M257606 3、創作說明（1) 【創作領域】 一種叢集式之散熱裝置，尤指一種可增加散熱面積之 叢集式之散熱裝置。 【先前技術】 近年來因科技不斷的向前邁進’個人電腦等相關領域 的設備與元件亦隨之日新月異，相關的產品如：硬碟、介 面卡、中央處理器等，處理的資料越來越大，處理的速产 也越來越快；然而，資料處理的速度提高，電子傳遞所^ 生的熱能也同時增加，造成個人電腦内部設備與積體電路 元件的彳呆作溫度過局’就連介面卡上的晶片在執行時亦备 發出高熱，因此，若沒有適時地將熱量散去，勢必會影二 其正常的運作，導致執行速度降低’甚至造成硬體&二曰= 壞，縮短其壽命，所以針對發熱源（即晶片）設 貝 裝置乃是一般常見的解決方法。 月熱 傳統的散熱結構主要具有一直接與電器發熱源接觸之 導熱板，該導熱板之導熱面通常具有較大 ^ 夠充分吸收發熱源各位置所產生的埶 _ 積’能 較佳的金屬材質製造為•，如鋼；：：：因，，以導熱性 良好導熱介質，導熱板不易直接藉由二空氣並非 必須在導熱板上延伸散熱面積，可0 ^ ^逸熱量，所以 已達到瓶頸，必須構思如何在有^鹏電腦内部空間利用 積，於是，業者推出有鰭片型散埶梦f積内擴增散熱面 吸收後，可透過與空氣接觸面積^ ，讓熱能由導熱板 内將熱能疏導至空氣中。 、貝的鱗片在短暫的時間M257606 3. Creation instructions (1) [Creation area] A cluster type heat sink, especially a cluster type heat sink that can increase the heat dissipation area. [Previous technology] In recent years, due to the continuous advancement of science and technology, equipment and components in related fields such as personal computers have also changed with each passing day. Related products such as hard disks, interface cards, and central processing units have been processing more and more data. The larger the processing speed, the faster the production is getting faster and faster; however, as the speed of data processing increases, the thermal energy generated by the electron transfer also increases, causing the internal equipment of the personal computer and the circuit components of the integrated circuit to overheat. Even the chip on the interface card is also prepared to emit high heat during execution. Therefore, if the heat is not dissipated in a timely manner, it will inevitably affect its normal operation, which will cause the execution speed to decrease, and even cause hardware & Shorten its life, so it is a common solution to set the shell device for the heat source (ie the chip). The traditional heat-dissipating structure of moonlight mainly has a heat-conducting plate that is in direct contact with the heat source of the electrical appliance. The heat-conducting surface of the heat-conducting plate usually has a large ^ enough to fully absorb the 埶 _ product generated by each position of the heat source. A better metal material Manufactured as, such as steel; ::: Because of the good thermal conductivity of the thermally conductive medium, it is not easy for the heat transfer plate to directly extend the heat dissipation area on the heat transfer plate by the two air. It can reach 0 ^ ^ to release heat, so it has reached the bottleneck. It is necessary to conceive how to use the product in the internal space of the computer. Therefore, after the fin-shaped fan dream product has been expanded to absorb the heat dissipation surface, it can pass through the area in contact with the air ^, allowing the thermal energy to be transferred from the heat transfer plate. Drain into the air. Bay scales in a short time
第5頁 四、創作說明（2) 然而，位於導熱板上 若散熱鰭片排列方式無法 向，將無法在熱阻與流阻 【創作内容】 之鰭片未必具有良好的導熱 有效配合風扇所疏導的氣^ 間得到最佳解決方案。 性， 方 免缺Ϊ:存ΐ創: = : =複;:::二;題，避 LPU之運作效能及使用壽命。 保 為達到上述㈣，本創作一種叢集式之散熱裝，係勺 5有一第一散熱單元，該第一散熱單元包括一盥CPU表面匕 接f之接觸面與及一遠離CPU2散熱面，以及複數組配置 於=述散熱面上之第二散熱單元，其每組第二散熱單元係 由複數根導熱柱所構成；如是，可藉每一散熱單元之導熱 柱增加其散熱面積，並降低散熱裝置之氣流散逸阻尼，使 cpu產生之高溫可迅速排離熱源，以確保cpu之運作效能 使用壽命。 【實施方式】 有關本創作之詳細說明及技術内容，現就配合圖式說 明如下： 請審查委員參閱『第1、2圖』，係本創作之外觀立 體示意圖，如圖所示：本創作為一種叢集式之散熱裝置， 係配置於電腦内中央處理單元5 0 ( CPU )(請同時參閱 第4圖』）上或其他發熱電器上，藉以疏散其運作時產 生之熱能，其具有有一第一散熱單元1 〇，該第一散熱單 M257606 四 、創作說明⑶ ' -*- 元1 〇包括一與貼近cpu 50表面之接 之散熱面12，並於前述散熱面12上i置； 1===元20’其中，每組第二散熱單T ^ ϋ係：：數根導熱柱2 i所構成；如是，可藉每 ΐ二ί ¥、、柱2 1增加其散熱面積，並降低散熱裝置之二 >”L月文逸阻尼，你ρριτ ς η方斗一 〈氣Page 5 IV. Creation Instructions (2) However, if the heat sink fins are not arranged in the same direction on the heat transfer plate, the heat resistance and flow resistance of the fins may not be good. To get the best solution. In order to avoid the operational efficiency and service life of the LPU. In order to achieve the above, a cluster-type heat dissipation device is created. The scoop 5 has a first heat dissipation unit. The first heat dissipation unit includes a contact surface of the CPU surface and a contact surface away from the CPU2, and a plurality of heat dissipation surfaces. A group of second heat dissipation units disposed on the heat dissipation surface, each group of which is composed of a plurality of thermally conductive columns; if so, the heat dissipation area of each heat dissipation unit can be used to increase its heat dissipation area and reduce the heat dissipation device The airflow is dissipated and damped, so that the high temperature generated by the CPU can be quickly discharged from the heat source to ensure the operating efficiency and service life of the CPU. [Embodiment] The detailed description and technical content of this creation are described below in conjunction with the drawings: Please refer to the "Comments 1 and 2" for the review members, which are the three-dimensional schematic diagrams of the appearance of this creation, as shown in the figure: This creation is A cluster type heat dissipation device is arranged on a central processing unit 50 (CPU) in a computer (see also Figure 4 at the same time) or other heating appliances to evacuate the heat generated during its operation. It has a first Cooling unit 1 〇, the first cooling sheet M257606 4. Creation instructions ⑶ '-*-Yuan 1 〇 includes a heat dissipation surface 12 connected to the surface of the CPU 50, and is placed on the aforementioned heat dissipation surface 12; 1 == = Yuan 20 'Among them, each group of the second heat dissipation sheet T ^ series :: composed of a plurality of thermally conductive columns 2 i; if so, you can increase the heat dissipation area and reduce the heat dissipation device by each of two ¥, column 2 1 The second > "L Moon Wenyi damping, you ρριτ ς η Fang Dou Yi Qi
# ς 5 〇產 尚溫可迅速排離熱源，U =±之運作效能及使用壽命。 棒铜ΐ Ϊ 2 ’導熱柱21係可為鋁柱或銅柱，“十至二+ 散鼽單元1 +成束苐二政熱單元2 〇之插入第一 ί心===?:、此時，於第-散熱』 加熱使第-散熱單元1 介質之接著劑，並 最後，將第二散熱單元2 〇、：：J:::2 0穩固結合， 狀，使導熱柱2 i與導熱 散開呈放射 可降，裝置内部之 之散熱空間， 請審查委員參閱『第刀挺升熱疏散效率。 分解立體示意圖，其中，—:』二係為本創作第二實施例 數根導熱柱2 1沖壓對綠=j第一放熱單元2 0係藉由複 22，組装時上折處係形成一插接部 質之接著劑，藉加熱定位 ^疋位槽1 3塗佈相同介 熱單元1 0與第二散熱單‘„ 2，使第-散 之熱傳導阻尼，並且，穩固結合，且降低材料中 升散熱效果。 、導…、柱2 1散開呈放射狀，以提 請審查委員參閱『 M257606 創作說明（4) 分解立體不思圖’為增力口散 之間可增設有尺寸較小的第熱，積，於第二散熱單元2 〇 空間利用，達到較佳散熱效^散熱單元2 0，，藉以提升 『第5圖』，係為本創作第四徐此外，請審查委員參間 配合散熱裝置空間設計，該$實施例分解立體示意圖，為 同的平面，使插設其上之第1，面1 2係包含複數高低不 列。 —散熱單元2 0呈不同高度排 為提南散熱效果，『第6 例分解立體示意圖，該第_散二1，係為本創作第五實施 邊緣適當位置處亦可配置複2、、單元1 〇之散熱面1 2之 供風扇4 0之配置。 、、且之風扇支柱3 0，藉以提 惟以上所述者，僅為本每 能以之限定本發明實施 之較佳具施例而已，當不 範圍所作之均等涔彳μ血攸=圍，即大凡依本發明申請專利 範圍内。4 &化與修飾，皆應仍屬本發明專利涵蓋之 第8頁 M257606 圖式簡單說明 【圖式之簡單說明】 第1圖，係為本創作之外觀立體示意圖 第2圖，係為本創作第一實施例分解立體示意圖 第3圖，係為本創作第二實施例分解立體示意圖 第4圖，係為本創作第三實施例分解立體示意圖 第5圖，係為本創作第四實施例分解立體示意圖 第6圖，係為本創作第五實施例分解立體示意圖 【圖式之符號說明】# ς 5 〇 Product Shang Wen can quickly remove heat sources, U = ± operating efficiency and service life. The rod copper Ϊ Ϊ 2 'conducting column 21 series can be aluminum or copper columns. "Ten to two + scattered unit 1 + bundled two political heating unit 2 〇 Insert the first heart ===?:, This At the time of heat dissipation, the first heat-dissipating unit 1 is heated to make the adhesive of the medium of the first heat-dissipating unit 1, and finally, the second heat-dissipating unit 2 0, :: J ::: 2 0 is firmly combined, and the heat-conducting column 2 i is connected to the heat. The radiation can be lowered when dispersed, and the heat dissipation space inside the device. Please refer to the review committee for the “Effective Evacuation Efficiency of the First Blade. Exploded Three-Dimensional Schematic Diagram, where ::” The second series is a number of thermally conductive columns of the second embodiment of this creation. 2 1 Pressing green = j first heat release unit 2 0 is made by compounding 22, and the upper fold is assembled to form an adhesive for the plug-in part when assembling, and is positioned by heating ^ 疋 slot 1 3 coated with the same dielectric unit 1 0 and the second heat dissipation sheet '„2 make the first-diffuse heat conduction damping, and are firmly combined, and reduce the heat dissipation effect in the material. , Guide ..., column 2 1 spreads out radially, in order to invite the reviewing committee to refer to the "M257606 Creative Instructions (4) Decomposing the three-dimensional thoughtless picture". A small-sized first heat and product can be added between Zenglikousan. The second heat dissipation unit 20 uses space to achieve better heat dissipation efficiency ^ The heat dissipation unit 20 is used to improve the "fifth picture", which is the fourth creation of this creation. In addition, please review the members of the committee to cooperate with the space design of the heat dissipation device. The three-dimensional schematic diagram of the embodiment is exploded, and the planes are the same, so that the first, the plane 12 and the plane 12 are included in the complex number. —The heat dissipation unit 20 is arranged at different heights to improve the heat dissipation effect of South. "The 6th example is an exploded three-dimensional schematic diagram. The first _Scatter 2 1 is a complex 2 and unit 1 can be arranged at the appropriate position of the fifth implementation of this creation. 〇 the heat dissipation surface 12 is provided for the fan 40. The fan pillar 30, by which the above-mentioned ones are mentioned, is only a preferred embodiment that can limit the implementation of the present invention. When the scope is not equal, the blood is equal. That is to say, within the scope of patent application according to the present invention. 4 & Chemical modification and modification should still belong to page 8 of the invention patent. M257606 Brief description of the drawings [Simplified description of the drawings] Fig. 1 is a three-dimensional schematic diagram of the appearance of this creation. The exploded three-dimensional schematic diagram of the first embodiment of the creation is shown in FIG. 3, which is the exploded three-dimensional schematic diagram of the second embodiment of the creation. Exploded Stereo Schematic Figure 6 is the exploded perspective schematic diagram of the fifth embodiment of this creation [Symbol description of the diagram]
第一散熱單元.......1〇 接觸面..........11 散熱面..........12 定位槽..........13 第二散熱單元.......20、2 0， 導熱柱.......... 2 1 插接部..........2 2 風扇支柱...........30 風扇...........40 中央處理單元.......50The first heat dissipation unit ......... 10 contact surface ......... 11 heat dissipation surface ......... 12 positioning groove ......... .13 2nd heat dissipation unit ....... 20, 2 0, thermally conductive post .......... 2 1 connector part ......... 2 2 fan pillar. .......... 30 Fan ......... 40 Central Processing Unit ... 50
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