 B TW I260965B
Authority
TW
Taiwan
Prior art keywords
heat sink
buckle
heat
protrusion
item
Prior art date
Application number
TW93125732A
Other languages
Chinese (zh)
Other versions
TW200608865A (en
Inventor
Gen-Cai Wang
Di-Qiong Zhao
Yi-Chyng Fang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW93125732A priority Critical patent/TWI260965B/en
Publication of TW200608865A publication Critical patent/TW200608865A/en
Application granted granted Critical
Publication of TWI260965B publication Critical patent/TWI260965B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A dissipating device and its method, the dissipating device includes a heat sink and a clip. The clip has a body. The heat sink has a distortional protrusion thereon. The protrusion fixes the clip to the heat sink. The method includes steps as below: offering a heat sink forming a protrusion thereon; offering a clip; putting the clip on the protrusion; pressing the protrusion; making the protrusion deformed to press on the clip. The method of this invention is convenience and the dissipating device is stable.

Description

1260965 九、發明說明: 【發明所屬之技術領域】 ^發明係關於-種散熱裝置及其製造綠,特別係指—種用於電 于疋件散熱之散熱裝置及其製造方法。 【先前技術】 内邱^著電子産輯勃迅速發展,大型積體電路技術獨進步,電腦 ^ :子7C件集成度越來越高,運行速度也越來越快,高頻高速處理 二推*日益力J快,但高頻高速運行必將使得電子元件之發熱量越來 如果熱Ϊ不及時散發&去’縣導致電子元制部溫度越來越 重影響電子元件運行之穩定性,如今散_題已減影響電腦 仃’此之-健要ϋ素,也成爲高速處理器實際細之瓶頸。 致/見子元件自身散熱已完全不能滿足實際應用之需求, = = 於發熱電子元件表面加裝一散熱器來輔助散熱,而爲 S壓 =3:元件牢固而緊密接觸’另外需要借助-扣具將散 田、=緊料熱電子元件表面。傳統扣具與散絲之配合方式大多採 熱器放於發熱電子元件表面,而扣具則放入散熱 二㈣中’通過扣具來抵壓住散熱11而將散熱器緊密貼合 牛表面。此種方式需要於散熱器上開設適當之容置槽用 此即減少散熱11之散熱·_片總數量與整體散熱表面 積,進而影響散熱效果。 •T古另:ΪΠ:具與散熱器之配合方式’係將扣具裝設於散熱器之 下方’如中α國專利公告第2490703號所揭露之_種散熱裝置組合,包 括-散熱器…風扇及-扣具,散熱器之底部爲—扣合部,其周緣開 設-凹槽’通過扣具將散熱器扣合於中央處理器上。上述扣具包括一 第一扣部二扣部,第—扣部包括第—片體及與其相鉚合之臂 部楚並二上體3成一溝槽、兩缺口 ’第二扣部包括開設-樞孔 之苐二片體。朴具結構複雜,操作不便;另外,該扣呈係通過彈性 收縮形變卡人散熱器扣合部之凹槽中,翻性差,時間久易鬆動;而 且、’由於扣具中之第-扣部内徑略大於散熱器扣合部之直徑,精確度 難以控制,景>響扣具與散熱器扣合部之間之緊密性。 因此,設計-觀_單、扣合咖之散熱裝纽其製造方法必 1260965 將對業者組裝電腦提供便利。 【發明内容】 ^本為明之目的係提供一種結構簡單、扣合穩固之散熱裝置及其製 造方法。 二μ本發明散熱裝置包括一散熱器及一扣具,該扣具設有一本體部, 5亥散熱器上設有受力變形之扣合部,該扣合部將本體部夾置於散熱器 埶的本,明散熱裝置之製造方法,包括以下步驟:提供一散熱器,散 …、杰上設有凸起;提供一扣具,並將扣具置於散熱器上;對凸起施力, 使凸起受力變形形成扣合部壓於扣具上。 本發明散熱裝置中散熱器之扣合部壓合於扣具上,使扣具牢固卡 扣於散熱器上,操作方便,結合緊密,穩定性好。 /、 【實施方式】 括-’本㈣散齡置之健實施方式包 1G包括—體成型之本體部11G,該本體部·中央開設-四個角分別延伸出-扣祕二 體餘體22 龍,該散熱 散_片222。^=41^=2^卜_呈放射狀排列之 孰體22 -端开心3 /套於散熱體22之圓筒221中央,並於散 知形成一可穿過扣孔112之 狀 具10本體部110之環緣246。 P該扣3邛係一壓合於扣 本發明散熱裝置之扣合部亦可 r綱合趙從扣具_部„。外圍壓靠“體=二= 本發明散熱裝置之製作方法,包括以 散熱體22及-圓柱體24,通赫 ’、~t空圓筒狀 24底面開設一環槽如;利用^車床^其^ 將圓柱體24放入散熱體22中:使:二$散熱體22加熱,再 之外形成-凸柱,騎触22冷卻a 贿熱體22 扣具1〇 ’該扣具〗°包括-本體部⑽,該本體部uS二;= 1260965 述凸柱之圓形扣孔112;接著,將扣具1Q之扣孔u 於 壓頭對糾柱加壓使其變形,即採用壓頭形狀與 ίϊί之旋1印機於其上部進行加壓,使環槽242之外圓 周又文形向外擴展形成環緣246壓合於扣具1〇本體部11()上,彳 使扣具10牢固卡扣於散熱器2〇上。 尽W 110上伙而 明之體22與圓柱體24也可—體成型,於此情況下本發 成一凸柱.U下步驟:對散熱器20 一端進行車床切削或沖壓形 成凸柱,經車床加工於凸柱底面開設^ =厂= 套:凸柱上,同樣如上所述通過:方 法了熱器上之扣合部結構即可,如另—種製作方 1置於散熱上妓至少—個凸起;提供—扣具10,將 於扣具《將扣分縣扣合部壓 !◦牢乍以:Τ於扣具1。上. 以上所述者纽(法提料辦請。惟, 爰依本發明精神所作之#3= /凡熟悉本案技藝之人士,在 範圍内。 修飾或瓶,皆應涵蓋於以下之憎專利 【圖式簡單說明】 圖係本發日熱裝置較 ^圖係第—圖之立體分解示意圖方式之立體不思圖 第二圖係第二圖之組裝示意圖。 第1係本發明較佳實施方式中扣具預裝於散熱器上之立體示意 【主要元件符號說明】 扣具 散熱體 圓筒 環槽 10 22 221 242 散熱器 圓桎體 散熱鰭片 環緣 20 24 222 246 1260965 本體部 110 扣孔 Π2 扣腳 114 孔口 1161260965 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a heat dissipating device and a manufacturing green thereof, and particularly to a heat dissipating device for dissipating heat from a crucible and a method of manufacturing the same. [Prior technology] Neiqiu has a rapid development of electronic production, and the large-scale integrated circuit technology has progressed independently. The computer ^: sub 7C parts are getting more and more integrated, the running speed is getting faster and faster, and the high-frequency high-speed processing is second. * Increasingly fast J, but high-frequency high-speed operation will make the heat of electronic components become more and more enthusiasm if the enthusiasm does not spread in time & go to the county to cause the temperature of the electronic components more and more seriously affect the stability of the operation of electronic components, Nowadays, the problem has been reduced to affect the computer 仃 'this is the key to the health of the high-speed processor. The heat dissipation of the sub-components is completely unable to meet the needs of the actual application. = = A heat sink is added to the surface of the heat-generating electronic component to assist the heat dissipation, while the S pressure = 3: the component is firmly and in close contact. With the surface, the surface of the hot electronic components. Most of the traditional fasteners and loose wires are placed on the surface of the heat-generating electronic components, and the fasteners are placed in the heat sink (4). The fasteners are pressed against the heat-dissipating 11 to closely fit the surface of the cow. In this way, it is necessary to provide a suitable accommodating groove on the heat sink. This reduces the heat dissipation of the heat dissipation 11 and the total number of heat dissipation surfaces, thereby affecting the heat dissipation effect. • T Gu another: ΪΠ: with the way of the heat sink 'to attach the buckle under the radiator', as disclosed in the Chinese Patent No. 2490703, the heat sink combination, including - radiator... The fan and the buckle are provided with a fastening portion at the bottom of the heat sink, and a peripheral opening-groove is used to fasten the heat sink to the central processing unit through the fastener. The buckle includes a first buckle portion and a second buckle portion. The first buckle portion includes a first sheet body and an arm portion riveted thereto, and the upper body 3 is formed into a groove, and the two notches are formed. The two holes of the pivot hole. The structure of the simple structure is complicated and the operation is inconvenient; in addition, the buckle is formed by the elastic shrinkage deformation in the groove of the buckle portion of the card radiator, and the turning property is poor, and the time is easy to loose; and, because of the first buckle in the buckle The diameter is slightly larger than the diameter of the heat sink fastening portion, and the accuracy is difficult to control, and the sound is tight between the buckle and the heat sink fastening portion. Therefore, the design-view-single-single-fashioned heat-dissipating device must be manufactured in a way that will facilitate the assembly of computers. SUMMARY OF THE INVENTION [The present invention provides a heat dissipating device having a simple structure, a fast fastening, and a manufacturing method thereof. The heat dissipating device of the present invention comprises a heat sink and a buckle, the buckle is provided with a body portion, and the 5H heat sink is provided with a force-changing fastening portion, and the fastening portion clamps the body portion to the heat sink. The manufacturing method of the heat dissipating device comprises the following steps: providing a radiator, dispersing, providing a protrusion on the upper surface; providing a buckle and placing the buckle on the radiator; applying force to the protrusion , the protrusion is deformed by force to form a fastening portion and pressed against the buckle. In the heat dissipating device of the invention, the fastening portion of the heat sink is pressed on the buckle, so that the buckle is firmly fastened on the heat sink, the operation is convenient, the combination is tight, and the stability is good. /, [Embodiment] The present invention includes a body portion 11G including a body-formed body portion 11G, and the body portion is centrally opened - four corners respectively extend out - a button body 2 body Dragon, the heat dissipation _ piece 222. ^=41^=2^卜_ Radially arranged carcass 22 - end happy 3 / set in the center of the cylinder 221 of the heat sink 22, and form a body 10 through the button hole 112 The rim 246 of the portion 110. P buckle 3 邛 一 一 一 一 扣 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 22 and - cylinder 24, Tonghe ', ~ t empty cylindrical 24 bottom surface to open a ring groove; use ^ lathe ^ ^ ^ The cylinder 24 is placed in the heat sink 22: so: two $ heat sink 22 heating, Further formed - the stud, the ride 22 cools a bribe hot body 22 buckle 1 〇 'the buckle 〗 ° includes - body portion (10), the body portion uS two; = 1260965 the circular pin hole 112 of the stud Then, the button hole of the buckle 1Q is pressed by the indenter to deform the column, that is, the pressure is applied to the upper portion of the ring by using the shape of the indenter, so that the outer circumference of the ring groove 242 is further The stencil is outwardly extended to form a rim 246 which is pressed against the body 1 (1) of the buckle 1 so that the clip 10 is firmly snapped onto the heat sink 2 。. The body 22 and the cylinder 24 of the W 110 can also be formed into a body. In this case, the hair is formed into a stud. U. Step: lathe cutting or stamping one end of the radiator 20 to form a stud, which is processed by a lathe. Open on the bottom of the column ^ = factory = sleeve: on the column, also passed as above: the structure of the button on the heat exchanger can be used, such as the other type 1 is placed on the heat sink, at least - convex From; provide - buckle 10, will be buckled "deduction of the deduction of the county buckle department! ◦ 乍 乍 Τ Τ Τ Τ Τ 。 。 。 。 。 。 。 。 。 。 。 Above. The above mentioned New Zealand (the law is requested by the law. However, #3= / who is familiar with the craft of the present invention, within the scope of the invention. The decoration or bottle should be covered in the following patents BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of the assembly of the second embodiment of the present invention. FIG. 1 is a schematic view of the second embodiment of the present invention. The three-dimensional indication of the middle buckle is pre-installed on the heat sink. [Main component symbol description] The fastener heat sink cylinder ring groove 10 22 221 242 The radiator round body heat dissipation fin ring edge 20 24 222 246 1260965 Body part 110 button hole Π2 buckle foot 114 orifice 116

99

Claims (1)

1260965 、申請專利範圍: 匕種散^置,包括-散_及-扣具,該扣具設有—本體部該散 ? 3變形之扣合部’該扣合部將本體部夾置於散熱器上。 2.如申凊專利《帛i項所述之散熱裝置,其中上述扣具之本體部 扣孔。 3·如几t請tt] 圍第2項所述之聽裝置,其中上述散熱器底部設有— 2柱系-位於該凸柱上之環緣,該環緣之外 直徑,且其壓於扣具之本體部上。 ms第3項所述之散熱裝置,其中上述散熱器包括-散执 32=。,該圓柱體穿套於散熱體内,其—端突出於散熱體;卜 5.如申請專職圍第丨項所狀散熱裝置,其巾 :突伸之概壓讀,該«合體從扣具本體料隱^;部 mr圍㈣散跑,其巾上购之本體部延伸 7. 如專利範Μ 6項所述之散熱裝置,其中上述扣合 一 端犬伸之複數壓合體,該等壓合體從扣具本 於腳 1 8. -種散熱裝置之製造方法,包括以下步驟:㈤㈣於扣腳上 (1)提供一散熱器,散熱器上設有凸起; ⑺提供一扣具,並將扣具置於散熱器上; (3)對凸起施力,使凸起受力變形形成扣合部壓於扣具上。 9. 如申請專纖圍第8項所述之散餘置之製造方法’,、其中 步驟中,政熱為包括一散熱體及一圓柱體,先將圓柱體底 工 ίΪΪ起再將體穿套於散熱體内,其—端突出於«體外形成 10. 如申明專利範圍第8項所述之散熱裝置之製造方法,其中 步驟中之凸起係通過車床切肖彳或沖壓於散熱器—端形成之一八 該凸柱底面加工形成有環槽。 凸柱 Υίίΐίϊη9項或第1G項所述讀熱m造方法,其 中上述%、槽由車床加工凸柱底面形成。 12·如申請專利範圍第9項或第1Q項所述之散熱裝置之製造方法,其 1260965 中上述第(3)步驟中利用旋鉚機對凸起加壓,使環槽外圓周受壓變形 後形成環緣壓於扣具上。1260965, the scope of application for patents: 匕 散 , 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 On the device. 2. The heat sink according to claim 帛i, wherein the body of the buckle has a buttonhole. 3. The apparatus according to item 2, wherein the bottom of the heat sink is provided with a - 2 column system - a ring edge on the protrusion, the diameter of the ring is outside, and the pressure is pressed On the body of the buckle. The heat sink of item 3, wherein the heat sink comprises - scatter 32 =. The cylinder is sleeved in the heat dissipating body, and the end thereof protrudes from the heat dissipating body; b. If the heat dissipating device is applied for the full-time encyclopedia, the towel: the protruding pressure reading, the «body from the buckle body The material is hidden ^; the part mr (four) is scattered, and the body part of the towel is extended. 7. The heat sink according to the invention, wherein the above-mentioned one end of the dog is stretched and the plurality of pressure bodies are buckled. The manufacturing method of the heat sink of the present invention includes the following steps: (5) (4) providing a heat sink on the buckle (1), and providing a protrusion on the heat sink; (7) providing a buckle and fastening the buckle Placed on the heat sink; (3) Apply force to the protrusion to deform the protrusion to form a fastening portion to press on the buckle. 9. If you apply for the method of manufacturing the spares described in item 8 of the special fiber, in which the political heat includes a heat sink and a cylinder, the cylinder is first hammered and then worn. The heat sink is formed in the body of the heat sink, and the heat sink is manufactured in the above-mentioned manner. The bump in the step is cut by a lathe or stamped on the heat sink. One end of the end is formed. The bottom surface of the stud is machined to form a ring groove. The method of manufacturing the heat reading m according to the item 9 or the item 1G, wherein the % and the groove are formed by the bottom surface of the lathe machining post. 12. The method for manufacturing a heat sink according to claim 9 or claim 1Q, wherein in step (3) of the above-mentioned step (3), in 1260965, the projection is pressed by a riveting machine to deform the outer circumference of the ring groove. After the formation of the ring edge is pressed against the buckle. 1111
TW93125732A 2004-08-27 2004-08-27 Dissipating device and the method TWI260965B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93125732A TWI260965B (en) 2004-08-27 2004-08-27 Dissipating device and the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93125732A TWI260965B (en) 2004-08-27 2004-08-27 Dissipating device and the method

Publications (2)

Publication Number Publication Date
TW200608865A TW200608865A (en) 2006-03-01
TWI260965B true TWI260965B (en) 2006-08-21

Family

ID=37874920

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93125732A TWI260965B (en) 2004-08-27 2004-08-27 Dissipating device and the method

Country Status (1)

Country Link
TW (1) TWI260965B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method

Also Published As

Publication number Publication date
TW200608865A (en) 2006-03-01

Similar Documents

Publication Publication Date Title
US7440284B1 (en) Holding device for a heat sink
TWM248206U (en) Clip for heat sink
TWI260965B (en) Dissipating device and the method
TWM243683U (en) Clip for heat sink
TW200842557A (en) Clip module
TW200813390A (en) Heat dissipation assembly and clips thereof
TWM302731U (en) Structure of bolting element for heat sink module of CPU
TWI303695B (en) Heat dissipation assembly and method thereof
TWI305877B (en)
TWI274323B (en) Mounting apparatus
TW200806161A (en) Heat sink assembly and clip thereof
TWM258574U (en) Clip for heat sink
TWM303416U (en) Cooling module
TWM284031U (en) Device for protecting the heat-dissipating cream on a heat-dissipating device
TWI227659B (en) Manufacturing method for heat sink
TWM318753U (en) Fastener of heat sinks
JP3001169U (en) Support release type release pin
TWM282244U (en) Structure of the heat-dissipating module for a CPU
TWM250189U (en) Heat-dissipation module fastening implement with pivot function
TWM419132U (en) Fixing device of heat dissipation module
TW200803707A (en) Heat sink assembly and clip thereof
TWM339717U (en) Fastener structure for heat sink
TWM303419U (en) Cooling device of a memory
TWM285192U (en) Improved structure of screwed fixed heat dissipating device
JP2003218553A (en) Laminated component, and its manufacturing method