CN117882182A - 吹扫系统 - Google Patents

吹扫系统 Download PDF

Info

Publication number
CN117882182A
CN117882182A CN202280058010.3A CN202280058010A CN117882182A CN 117882182 A CN117882182 A CN 117882182A CN 202280058010 A CN202280058010 A CN 202280058010A CN 117882182 A CN117882182 A CN 117882182A
Authority
CN
China
Prior art keywords
supply
purge
purge gas
pipe
flow rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280058010.3A
Other languages
English (en)
Chinese (zh)
Inventor
和田快也
伊藤靖久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Machinery Ltd
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of CN117882182A publication Critical patent/CN117882182A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221—Overhead conveying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Pipeline Systems (AREA)
  • Separation Of Gases By Adsorption (AREA)
CN202280058010.3A 2021-10-21 2022-09-12 吹扫系统 Pending CN117882182A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-172598 2021-10-21
JP2021172598 2021-10-21
PCT/JP2022/034096 WO2023067947A1 (ja) 2021-10-21 2022-09-12 パージシステム

Publications (1)

Publication Number Publication Date
CN117882182A true CN117882182A (zh) 2024-04-12

Family

ID=86059057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280058010.3A Pending CN117882182A (zh) 2021-10-21 2022-09-12 吹扫系统

Country Status (5)

Country Link
US (1) US20250226254A1 (https=)
JP (1) JPWO2023067947A1 (https=)
CN (1) CN117882182A (https=)
TW (1) TWI899511B (https=)
WO (1) WO2023067947A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005167168A (ja) * 2003-12-02 2005-06-23 Dan-Takuma Technologies Inc パージバルブおよび保管装置
JP5716968B2 (ja) * 2012-01-04 2015-05-13 株式会社ダイフク 物品保管設備
JP6087161B2 (ja) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 基板収容容器のパージ方法
KR101903441B1 (ko) * 2014-06-16 2018-10-02 무라다기카이가부시끼가이샤 퍼지 장치, 퍼지 시스템, 퍼지 방법 및 퍼지 시스템에 있어서의 제어 방법
JP6856015B2 (ja) * 2017-12-20 2021-04-14 株式会社ダイフク 保管設備

Also Published As

Publication number Publication date
JPWO2023067947A1 (https=) 2023-04-27
TW202322925A (zh) 2023-06-16
US20250226254A1 (en) 2025-07-10
WO2023067947A1 (ja) 2023-04-27
TWI899511B (zh) 2025-10-01

Similar Documents

Publication Publication Date Title
US11978652B2 (en) Automatic handling buffer for bare stocker
CN103171843B (zh) 物品保管设备以及物品保管方法
TWI868516B (zh) 搬送系統，容器開閉裝置
US9230845B2 (en) Article storage facility and article storage method
US8070410B2 (en) Scalable stocker with automatic handling buffer
KR102428092B1 (ko) 용기 수납 설비
KR102346977B1 (ko) 용기 수납 설비
KR20130080419A (ko) 물품 보관 설비 및 물품 보관 방법
KR102311744B1 (ko) 용기 수납 설비
CN108398168B (zh) 流量测定系统
CN110957237A (zh) 晶片吹扫型搁架组件以及具有该组件的缓冲模块
CN117882182A (zh) 吹扫系统
US11581198B2 (en) Processing apparatus
KR102764783B1 (ko) 보관 선반
KR101647277B1 (ko) 베어 스토커용 자동 취급 버퍼
JP7277813B2 (ja) 搬送システム及び容器開閉装置
JP2024170193A (ja) 保管設備

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination