TWI907400B - 半導體裝置、半導體裝置的製造方法 - Google Patents
半導體裝置、半導體裝置的製造方法Info
- Publication number
- TWI907400B TWI907400B TW110110172A TW110110172A TWI907400B TW I907400 B TWI907400 B TW I907400B TW 110110172 A TW110110172 A TW 110110172A TW 110110172 A TW110110172 A TW 110110172A TW I907400 B TWI907400 B TW I907400B
- Authority
- TW
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- Prior art keywords
- insulator
- oxide
- insulating film
- film
- conductor
- Prior art date
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- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
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Landscapes
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-063049 | 2020-03-31 | ||
| JP2020063049 | 2020-03-31 | ||
| JP2020115292 | 2020-07-03 | ||
| JP2020-115292 | 2020-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202213796A TW202213796A (zh) | 2022-04-01 |
| TWI907400B true TWI907400B (zh) | 2025-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110110172A TWI907400B (zh) | 2020-03-31 | 2021-03-22 | 半導體裝置、半導體裝置的製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12557366B2 (https=) |
| JP (2) | JP7629446B2 (https=) |
| KR (1) | KR20220160579A (https=) |
| CN (1) | CN115244713A (https=) |
| TW (1) | TWI907400B (https=) |
| WO (1) | WO2021198836A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202329333A (zh) * | 2021-11-30 | 2023-07-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置、半導體裝置的製造方法 |
| US11768237B2 (en) | 2022-05-10 | 2023-09-26 | Google Llc | Leakage screening based on use-case power prediction |
| WO2024165987A1 (en) * | 2023-02-09 | 2024-08-15 | Zinite Corporation | Passivation elements of a thin film transistor |
| CN117979690B (zh) * | 2023-12-22 | 2024-09-27 | 北京超弦存储器研究院 | 一种半导体器件及其制造方法、电子设备 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201126245A (en) * | 2009-09-24 | 2011-08-01 | Semiconductor Energy Lab | Semiconductor device |
| TW201145519A (en) * | 2009-11-20 | 2011-12-16 | Semiconductor Energy Lab | Semiconductor device |
| WO2017144994A1 (ja) * | 2016-02-22 | 2017-08-31 | 株式会社半導体エネルギー研究所 | トランジスタおよびその作製方法、半導体ウエハならびに電子機器 |
| TW201834254A (zh) * | 2013-09-06 | 2018-09-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| TW201834197A (zh) * | 2016-12-09 | 2018-09-16 | 日商半導體能源硏究所股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
| JP2019047101A (ja) * | 2017-09-05 | 2019-03-22 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
| TW201929202A (zh) * | 2014-02-05 | 2019-07-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置、使用該半導體裝置的顯示裝置、使用該顯示裝置的顯示模組以及使用該半導體裝置、該顯示裝置及該顯示模組的電子裝置 |
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| US20130087784A1 (en) | 2011-10-05 | 2013-04-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102548001B1 (ko) | 2015-07-08 | 2023-06-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| WO2019053573A1 (ja) | 2017-09-15 | 2019-03-21 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
| WO2020049425A1 (ja) | 2018-09-05 | 2020-03-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US10978563B2 (en) | 2018-12-21 | 2021-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| WO2021064503A1 (ja) | 2019-10-04 | 2021-04-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN114616681A (zh) | 2019-11-01 | 2022-06-10 | 株式会社半导体能源研究所 | 半导体装置 |
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| TW201834254A (zh) * | 2013-09-06 | 2018-09-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
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| JPWO2021198836A1 (https=) | 2021-10-07 |
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| CN115244713A (zh) | 2022-10-25 |
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