TW554580B - Electric connector with coating of anti-soldering ink and its manufacturing method - Google Patents

Abstract

A kind of electric connector with coating of anti-soldering ink and its manufacturing method are disclosed in the present invention. The invention includes an insulation housing stage and plural terminals. In the invention, the selected material pieces to be stamped with the terminal prototype are coated with one step or more than one step of anti-soldering ink, so as to coat the anti-soldering ink at the appropriate position on the upper side of the soldering terminal of the terminal. The soldering terminal below the anti-soldering ink is respectively clamped with the solder bump to assemble the electric connector having anti-soldering ink. Therefore, through the structure of anti-soldering ink coating on top of the solder bump the climbing (due to the siphonic effect) of liquid tin from the melted solder bump can be effectively prevented when conducting thermal reflow and soldering onto the electric connector, so as prevent the poor contact between the terminal and the circuit board.

Description

554580 V. Description of the invention (1)

The present invention relates to the design of the -4 manufacturing method, but refers to-a kind of electrical connection; ΓΓ: electrical connector of the ink and ί; welding 4 W, Μ〇 connected α. The braided end of the braid is coated with an organic, liquid upward-swelling electrical connector and its manufacturing method design. A conventional electrical connector terminal assembly structure # 1i (not shown in the second figure and the twelfth figure) is mainly provided in the structure of the insulating housing 丨 0. A plurality of cavities 1 0 1 are provided in each of the cavities 1 0i. A U-shaped or sheet-shaped or other special-shaped 钿 20 is provided. The 泫 terminal 20 usually has a contact end 201 and a 〆 soldering end 2 0 2 ′, and is pre-clamped at each terminal 20 and the soldering end 202. A solder ball 30, so that when the entire electrical connector is to be installed on the circuit board 40, it can be placed in a predetermined position on the circuit board 40 in advance, so that the lower end solder ball 3o is pressed against the board surface solder joint. Then, the circuit board 40-connector is soldered and sent to a hot air return welding machine, and the solder ball 30 is melted by the hot air to fix the electrical connection to the circuit board 40. However, when the solder ball 30 is refined into a tin solution 3 0 ′, if the upper end of the solder ball 30 is not designed to support the structure, the tin solution 3 0 ′ often rises upward (siphon phenomenon), resulting in the tin solution 3 〇 'can not fully contact the solder joints of the circuit board 4 (as shown in Figures 14 and 15) after solidification. If this not only causes an increase in the cost of the mouth tube, but also makes electronic and computer equipment unusable or unusable. Stability and so on. However, if you want to use the cavity 101 or the terminal 20 of the insulating shell seat 0 on the top of the solder ball 30 to design a structure that prevents the solder liquid from flowing on, it will take a while. ^ The whole body often needs to change the design of many assembly structures. Moreover, the design of the various cavity 101 structures or the terminal 20 structures need to be adapted to the load-bearing structure: The main purpose of the present invention is to provide an electrical connector coated with solder resist ink and its manufacturing method design. In order to improve the siphon effect of the solder ball melting into the tin liquid during the hot air return welding step without changing the insulation shell seat structure or the terminal structure,

Page 4 554580 5. Description of the invention (2) The phenomenon of excessive channeling is formed, so that the tin liquid can completely contact the solder on the PC board with the tin washer. A second objective of the present invention is to provide an electrical connector design coated with solder resist ink, which is composed of an insulating shell base and a plurality of terminal balls, but 'the plurality of terminals planted in the insulating shell base are selected A solder resist ink is coated or printed on the soldering end, and a tin block is sandwiched between the soldering end under the solder resist ink, thereby forming an electrical connector coated with the solder resist ink to improve the tin block during the hot air return soldering stage. The siphon effect of melting into the tin liquid causes excessive upward channeling. Another object of the present invention is to provide a method for manufacturing an electrical connector coated with a solder resist ink, wherein the solder resist ink can be coated or printed on a conductive plate of a terminal first, and then the terminal is punched out according to the coating position of the solder resist ink. Embryo shape, then Φ bend the terminal into a structural shape with a contact end and a soldering end, so that the solder resist ink is just above the solder end, and a tin block is sandwiched between the solder end under the solder resist ink to form a coating Electrical connector for solder resist ink. Another object of the present invention is to provide a method for manufacturing an electrical connector coated with solder resist ink, wherein the material sheet can be punched out of the terminal shape first, and then "selected terminal shape piece is coated or printed with solder resistance ink, and then The terminal is bent into a structural shape having a contact end and a soldering end, and a solder block is clamped by the soldering end. Another object of the present invention is to provide a method for manufacturing an electrical connector coated with solder resist ink, wherein the The blank can be stamped out of the terminal shape first, and then the terminal is bent into a structural shape with a contact end and a soldered end, and then the # fixed terminal is coated or printed with solder resist ink at the soldered end, and then the soldered end is used. Set up tin blocks.

Page 5 554580 5. Description of the invention (3) As shown in the first, second and third figures, the design of the present invention for "electric connector coated with solder resist ink" mainly includes an insulating shell 1 and a plurality of branch terminals 2, among which: Insulation housing 1 (refer to the first figure) is a seat for other electronic components (such as CPU), circuit boards or electrical connectors, its structural shape Not limited to a specific one, but a cavity 11 structure with at least a plurality of terminals is provided in the structure for the following plural terminal 2 to be planted; the terminal 2 (as shown in the second or third picture) is made of a metal sheet The conductor formed and inserted in the cavity 11 of the insulating housing 1 includes a contact end 21 and a soldering end 22 for the contact end 21 to be connected with other electronic components, circuit boards or electrical connections. The soldering terminal 2 2 is combined with the circuit board welding __; however, the present invention is mainly the application or printing or spraying of one or more solder resist inks 2 3 at the appropriate position of the selected soldering terminal 2 2 'With the solder resist ink 2 3 structure to prevent the solder liquid from rising upward during soldering; borrow the above The structural design of the electrical connector coated with solder resist ink, when the electrical connector is to be assembled on the circuit board 40 (see the fourth or fifth picture) < can be pre-positioned so that the tin block is 3 points Touch the circuit board 40, and then transfer the circuit board 40 and the electrical connector into a hot return air welding machine, and use the hot air to melt the tin block 3 into the tin liquid 3; the tin block (or tin sheet or Tin pillar) 3, tin block 3, which are pre-planted on the soldering end 2 of terminal 2 with solder resist ink 2 3 underneath the tin plasmid, so as to melt into a tin liquid during hot air welding and solder to terminal 2 Between the soldering end 22 and the circuit board. Please refer to the sixth diagram or the seventh diagram βP. Since the present invention is provided with a solder resist ink 2 3 at the soldering end 2 2 of the terminal 2, the solder liquid 3 cannot pass upward along the soldering end 2 2. Liter

Page 6 554580 V. Explanation of the invention (4)), that is, it can be between 40, and it is the siphonic property of tin liquid. Based on the "preparation method", the method is to create (a) coating or sub-materials (b) times according to the anti-nine maps (c) to make the terminal 3 liquid, so that the structure can be omitted, and the structure is mainly described. Steps of printing or spraying 2 0 0 selective soldering ink 2 3); 2 Bend to make sure that it is completely itched, and change the cavity 1 1 and 9 as early as 2 2 and the circuit board to reduce the quality control cost, the connection structure In order to effectively prevent the stability of this k-liter electronic product, m is ▲ "The electrical connection of the solder resist ink is applied; the formation of the structure of the solder resist ink 23 can be as follows: 11 or more solder resists Ink 2 3 at the end (as shown in the eighth figure); the coating position is stamped out of the prototype of terminal 2 (such as the structure with a contact end 21 and a soldered end 2 2 (d) = $ = = ^ The soldering end below 2 2 1 3 is provided with a tin block 3 (as shown in the tenth figure, the above-mentioned features of the electrical connector of the anti-ink 23 ink can be used to construct the insulating shell base 1 according to the above-mentioned coating resistance 4 black cost. The electrical connector with capacity 彳 = 1 ▲, as for the step of planting the terminal 2 in the capacity of the insulation housing 1 ^〗 1, it can be implanted after the tin block 3 is inserted, so the assembly method, Γ 1 ’can also be planted with terminal 2 before interposing tin blocks. Secondly, apply Ϊ f: limit. The following is a method of making an electrical connector with a few dry inks (not shown). The steps can also be:

In the terminal material, select the terminal 9 at the remote place first, and then punch out the prototype of terminal 2; ^ The soldering end of the prototype is coated or spray-printed or printed with

554580 V. Description of the invention (5) One or more solder resist inks 2 3; (c) Bending the terminal 2 into a structural shape having a contact end 21 and a soldering end 22; (d) reselecting the resistance Tin block 3 is sandwiched between the soldering ends below soldering ink 3; thus, the method for preparing soldering resisting ink 23 according to the present invention can be applied or sprayed before or after stamping on the terminal sheet 2 0 0 Or, it can be printed by the same way after the terminal 2 is bent into a contact end 21 and a soldering end 22, and then coated or spray-printed or printed on the soldering end 22.

In summary, the design of the present invention for the "electrical connector coated with solder resist ink and its manufacturing method", the use of its means is novel and undoubted, and the efficacy and the design purpose are indeed consistent, and it has been said that the reasonable progress is reasonable. To this end, an application for an invented patent was filed in accordance with the law, but Jun Bureau was kindly requested to review it in detail and grant the patent as a prayer.

Page 8 554580 Brief description of the drawings The first picture shows the application of the invention The second picture shows the assembled state of the invention The third picture shows the assembled state of the invention The fourth picture shows the electrical connection of the invention The fifth picture shows the electrical connection of the invention. The sixth diagram is the anti-welding oil of the present invention. The seventh diagram is another intention of the present invention. The eighth figure is the coating of the material sheet of the present invention. The ninth figure is the solder resist of the present invention. The tenth figure is the bending end of the present invention. The eleventh figure is the bending of the present invention. The twelfth figure is the conventional tin block clamp. The thirteenth figure is The other fourteenth picture is the conventional tin block solution. The fifteenth picture is the conventional tin block solution. The main drawing numbers are: Insulation housing 1; Terminal 2; Soldering end 2 2; Tin block 3; Circuit board 4 0; Example schematic. State diagram. Schematic illustration of another embodiment. Schematic diagram of the device installed on the circuit board. Another embodiment of the device is placed on a circuit board to illustrate the ink to prevent siphoning. Example A schematic view of solder resist ink preventing solder siphon from being provided with solder resist ink. Schematic of stamped terminal of ink sheet. Front view of sub and sandwiched tin blocks. A perspective view of the terminals and clamped tin blocks. Let the structure not be intended. A schematic diagram of a sandwich structure. Schematic of tin-forming solution. Another schematic of tin-forming liquid. Cavity 1 1; Contact end 2 1; Solder resist ink 2 3; Tin liquid 3, Sheet 2 0 0;

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Claims (1)

554580 6. Scope of patent application · '1. An electrical connector coated with solder resist ink, including at least: an insulating shell seat, which is provided with an inserting seat, and is provided with a plurality of terminals for the planting of terminals in the structure Receptive cavity; a plurality of terminals are respectively inserted into the receiving cavity of the insulating shell seat, and its structure includes at least a contact end and a soldering end, and one or more solder resist inks are coated at a selected position of the soldering end. By using the solder resist ink, the solder liquid is prevented from rising upward during soldering. 2. A method for manufacturing an electrical connector coated with solder resist ink. The electrical connector includes at least an insulating shell seat, a plurality of terminals, and a plurality of tin blocks. The manufacturing method is characterized by: (a) coating more than one resist first The soldering ink is used to φ j (b) times to punch out the prototype of the terminal according to the coating position of the soldering resistance ink; (c) The terminal is bent into a structure with a contact end and a soldering end; The manufacturing method of the electrical connector of the soldering ink is that the terminal has the soldering resisting ink, and the electrical connector with the soldering resisting ink and the insulating shell seat. 3. The method for manufacturing an electrical connector coated with solder resist ink as described in item 2 of the scope of patent application, wherein the one or more solder resist inks can be applied to the sheet after punching out the prototype of the terminal. Selected. 4. The method for manufacturing an electrical connector coated with solder resist ink as described in item 2 of the scope of the patent application, wherein the one or more solder resist inks can be bent after the terminal is bent into a structure with contact ends and soldered ends, and then Apply at the selected position on the welding end. Page 10