JPWO2023067947A1 - - Google Patents
Info
- Publication number
- JPWO2023067947A1 JPWO2023067947A1 JP2023555032A JP2023555032A JPWO2023067947A1 JP WO2023067947 A1 JPWO2023067947 A1 JP WO2023067947A1 JP 2023555032 A JP2023555032 A JP 2023555032A JP 2023555032 A JP2023555032 A JP 2023555032A JP WO2023067947 A1 JPWO2023067947 A1 JP WO2023067947A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
- H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3221—Overhead conveying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Pipeline Systems (AREA)
- Separation Of Gases By Adsorption (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021172598 | 2021-10-21 | ||
| PCT/JP2022/034096 WO2023067947A1 (ja) | 2021-10-21 | 2022-09-12 | パージシステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023067947A1 true JPWO2023067947A1 (https=) | 2023-04-27 |
| JPWO2023067947A5 JPWO2023067947A5 (https=) | 2024-06-07 |
Family
ID=86059057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023555032A Pending JPWO2023067947A1 (https=) | 2021-10-21 | 2022-09-12 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250226254A1 (https=) |
| JP (1) | JPWO2023067947A1 (https=) |
| CN (1) | CN117882182A (https=) |
| TW (1) | TWI899511B (https=) |
| WO (1) | WO2023067947A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005167168A (ja) * | 2003-12-02 | 2005-06-23 | Dan-Takuma Technologies Inc | パージバルブおよび保管装置 |
| JP2013139319A (ja) * | 2012-01-04 | 2013-07-18 | Daifuku Co Ltd | 物品保管設備 |
| JP2013179287A (ja) * | 2012-02-03 | 2013-09-09 | Tokyo Electron Ltd | 基板収容容器のパージ方法 |
| WO2015194255A1 (ja) * | 2014-06-16 | 2015-12-23 | 村田機械株式会社 | パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法 |
| JP2019108220A (ja) * | 2017-12-20 | 2019-07-04 | 株式会社ダイフク | 保管設備 |
-
2022
- 2022-09-12 WO PCT/JP2022/034096 patent/WO2023067947A1/ja not_active Ceased
- 2022-09-12 CN CN202280058010.3A patent/CN117882182A/zh active Pending
- 2022-09-12 US US18/700,352 patent/US20250226254A1/en active Pending
- 2022-09-12 JP JP2023555032A patent/JPWO2023067947A1/ja active Pending
- 2022-10-14 TW TW111138940A patent/TWI899511B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005167168A (ja) * | 2003-12-02 | 2005-06-23 | Dan-Takuma Technologies Inc | パージバルブおよび保管装置 |
| JP2013139319A (ja) * | 2012-01-04 | 2013-07-18 | Daifuku Co Ltd | 物品保管設備 |
| JP2013179287A (ja) * | 2012-02-03 | 2013-09-09 | Tokyo Electron Ltd | 基板収容容器のパージ方法 |
| WO2015194255A1 (ja) * | 2014-06-16 | 2015-12-23 | 村田機械株式会社 | パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法 |
| JP2019108220A (ja) * | 2017-12-20 | 2019-07-04 | 株式会社ダイフク | 保管設備 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117882182A (zh) | 2024-04-12 |
| TW202322925A (zh) | 2023-06-16 |
| US20250226254A1 (en) | 2025-07-10 |
| WO2023067947A1 (ja) | 2023-04-27 |
| TWI899511B (zh) | 2025-10-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20240213 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240213 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250128 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250328 |
|
| A02 | Decision of refusal |
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