M240782 五、創作說明（1) 【新型所屬之技術領域】 本創作涉及一種散熱裝置，特別涉及一種電子元器件 尤其是電腦的元器件的散熱裝置。 【先前技術】 電腦内部的電子元器件在工作時通常會產生熱量，使 元器件温度升高，對元器件的正常工作會產生影響。其中 ，中央處理器工作時的溫度特別高。因此，必須安裝散熱 裝置以確保元器件在適當的溫度下正常工作。 目前所使用的絕大多數PC機的中央處理器均只採用散 熱片和風扇作為散熱部件，且將散熱部件直接裝在中央處 理器上。散熱片的不同位置有溫差，散熱不均勻，影響散 Φ 熱效果。 【新型内容】 本創作的目的是提供一種利用熱柱、散熱鰭片組成散 ‘ 熱部件的散熱裝置，為中央處理器提供了更好的散熱條件 〇 為了達到上述的目的，本創作的技術方案如下 一種散熱裝置，包括與元器件接觸的散熱板、傳遞熱 量的多個散熱鰭片和至少一個熱柱，所述的多個散熱鰭片 與散熱板平行排列，多個散熱鰭片與散熱板上均設有一個 形狀尺寸與熱柱配合的通孔，熱柱貫穿插入通孔中並與散 熱鰭片、散熱板貼合。 馨 在本創作的較佳方案中，所述的熱柱與散熱板、散熱 鰭片均通過焊接或導熱膠或導熱樹脂連接。M240782 V. Creation Description (1) [Technical Field of New Type] This creation relates to a heat dissipation device, in particular to a heat dissipation device for electronic components, especially components of a computer. [Previous technology] Electronic components inside a computer usually generate heat during work, which increases the temperature of the components and affects the normal operation of the components. Among them, the temperature of the central processing unit is particularly high. Therefore, a heat sink must be installed to ensure that the components work properly at the proper temperature. The CPU of most PCs currently used only uses heat sinks and fans as heat dissipation components, and the heat dissipation components are directly mounted on the CPU. There are temperature differences at different positions of the heat sink, and the heat dissipation is uneven, which affects the heat dissipation effect. [New content] The purpose of this creation is to provide a heat dissipation device that uses thermal pillars and fins to dissipate thermal components, which provides better heat dissipation conditions for the central processor. In order to achieve the above purpose, the technical solution of this creation The following heat dissipation device includes a heat dissipation plate in contact with components, a plurality of heat dissipation fins for transferring heat, and at least one heat pillar, the plurality of heat dissipation fins are arranged in parallel with the heat dissipation plate, and the plurality of heat dissipation fins and the heat dissipation plate A through hole with a shape and a size matched with a thermal pillar is provided on the upper side, and the thermal pillar penetrates the through hole and is attached to the heat dissipation fin and the heat dissipation plate. Xin In the preferred scheme of this creation, the thermal pillars are connected to the heat sink plate and the heat sink fins by welding or thermally conductive glue or thermally conductive resin.
第5頁 M240782 五、創作說明（2) 所述的散熱鰭片和散熱板上的通孔分別位於其中部。 所述的熱柱底端設有一個邊長大於熱柱直徑的方形安 裝塊，散熱板上的通孔靠近元器件的一端也對應的成方形 ，方形安裝塊嵌裝在方形孔中。 由於採用上述的方案，提供了一種全新結構的散熱裝 置，利用熱柱將中央處理器工作時所產生的熱量快速並且 均勻地引導至各散熱鰭片，這樣，不同位置的散熱鰭片溫 差小，散熱均勻，效果好。 為使能更進一步瞭解本創作之特徵及技術内容，請參 閱以下有關本創作之詳細說明與附圖，然而所附圖式僅提 供參考與說明用，並非用來對本創作加以限制者。 【實施方式】 下面結合附圖和實施例對本創作作進一步詳細的說明 如第一圖至第三圖所示，一種散熱裝置，包括與元器 件接觸的散熱板1、傳遞熱量的多個散熱縛片2和一個熱柱 3 ,多個散熱鰭片2與散熱板1平行排列，多個散熱鰭片2與 散熱板1的中部均設有一個形狀尺寸與熱柱3配合的通孔4 ，熱柱3貫穿插入通孔4中並與散熱鰭片2、散熱板1貼合。 熱柱3底端設有一個邊長大於熱柱3直徑的方形安裝塊 3 1，散熱板1上的通孔4靠近元器件的一端也對應的成方形 安裝孔，方形安裝塊3 1嵌裝在方形安裝孔中且與散熱板1 的外端面齊平。熱柱3與散熱板1、散熱鰭片2均通過焊接 或導熱膠或導熱樹脂連接。Page 5 M240782 5. The heat dissipation fins and the through holes on the heat sink as described in the creative instructions (2) are located in the middle. The bottom end of the thermal pillar is provided with a square mounting block with a side length greater than the diameter of the thermal pillar. The end of the through hole on the heat dissipation plate near the component is also correspondingly square. The square mounting block is embedded in the square hole. Because the above-mentioned solution is adopted, a new structure of the heat dissipation device is provided, and the heat generated by the central processing unit is quickly and uniformly guided to the heat dissipation fins by using a thermal column. In this way, the temperature difference of the heat dissipation fins at different positions is small. Uniform heat dissipation and good effect. In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation, but the drawings are for reference and explanation only, and are not intended to limit this creation. [Embodiment] The following describes the creation in further detail with reference to the drawings and embodiments. As shown in the first to third figures, a heat dissipation device includes a heat dissipation plate 1 in contact with components, and a plurality of heat dissipation bindings for transferring heat. The fins 2 and a thermal pillar 3, a plurality of radiating fins 2 are arranged in parallel with the radiating plate 1, and a middle portion of the plurality of radiating fins 2 and the radiating plate 1 is provided with a through hole 4 matched with the thermal column 3. The post 3 is inserted into the through hole 4 and is attached to the heat dissipation fin 2 and the heat dissipation plate 1. The bottom end of the thermal pillar 3 is provided with a square mounting block 31 with a side length larger than the diameter of the thermal pillar 3. The through hole 4 on the heat sink 1 is also corresponding to a square mounting hole at the end near the component. The square mounting block 31 is embedded. In a square mounting hole and flush with the outer end face of the heat sink 1. The thermal pillar 3 is connected to the heat dissipation plate 1 and the heat dissipation fins 2 by welding or thermally conductive glue or thermally conductive resin.
M240782 五、創作說明（3) 由技術常識可知，本創作可以通過其他的不脫離其精 神實質或必要特徵的實施方案來實現。因此，上述公開的 實施方案，就各方面而言，都只是舉例說明，並不是僅有 的。所有在本創作申請專利範圍内或在等同於本創作的申 請專利範圍内的改變均被本創作包含。M240782 V. Creative Instructions (3) From the common technical knowledge, this creative work can be realized through other implementation schemes that do not depart from its essence or essential characteristics. Therefore, the above-disclosed embodiments are merely examples for all aspects, and are not the only ones. All changes that are within the scope of the patent application for this creation or within the scope of the patent application equivalent to this creation are included in this creation.
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