M299296 八、新型說明： 【新型所屬之技術領域】 本劍作為-種J C測試分類機之技街領減，尤其指一種改良 機台測試區之結構，配合使用不同的測試座（soc即，能簡化機 台的複雜程度’增加所能測試晶片的數目，提昇測試效率。 L先W技術】 上、I 〇測試分類機為—_於對受測之晶片進行相關的電性測 t亚對測試後之晶片加以分類處理，以利後續相關作業的進行， 亚此整合於整套晶片測試系統中，以降低整體的試測成本。 此類的1 C測試分類機其作業流程，依序為將制晶片自待 ==機台之顺㈣，再嘴單元及測朗將待測晶 =娜之插座，此_插座僅作為將制晶片之接脚作電 至顧早兀處而進行相關之測試。但此結構有—大缺點， 在日日片進行測試過程中，苴一 愍於曰U 餐早兀及戰頭不能離開，只能持 一果曰之上保持良好的電性連接以利測試作業順利進 :::同時多組晶片進行測試，相對地也是需要複數組吸嘴 ’因此會使機台上之機構數目幕 =:於所需機構數目較多，因此單-機台能進同時= 測试U數目也受限，啊效率不佳。 【新型内容】 M299296 -、^創作之主要目的是提供-種為能簡化機台結構之！c剛試 分類機:主要是使測試區内之測試作業及移載作業獨立分崎 作’即當晶片娜載至賴座及_單元時，就觀定而進行測 ，作業’而作轉·具之相_構鱗即可離開而騎其他組 晶片的移載’因此能使機台結構簡化，製造成本降低。、 本創作之-人要目的是提供—種能提高測試效率之I C測試分 减由於在晶片測試過程中，負責晶片移載的相關機構能進行 其他曰曰片的移載作業’故相同的作業時間能進行的晶片測試數量 更夕’而利用本創作之結構，所能容置進行晶片數量又更多，因 此更能提昇晶片的測試效率。 為達上述之目的，本創作主要是在機台之測試區内設有複數 組測試座及複數組職單元、—組能於機台上能減移動至測試 座處的壓桿機構，並能適時施壓於測試座使其達開閉的動作，另 外也設有一抓取機構，能將晶片移出或送至測試座處；藉此當待 測晶片被放置於測試座後即被固定，配合測試單元進行後續測試 動作，而此時壓桿機構及取放機構則能離開而進行其他的動作。 為使審查委員清楚了解本創作之詳細流程及技術内容，本創 作人將配合以下之圖式及詳細之解說，以求審查委員清楚了解本 創作之精神所在： M299296 【實施方式】 如第-及二圖所示’分別為本創作T c試測分類機之主要構 件的俯視圖及側視圖，該機台上主要分為測試區丨及元件區2兩 部份’兩者之間設有輪送機構3，作為晶片的移載工具。該元件 區2為待測及測試完成後之晶片的置放處所，如第二圖所示，此 處設有-組抓取機構21，利用其上之吸嘴單元2 i i即可將晶 片移載至輸賴構3之域處3 1處，之後再移人職區丄内。 而測試完成後之晶片也是侧托盤3丨送回元件區2，此作業程 序會經電腦加以控制，將待測晶片、測試後之良品與不良品分= 放置於相對應之儲存_。此部份與㈣方式機似，故不再詳 加描述。 本創作改良之處主要是針制試區丨内之結構，提供一種測 试作業及移載作業錢立分崎作的方式，藉此賴體結構更為 簡化，同時使機台的成本大幅降低。如第__圖所示，本創作機台 之測試區1内，可區分為四組的測試作業區a、b、c、d，每 -組測試作業區的結構皆相同’故現僅就其中—組結構作詳細說 明，其他組結構也皆以相同方式運作。如第三圖所示，為該測試 作業區a之立體圖，為了避免部份構件被遮蔽而無法看清楚，位 於最頂部的抓取機構餅出部份結構，詳細結構如細圖所示， 各構件相互間的空間關係也可參考第一、二圖所示。 7 M299296 _ = 主要包括有複數個測試M299296 VIII. New description: [New technical field] This sword is the technical street of the JC test classification machine, especially the structure of the improved machine test area, with different test sockets (soc Simplify the complexity of the machine 'increasing the number of tested wafers and improving the test efficiency. L first W technology】 The upper, I 〇 test classifier is - _ related to the tested wafers related electrical test t sub-pair test The subsequent wafers are sorted and processed to facilitate the subsequent related operations, which are integrated into the entire wafer test system to reduce the overall test cost. The operation procedure of this type of 1 C test sorter is in order. The wafer is self-suppressed == the machine is shun (4), and the mouth unit and the measuring horn will be tested for the crystal=Na's socket. The _ socket is only used as a test for the chip to be soldered to the early stage. However, this structure has a big disadvantage. In the process of testing the Japanese film, the 曰U 餐 U meal can be left early and the war can't leave, and can only maintain a good electrical connection on top of a fruit to facilitate the test operation. Smooth progress::: Multiple groups at the same time The wafer is tested, and relatively requires a complex array of nozzles. Therefore, the number of mechanisms on the machine is reduced. =: The number of required mechanisms is large, so the single-machine can enter simultaneously = the number of test U is also limited.啊 Inefficient. [New content] M299296 -, ^ The main purpose of the creation is to provide - to simplify the structure of the machine! c just test classification machine: mainly to make the test area and transfer operations in the test area independent "Kawasaki" means that when the wafer is loaded into the riddle and the _ unit, it is determined to perform the measurement, and the operation is carried out, and the phase of the directional structure can be removed and the transfer of other groups of wafers can be The structure of the machine is simplified, and the manufacturing cost is reduced. The purpose of this creation is to provide an IC test that can improve the test efficiency. Because the relevant mechanism responsible for wafer transfer can perform other pictures during the wafer test process. The transfer operation 'so the number of wafer tests that can be performed in the same operation time is even better', and with the structure of the present invention, the number of wafers that can be accommodated is increased, so that the test efficiency of the wafer can be improved. Purpose, this The main purpose is to have a multi-array test seat and a multi-array unit in the test area of the machine, the group can reduce the pressure bar mechanism moved to the test seat on the machine table, and can apply pressure to the test seat at the appropriate time. The opening and closing action is additionally provided with a grasping mechanism for removing or feeding the wafer to the test seat; thereby, when the wafer to be tested is placed in the test seat, it is fixed, and the test unit is used for subsequent test actions, and At this point, the pressure bar mechanism and the pick-and-place mechanism can leave and perform other actions. In order to make the reviewer clearly understand the detailed process and technical content of the creation, the creator will cooperate with the following drawings and detailed explanations for review. Members clearly understand the spirit of this creation: M299296 [Implementation] As shown in the first and second figures, respectively, the top view and side view of the main components of the T c test and classification machine are divided into tests. Two parts of the zone and the component area 2 are provided with a transfer mechanism 3 as a transfer tool for the wafer. The component area 2 is a placement place of the wafer after the test and the test is completed. As shown in the second figure, a group grasping mechanism 21 is provided here, and the wafer can be moved by using the nozzle unit 2 ii thereon. It is carried to 31 places in the domain of the transfer and relocation, and then moved to the occupation area. After the test is completed, the wafer is also returned to the component area 2 by the side tray 3, and the operation program is controlled by the computer, and the wafer to be tested, the good product after the test, and the defective product are placed in the corresponding storage_. This part is similar to the (4) mode, so it will not be described in detail. The improvement of this creation is mainly the structure of the needle test area, which provides a way of testing and transferring the operation, so that the structure is simplified and the cost of the machine is greatly reduced. . As shown in the figure __, the test area 1 of the creation machine can be divided into four groups of test work areas a, b, c, and d, and the structure of each test group is the same. The group structure is described in detail, and the other group structures operate in the same way. As shown in the third figure, in the perspective view of the test work area a, in order to prevent some components from being obscured and not visible, the topmost gripping mechanism has a part of the structure, and the detailed structure is as shown in the detailed drawings. The spatial relationship between the components can also be referred to in the first and second figures. 7 M299296 _ = mainly includes multiple tests
=ΓΓ7及抓取機構8，每—測試單元6頂部皆設有 5，_試單元6底部與下方相對應之測試電路板相連 β對晶片進行預設的電性測試。而_座5設置於測試單 部’負責夾持固定晶片，並與晶片底部之接脚作電性連接， 以供下方測試早兀6進_試。如第五圖麻，林創作所使用 之測試座5的立體圖，為燒式測試座（bura-in Socket) ”傳、、先方式不同’其具有夾翻定魏，當施壓於其頂部之壓塊 51使之下降時’即可使位於頂部開放空間之金屬壓條縮回；當 外力消失時，則金屬壓條將伸出施壓於放置其上的晶片，以達固 定的目的。該測試座5頂部開放扣的頂面5 2，即為晶片的放 置之處。 壓桿機構7是作為觸動測試座5開啟或夾持固定的機構，其 包括有—壓桿71、昇降機構7 2、平移機構7 3所構成，該壓 才干7 1為中間設有數貫穿空間7工丄的板體，每一個空間7 1 1 是對應於測試座5之頂部中間位置，為“的放置處，當壓桿了 1下降時恰施壓於測試座5之壓塊5 2處，而達開啟之目的。該 壓桿71兩端各設有一昇降機構了 2，以控制壓桿昇降動作，該 兩昇降機構7 2是受平移機構73所牽引’能在機台上作橫向的 位移。其中該平移機構7 3包括設置於兩昇降機構7 2底部之滑 M299296 轨7 31上、一伺服馬達7 3 2，該伺服馬達7 3 2並利用時規 皮帶7 3 3與其中一昇降機構7 2連結，以帶動整體作橫向的位 移。 如第四圖所示，為抓取機構之立體圖。參第一圖所示，本創 作之一組抓取機構8是供機台上兩個測試作業區^及c (或 d)使用，該抓取機構8是用以將輸送機構3之托盤31上的晶 片及起移動至測試座5處。該取放機構8是由複數吸嘴單元8 1、昇降機構8 2及平移機構8 3所構成，該複數吸嘴單元81 疋固定於一支架8 4處並受昇降機構8 2控制整組的昇降動作， 而平移機構8 3用以控制昇降機構8 2在機台之測試作業區内作 橫向移動，該平移機構8 3是利賴服馬達之皮帶牵引著昇降機 構在滑軌上移動，以產生橫向的位置。另外該吸嘴單元8丄另設 有相關管路及控制電路，使其適時產生吸力。 接著就整個測试作業區内之作動方式作一說明： 請參考第三圖解，當輸送機構將承鑛制；之托盤3 移至測試作業區a時，該壓桿機構7將先移動至測試座5處，之 後墨桿7 1下降施壓於_座5使其呈開啟狀態，而祕取機構 8則將移至托盤31上方，之後下降吸嘴單元81而將晶片吸起 後移動至賴座5處，並將晶片下降放置於測試座5上，之後壓 才干7 1先接使付晶片被測試座5所固定，此時晶片則利用測試 M299296 :===杨作’在_過程中，壓桿機構7可再 一 ，而抓取機構8職相同的軸方式將另 片2晶峨訂―_觸，㈣_賴之待測晶 綱6目?1之測試座處而進行測試。而過程中如果有—組晶片 回輸送機構娜8制物之晶片送 由以上的說明可知，當待測晶片被放置於測試座後，即可 自行被固定而進行後續的測試作業，轉壓機構及抓取機構則可 /進仃/、他、如0片的移載作業，如此—來，每—細_作業區僅 組桿壓機構及抓取機構，甚至也可多組測試作業區共用此機 ，例如在本貫施例中，即為兩_試作#區共用—組抓取機構C 因此本創狀1 C峨叙、_大_化，缺得絲降低，更 具市場競爭力，同時能提昇測試件#的效率。 以上所述者，僅為本創作之較佳實施例而已，並非用來限定 本創作實施例之範圍。即凡依本創作中請專利範圍所作的均等變 化及修飾，皆為本創作之專利範圍所涵蓋。 【圖式簡單說明】 第一圖為本創作之平面示意圖； 第二圖為本創作之側視圖； 10 M299296 第三圖為本創作之單一測試作業區之立體圖 第四圖為本創作抓取機構之立體圖； 第五圖為本創作測試座之立體圖。 【主要元件符號說明】 1 測試區 2 元件區 3 輸送機構 5 測試座 5 1壓塊 6 測試單元 7 壓桿機構 7 1壓桿 7 2昇降機構 7 3 1滑軌 7 3 3時規皮帶 8 抓取機構 8 1吸嘴單元 8 3平移機構 21 抓取機構 3 1 托盤 5 2頂面 7 1 1空間 7 3平移機構 7 3 2伺服馬達 8 2昇降機構= ΓΓ 7 and the grabbing mechanism 8, each of the test unit 6 is provided with a top 5, the bottom of the test unit 6 is connected to the corresponding test circuit board below. The predetermined electrical test is performed on the wafer. The _ seat 5 is placed in the test unit's responsible for holding the fixed wafer and electrically connecting it to the bottom of the wafer for testing below. As shown in the fifth figure, the stereogram of the test stand 5 used by Lin Creative is a burn-in test socket (bura-in Socket). The transmission is different from the first method. When the pressing block 51 is lowered, the metal bead located in the top open space can be retracted; when the external force disappears, the metal bead will protrude and press the wafer placed thereon for the purpose of fixing. 5 The top surface 52 of the top open buckle is where the wafer is placed. The pressing rod mechanism 7 is a mechanism for opening or clamping the touch test stand 5, which comprises a pressing rod 71, a lifting mechanism 7, and a translation The mechanism 7 3 is composed of a pressure body 7 1 which is a plate body which is provided with a plurality of working spaces 7 in the middle, and each space 7 1 1 corresponds to a top intermediate position of the test seat 5, which is a “placement, when the pressure bar When 1 is lowered, it is pressed against the pressure block 52 of the test seat 5 to achieve the purpose of opening. A lifting mechanism 2 is disposed at each end of the pressing rod 71 to control the lifting and lowering action of the pressing rod. The two lifting mechanisms 7 2 are pulled by the translation mechanism 73 to be laterally displaced on the machine table. The translation mechanism 73 includes a slide motor M299296 on the bottom of the two lift mechanisms 7 2 and a servo motor 723. The servo motor 723 uses the timing belt 7 3 3 and one of the lift mechanisms 7 . 2 links to drive the overall lateral displacement. As shown in the fourth figure, it is a perspective view of the grasping mechanism. As shown in the first figure, a group of grasping mechanisms 8 of the present invention is used for two test work areas ^ and c (or d) on the machine table, and the pick-up mechanism 8 is a tray 31 for transporting the transport mechanism 3. The upper wafer and the movement are moved to the test stand 5. The pick-and-place mechanism 8 is composed of a plurality of nozzle units 81, a lifting mechanism 8 2 and a translation mechanism 83. The plurality of nozzle units 81 are fixed to a bracket 84 and are controlled by the lifting mechanism 8 2 . The lifting mechanism 83 is used to control the lifting mechanism 8 2 to move laterally in the testing work area of the machine, and the translation mechanism 83 is a belt of the motor to pull the lifting mechanism to move on the sliding rail, Produces a lateral position. In addition, the nozzle unit 8 is provided with a related pipeline and a control circuit to generate suction in a timely manner. Then, a description will be made on the operation mode in the entire test work area: Please refer to the third diagram. When the transport mechanism moves the tray 3 to the test work area a, the press mechanism 7 will first move to the test. At the 5th position, after the ink stick 7 1 is lowered, the pressure is applied to the seat 5 to be opened, and the secret mechanism 8 is moved to the upper side of the tray 31, after which the nozzle unit 81 is lowered to suck up the wafer and then move to the base. At the 5th position, the wafer is lowered and placed on the test stand 5, and then the pressurization 7 1 is first connected so that the wafer is fixed by the test stand 5. At this time, the wafer is tested by M299296: ===Yang Zuo' in the process The pressure bar mechanism 7 can be further tested, and the same axis mode of the grasping mechanism 8 is used to test the other piece of the crystal film, and the test piece is tested. In the process, if there is a wafer transfer mechanism of the group wafer transfer mechanism, the above description shows that when the wafer to be tested is placed in the test socket, it can be fixed by itself for subsequent test operations, and the pressure conversion mechanism And the pick-up mechanism can / enter / /, he, such as 0 pieces of transfer operations, so - each - fine _ work area only set up the pressure mechanism and the grabbing mechanism, or even multiple sets of test areas shared This machine, for example, in the present embodiment, that is, the two _ trials # zone sharing - group grabbing mechanism C, thus the creation of 1 C 峨 、, _ big _, lack of silk, more market competitive, At the same time, the efficiency of the test piece # can be improved. The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present embodiments. All changes and modifications made to the patent scope of this creation are covered by the scope of the patent. [Simple diagram of the diagram] The first diagram is a schematic diagram of the creation; the second diagram is a side view of the creation; 10 M299296 The third diagram is a perspective view of the single test operation area of the creation. The fourth diagram is the creation of the capture mechanism. The perspective view; the fifth picture is a perspective view of the creation test stand. [Main component symbol description] 1 Test zone 2 Component area 3 Transport mechanism 5 Test stand 5 1 Press block 6 Test unit 7 Press bar mechanism 7 1 Press bar 7 2 Lift mechanism 7 3 1 Slide rail 7 3 3 Timing belt 8 Grab Pickup mechanism 8 1 nozzle unit 8 3 translation mechanism 21 gripping mechanism 3 1 tray 5 2 top surface 7 1 1 space 7 3 translation mechanism 7 3 2 servo motor 8 2 lifting mechanism