TWM250422U - Electrical connector - Google Patents

Electrical connector Download PDF

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Publication number
TWM250422U
TWM250422U TW092216484U TW92216484U TWM250422U TW M250422 U TWM250422 U TW M250422U TW 092216484 U TW092216484 U TW 092216484U TW 92216484 U TW92216484 U TW 92216484U TW M250422 U TWM250422 U TW M250422U
Authority
TW
Taiwan
Prior art keywords
electrical connector
welding
hole
patent application
scope
Prior art date
Application number
TW092216484U
Other languages
English (en)
Inventor
Gen-Sheng Lee
Ming-Lun Szu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW092216484U priority Critical patent/TWM250422U/zh
Priority to JP2004007356A priority patent/JP2005093413A/ja
Priority to US10/940,133 priority patent/US20050059276A1/en
Publication of TWM250422U publication Critical patent/TWM250422U/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/1084Notched leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10984Component carrying a connection agent, e.g. solder, adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/041Solder preforms in the shape of solder balls
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

M250422 五、創作說明(1) 【新型所屬之技術領域】 本創作係關於一種電連接器, 一 之端子結構之電連接器。 曰種具有焊接錫球 【先前技術】 按’!知用於電性連接中央處理單元至電 連接器,通常具有兩種端子構形,即 ft之^ 著型端子。隨著製造技術之不斷發展,= f 到了普及,使得表面黏著型端子在該等中央業:付 R曰! 口 \土夕筮nQR no ) 〇如美國專利20 00年 8月1日A 口之第6, 095, 842號、2〇〇〇年8月8 6, 0 99, 32 1號及200 1年7月31日公止夕〇 弟 掘-认#碎笠羽立々命圭Α σ之第6, 267, 6 1 5號等所 揭不,均係該4 I知之電連接器用端子結構,盆盥
焊接前係於端子末端預植錫球,而該預植錫球:過程,J 先於端子末端塗佈一層具黏性之助焊劑,藉其粘性將 預定位,然後經加熱至一定溫度使錫球部分熔化,然 卻固化,從而使錫球固接於端子之末端。 τ 惟,該等習知電連接器端子之預植錫球過程存在以下 缺失:首先,將錫球預定位於端子上時,需要在端子上塗 佈助焊劑,費料費工;其次,因該等端子尺寸較小,於端 子末端塗佈助焊劑時,極易發生誤操作而使端子之接觸部 亦沾上助焊劑,導致端子接觸部電阻增加,進而使電訊傳 輸品質不佳;其三’焊接處易應力集中並以產生疲勞產生 裂紋,而端子與錫球焊接之結合面為平面,焊接處之裂紋 易沿平直之結合面擴散從而破壞其連接。繁於上述之習知
五、創作說明(2) S容Γ有對該等電連接器端子改進之必要。 升機!的在於提供一種可降低製造成本,且可提 开機械及電氣性能之電連接器。 收六5 H,電連接裔包括設有複數端子孔之絕緣本體、 之導電端子及烊接於端子上之錫球。該等端 垂直錫球焊接之焊接部,焊接部設有至少兩相互 球ΐίϊ:,該等相互垂直之焊接面至少部分嵌入錫 求’並與錫球形成焊接連接。 子之ί :=對&知技術之優點在於:將錫球預定位於端 子^接4時’無須在焊接部涂抹黏性助焊劑以定位锡球 而可將錫球施以一定壓力,使至少兩相互垂直之焊接面 =t嵌入錫球而將錫球預定位;且端子與錫球焊接後,焊 與錫球形!至少兩相互垂直之焊接連接,&而可防止 疲勞之裂紋沿焊接面快速直線擴展。 【實施方式】 ' 請參閱第二至第五圖’本創作之電連接器1〇,係用於 3f電路板(未圖示)上’其包括設有複數端子孔(未 之絕緣本體12、收容於端子孔内之導電端子16以及 =於端子16一端之易熔性接合元件(本實施例中為一種 塑性較大之錫球1 8 )。 導電端子16設有用以將其固定於端子孔内之薄板狀基 =〇,自基部16〇之-端延伸有弧形之彈性接觸部162 , 基。卩160之相對另一端向其一側垂直延伸有焊接部164。焊 五、創作說明(3) 接=164呈圓形板狀,其底面係為第一焊接面1 642,其中 匕°又有垂直貝穿焊接部164之圓形通孔1640,通孔1640之 側面設為第二焊接面1 644,第一焊接面1 642與 1 644相互垂直。 β® 明=參閱第三至第五圖。為便於將錫球18焊接於端子 16,通常先將錫球18預定位於端子16之焊接部“^。將錫 f 18預定位於端子16上時,於焊接部〗64之上、下方分別 提供一上模20及一下模40。該上模20具有與通孔164〇形狀 相仿仁尺寸略大之槽孔(未圖示),下模4〇具有與錫球Μ 尺寸相同之半球形凹孔4〇〇。錫球丨8係置於下模4〇與焊接 部164之間,由於錫球18具有較大之塑性,故合模^,可 將錫球18之一部分壓至通過通孔164〇,並凸出於焊接部 164 —定咼度,第一焊接面1642之一部分及第二焊接面 1 644則嵌入錫球18中,從而將錫球18預定位於端子16之焊 接部1 64。然後將端子1 6及錫球丨8加熱至一定溫度使錫球 1 8部分熔化然後冷卻固化,從而將錫球丨8固接於端子1匕之 焊接部164,完成預植球過程。 將錫球18預定位於端子16上時,本創作係直接將錫球 18壓入通孔1 640而將錫球18定位,從而無須使用助焊劑。 另,電連接器10焊接於電路板上之後,當其受震蕩時,錫 球1 8焊接處易產生裂紋。然於本創作中,焊接連接處具有 相互垂直之第一及第二焊接面1642、1644,當裂紋於第一 焊接面1 642外側產生並逐步擴展到第二焊接面1 644時,其 擴展方向為抗疲勞性能較好之錫球丨8之基體,故能有效/方 M250422 五、創作說明(4) 止裂紋沿直線進一步擴展。 請參閲第六圖,本創作之另一實施例端子丨6,的焊接 部164之通孔ι64〇,設為矩形,並由矩形之各角部設有向 孔内凸伸之尖角部1 646,,且錫球18,被壓入通孔丨64〇,而 預定位〃於端子16,上時,該等尖角部1 646,均可刺入錫球 18 ’從而可增加對錫球18,預定位之作用力。另, 18焊接於焊接部164,時,可形成複數曲面; 而可錢防止裂紋沿焊接面直線快速擴展。¥接面’攸 綜合上述,本創作確已符合新型專利之 提出專利申請。惟,以上所述僅為本創作之較给友依法 舉凡熟悉本創作技藝之人士爰依本創作之精:施例, 修御或變化,皆應涵蓋在以下申請專利 斤作之等效
M250422 圖式簡單說明 【圖式簡單說明】 第一圖係與本創作相關之一種習知電連接器用之端子之示 意圖。 第二圖係本創作電連接器之立體圖。 第三圖係本創作電連接器之端子將錫球預定位前之示意圖 〇 第四圖係本創作電連接器之端子將錫球預定位後之示意圖 〇 第五圖係本創作電連接器之端子預植錫球後之示意圖。 第六圖係本創作電連接器第二實施例之端子之示意圖。 【元件符號說明】 電連接器 10 絕緣本體 12 端子 16、16, 基部 160 接觸部 162 焊接部 164 >164, 通孔 1640 、 1640, 第一焊接面 1642 第二焊接面 1644 尖角部 1 646, 锡球 18、18, 上模 20 下模 40 凹孑L 400

Claims (1)

  1. M250422 六、申請專利範圍 1· 一種電連接器,其包括: 設有複數端子孔之絕緣本體; 容置於端子孔中之複數導電端子,該等端 於絕緣本體之基部、由基部—端延伸之焊接= 基部另一端延伸之接觸部,焊接% 邛及由 垂直之焊接面; 有至少兩相互 焊接t焊接部上之錫球,前述垂直之兩焊接面至少 分嵌入錫球,並與錫球形成焊接連接。 σ 2.如申請專利,範圍第1項所述之電連接器,其中焊接 有通孔,前述相互垂直之焊接面為通孔之侧面舆 部之底面。 3 ·如申請專利範圍第2項所述之電連接器,其中通孔之形 狀為圓形。 / 4.如申請專利範圍第2項所述之電連接器,其中通孔設有 複數向孔内凸伸之尖角部,該等尖角部均刺入錫球並 與錫球形成焊接連接。 5·如申清專利範圍第4項所述之電連接器,其中焊接部為 垂直於基部之圓形板狀,通孔係垂直貫穿該圓形板。 6· —種電連接器,其包括: 設有複數端子孔之絕緣本體; 容置於端子孔中之複數導電端子,該等端子設有固持 於絕緣本體之基部、由基部一端延伸之焊接部及由 基部另一端延伸之接觸部,焊接部設有具有複數個 尖角部之烊接面;
    第10頁 M250422 六、申請專利範圍 焊接於焊接部上之錫球,該錫球與前述焊接面形成焊 接連接。 7 ·如申請專利範圍第7項所述之電連接器,其中焊接面之 複數失角部係刺入錫球。 8 ·如申請專利範圍第7項所述之電連接器,其中烊接部設 有通孔’前述複數尖角部係設置於焊接部之通孔邊緣 〇 9 ·如申請專利範圍第8項所述之電連接器,其中尖角部係
    自通孔側壁向孔内凸伸形成。、 . 1 0 ·如申請專利範圍第9項所述之電連接器,其中焊接部係 自基部之一端垂直延伸而形成之圓板狀。 ii· 一種電連接器端子,包括: 板狀基部、由基部一端延伸之彈性接觸部、由基部另 一端相對接觸部延設之焊接部及焊接於焊接部之易 溶性接合元件,其中 4接部設有具複數尖角部之焊接面,而易溶性接合元 件係部分嵌置於焊接部並與焊接面焊接連接。 12.如申請專利範圍第η項所述之電連接器端子,其中焊
    接部設有通孔,前述複數尖角部係設置於焊接部之通 孔邊緣。 1 3 ·如申請專利範圍第1 2項所述之電連接器端子,其中尖 角部係自通孔側壁向孔内凸伸形成。
TW092216484U 2003-09-12 2003-09-12 Electrical connector TWM250422U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW092216484U TWM250422U (en) 2003-09-12 2003-09-12 Electrical connector
JP2004007356A JP2005093413A (ja) 2003-09-12 2004-01-14 電気コネクタ
US10/940,133 US20050059276A1 (en) 2003-09-12 2004-09-13 Connector with solder-bearing contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092216484U TWM250422U (en) 2003-09-12 2003-09-12 Electrical connector

Publications (1)

Publication Number Publication Date
TWM250422U true TWM250422U (en) 2004-11-11

Family

ID=34271516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092216484U TWM250422U (en) 2003-09-12 2003-09-12 Electrical connector

Country Status (3)

Country Link
US (1) US20050059276A1 (zh)
JP (1) JP2005093413A (zh)
TW (1) TWM250422U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381755B2 (en) 2017-01-20 2019-08-13 Lotes Co., Ltd Electrical connector to avoid missing solder

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7029292B2 (en) * 2003-12-16 2006-04-18 Hon Hai Precision Ind. Co., Ltd. Electrical connector and contact
TWI326235B (en) * 2004-09-15 2010-06-21 Molex Inc Method of attaching a solder element to a contact and the contact assembly formed thereby
US7575440B1 (en) * 2008-08-25 2009-08-18 Hon Hai Precision Ind. Co., Ltd. IC socket capable of saving space on a system board
US7837522B1 (en) * 2009-11-12 2010-11-23 Samtec, Inc. Electrical contacts with solder members and methods of attaching solder members to electrical contacts
JP2014517462A (ja) 2011-05-13 2014-07-17 モレックス インコーポレイテド 電源コネクタ
US8974236B2 (en) * 2012-07-26 2015-03-10 Hon Hai Precision Industry Co., Ltd. Low profile electrical connector
CN107565234B (zh) * 2017-07-24 2019-08-30 番禺得意精密电子工业有限公司 电连接器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3413186B2 (ja) * 2001-07-13 2003-06-03 モルデック株式会社 コネクタ及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381755B2 (en) 2017-01-20 2019-08-13 Lotes Co., Ltd Electrical connector to avoid missing solder

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Publication number Publication date
US20050059276A1 (en) 2005-03-17
JP2005093413A (ja) 2005-04-07

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