TWM254027U - Optical module - Google Patents
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- TWM254027U TWM254027U TW093203351U TW93203351U TWM254027U TW M254027 U TWM254027 U TW M254027U TW 093203351 U TW093203351 U TW 093203351U TW 93203351 U TW93203351 U TW 93203351U TW M254027 U TWM254027 U TW M254027U
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- circuit board
- optical module
- light sensor
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- 230000003287 optical effect Effects 0.000 title claims description 36
- 239000012212 insulator Substances 0.000 claims description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 5
- 238000010586 diagram Methods 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012552 review Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
M254027 月/曰 修正 i號932 四、創作說明(1) 【新型所屬之技術領域】 本創作係提供—接μ的 能之電子設備上,利予模組,尤指一種用於具照相功 光學槙組之外形尺寸:各兀件間之疊層架設’以達成縮小 【先前技術】 之整Ϊ更::i 1C發展與進步’使得電子產品 社,A ^M 尤/、小型化數位相機與行動電話的連 ϊ輪;=邊支援與架i具有將影像快速 行動電話漸化:;:=到ϊ”所喜愛;然*,在 模組同等縮小,以二;;:;”使附設於其上之光學 衣正體之造型輕巧、攜帶方便的訴求, 已成=^事該相關行業之研究課題。 學模:二^::::’係為習知光學模組示意圖’該光 ” 包有電路板i〇a、光感應器⑴及鏡頭座 杏^’虛、巾’於電路板1()3中間處連結有光感應器lla,此 ^感應益1 U係可為電荷耦合元件(Charge Coupled
Devlce,CCD)或互補式金屬氧化半導體感應器(cm〇s s_ei^or)等,於光感應器Ua之周圍環設有各式各樣之電子 ^13a(如:電阻、電容、晶片等);另於電路板i〇a上固 二有、兄頭座12a,此鏡頭座12a具有光學鏡頭1213及容置室 U2a,此容置室1223係可容設有電路板i〇a之電子元件 及光感應器11a,且鏡頭座lla之底面積係與電路板1〇a之 面積相當’以組合成一光學模組1 a之整體結構。 然而,上述習知之光學模組,由於該光感應器lla及 電子凡件1 3a係同時固設連結於電路板〗〇a之板面上,並佔 第5頁 M254027 案號 93203351 四、創作說明(2) 修正 據電路板l〇a大部份之使用面積’使得該電路板1〇a之外形 尺寸無法獲得有效縮小,進而令該光學模組la之外形結構 顯得相當魔大。 於是,本創作人有感於上述問題點及從事該行業多年 之經驗,並針對可進行改善之不便與問題點,乃潛心研究 並配合實際之運用’並本著精益求精之精神,終於提出一 種設計合理且有效改善上述問題點之太舍丨徒。 【新型内容】 本創作之主要目的’在於可提供—種光學模組,其係 利用絕緣體以將光感應裔及電子元件疊層架設,可使★亥電 路板之使用面積得以大幅縮小,進而有效降低光學模組之 外形尺寸。 ^ 為了達成上述之目的,本創作係提供一種光學模組, 係用於具照相功能之電子设備上’包括有電路板、光感應 器及鏡頭座,其中,電路板上設有各種不同之電子元件, 於電子元件上方設有光感應器,此光感應器與電路板之電 性連結,且於兩者間設有至少一相對應之絕緣體;另電路 板係供鏡頭座固設於其上方,此鏡頭座具有光學鏡頭及容 置室,此容置室容設有電路板之電子元件及光感應器,並 組成光學模組之整體,進而達成上述之目的。 【實施方式】 為了使 貴審查委員能更進一步瞭解本創作之特徵及 技術内容,請參閱以下有關本創作之詳細說明與附圖,而 所附圖式僅提供參考與說明用,並非用來對本創作加以限 制者0
M254027
案號 93203351 四、創作說明(3) 請參閱第二圖、第三圖及筮 _ 栳夕八絰fr舻同☆人立卓四圖所示’係分別為本創 作之分解立體圖、組合示竜圖+ 。及、、且合剖視圖,本創作孫媒 供一種光學模組,其係可用於呈日^ ^优口 +劁作係挺 ^目機w⑽、玩具(TGY>或倒車距離顯示器等電子設 備上’該光學杈組1主要包括有電 鏡頭座30,其中: 攸α尤认應态20及 電路板1〇係以不導電材料所製成 面可供-排線⑴exCable)、連結插槽或連接@ ”底 (jonnector)電性連結,於電路板10之頂面固設連結有各 種:同之二子元件11(如:電阻、電容、晶片等)及預留有 :灵數孔洞12 ;另於電路板之四端角落處分別設有呈交叉 相對之斜面1 3。 ^光感應器20係可為電荷耦合元件(CCD)、互補式金屬 乳化半導體感應器(CMOS Sensor)4是其他感光元件等, ^光感應為20之左、右兩側邊處設有多數接觸端子21,該 專接觸端子21係可連結於電路板1〇之孔洞12並使其電性導 通,另於電路板1 〇與光感應器2 〇間至少設有一相對應之絕 緣體Μ,以使該光感應器2〇恰位於電路板1〇之電子元件^ ^方處,該絕緣體22係可為陶瓷材料所製成,其係可以黏 膠或树脂固著於光感應器2〇之底面上,且該絕緣體22係可 ^ 一長條狀矩形體、圓柱體或其他幾何形狀之型態,本實 施例係為一長條狀矩形體。 鏡頭座3 0係由一矩形框架3丨及從框架3丨向上延伸出一 圓同形環架32所構成,此環架32係可供一光學鏡頭33置設 上其t部;於框架31與環架32之相隔處形成有一間隔板 ——:—-------
第7頁 M254027 -93203351 ^ 年 g:月 > 日 修正 四、創作說明(4) ~ 34 ’於間隔板34之中心處設有一貫穿孔35,且於貫穿孔35 下方设有一矩形置放槽36,此置放槽36可供一透明玻璃板 3 7置设,另於框架3 j之四端角落處分別向下延伸有三角形 之^位塊38,該等定位塊38之傾斜面係為朝向内側,並,令 兩父叉相對之疋位塊Μ距離與電路板10之兩交叉斜面13距 離相等,利於將鏡頭座30穩固定位連結於電路板1〇上;再 者,於框架31内部形成有一容置室39,此容置室39係可供 電路板10之電子幻叫及光感應器2G置設,且框㈣之底 面積係與電路板10之面積相當,以組成光學模组丨之整體 組合電路板10與光感應器20時,可先於 一之底面塗著黏膠,將其固著於電路板10之頂面上, 將光感應器20固著連結於電路板10之電子元件u上方,_ ϊίΐΐΓ0之接觸端子21穿設於電路板10之孔洞12並產 S性連結;㈣頭錢之定位塊38喪入電路板10 it,以使電路板10之電子元件u及光感應器20 碩座30之容置室39内。 於鏡 請參閱第五圖所示,係為本創作另一實施例 =其中,該絕緣體22,係為圓柱體,可將其: 於電路板10之預設位置處,並於該絕緣體22,之 = 黏聲,再將光感應器20之底面貼合於絕緣體Μ,上 2著 :’使光感應器20之接觸端子21穿設連結於電路板ι。同 σ 2上,以達成電路板1〇與光感應器2〇之組合。
M254027 案號 9320335j_
四、創作說明(5) 圖,其中電路板10係由第一電路板1〇1及第二電路板1〇2所 ,成,於該第二電路板101上設有一部份電子元件11(如·· 晶片),另於該第二電路板102上則固設其餘之電子元件u P气乂電阻 > 電合),於各该電路板1 0 1、1 〇 2及光感應器2 0 —:別置"又有、巴緣體2 2 α作為區隔,該絕緣體2 2,係可為 ::或二層以上之間隔設置;如此,可使該光學模組k 外形獲得更為縮小化的結構。 上所述依據本創作光學模組,至少具有以下諸多 可=絕緣體以將光感應器及電子元件疊層架設, 之使用面積獲得大幅縮+,有效降低光學模 、、且之外形尺寸,並達成外型輕巧、攜帶方便之功效。 性、,當知本創作之光學模組已具有產業利用 類產品及公開使用,申==作構造亦不曾見於同 合新型專利申請要件申…未見於諸類刊物i,完全符 内容所為之等效結構變化,或直接或::4 : : ΐ ΐ Γ 領域’均同理皆包含於本創作之範圍:相
第9頁 M254027 _案號93203351_0年α月入日 修正 圖式簡單說明 【圖式簡單說明】 第一圖 係為習知光學模組示意圖。 第二圖 係為本創作之立體分解圖。 第三圖 係為本創作之組合示意圖。 第四圖 係為本創作之組合剖視圖。 第五圖 係為本創作另一實施例之示意圖。 第六圖 係為本創作又一實施例之示意圖。 【元件代表符號】 【習知】
第10頁 光學模組 1 a 電路板 10a 光感應器 11a 鏡頭座 12a 光學鏡頭 121a 容置室 122a 電子元件 13a 本創作】 光學模組 1 電路板 10 第一電路板1 01 第二電路板 102 電子元件 11 孔洞 12 斜面 13 光感應器 20 接觸端子 21 絕緣體 22,22 鏡頭座 30 框架 31 環架 32 光學鏡頭 33 間隔板 34 M254027
Claims (1)
- M254027____t?# 932033^ 五、申請專利範圍 一 1 · 一種光學模組,包括一電路板、一光感應器及一鏡 頭座i其中,該電路板上設有各種不同之電子元件,於該 電子元件上方設有一光感應器,該光感應器與該電路板之 電性連結’且於兩者間設有至少一相對應之絕緣體;另該 電路板係供一鏡頭座固設於其上方,該鏡頭座具有一光學 鎖:頭f —容置室’該容置室容設有電路板之電子元件及光 感應為’並組成光學模組之整體。 ^ 1如申請專利範圍第1項所述光學模組,其中該光學 杈組係可用於具照相功能之行動電話上。 3 ·如申請專利範圍第1項所述光學模組,其中該絕緣 體係為一陶瓷材料。 4·如申請專利範圍第1項所述光學模組,其中該絕緣 體係没於電路板之頂面上。 5.如申請專利範圍第i項所述光學模組,其中該絕緣 體係設於光感應器之底面處。 ^ 6 ·如申請專利範圍第5項所述光學模組,其中該絕緣 體係設於光感應器底面之四端角落處。 ^ 了 ·如申清專利範圍第1項所述光學模組,其中該絕緣 體係為一長條狀矩形體。M254027第13頁
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TW093203351U TWM254027U (en) | 2004-03-05 | 2004-03-05 | Optical module |
US10/863,466 US20050195323A1 (en) | 2004-03-05 | 2004-06-09 | Optical module |
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TW093203351U TWM254027U (en) | 2004-03-05 | 2004-03-05 | Optical module |
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TW093203351U TWM254027U (en) | 2004-03-05 | 2004-03-05 | Optical module |
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DE102016219423A1 (de) * | 2016-10-06 | 2018-04-12 | Robert Bosch Gmbh | Anordnung |
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JP2003198897A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | 光モジュール、回路基板及び電子機器 |
TW571409B (en) * | 2002-12-03 | 2004-01-11 | Advanced Semiconductor Eng | Optical device and packaging method thereof |
US6930378B1 (en) * | 2003-11-10 | 2005-08-16 | Amkor Technology, Inc. | Stacked semiconductor die assembly having at least one support |
US20050161791A1 (en) * | 2004-01-23 | 2005-07-28 | Texas Instruments Incorporated | Multiple die-spacer for an integrated circuit |
-
2004
- 2004-03-05 TW TW093203351U patent/TWM254027U/zh not_active IP Right Cessation
- 2004-06-09 US US10/863,466 patent/US20050195323A1/en not_active Abandoned
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US20050195323A1 (en) | 2005-09-08 |
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