JP2010109091A - Semiconductor device, method of manufacturing the same, and electronic apparatus using semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress an operation failure of a semiconductor element due to a thermal reason by stabilizing thermal conduction from the semiconductor element to a radiator plate through heat radiation grease. <P>SOLUTION: This semiconductor device includes: a radiator plate 3 having a recess 3a at least on one surface; heat radiation grease 6 filled in the recess 3a of the radiator plate 3; a semiconductor element 1 with at least a part thereof arranged in the recess 3a while contacting the heat radiation grease 6; and a wiring member 2 electrically connected to the semiconductor element 1 and arranged in an outer peripheral part of the recess 3a. The semiconductor device further includes an energization body 4 arranged on the side opposite to the recess 3a of the radiator plate 3 with respect to the semiconductor element 1 for energizing the semiconductor element 1 toward the inside of the recess 3a, and the energization body 4 is attached to the outer peripheral part of the recess 3a of the radiator plate 3 by an attachment means 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a configuration of a semiconductor device with improved heat dissipation efficiency from a semiconductor element mounted on a wiring member, a manufacturing method thereof, and an electronic apparatus using the same.

  Since it has become possible for a semiconductor element to pass a large current, heat generation may become very large, and therefore measures for heat dissipation have become important.

For example, in the semiconductor device described in FIG. 3 of Patent Document 1, the following heat dissipation measures have been taken. That is, a heat radiating plate having a concave portion is provided, and the heat radiating grease is filled in the concave portion, and the semiconductor element is disposed in contact with the heat radiating grease. Thereby, a structure in which the semiconductor element and the heat radiating plate are coupled in a thermally conductive state via the heat radiating grease is provided, and the heat radiating efficiency is improved.
Japanese Patent Laid-Open No. 4-99051

  However, in the case of the heat dissipation countermeasure of the above conventional example, the heat conduction from the semiconductor element to the heat sink via the heat dissipation grease is unstable, and as a result, the semiconductor element may malfunction. was there.

  In order to stabilize the heat conduction from the semiconductor element to the heat dissipation plate through the heat dissipation grease, it is very important that the contact between the semiconductor element and the heat dissipation grease is stable. However, when the semiconductor element is simply in contact with the heat dissipation grease, the contact area between the semiconductor element and the heat dissipation grease differs for each product (semiconductor device). As a result, a malfunction of the semiconductor element may occur.

  In view of the above, an object of the present invention is to stabilize the heat conduction from the semiconductor element to the heat sink through the heat dissipation grease, thereby suppressing the malfunction of the semiconductor element due to thermal reasons.

  The semiconductor device of the present invention includes a heat sink having a recess on at least one surface, a heat dissipation grease filled in the recess of the heat sink, and at least a part of the heat sink in the recess. In order to solve the above-described problem, the semiconductor element is provided with a semiconductor element disposed on the wiring board and a wiring member that is electrically connected to the semiconductor element and disposed on the outer periphery of the recess. A biasing member disposed on the opposite side of the recess of the heat sink and biasing the semiconductor element toward the recess; and the biasing member is attached to an outer peripheral portion of the recess of the heat sink It is attached by.

  Further, the method of manufacturing a semiconductor device according to the present invention includes at least one of a heat sink having a recess on at least one surface thereof, heat dissipation grease filled in the recess of the heat sink, and in contact with the heat dissipation grease. A method of manufacturing a semiconductor device comprising: a semiconductor element having a portion disposed in the recess; and a wiring member electrically connected to the semiconductor element and disposed in an outer peripheral portion of the recess, The semiconductor element mounted on the wiring member is disposed in the concave portion of the heat radiating plate so as to be in contact with the heat radiating grease, and is biased to the semiconductor element on the side opposite to the concave portion of the heat radiating plate. The semiconductor element is urged toward the inside of the recess by attaching the urging body to the outer peripheral portion of the recess in the heat radiating plate with the fixture.

  According to the semiconductor device having the above-described configuration and the manufacturing method thereof, the biasing body that biases the semiconductor element into the recess is attached to the outer peripheral portion of the recess in the heat sink, so that the semiconductor element is in the heat dissipation grease in the recess. Pressed against. Therefore, the contact state between the semiconductor element and the heat dissipation grease is stabilized, and as a result, the heat of the semiconductor element is efficiently transferred to the heat dissipation plate through the heat dissipation grease. Thereby, the malfunction of the semiconductor element due to thermal reasons can be suppressed.

  The semiconductor device and the manufacturing method thereof according to the present invention can take the following aspects based on the above configuration.

  That is, in the semiconductor device having the above-described configuration, it is preferable that the wiring member is attached to the outer peripheral portion of the concave portion of the heat radiating plate together with the biasing body by the fixture.

  Moreover, the said fixture is comprised with a screw | thread, The screw hole which screws the said screw | screw can be set as the structure formed in the outer peripheral part of the said recessed part in the said heat sink. The screw holes are preferably formed on both sides of the recess.

  Moreover, the said recessed part and the said semiconductor element are oblong shapes, and the said biasing body can be set as the structure which is an elongate shape extended in the direction orthogonal to the oblong shape of the said recessed part. In that case, the dimension corresponding to the longitudinal direction of the said recessed part of the said urging | biasing body is smaller than the dimension of the longitudinal direction of the said recessed part, and it is set as the structure which the longitudinal direction both ends of the said recessed part are exposed from the said urging | biasing body. It is preferable.

  Moreover, the electrical connection part of the said semiconductor element and the said wiring member is coat | covered with the protective resin body, and the said semiconductor element can be set as the structure urged | biased in the said recessed part via the said protective resin body. . Preferably, the protective resin body covers the opposite side of the semiconductor element from the concave portion, and the outer peripheral shape of the protective resin body is smaller than the inner peripheral shape of the concave portion.

  It is preferable that the urging body and the fixture are formed of a heat conductive material. Moreover, the said urging | biasing body, the said fixture, and the said heat sink can be comprised with a metal.

  In the method for manufacturing a semiconductor device having the above-described configuration, a screw may be used as the fixture, and the screw may be screwed into a screw hole formed in an outer peripheral portion of the recess in the heat sink.

  Moreover, it is preferable to attach the said wiring member to the outer peripheral part of the said recessed part in the said heat sink with the said biasing body with the said fixture.

  An electronic apparatus including a plurality of the semiconductor devices having any one of the above-described configurations and having the plurality of semiconductor devices arranged in a planar shape can be configured.

  Hereinafter, a semiconductor device and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view showing the semiconductor device of the present embodiment. This semiconductor device is an example of a case where it is used as a driving circuit for a TV, and a plurality of such semiconductor devices are arranged in a plane on the entire periphery of the TV screen and are driven to form an image.

  The semiconductor device shown in FIG. 1 includes a semiconductor element 1, a wiring member 2 electrically connected to the semiconductor element 1, a metal radiator plate 3 having a recess 3a on at least one surface, the semiconductor element 1, and the wiring member. 2 and an urging body 4 attached to the heat radiating plate 3.

  The wiring member 2 has a substantially quadrangular planar shape, and an upper end portion in FIG. 1 is provided with a display unit connection terminal 2a facing the inside of the TV screen, and a lower end portion in FIG. An external connection terminal 2b facing outward is provided. The wiring member 2 is disposed on the outer peripheral portion of the recess 3 a of the heat radiating plate 3.

  The heat radiating plate 3 has an elongated shape that is elongated in the left-right direction in FIG. 1, and a recess 3 a is provided in the center portion on the left and right. The recess 3a has an elongated shape that is elongated in the vertical direction in FIG. The semiconductor element 1 also has an elongated shape elongated in the vertical direction in FIG. 1, and the lower part thereof is housed in the recess 3a. The heat radiating plate 3 is provided with an attachment hole 3b for attachment to an electronic device.

The urging body 4 is attached to the outer peripheral portion of the recess 3a of the heat radiating plate 3 by a fixture 5, thereby
The semiconductor element 1 is urged downward in the recess 3a.

  FIG. 2 shows an enlarged plan view of the region indicated by the circle A in FIG. 1 with the biasing body 4 removed. Moreover, the expanded sectional view along the BB line in FIG. 2 is shown in FIG.

  As shown in FIGS. 2 and 3, heat radiation grease 6 is filled in the recess 3 a of the heat radiation plate 3. At least the lower part of the semiconductor element 1 is disposed in the recess 3a so that the lower part of the semiconductor element 1 is in contact with the heat-dissipating grease 6 in an immersed state.

  As shown in FIGS. 2 and 3, the semiconductor element 1 has an electrode 1a on the upper surface side, and the electrode 1a has an inner lead 8a at the tip of the wiring 8 constituting the wiring member 2 via a bump 7. Are electrically connected. The upper portion of the semiconductor element 1 is covered with a protective resin body 9 so as to cover this electrical connection portion. The outer peripheral shape of the protective resin body 9 is an elongated shape (the elongated shape in the vertical direction in FIG. 2 as in the semiconductor element 1) smaller than the inner peripheral shape of the recess 3a.

  As shown in FIG. 3, the wiring member 2 having a substantially quadrangular planar shape has a configuration in which a plurality of wirings 8 are arranged on a flexible tape substrate 2c and the upper surface thereof is covered with a resist 2d. And has sufficient flexibility as a whole. The adhesive sheet 10 is affixed to the outer peripheral part of the recessed part 3a, and the outer peripheral part of the recessed part 3a in the tape base material 2c is joined to the heat sink 3 by the adhesive sheet 10.

  The fixture 5 is composed of a metal screw 5a, and the heat radiating plate 3 is provided with a screw hole 3c for fastening the screw 5a.

  Next, a process for manufacturing the semiconductor device having the configuration shown in FIGS. 1 to 3 will be described with reference to FIGS.

  First, as shown in FIG. 4, one in which an adhesive sheet 10 is attached to the outer peripheral portion of the recess 3 a of the heat radiating plate 3 is prepared. Then, the heat radiation grease 6 in a fluid state is filled in the recess 3a.

  Next, as shown in FIG. 5, the semiconductor element 1 mounted on the wiring member 2 is lowered by pushing lightly downward in the recess 3 a while crushing the heat-dissipating grease 6 which is still in the fluid state in the recess 3 a. . At this time, the semiconductor element 1 is electrically connected to the inner lead 8a of the wiring member 2 as described above, and the upper portion of the semiconductor element 1 is covered with the protective resin body 9 so as to cover the electrical connection portion. Yes.

  Thereafter, as shown in FIG. 6, the urging body 4 is placed on the protective resin body 9 so as to urge the semiconductor element 1 downward in the recess 3 a. Next, although not shown in FIG. 6, the urging body 4 is attached to the heat radiating plate 3 portion on the outer periphery of the concave portion 3 a by the fixture 5. A completed state in which the screw 5a is screwed into the screw hole 3c is shown in FIGS.

  Next, the configuration of the semiconductor device as described above and the effects obtained by the manufacturing process will be described.

  First, as shown in FIG. 3, when the screw 5 a is screwed into the screw hole 3 c, the semiconductor element 1 is pressed and urged by the urging body 4 to the heat radiation grease 6 through the protective resin body 9. In the wiring member 2 electrically connected to the semiconductor element 1, sufficient flexibility is maintained outside the protective resin body 9 covering the semiconductor element 1. Therefore, when the semiconductor element 1 is pressed downward in the recess 3 a by the urging body 4 through the protective resin body 9, the outer side of the protective resin body 9 of the wiring member 2 bends downward. As a result, the semiconductor element 1 is pressed and urged against the heat radiation grease 6 as shown in FIG.

  Further, as is understood from FIG. 1, the urging body 4 has a long shape extending in a direction (left and right direction in FIG. 1) perpendicular to the long concave portion 3 a. Accordingly, when the left and right portions of the elongated shape are screwed into the screw holes 3c with the screws 5a, the semiconductor element 1 is maintained in a substantially horizontal state as shown in FIG. The heat radiating grease 6 is pressed and urged.

  As a result, the contact area between the semiconductor element 1 and the heat radiating grease 6 is stabilized in a wide state, whereby heat generated by the semiconductor element 1 is effectively transmitted to the heat radiating plate 3 through the heat radiating grease 6. Therefore, the malfunction of the semiconductor element 1 due to thermal reasons can be suppressed.

  Further, since the urging body 4 itself is also made of metal and the screw 5a for stopping the urging body 4 is also made of metal, the heat of the semiconductor element 1 transmitted to the urging body 4 is also transmitted through the urging body 4 and the screw 5a. Can be transmitted to the heat sink 3. Also from this point, the malfunction of the semiconductor element 1 due to thermal reasons can be suppressed.

  When the screw 5a is screwed into the screw hole 3c, the screw 5a passes through the wiring member 2. On the other hand, the screw 5a penetrating portion of the wiring member 2 is configured to avoid the wiring 8. Therefore, even if the screw 5a is made of metal in consideration of heat transfer, an electrical short circuit can be avoided.

  If the screw 5a is screwed into the screw hole 3c, the wiring member 2 and the urging member 4 can be attached to the heat radiating plate 3 at the same time as shown in FIG. Accordingly, the workability is good, and the heat dissipation effect through the biasing body 4 is also obtained as described above. By adopting this configuration, a plurality of specific effects can be obtained at the same time.

  Furthermore, when screwing the screw 5a into the screw hole 3c, for example, an electric screwdriver can be used, and at that time, vibration of the electric screwdriver is transmitted to the semiconductor element 1 via the biasing body 4. As a result, the semiconductor element 1 is immersed in the heat dissipation grease 6 while receiving vibration, so that the heat dissipation grease 6 is more likely to adhere to the bottom surface and the lower outer peripheral surface of the semiconductor element 1. As a result, the heat generated by the semiconductor element 1 can be effectively transmitted to the heat radiating plate 3 via the heat radiating grease 6, and the effect of suppressing the malfunction of the semiconductor element 1 due to thermal reasons can be sufficiently obtained.

  Further, in such a completed assembly state, as shown in FIG. 1, the elongated biasing body 4 arranged in a direction orthogonal to the elongated recess 3a corresponds to the longitudinal direction of the recess 3a. The dimension is set smaller than the longitudinal dimension of the recess 3a. Accordingly, the recesses 3a are exposed on both sides of the urging body 4 in the longitudinal direction of the recesses 3a. For this reason, even when the heat radiation grease 6 is excessively filled in the concave portion 3a, the excessive heat radiation grease 6 flows out from the exposed portion of the concave portion 3a. As a result, the semiconductor element 1 can be pressed and urged against the heat radiating grease 6 by the flat plate-like urging body 4 as described above while the horizontal state is substantially maintained as shown in FIG.

  According to the semiconductor device and the manufacturing method thereof of the present invention, the contact state between the semiconductor element and the heat dissipation grease is stabilized, and as a result, the heat of the semiconductor element is efficiently transmitted to the heat dissipation plate through the heat dissipation grease. Since the malfunction of the semiconductor element due to the reason can be suppressed, it is useful as a semiconductor device used in various electronic devices.

The top view which shows the semiconductor device in one Embodiment of this invention An enlarged plan view showing a part of the semiconductor device indicated by a circle A in FIG. 1 with the biasing body 4 removed. FIG. 2 is an enlarged cross-sectional view of the semiconductor device taken along line BB in FIG. Sectional drawing which shows 1 process of the manufacturing method of the same semiconductor device Sectional drawing which shows the process after FIG. 4 of the manufacturing method Sectional drawing which shows the process after FIG. 5 of the manufacturing method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Wiring member 3 Heat sink 3a Recess 3b Mounting hole 3c Screw hole 4 Energizing body 5 Mounting tool 5a Screw 6 Radiation grease 7 Bump 8a Inner lead 9 Protective resin body 10 Adhesive sheet

Claims (14)

A heat sink having a recess on at least one surface;
A heat dissipating grease filled in the recess of the heat dissipating plate;
In a state where it is in contact with the heat dissipation grease, at least a part of the semiconductor element is disposed in the recess, and
In a semiconductor device comprising: a wiring member that is electrically connected to the semiconductor element and disposed on an outer peripheral portion of the recess;
With respect to the semiconductor element, provided on the opposite side of the recess of the heat dissipation plate, comprising a biasing body that biases the semiconductor element into the recess,
The semiconductor device according to claim 1, wherein the biasing body is attached to an outer peripheral portion of the concave portion of the heat radiating plate with a fixture.   The semiconductor device according to claim 1, wherein the wiring member is attached to the outer peripheral portion of the concave portion of the heat radiating plate together with the biasing body by the fixture.   The semiconductor device according to claim 2, wherein the fixture is configured by a screw, and a screw hole for screwing the screw is formed in an outer peripheral portion of the recess in the heat radiating plate.   The semiconductor device according to claim 3, wherein the screw holes are formed on both sides of the recess.   The said recessed part and the said semiconductor element are long shapes, and the said biasing body is a long shape extended in the direction orthogonal to the long shape of the said recessed part. The semiconductor device described.   The dimension corresponding to the longitudinal direction of the said recessed part of the said urging | biasing body is smaller than the dimension of the longitudinal direction of the said recessed part, and the longitudinal direction both ends of the said recessed part are exposed from the said urging | biasing body. Semiconductor device.   The electrical connection part of the said semiconductor element and the said wiring member is coat | covered with the protective resin body, The said semiconductor element is urged | biased in the said recessed part via the said protective resin body. The semiconductor device according to one item.   The semiconductor device according to claim 7, wherein the protective resin body covers a side opposite to the concave portion of the semiconductor element, and an outer peripheral shape of the protective resin body is smaller than an inner peripheral shape of the concave portion.   The semiconductor device according to claim 1, wherein the urging body and the fixture are formed of a heat conductive material.   The semiconductor device according to claim 1, wherein the urging body, the fixture, and the heat sink are made of metal. A heat radiating plate having a recess on at least one surface thereof, a heat radiating grease filled in the recess of the heat radiating plate, and a semiconductor element at least partially disposed in the recess in a state of being in contact with the heat radiating grease; In the method of manufacturing a semiconductor device, which is electrically connected to the semiconductor element and includes a wiring member disposed on an outer peripheral portion of the recess.
The semiconductor element mounted on the wiring member is disposed in the recess of the heat radiating plate so as to come into contact with the heat radiating grease,
With respect to the semiconductor element, an urging body is disposed on the side opposite to the concave portion of the heat sink,
A manufacturing method of a semiconductor device, wherein the biasing body is attached to an outer peripheral portion of the concave portion of the heat radiating plate by the fixture, thereby biasing the semiconductor element toward the concave portion.   The method of manufacturing a semiconductor device according to claim 11, wherein a screw is used as the fixture, and the screw is screwed into a screw hole formed in an outer peripheral portion of the recess in the heat sink.   The method of manufacturing a semiconductor device according to claim 11, wherein the wiring member is attached to the outer peripheral portion of the concave portion of the heat radiating plate together with the urging member by the fixture.   An electronic apparatus comprising a plurality of the semiconductor devices according to claim 1, wherein the plurality of semiconductor devices are arranged in a planar shape.

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