TWI907400B - 半導體裝置、半導體裝置的製造方法 - Google Patents

半導體裝置、半導體裝置的製造方法

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Publication number
TWI907400B
TWI907400B TW110110172A TW110110172A TWI907400B TW I907400 B TWI907400 B TW I907400B TW 110110172 A TW110110172 A TW 110110172A TW 110110172 A TW110110172 A TW 110110172A TW I907400 B TWI907400 B TW I907400B
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Taiwan
Prior art keywords
insulator
oxide
insulating film
film
conductor
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TW110110172A
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English (en)
Chinese (zh)
Other versions
TW202213796A (zh
Inventor
山崎舜平
小松良寛
水上翔太
川口忍
澤井寛美
山根靖正
恵木勇司
櫻田勇二郎
笹川慎也
Original Assignee
日商半導體能源研究所股份有限公司
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Publication of TW202213796A publication Critical patent/TW202213796A/zh
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    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
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    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
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  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
TW110110172A 2020-03-31 2021-03-22 半導體裝置、半導體裝置的製造方法 TWI907400B (zh)

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US (1) US12557366B2 (https=)
JP (2) JP7629446B2 (https=)
KR (1) KR20220160579A (https=)
CN (1) CN115244713A (https=)
TW (1) TWI907400B (https=)
WO (1) WO2021198836A1 (https=)

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TW202329333A (zh) * 2021-11-30 2023-07-16 日商半導體能源研究所股份有限公司 半導體裝置、半導體裝置的製造方法
US11768237B2 (en) 2022-05-10 2023-09-26 Google Llc Leakage screening based on use-case power prediction
WO2024165987A1 (en) * 2023-02-09 2024-08-15 Zinite Corporation Passivation elements of a thin film transistor
CN117979690B (zh) * 2023-12-22 2024-09-27 北京超弦存储器研究院 一种半导体器件及其制造方法、电子设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201126245A (en) * 2009-09-24 2011-08-01 Semiconductor Energy Lab Semiconductor device
TW201145519A (en) * 2009-11-20 2011-12-16 Semiconductor Energy Lab Semiconductor device
WO2017144994A1 (ja) * 2016-02-22 2017-08-31 株式会社半導体エネルギー研究所 トランジスタおよびその作製方法、半導体ウエハならびに電子機器
TW201834254A (zh) * 2013-09-06 2018-09-16 日商半導體能源研究所股份有限公司 半導體裝置
TW201834197A (zh) * 2016-12-09 2018-09-16 日商半導體能源硏究所股份有限公司 半導體裝置以及半導體裝置的製造方法
JP2019047101A (ja) * 2017-09-05 2019-03-22 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
TW201929202A (zh) * 2014-02-05 2019-07-16 日商半導體能源研究所股份有限公司 半導體裝置、使用該半導體裝置的顯示裝置、使用該顯示裝置的顯示模組以及使用該半導體裝置、該顯示裝置及該顯示模組的電子裝置
WO2019171196A1 (ja) * 2018-03-07 2019-09-12 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
TW201941402A (zh) * 2013-12-26 2019-10-16 日商半導體能源研究所股份有限公司 半導體裝置
TW202005096A (zh) * 2012-07-20 2020-01-16 日商半導體能源研究所股份有限公司 半導體裝置及顯示裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101870119B1 (ko) 2009-12-25 2018-06-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2012014786A1 (en) 2010-07-30 2012-02-02 Semiconductor Energy Laboratory Co., Ltd. Semicondcutor device and manufacturing method thereof
CN107947763B (zh) 2010-08-06 2021-12-28 株式会社半导体能源研究所 半导体集成电路
US20130087784A1 (en) 2011-10-05 2013-04-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102548001B1 (ko) 2015-07-08 2023-06-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
WO2019053573A1 (ja) 2017-09-15 2019-03-21 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
WO2020049425A1 (ja) 2018-09-05 2020-03-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10978563B2 (en) 2018-12-21 2021-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2021064503A1 (ja) 2019-10-04 2021-04-08 株式会社半導体エネルギー研究所 半導体装置
CN114616681A (zh) 2019-11-01 2022-06-10 株式会社半导体能源研究所 半导体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201126245A (en) * 2009-09-24 2011-08-01 Semiconductor Energy Lab Semiconductor device
TW201145519A (en) * 2009-11-20 2011-12-16 Semiconductor Energy Lab Semiconductor device
TW202005096A (zh) * 2012-07-20 2020-01-16 日商半導體能源研究所股份有限公司 半導體裝置及顯示裝置
TW201834254A (zh) * 2013-09-06 2018-09-16 日商半導體能源研究所股份有限公司 半導體裝置
TW201941402A (zh) * 2013-12-26 2019-10-16 日商半導體能源研究所股份有限公司 半導體裝置
TW201929202A (zh) * 2014-02-05 2019-07-16 日商半導體能源研究所股份有限公司 半導體裝置、使用該半導體裝置的顯示裝置、使用該顯示裝置的顯示模組以及使用該半導體裝置、該顯示裝置及該顯示模組的電子裝置
WO2017144994A1 (ja) * 2016-02-22 2017-08-31 株式会社半導体エネルギー研究所 トランジスタおよびその作製方法、半導体ウエハならびに電子機器
TW201834197A (zh) * 2016-12-09 2018-09-16 日商半導體能源硏究所股份有限公司 半導體裝置以及半導體裝置的製造方法
JP2019047101A (ja) * 2017-09-05 2019-03-22 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
WO2019171196A1 (ja) * 2018-03-07 2019-09-12 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

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