TWI899511B - 淨化系統 - Google Patents

淨化系統

Info

Publication number
TWI899511B
TWI899511B TW111138940A TW111138940A TWI899511B TW I899511 B TWI899511 B TW I899511B TW 111138940 A TW111138940 A TW 111138940A TW 111138940 A TW111138940 A TW 111138940A TW I899511 B TWI899511 B TW I899511B
Authority
TW
Taiwan
Prior art keywords
supply
pipe
purified gas
purification system
flow rate
Prior art date
Application number
TW111138940A
Other languages
English (en)
Chinese (zh)
Other versions
TW202322925A (zh
Inventor
和田快也
伊藤靖久
Original Assignee
日商村田機械股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商村田機械股份有限公司 filed Critical 日商村田機械股份有限公司
Publication of TW202322925A publication Critical patent/TW202322925A/zh
Application granted granted Critical
Publication of TWI899511B publication Critical patent/TWI899511B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221—Overhead conveying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Pipeline Systems (AREA)
  • Separation Of Gases By Adsorption (AREA)
TW111138940A 2021-10-21 2022-10-14 淨化系統 TWI899511B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-172598 2021-10-21
JP2021172598 2021-10-21

Publications (2)

Publication Number Publication Date
TW202322925A TW202322925A (zh) 2023-06-16
TWI899511B true TWI899511B (zh) 2025-10-01

Family

ID=86059057

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111138940A TWI899511B (zh) 2021-10-21 2022-10-14 淨化系統

Country Status (5)

Country Link
US (1) US20250226254A1 (https=)
JP (1) JPWO2023067947A1 (https=)
CN (1) CN117882182A (https=)
TW (1) TWI899511B (https=)
WO (1) WO2023067947A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013179287A (ja) * 2012-02-03 2013-09-09 Tokyo Electron Ltd 基板収容容器のパージ方法
WO2015194255A1 (ja) * 2014-06-16 2015-12-23 村田機械株式会社 パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005167168A (ja) * 2003-12-02 2005-06-23 Dan-Takuma Technologies Inc パージバルブおよび保管装置
JP5716968B2 (ja) * 2012-01-04 2015-05-13 株式会社ダイフク 物品保管設備
JP6856015B2 (ja) * 2017-12-20 2021-04-14 株式会社ダイフク 保管設備

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013179287A (ja) * 2012-02-03 2013-09-09 Tokyo Electron Ltd 基板収容容器のパージ方法
WO2015194255A1 (ja) * 2014-06-16 2015-12-23 村田機械株式会社 パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法

Also Published As

Publication number Publication date
CN117882182A (zh) 2024-04-12
JPWO2023067947A1 (https=) 2023-04-27
TW202322925A (zh) 2023-06-16
US20250226254A1 (en) 2025-07-10
WO2023067947A1 (ja) 2023-04-27

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