TWM246802U - Image sensor package with glass on chip configuration - Google Patents

Description

M246802

4. Description of creation (l) [Technical field to which the new type belongs] Especially related to the image sensor This creation relates to an image sensor package, a glass on a wafer [glass 〇ri chip, g〇C] Package. [Previous technology] With the development of technology, more and more personal hand-held electronic ports will use image sensors, such as digital cameras, number 2; and the number of individuals ... [and], etc. : Device =, to capture optical image signals by hand sensing, convert the optical image signals into electrical signals and transfer them to the circuit substrate, so that the optical image signals can be identified, processed or stored. The image sensor is an image sensor The chip is installed in a crystal cavity, which can be formed by a lead frame or a hard printed circuit board = pre-mold, or a groove formed by a ceramic substrate, and then a transparent glass Sealed, and the space in which the image sensing wafer is sealed is usually vacuum or filled with inert gas to prevent moisture or dust particles from entering. Once U.S. Patent Publication No. 6,3 4 2,4 0 6 discloses a COG packaging structure of a shirt image sensor, which is an image sensing chip flip chip bonded to a transparent glass' the transparent glass It has signal input terminals and signal output terminals connected to each other and formed on different surfaces. The image sensing chip is formed with a plurality of bumps to be electrically connected to the signal input terminal of transparent glass. The signal output end of the transparent glass is bonded to a printed circuit board with an opening, so the electrical transmission path is transmitted from the image sensing chip to the printed circuit board through the transparent glass side. The transparent glass must be provided with It has the functions of light transmission and double-sided electrical conduction. It must be transparent in glass

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Forming a double-sided electrical conduction line is difficult and costly. The ancient method 1 = the image sensor chip must be formed with bumps. In addition, the image sensor chip is electrically connected to transparent glass according to its packaging. Provide another one: layer = adhesive seals the periphery of the connection 1 and the image sensor chip ^ ^ The size of the first layer is approximately the same. When the light-transmitting layer does not have sufficient load bearing area for electrical sealing after electrical connection Application of layers or adhesives. [New content 1 The main purpose of this creation is to provide an image sensor package of glass on chip (G0C). The use of a transparent glass with a slot is provided on the image sensor chip. On the surface, the slot corresponds to the bonding pad of the image sensing chip, so that a plurality of bonding wires are connected to the bonding pad of the image sensing chip and the conductive wire of the transparent glass through the L slot. The purpose is to provide a glass-on-wafer image sensor package. A sealing ring is provided between the image sensing chip and the transparent glass, and surrounds the sensing area of the image sensing chip, so that the image A sealed space is formed between the sensing area of the sensing chip and the transparent glass. 'There is no need for other transparent glue in the sealed space to avoid reducing the resolution of the sensing area of the image sensing chip. The image sensor package of glass on a wafer created according to the present invention is mainly composed of an image sensing chip, a transparent glass and a colloid, wherein the image sensing chip has an active surface, and the active The surface system includes a sensing side area and a peripheral area. The peripheral area is formed with a plurality of bonding pads. The transparent glass is disposed on the active surface of the image sensing chip. The transparent glass has

Page 9 M246802 IV. Creative Instructions (3)-a " " '-a f a surface, a second surface and at least one slot, the first surface is provided with a light transmitting area and a wiring Area, the second surface is directed toward the f-moving surface of the image sensing chip, and the light-transmitting area corresponds to the sensing fL wiring area of the image sensing chip, and a plurality of conductive lines are formed. Here, a plurality of bonding wires are electrically connected to the pads of the image sensing chip, and the other ends of the conductive lines are implanted with a plurality of solder balls, and the slot holes pass through the first surface of the transparent glass And the second surface, and corresponding to the bonding pads of the image sensing chip, the sealing system covers the bonding wires. [Embodiment] With reference to the attached drawings, the present invention will enumerate the following embodiment descriptions. According to a specific embodiment of this creation, please refer to FIG. 1, an image sensor package 100 of glass on a chip [glass ON chip, GOC], which mainly includes an image sensing chip 110, a Light-transmitting glass 120 and a colloid 130, wherein the image-sensing chip 110 is an optical sensing chip, a charge coupled device (CCD), and a complementary metal oxide Semiconductor [complementary metal oxide semiconductor (CMOS)] or photodiode [photodiode], the image sensing chip 110 has an active surface 111, the active surface 111 includes a sensing area 丨 2 and a peripheral area 113, The peripheral region 113 is formed with a plurality of bonding pads 114, and the transparent glass 1 2 0 is disposed on the active surface 111 of the image sensing wafer 1 1 0. The image sensing wafer 1 10 and the transparent glass 1 A sealing ring 140 having a mouth shape or a 0 shape is arranged between 20, and the sealing ring 140 surrounds the sensing area 1 12 of the image sensing chip 110, and is arranged on the image sensing chip 110. Sensing area 1 1 2 and

Page 10 M246802 IV. Creative Instructions (4)

Between the solder pads 11 4, a sealed space is formed between the sensing area 丨 i 2 of the image sensing chip 110 and the transparent glass 12 0. Preferably, the sealed space is vacuum-sealed. Or filled with inert gas' to prevent moisture or dust particles from invading, the sealing ring 14 0 does not cover the sensing area 112 of the image sensing wafer 1 1 0, and the transparent glass 120 has a first surface 121 A second surface 122 and at least one slot 123, the first surface 121 has a light transmitting area 124 and a wiring area 125, and the second surface 1 22 is an active surface facing the image sensing chip 110 111. The light-transmitting area 1 24 is a sensing area 11 2 corresponding to the image sensing chip π 〇, and the wiring area 1 25 is formed with a plurality of conductive lines 126. Preferably, the wiring area 125 is formed with a protection Layer 127 to cover the conductive lines 126 to prevent the conductive lines 126 from being oxidized or scratched. One end of the conductive lines 1 2 6 is electrically connected to the image sensing chip 11 by a plurality of bonding wires 1 50. 0 of the recording pad 11 4, the other end of these conductive lines 1 2 6 are planted with a plurality of solder balls 1 6 0 to pass The image sensor is packaged with an electronic signal of 1Q. The slot 123 penetrates the first surface 121 and the second surface 122 of the transparent glass 120. The slot 123 surrounds the transparent area 124 and should The solder pads 114 of the image sensing chip 110, so that the fresh wires 150 can pass through the slot 1 2 3 and connect the conductive pads 1 丨 4 of the image sensing chip 11 0 with the conductivity of the transparent glass 110. Circuit 1 2 6, the slot 1 2 3 can be located between the transparent area 124 of the transparent glass 120 and the wiring area 125 or in the wiring area 125. When the slot 1 2 3 is located in When the wiring area 丨 25, the wiring of the conductive lines 126 cannot be affected. The sealant 丨 3 〇 is formed by injection molding or stamping, and is filled in the slot 123 of the transparent glass 120. The pad u 4 covering the bonding wires 1 50 and the image sensing chip 11 0 is used. In this embodiment,

Page 11 M246802 IV. Creation instructions (5) The sealing gel 1 3 0 is filled between the peripheral area 11 3 of the image sensing wafer 11 0 and the transparent glass 110 to gain the image sensing wafer 11 The fixedness between 0 and the transparent glass 110.

Since the slot 123 of the transparent glass 120 corresponds to the bonding pad 114 of the image sensing chip 110, the bonding wires 150 can be directly connected to the bonding pad of the image sensing chip 11 through the slot 123. And the conductive line 126 of the light-transmitting glass 120, the bumps 114 on the image sensing wafer 1 () need not be formed, which is more economical in manufacturing process. In addition, the sealing ring 14 is surrounded by A sensing space ij 2 of the image sensing wafer 11 〇, so that a sealed space is formed between the sensing area 11 2 of the image sensing wafer i J 〇 and the transparent glass 120. The sealed space does not need to exist Other transparent glue, which can avoid the sealing gel 丨 30 / defect the sensing area of the image sensing chip 丨 丨 〇 2 to avoid reducing the resolution of the sensing area ij 2 of the image sensing chip 1100 degree. The scope of protection of this creation shall be determined by the scope of the attached patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of this creation shall belong to this creation. protected range.

Page 12 M246802 Schematic description [Schematic description] Figure 1 · According to a specific embodiment of this creation, a schematic cross-sectional view of a glass-on-chip image sensor package. Brief description of component symbols: I 0 0 image sensor package II 0 image sensor chip 111 active surface 11 2 sensing area 11 3 peripheral area 11 4 solder pad 120 transparent glass 121 first surface 122 second surface 123 slot hole 124 Transparent area 125 Wiring area 1 2 6 Conductive line 1 2 7 Protective layer 1 3 0 Sealant 140 Seal ring 150 Welding wire 1 6 0 Solder ball

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Claims (1)

M246802 5. Scope of patent application [Scope of patent application] 1. An image sensor package of glass on chip (GOC), including: An image sensing chip, which has an active surface, the active surface The system includes a sensing area and a peripheral area. The peripheral area is formed with a plurality of welding pads. A light-transmitting glass is disposed on the image sensing chip. The light-transmitting glass has a first surface and a second surface. Surface and at least one slot, the first surface has a light-transmitting area corresponding to the sensing area of the image sensing chip, the first surface is formed with a plurality of conductive lines, and the Thai groove The holes penetrate the first surface and the second surface of the transparent glass, and correspond to the pads of the image sensing wafer; a plurality of bonding wires are connected to the pads of the image sensing wafer and The conductive lines of the transparent glass; a colloid that covers the bonding wires; and a plurality of solder balls that are implanted on the conductive lines of the first surface of the transparent glass. 2. The image sensing of glass on a wafer as described in item 1 of the scope of patent application. The sensor package further includes a sealing ring, which is arranged between the image sensing wafer and the transparent glass and surrounds The sensing area of the image sensing chip makes a closed space formed between the sensing area of the image sensing chip and the transparent glass. 3. The image sensor package of glass on a wafer as described in item 2 of the scope of the patent application, wherein the sealing ring is provided on the image sensor chip. M246802 V. Scope of patent application Between the test area and the pads. 4. The image sensor package of glass on a wafer as described in item 2 of the scope of the patent application, wherein the sealing ring does not cover the sensing area of the image sensing chip. 5. The image sensor package of glass on a wafer as described in item 2 of the scope of patent application, wherein the sealing ring is mouth-shaped. 6. The glass-on-wafer image sensor package according to item 1 of the scope of the patent application, wherein the first surface has a wiring area, and the conductive lines are formed in the wiring area. 7. The glass-on-wafer image sensor package as described in item 6 of the scope of the patent application, wherein the slot is provided between the light-transmitting area and the wiring area. The image sensor package of glass on a wafer as described in item 6 of the scope of patent application, wherein the slot is provided in the wiring area. 9 The image sensor of glass on a wafer as described in item 6 of the scope of the patent application] device package 'wherein the wiring area is formed with a protective layer to cover the conductive lines. I 〇 The glass image on the wafer as described in item 1 of the scope of patent application II / The device package ’, wherein the slot surrounds the light transmitting area. ^ The image of the glass on the wafer described in the scope of the patent application No. 1 > 'the package of the device', wherein the sealant system is filled with the 孑 L 〇 tester of the transparent glass ^ Image sensing of glass on a wafer, wherein the sealant system is filled in the image sensing wafer Page 15 M246802 Page 16